EP1879440A2 - Appareil d'affichage et procédé de combinaison de base de châssis avec bossage - Google Patents

Appareil d'affichage et procédé de combinaison de base de châssis avec bossage Download PDF

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Publication number
EP1879440A2
EP1879440A2 EP07252729A EP07252729A EP1879440A2 EP 1879440 A2 EP1879440 A2 EP 1879440A2 EP 07252729 A EP07252729 A EP 07252729A EP 07252729 A EP07252729 A EP 07252729A EP 1879440 A2 EP1879440 A2 EP 1879440A2
Authority
EP
European Patent Office
Prior art keywords
embossment
chassis base
boss
display apparatus
bosses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07252729A
Other languages
German (de)
English (en)
Other versions
EP1879440A3 (fr
Inventor
c/o Samsung ASDI Co. Ltd. Kim Myoung-Kon
Won-Kyu c/o Samsung ASDI Co. Ltd. Bang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of EP1879440A2 publication Critical patent/EP1879440A2/fr
Publication of EP1879440A3 publication Critical patent/EP1879440A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2217/00—Gas-filled discharge tubes
    • H01J2217/38—Cold-cathode tubes
    • H01J2217/49—Display panels, e.g. not making use of alternating current
    • H01J2217/492—Details
    • H01J2217/49264—Vessels

Definitions

  • the present invention relates to a display apparatus.
  • flat panel display apparatus such as liquid crystal displays, plasma display panels, field emission displays, and vacuum fluorescent displays have been developed.
  • a plasma display panel is a flat panel display device that displays an image using a gas discharge.
  • Plasma display panels have become popular since they can be manufactured to be large and thin, with a wide viewing angle, and can display high quality images.
  • a conventional plasma display apparatus includes a plasma display panel combining a front panel and a rear panel.
  • the plasma display panel is typically mounted on a chassis base. If the chassis base is made from relatively thin metal in order to save weight there is a tendency for it to deform during the assembly process.
  • the present invention sets out to provide a display apparatus that overcomes the above problems.
  • the invention provides a display apparatus as set out in claim 1 and a method of manufacturing a display apparatus as set out in Claim 11.
  • Preferred features of the invention are set out in claims 2 to 10, and 12 and 13.
  • FIG. 1 is an exploded perspective view of circuit boards mounted to a plasma display device according to the present invention.
  • FIG. 2 is a perspective view illustrating a press fitting of a boss to a chassis base of a plasma display apparatus according to an embodiment of the present invention.
  • FIG. 3 is a perspective view illustrating a press fitting of two bosses to a chassis base of a plasma display apparatus according to another embodiment of the present invention.
  • FIG. 4a is a perspective view illustrating a modified version of a press fitting of two bosses to a chassis base of a plasma display apparatus according to yet another embodiment of the present invention.
  • FIG. 4b is a cross sectional view of the press fitting of Fig. 4a.
  • FIG. 5 is a perspective view illustrating a press fitting of three bosses to a chassis base of a plasma display apparatus according to still another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a press fitting of a boss to a chassis base according to yet another embodiment of the present invention.
  • FIG. 7 is a flow chart illustrating a method of combining a boss with a chassis base according to still another embodiment of the present invention.
  • a plasma display apparatus (not shown) includes a plasma display panel including a front panel and a rear panel.
  • the plasma display panel is a three-electrode type surface discharge AC PDP
  • the front panel includes a transparent front substrate, sustain electrode pairs formed on the front substrate to generate a sustain discharge, a front dielectric layer covering the sustain electrode pairs, and a protective layer coated on the front dielectric layer.
  • the rear panel includes a rear substrate, address electrodes crossing the sustain electrode pairs, a rear dielectric layer covering the address electrodes, barrier ribs that form discharge cells by defining a discharge space, and phosphor layers coated on the discharge cells.
  • the plasma display panel may be of various types including a three-electrode type surface discharge AC PDP.
  • a thermal conductive medium may be attached to a rear surface of the plasma display panel to dissipate heat generated during the operation of the plasma display panel.
  • the chassis base may be disposed on the rear of the plasma display panel, and may be combined with the plasma display panel using fixing means, such as a double-sided tape.
  • a plurality of circuit boards that generate electrical signals for applying a voltage to the sustain electrode pairs and the address electrodes of the plasma display panel are mounted on the rear of the chassis base. In order to apply a voltage to each of the sustain electrode pairs and the address electrodes of the plasma display panel, terminal units of each of the sustain electrode pairs and the address electrodes of the plasma display panel are electrically connected to terminals of the circuit boards by signal transmitting elements.
  • a plasma display device such as described generally above includes a plasma display panel 1 mounted to a chassis base 10 by a fixing means 7.
  • the plasma display panel 1 includes a front panel 2 and a rear panel 3 and a thermal conductive medium 6 is located on one surface of the rear panel.
  • Circuit boards 4 are mounted to the chassis base 10 using bosses 15, as described in more detail below.
  • FIGs. 2-5 show several embodiments of the present invention including bosses 15, 25, 35, 45 press-fitted to a respective chassis base 10, 20, 30, 40, 50.
  • the chassis base 10 is formed from a steel group material such as an aluminum-zinc alloy coated steel sheet or EGI (electrolytic galvanized iron) to a thickness of about 1.0 mm or less, for example, about 0.8mm, and thus, the chassis base 10 is lightweight.
  • the plasma display panel 1 is supported by the front of the chassis base 10 and the circuit boards are supported by the rear of the chassis base 10. Accordingly, the chassis base 10 is required to have a high strength and therefore, a reinforcing member may be attached to the rear of the chassis base 10.
  • the circuit boards are combined with the chassis base 1 using a screw combining method in which bosses 15 and screws are used. More specifically, the bosses 15 are coupled to the chassis base 10, screw threads being formed on internal surfaces of the bosses 15. The circuit boards can be combined with the chassis base 10 when the screws are screwed into the threads of the bosses 15 through holes in the circuit boards.
  • the chassis base 10 When the bosses 15 are press fitted to the thin steel chassis base 10, the chassis base 10 may deform, reducing the overall strength of the chassis base 10. As depicted in FIGS. 2 through 5, embossments 10a, 20a, 30a, 30b, and 40a are formed around bosses 15, 25, 35, and 45 of chassis bases 10, 20, 30, and 40, respectively, to prevent the chassis bases from deforming.
  • the embossment 10a protrudes from a surface of the chassis base 10 in a region around the boss 15 in the same direction in which the boss 15 protrudes.
  • the embossment 10a has a generally circular shape.
  • the embossment 20a protrudes from a surface of the chassis base 20 in a region around the two bosses 25 in the same direction in which the two bosses 25 protrude.
  • the embossment 20a is formed so that both of its ends are curved into arcs having radii less than or equal to R from the centerlines of the two bosses 25, where R is a distance about 40 mm or less.
  • an embossment of the two bosses 35 includes a first embossment 30a and a second embossment 30b. More specifically, the first embossment 30a protrudes from a surface of the chassis base 30 in a region around the two bosses 35 in the same direction in which the two bosses 35 protrude, and the second embossment 30b is recessed from a surface of the first embossment 30a in a direction opposite to which the bosses 35 protrude. A radius of arc defining the ends of the second embossment 30b is less than a radius of arc defining the ends of the first embossment 30a. Accordingly, an increase in the height of the bosses 35 due to the embossing process can be prevented.
  • an embossment 40a protrudes from a surface of the chassis base 40 in the same direction in which the three bosses 45 protrude.
  • the embossment 40a has a shape in which three circular arcs are formed in regions around the three bosses 45 and have radii smaller than or equal to R from the centerlines of the three bosses 45, where R is a distance of about 40 mm or less. Accordingly, when the three bosses 45 are disposed in an "L" shape, the embossment 40a also has a corresponding "L" shape.
  • FIG. 6 is a cross-sectional view illustrating a press fitting of the boss 15 to the chassis base 10 according to an embodiment of the present invention
  • FIG. 7 is a flow chart of a method of combining a boss with a chassis base according to another embodiment of the present invention.
  • a method of forming the embossment 10a in the chassis base 10 and the method of combining the boss 15 with the embossment 10a will now be described with reference to FIGS. 6 and 7.
  • the embossment 10a is formed to protrude from the surface of the chassis base 10 in the same direction in which the boss 15 protrudes (S10).
  • the embossment 10a may be formed in the chassis base 10 using a conventional embossing processing method. More specifically, the embossment is formed by pressing the chassis base 10 into a die 13 with a punch 14, the punch 14 and the die 13 being placed on opposite sides of the chassis base 10. As such, the embossment 10a is formed to protrude from the surface of the chassis base 10 in the same direction in which the boss 15 protrudes.
  • a hole is then formed in a region of the embossment 10a where the boss 15 is will be press fitted (S20).
  • the hole is located in the center of the circular embossment 10a.
  • An outer diameter of the head portion of the boss 15 is dimensioned to be larger than an inner diameter of the hole of the chassis base such that the head portion of the boss 15 can pass through the hole in the chassis base when press fitted.
  • the die 13 is disposed on a surface of the embossment 10a on the chassis base 10 facing a direction in which the embossment 10a protrudes (S30). In one embodiment, the die 13 is disposed such that leg portions of the die 13 contact the rear surface of the embossment 10a.
  • the boss 15 may then be inserted into the hole of the embossment 10a (S40).
  • a lower part of the boss 15 is sufficiently inserted into the hole of the embossment 10a
  • the lower part of the boss 15 is pressed into the embossment 10a using the punch 14 (S50).
  • the boss 15 is inserted into the hole of the embossment 10a, stress is generated in regions indicated by dotted circles in FIG. 6 between the chassis base 10 and the boss 15 due to the pressing force of the punch 14.
  • the transmission of the stress is limited to the embossment 10a.
  • the deformation of the chassis base 10 due to the stress is limited to a particular region of the chassis base 10, more specifically, to the region of the embossment 10a as indicated by the arrows in FIG. 6. Accordingly, the deformation of the chassis base 10 due to press fitting process is minimized, and as a result, the strength of the chassis base 10 is not reduced.
  • a radius R from the centerline of the boss 15 inserted into the center of the embossment 10a to an edge of the embossment 10a is approximately 40 mm or less, and in some embodiments, may be from about 18 to 20 mm. If the radius R is greater than 40 mm, the deformation of the chassis base 10 may not be able to be limited to a particular region. As a result, the strength of the chassis base 10 is reduced, thereby reducing the reliability of the chassis base 10.
  • the embossment 20a has a shape that includes end arcs each having a radius of from about 18 to 20mm from the centerline of each of the bosses 25 and the embossment 40a has an "L" shape that includes arcs of three circles each having a radius of 18 to 20 mm from the centerline of each of the bosses 45.
  • an embossment is formed in a region around one to three bosses.
  • the present invention is not limited thereto and an embossment may be formed around four or more bosses.
  • the method of combining the two bosses 35 with the chassis base 30 in which the first embossment 30a and the second embossment 30b are formed as depicted in FIG. 4 is similar to the method described above. However, the first and second embossments 30a, 30b may be sequentially formed in the chassis base 30.
  • the second embossment 30b which has a arc radius less than the first embossment 30a, is recessed from the surface of the first embossment 30a in a direction opposite to the direction in which the two bosses 35 protrude. Then, the die is disposed on the surface of the chassis base 30 facing the surface from which the first embossment 30a protrudes.
  • the plasma display apparatus may further include a front cabinet and a rear cabinet.
  • the front and rear cabinets protect the plasma display apparatus from external impact.
  • the rear cabinet may also block the emission of electromagnetic waves from the chassis base.
  • Embodiments of the present invention are not limited to those described herein, but rather may be applied to any display apparatus, such as a liquid crystal display (LCD), an organic light-emitting display (OLED), or an FED including a display panel and a chassis base on which circuit boards for driving the display panel are mounted, and in which the coupling bosses with the chassis base is required.
  • LCD liquid crystal display
  • OLED organic light-emitting display
  • FED FED including a display panel and a chassis base on which circuit boards for driving the display panel are mounted, and in which the coupling bosses with the chassis base is required.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
EP07252729.4A 2006-07-10 2007-07-06 Appareil d'affichage et procédé de combinaison de base de châssis avec bossage Withdrawn EP1879440A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060064455A KR20080005732A (ko) 2006-07-10 2006-07-10 디스플레이 장치 및 섀시 베이스와 보스의 결합 방법

Publications (2)

Publication Number Publication Date
EP1879440A2 true EP1879440A2 (fr) 2008-01-16
EP1879440A3 EP1879440A3 (fr) 2014-10-15

Family

ID=38617297

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07252729.4A Withdrawn EP1879440A3 (fr) 2006-07-10 2007-07-06 Appareil d'affichage et procédé de combinaison de base de châssis avec bossage

Country Status (4)

Country Link
US (1) US7564680B2 (fr)
EP (1) EP1879440A3 (fr)
KR (1) KR20080005732A (fr)
CN (1) CN101106878B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100926649B1 (ko) * 2006-07-06 2009-11-16 삼성전자주식회사 결합유닛 및 이를 갖는 휴대용컴퓨터
KR100874065B1 (ko) * 2007-04-18 2008-12-12 삼성에스디아이 주식회사 보스 및 이를 구비한 플라즈마 디스플레이 장치
KR101619786B1 (ko) * 2010-01-08 2016-05-13 삼성디스플레이 주식회사 바텀 샤시의 제조 방법, 이에 따라 제조된 바텀 샤시, 액정 표시 장치의 제조 방법 및 이에 따라 제조된 액정 표시 장치
KR102116932B1 (ko) * 2015-12-04 2020-05-29 삼성전자주식회사 인쇄회로기판 장착 구조 및 이를 포함하는 디스플레이 장치
KR102663222B1 (ko) * 2019-03-06 2024-05-07 삼성전자주식회사 디스플레이 장치 및 그 제조 방법
KR102176720B1 (ko) * 2020-05-25 2020-11-10 삼성전자주식회사 인쇄회로기판 장착 구조 및 이를 포함하는 디스플레이 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050047100A1 (en) * 2003-09-02 2005-03-03 Doo-Young Kim Plasma display device and standoff of chassis base therefor
KR20050036267A (ko) * 2003-10-15 2005-04-20 삼성에스디아이 주식회사 회로기판의 결합구조 및 접지구조가 개선된 플라즈마디스플레이 장치
US20060044745A1 (en) * 2004-08-28 2006-03-02 Sok-San Kim Display apparatus
US20060126314A1 (en) * 2004-12-15 2006-06-15 Kwang-Jin Jeong Plasma display apparatus

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US5148350A (en) * 1990-04-23 1992-09-15 Motorola, Inc. Portable electronics apparatus housing and chassis
KR100246511B1 (ko) * 1991-09-11 2000-03-15 토마스 에프. 멀베니 액추에이터 암 몸체, 액추에이터 암판 및 제어된 환경의 외부에 있는 vcm 마그네트를 포함하는 1.8인치 윈체스터 드라이브 카드
EP0604893B1 (fr) * 1992-12-26 2002-05-02 Canon Kabushiki Kaisha Appareil à cristal liquide
KR100563740B1 (ko) 1999-02-06 2006-03-24 삼성전자주식회사 측면 실장형 엘씨디 모니터
JP2002151866A (ja) * 2000-11-14 2002-05-24 Nec Corp 携帯機器の強度アップ実装構造
EP1394661A1 (fr) * 2002-08-28 2004-03-03 Agilent Technologies, Inc. - a Delaware corporation - Enceinte d'instrument
KR20060022468A (ko) 2004-09-07 2006-03-10 삼성전자주식회사 백라이트 어셈블리 및 이를 갖는 액정표시장치
KR100627320B1 (ko) 2005-02-25 2006-09-25 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4368859B2 (ja) * 2005-02-25 2009-11-18 三星エスディアイ株式会社 プラズマディスプレイ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050047100A1 (en) * 2003-09-02 2005-03-03 Doo-Young Kim Plasma display device and standoff of chassis base therefor
KR20050036267A (ko) * 2003-10-15 2005-04-20 삼성에스디아이 주식회사 회로기판의 결합구조 및 접지구조가 개선된 플라즈마디스플레이 장치
US20060044745A1 (en) * 2004-08-28 2006-03-02 Sok-San Kim Display apparatus
US20060126314A1 (en) * 2004-12-15 2006-06-15 Kwang-Jin Jeong Plasma display apparatus

Also Published As

Publication number Publication date
CN101106878B (zh) 2011-10-05
CN101106878A (zh) 2008-01-16
KR20080005732A (ko) 2008-01-15
EP1879440A3 (fr) 2014-10-15
US7564680B2 (en) 2009-07-21
US20080007903A1 (en) 2008-01-10

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