EP1856729A1 - Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur - Google Patents

Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur

Info

Publication number
EP1856729A1
EP1856729A1 EP06724965A EP06724965A EP1856729A1 EP 1856729 A1 EP1856729 A1 EP 1856729A1 EP 06724965 A EP06724965 A EP 06724965A EP 06724965 A EP06724965 A EP 06724965A EP 1856729 A1 EP1856729 A1 EP 1856729A1
Authority
EP
European Patent Office
Prior art keywords
thread
chip
eyelets
substrate
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06724965A
Other languages
German (de)
English (en)
Inventor
Volker Brod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP1856729A1 publication Critical patent/EP1856729A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8134—Bonding interfaces of the bump connector
    • H01L2224/81345—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs

Definitions

  • the invention relates to a method for electrically and mechanically connecting chip pads of an RFID chip with arranged on a strip-like substrate pads according to the preamble of claim 1 and a transponder with at least one RFID chip and at least one RFID antenna on the is arranged band-like substrate, according to the preamble of claim 10th
  • semiconductor chips also known as bare dice, such as RFID chips
  • electrical circuits such as RFID antennas
  • Such types of connections are time consuming to manufacture and often require stopping the continuously moving, belt-like substrate.
  • additional devices arranged along the substrate strip such as, for example, a thermosetting curing station, are required, which are cost-intensive in terms of their purchase and space-consuming within an overall system.
  • FIG. 1a is - shown in a schematic side view - the belt-like substrate, which is left-hand side unrolled by a roller, not shown here and the right side on a roll, not shown here, moved from left to right.
  • the antennas 2 are applied to the substrate in a loop shape, for example by means of a printing process, as is apparent from a comparison with FIG. 1b, which shows a plan view of the conventional assembly process shown in FIG. 1a.
  • the antennas 2 have at the end two connection surfaces 3, which are covered in a second process step with a preferably electrically conductive adhesive 4.
  • a preferably electrically conductive adhesive 4 for this purpose, an adhesive applicator 5 is used, which applies a predetermined amount of adhesive, as represented by the double arrow 6.
  • a chip 7 is placed upside down on the adhesive agent point 4 and pressed onto it.
  • a curing of the adhesive by means of heat by a curing device 8, which is vertically displaceable, as shown by the double arrow 9, instead.
  • the tape-like substrates 1 are stopped for a short time at each process step, the length of this standstill of the substrate tape 1 primarily surface hardening times of the adhesive used and the speed of the flip-chip device when transferring the chip 7 on the adhesives ittel- surface 4, especially during the associated pick-and-place method.
  • the present invention has for its object to provide a method for e- lectric and mechanical connection of chip pads of an RFID chip arranged on a belt-like substrate pads and a transponder to provide a quick and easy connection is created, wherein a high throughput of a device applying this method should be ensured.
  • An essential point of the invention is that in a method for electrically and mechanically connecting chip pads of an RFID chip with pads arranged on a strip-like substrate, these chip pads, which have on their surfaces a plurality of thread-like hooks and / or thread-like eyelets, with their associated pads, which have on their surfaces a variety of thread-like eyelets and / or thread-like heels, are locked together under pressure.
  • the thread-like hooks and eyes are preferably formed with a size in the nanometer range, whereby an accurate positioning of the individual chip pads and pads to each other is possible.
  • this standstill time can be reduced to a minimum since subsequent adhesive curing process steps are eliminated.
  • electrically conductive threads or electrically insulating threads are used with an electrically conductive coating, in addition to the mechanical and to obtain the electrical contact between the chip pads and the antenna pads. This eliminates the need for additional connecting steps for electrical and / or mechanical contacting, such as an adhesive or solder joint.
  • the semiconductor chips either have chopping on their chip connection surfaces or eyelets already generated in nanotechnology during chip production. Such chips are then subsequently applied to wafers or arranged in one or more rows on a further band or an angled to the substrate band feeder to be stored continuously on the substrate band in the region of the other antenna pads.
  • An upper and lower side roller subsequently arranged in the substrate belt running direction provide for a short-time pressurization between the deposited chip and the substrate so that the hooks on one surface and the eyelets on the other surface are permanently interlocked with one another or clawed into one another.
  • the threads may be formed prior to the co-hiding step by a printing process or by roughening the surface of the chip module pad and / or the pads of the antenna.
  • both the mechanical and the electrical connection can be created under the action of force within a very short time within a common assembly step.
  • This has an effect on the production of transponders both in the application of the flip-chip technique, in which each RFID chip is deposited from the wafer onto the pads and the belt-like substrate and pressed against each other while the ribbon-like substrate stands still for a short time , as well as in the application of the continuously moving substrate strip, on which the RFID chips are stored consecutively arranged, from.
  • a transponder with at least one of the RFID chips and at least one of the RFID antennas, which is arranged on the belt-like substrate, is characterized in that the chip pads have either the hooks or thread-like eyelets and the antenna pads the complementary acting eyelets or hoes ,
  • FIG. 2 in a schematic enlarged view of the invention
  • FIG. 3 shows a schematic representation of various forms of chip pads and antenna pads for carrying out the method according to the invention
  • Fig. 4 is a schematic side view of the connection method according to an embodiment of the invention.
  • Fig. 5 is a schematic side view of the connection method according to another embodiment of the invention.
  • a semiconductor chip 10 has point-like chip connection surfaces 11, 12 or nanobond surfaces. These nanobond surfaces 11, 12 are provided with thread-like eyelets 13, 14, which lie in the nanometer range in size.
  • the thread-like eyelets 13 are preferably made of electrically conductive threads, such as metal threads 14, or electrically insulating threads with electrically conductive coating.
  • a substrate strip not shown in more detail here, has an antenna 15, 18, which is shown here in fragmentary form.
  • the antenna sections 15, 18 are provided on the end with nanobond surfaces or antenna connection surfaces 19, 20, which are reproduced in an enlarged representation.
  • the enlarged illustration shows that the antenna connection surface 19 has hooks 16 made of the metal thread or, in turn, of electrically insulating thread with an electrically conductive coating. These hooks 16 engage in the eyelets 13 in an assembly of the semiconductor chip 10 and the antenna of the antenna portion 15 into each other and provide both a mechanical and an electrical connection in a so-called nanobond method, as by the reference numeral 17 is shown.
  • a chip 21 may, for example, have two strip-shaped chip connection surfaces 22, 23 with a hackle-shaped or loop-shaped surface structure according to the invention.
  • a chip 24 may have rectangular, smallest chip pads 25, 26 with the hackle or loop-shaped surface structures.
  • antenna sections 28, 29 may also have connection surfaces 30, 31 provided with hooks or eyelets at the ends in strip form.
  • antenna sections 32, 33 have rectangular nanobond surfaces 34, 35 for their assignment to the chip pads 25, 26.
  • FIG. 4 shows a schematic side view of a connection method according to an embodiment of the invention.
  • This connection method includes the flip-chip method, wherein a substrate belt 36 with RFID antennas 37 arranged thereon is moved from left to right discontinuously, that is to say with a brief standstill, as represented by the reference numeral 38.
  • each RFID antenna 37 Onto each RFID antenna 37, a nanostructure, that is to say thread-like hooks or thread-like eyelets, is applied in the region of the antenna connection surfaces by means of an applicator 39. This area is represented by the reference numeral 40.
  • a chip 42 with eye or hook-shaped threads 43 already arranged thereon is removed from a wafer (not illustrated here) and turned over, as represented by the reference numeral 44.
  • the chip 42 is then deposited with its chip contact surfaces 43 arranged on the underside on the antenna connection surfaces 40, which have the required nanostructure on their surface and briefly pressed, so that a permanent mechanical and electrical connection between the chip pads 43 and the Antennenan gleich- surfaces 40 is created.
  • the substrate strip 36 is stopped for a short time. A required according to the prior art curing process is eliminated.
  • FIG. 5 shows a schematic side view of the connection method according to a further embodiment of the invention.
  • the connection method reproduced in this illustration enables a very fast assembly of the antennas with the chips, since a substrate strip 45 can be continuously moved continuously.
  • chips 47 are fed to the substrate strip in a multiple row or single row.
  • the feed takes place at a speed 48 which corresponds to a speed 49 of the substrate strip 45.
  • the chips 47 have the threads already formed as chopping or eyelets in the area of the chip connection surfaces 47a.
  • the feeder unit 46 also called a chip feeder, can consist of a blister tape, surf tape, chip shooter or vibrority assembly feeder, for example.
  • each chip 47 passes through upper and lower rollers 50, 51, which exert a force 52, 53 on the chips 47 and the substrate strip with the antennas, not shown here, against the substrate strip 45, in order to achieve a permanent interlocking process make the chip pads with the pads of the antennas.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé pour établir une liaison électrique et mécanique entre des pastilles (11, 12 ; 22, 23 ; 25, 26 ; 43 ; 47a) d'une puce RFID (10 ; 21 ; 24 ; 42, 47) et des pastilles (19, 20 ; 30, 31 ; 34, 35) situées sur un substrat en bande (36 ; 45), les pastilles (11, 12 ; 22, 23 ; 25, 26 ; 43 ; 47a) de la puce, qui présentent sur leurs surfaces une pluralité de crochets en fil et/ou d'oeillets en fil (13), étant accrochées, par application de pression (52, 53), aux pastilles associées (11, 12 ; 22, 23 ; 25, 26 ; 43 ; 48) présentant sur leurs surfaces une pluralité d'oeillets en fil et/ou de crochets en fil (16). Ladite invention concerne également un transpondeur.
EP06724965A 2005-03-09 2006-03-08 Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur Withdrawn EP1856729A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005011186 2005-03-09
DE102005016930A DE102005016930A1 (de) 2005-03-09 2005-04-13 Verfahren zum elektrischen und mechanischem Verbinden von Chipanschlussflächen mit Antennenanschlussflächen und Transponder
PCT/EP2006/060536 WO2006094989A1 (fr) 2005-03-09 2006-03-08 Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur

Publications (1)

Publication Number Publication Date
EP1856729A1 true EP1856729A1 (fr) 2007-11-21

Family

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Application Number Title Priority Date Filing Date
EP06724965A Withdrawn EP1856729A1 (fr) 2005-03-09 2006-03-08 Procede pour etablir une liaison electrique et mecanique entre des pastilles de puce et des pastilles d'antenne et transpondeur

Country Status (5)

Country Link
US (1) US20080191944A1 (fr)
EP (1) EP1856729A1 (fr)
JP (1) JP2008532158A (fr)
DE (1) DE102005016930A1 (fr)
WO (1) WO2006094989A1 (fr)

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US20090079068A1 (en) * 2007-09-26 2009-03-26 Neology, Inc. Methods for attaching a flip chip integrated circuit assembly to a substrate
DE102009013826A1 (de) 2009-03-18 2011-03-10 Michalk, Manfred, Dr. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
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