IT1401734B1 - Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione - Google Patents
Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazioneInfo
- Publication number
- IT1401734B1 IT1401734B1 ITTO2010A000555A ITTO20100555A IT1401734B1 IT 1401734 B1 IT1401734 B1 IT 1401734B1 IT TO2010A000555 A ITTO2010A000555 A IT TO2010A000555A IT TO20100555 A ITTO20100555 A IT TO20100555A IT 1401734 B1 IT1401734 B1 IT 1401734B1
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- Prior art keywords
- nanotubes
- layer
- electronic device
- device including
- manufacturing procedure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
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Priority Applications (2)
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ITTO2010A000555A IT1401734B1 (it) | 2010-06-29 | 2010-06-29 | Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione |
US13/170,908 US9145294B2 (en) | 2010-06-29 | 2011-06-28 | Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof |
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ITTO2010A000555A IT1401734B1 (it) | 2010-06-29 | 2010-06-29 | Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione |
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IT1403468B1 (it) | 2010-12-21 | 2013-10-17 | St Microelectronics Srl | Mezzi di rotolamento di un dispositivo semovente e relativo dispositivo |
JP5788760B2 (ja) * | 2011-10-19 | 2015-10-07 | 日東電工株式会社 | 熱伝導性シート、led実装用基板およびledモジュール |
US8753924B2 (en) | 2012-03-08 | 2014-06-17 | Texas Instruments Incorporated | Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
FR2995877B1 (fr) * | 2012-09-21 | 2014-10-24 | Thales Sa | Structure meca-thermique adaptee pour un environnement spatial |
JP6118540B2 (ja) * | 2012-11-08 | 2017-04-19 | 新光電気工業株式会社 | 放熱部品及びその製造方法 |
AT514514A1 (de) * | 2013-06-28 | 2015-01-15 | Stefan Dipl Ing Pargfrieder | Vorrichtung und Verfahren für das elektrische Testen von Produktsubstraten |
US9257764B2 (en) * | 2014-01-16 | 2016-02-09 | International Business Machines Corporation | Low insertion force connector utilizing directional adhesion |
US9425331B2 (en) * | 2014-08-06 | 2016-08-23 | The Boeing Company | Solar cell wafer connecting system |
US20160106005A1 (en) * | 2014-10-13 | 2016-04-14 | Ntherma Corporation | Carbon nanotubes as a thermal interface material |
JP6405914B2 (ja) * | 2014-11-11 | 2018-10-17 | 株式会社デンソー | 熱交換装置及び熱交換装置の製造方法 |
KR102412965B1 (ko) * | 2014-12-30 | 2022-06-24 | 삼성전자주식회사 | 2차원 물질층을 포함하는 전자소자 및 잉크젯 프린팅을 이용한 전자소자의 제조방법 |
DE102018218832A1 (de) * | 2018-11-05 | 2020-05-07 | Robert Bosch Gmbh | Kühlkörper mit kohlenstoffnanostrukturbasierten Fasern |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10125905C1 (de) * | 2001-05-28 | 2002-11-28 | Infineon Technologies Ag | Lösbare Verbindung zwischen einem ungehäusten Chip und einem Träger |
US6856016B2 (en) * | 2002-07-02 | 2005-02-15 | Intel Corp | Method and apparatus using nanotubes for cooling and grounding die |
DE10248644B4 (de) * | 2002-10-18 | 2008-07-03 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
US7612370B2 (en) * | 2003-12-31 | 2009-11-03 | Intel Corporation | Thermal interface |
DE102005016930A1 (de) * | 2005-03-09 | 2006-09-21 | Mühlbauer Ag | Verfahren zum elektrischen und mechanischem Verbinden von Chipanschlussflächen mit Antennenanschlussflächen und Transponder |
WO2006098026A1 (ja) * | 2005-03-17 | 2006-09-21 | Fujitsu Limited | 接続機構、半導体パッケージ、およびその製造方法 |
US7428138B2 (en) * | 2005-10-06 | 2008-09-23 | Intel Corporation | Forming carbon nanotube capacitors |
US7532475B2 (en) * | 2006-03-30 | 2009-05-12 | International Business Machines Corporation | Semiconductor chip assembly with flexible metal cantilevers |
JP4744360B2 (ja) * | 2006-05-22 | 2011-08-10 | 富士通株式会社 | 半導体装置 |
US8974904B2 (en) * | 2007-07-05 | 2015-03-10 | University Of Dayton | Aligned carbon nanotubes for dry adhesives and methods for producing same |
US7719039B2 (en) * | 2007-09-28 | 2010-05-18 | Freescale Semiconductor, Inc. | Phase change memory structures including pillars |
US8598569B2 (en) * | 2008-04-30 | 2013-12-03 | International Business Machines Corporation | Pentacene-carbon nanotube composite, method of forming the composite, and semiconductor device including the composite |
US7960653B2 (en) * | 2008-07-25 | 2011-06-14 | Hewlett-Packard Development Company, L.P. | Conductive nanowires for electrical interconnect |
JP5239768B2 (ja) * | 2008-11-14 | 2013-07-17 | 富士通株式会社 | 放熱材料並びに電子機器及びその製造方法 |
DE102010002447A1 (de) * | 2010-02-26 | 2011-09-01 | Tutech Innovation Gmbh | Klebstoff mit anisotroper elektrischer Leitfähigkeit sowie Verfahren zu dessen Herstellung und Verwendung |
-
2010
- 2010-06-29 IT ITTO2010A000555A patent/IT1401734B1/it active
-
2011
- 2011-06-28 US US13/170,908 patent/US9145294B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ITTO20100555A1 (it) | 2011-12-30 |
US20110316173A1 (en) | 2011-12-29 |
US9145294B2 (en) | 2015-09-29 |
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