IT1401734B1 - Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione - Google Patents

Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione

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Publication number
IT1401734B1
IT1401734B1 ITTO2010A000555A ITTO20100555A IT1401734B1 IT 1401734 B1 IT1401734 B1 IT 1401734B1 IT TO2010A000555 A ITTO2010A000555 A IT TO2010A000555A IT TO20100555 A ITTO20100555 A IT TO20100555A IT 1401734 B1 IT1401734 B1 IT 1401734B1
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IT
Italy
Prior art keywords
nanotubes
layer
electronic device
device including
manufacturing procedure
Prior art date
Application number
ITTO2010A000555A
Other languages
English (en)
Inventor
Alessandro Mascali
Davide Giuseppe Patti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITTO2010A000555A priority Critical patent/IT1401734B1/it
Priority to US13/170,908 priority patent/US9145294B2/en
Publication of ITTO20100555A1 publication Critical patent/ITTO20100555A1/it
Application granted granted Critical
Publication of IT1401734B1 publication Critical patent/IT1401734B1/it

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D11/00Heat-exchange apparatus employing moving conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
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ITTO2010A000555A 2010-06-29 2010-06-29 Dispositivo elettronico comprendente uno strato di interfaccia di connessione basato su nanotubi, e procedimento di fabbricazione IT1401734B1 (it)

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JP5788760B2 (ja) * 2011-10-19 2015-10-07 日東電工株式会社 熱伝導性シート、led実装用基板およびledモジュール
US8753924B2 (en) 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
FR2995877B1 (fr) * 2012-09-21 2014-10-24 Thales Sa Structure meca-thermique adaptee pour un environnement spatial
JP6118540B2 (ja) * 2012-11-08 2017-04-19 新光電気工業株式会社 放熱部品及びその製造方法
AT514514A1 (de) * 2013-06-28 2015-01-15 Stefan Dipl Ing Pargfrieder Vorrichtung und Verfahren für das elektrische Testen von Produktsubstraten
US9257764B2 (en) * 2014-01-16 2016-02-09 International Business Machines Corporation Low insertion force connector utilizing directional adhesion
US9425331B2 (en) * 2014-08-06 2016-08-23 The Boeing Company Solar cell wafer connecting system
WO2016061006A2 (en) * 2014-10-13 2016-04-21 Ntherma Corporation Carbon nanotubes as a thermal interface material
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