EP1834163A1 - Dispositif de mesure de force, en particulier capteur de pression, et son procédé de production - Google Patents

Dispositif de mesure de force, en particulier capteur de pression, et son procédé de production

Info

Publication number
EP1834163A1
EP1834163A1 EP05823178A EP05823178A EP1834163A1 EP 1834163 A1 EP1834163 A1 EP 1834163A1 EP 05823178 A EP05823178 A EP 05823178A EP 05823178 A EP05823178 A EP 05823178A EP 1834163 A1 EP1834163 A1 EP 1834163A1
Authority
EP
European Patent Office
Prior art keywords
substrate
deformation body
deformation
layer
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05823178A
Other languages
German (de)
English (en)
Inventor
Joachim Morsch
Jens Rabe
Wolfgang Brode
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hydac Electronic GmbH
Original Assignee
Hydac Electronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hydac Electronic GmbH filed Critical Hydac Electronic GmbH
Publication of EP1834163A1 publication Critical patent/EP1834163A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity

Definitions

  • Device for measuring forces in particular pressure sensor, and associated manufacturing method
  • the invention relates to a device for measuring forces, in particular a .Drucksensor, and an associated manufacturing method.
  • a deformation body which consists for example of stainless steel or of another substantially elastically deformable material. On the deformation body are in . Thick film technology or thin-film technology strain-sensitive resistors 0, in an area of the. Verrormungs stressess that deforms when pressurized in a predetermined manner.
  • the deformation body is a pressure membrane that separates a high pressure side from a low pressure side and deforms according to the prevailing pressure difference. 5:
  • the measuring elements are applied to a stainless steel substrate, to which Before applying the measuring elements an electrically insulating cover layer must be applied. Subsequently, the. Stainless steel substrate by spot welding on also made of stainless steel. existing deformation body defined. This also requires a high material usage and a complex manufacturing process.
  • the invention is therefore based on the object, a device and an associated H first! I provide methods that the disadvantages of . Overcome the prior art. In particular, devices according to the invention should be inexpensive to produce, to different
  • Force measuring ranges can be easily adapted. and be durable and reliable in operation.
  • such devices should have a high. Long-term stability, good linearity and a low temperature dependence of the measured signals have.
  • the associated manufacturing process should be inexpensive to carry out. , , , , ,
  • the object is in a device for measuring forces, in particular in a pressure sensor / with a deformable as a result of a force, in particular as a result of pressurization deformable deformation body, and with at least one measuring element by means of which deformation of the deformation body is convertible into an electrical measurement signal, wherein the measuring element is arranged on a planar substrate, and wherein the substrate is fixed to the deformation body such that a deformation of the deformation body as a result the application of force also results in a deformation of the substrate, achieved in that the substrate consists of an electrically insulating material, and that the substrate due to its material and / or its shape has a lower flexural rigidity than the deformation body. , ⁇ • .
  • a multiplicity of physical variables can be measured with the device according to the invention, which can be converted into a force.
  • the device according to the invention can be designed as a pressure sensor, both as
  • Absolute pressure sensor as well as differential pressure sensor. Particularly advantageous is the application of the invention for high pressure sensors with a. Nominal pressure range of 100 bar or more, in particular up to, for example, 600 bar.
  • the device according to the invention can also be used, for example, as an acceleration sensor, in which case the deformation element is designed as a spring element clamped on at least one side, which deforms as a result of acceleration due to the inertia of its own mass or of a mass body arranged on the spring element.
  • piezoresistive measuring elements having a high K-factor of, for example, from 2 to 50, in addition to the known strain gauges, can alternatively or additionally be used, in particular piezoresistive resistors made of a polycrystalline material, for example doped polysilicon.
  • piezoelectric measuring elements can also be used or it is possible to apply electrode surfaces which enable a capacitive evaluation of the deformation.
  • the application of the measuring elements is preferably carried out in thin-film or thick film technology. The application can take place over the entire surface or at least unstructured, for example by sputtering or vapor deposition, with subsequent structuring, for example by photolithographic processes and wet-chemical or dry-chemical etching.
  • the measuring elements can also be applied structured / for example by screen printing, stamping, masked cathode sputtering or the like.
  • four measuring elements are in the form of four
  • the measuring elements are preferably in use. applied to the sheet substrate, and it.
  • a variety of substrates can be produced in use on a so-called wafer.
  • the thickness of the substrate is typically between 50 ⁇ m and 500 ⁇ m, in particular between 80 and 300 ⁇ m.
  • the thickness of the deformation body is at least in the region of the measuring element typically in the range of 150 .mu.m to 600 .mu.m, so that there is no significant stiffening of the deformation body by fixing the substrate.
  • the deformation body itself is preferably made of stainless steel, an alloy which is inert to the medium to be measured, ceramics or the like.
  • the substrate is made of an electrically insulating material,. preferably from a so-called Low Temperature Cofired Ceramic (LTCC), a glass ceramic, a ceramic-glass composite or even a pure glass. These materials advantageously have a low modulus of elasticity and a high breaking strength in comparison to the materials of the usual deformation bodies.
  • LTCC Low Temperature Cofired Ceramic
  • the surface of the substrate may be polished, especially if the measuring elements are in Thin-film technology can be applied. If the measuring elements are applied in thick-film technology, unpolished surfaces of the substrate can also be coated, which is advantageous.
  • the substrate is made up of a plurality of layers, the individual layers being present in film-like form prior to sintering and firmly joined together by sintering.
  • a first, preferably inner layer can be the priority. determine mechanical stability of the substrate, whereas a second, preferably outer layer primarily forms a surface with low roughness, so that thin film components such as tracks, resistors or the like can be applied to this surface.
  • the layers are foil-like and flexible in the unsintered state.
  • the first, inner layer preferably consists of a glass ceramic with a high proportion of a relatively coarse-grained filler, for example zirconium dioxide.
  • the proportion of the filler is more than 50 wt.%, In particular between 50 and 80 wt.%.
  • the particle size D50 is more than 1 .mu.m, in particular more than 3 microns.
  • the second, outer layer is made with a finely ground powder having a grain size D50 of less than 1 ⁇ m of ceramic and noncrystallizing glasses. This results in sintering an outer layer with a nearly pore-free fine-grained structure with a very low surface roughness.
  • layer structures having a plurality of first, inner layers for example a layer structure with a stacking ratio of the outer to inner layers of 2: 2 to 2: 6, ie two second, outer layers and two to six first, inner layers, are particularly advantageous.
  • the thermal expansion coefficient of the substrate is adapted to the expansion coefficient of the deformation body. So the difference is the thermal. Expansion coefficients of substrate and deformation body in the temperature range of interest usually less than 5 pp . m / K, preferably less than 3 ppm / K, and in any case in a restricted temperature range up to less than 1 ppm / K. This avoids that due to temperature fluctuations deformations occur which lead to an output signal of the measuring element and thus of the Drucksensbrs, although no corresponding pressure change is to be detected. ,
  • connection between the substrate and the deformation body is preferably at least partially planar.
  • materials for the deformation body and the substrate are in principle also considered compounds that do not require a separate bonding layer, such as eutectic bonding to form eutectics, or the so-called anodic bonding with appropriate technical glasses.
  • a separate bonding layer for example, an adhesive layer, such as an epoxy adhesive or a polyimide adhesive, a Metalllot or a Glass solder can be used.
  • the bonding layers can be applied to the substrate or the deformation body on one or two sides.
  • the application of the bonding layer can already be structured, for example by screen printing or by stamping an adhesive paste or a glass solder paste.
  • the compound layer can also be applied over the entire surface and then patterned.
  • all methods known from the thick-film technology and thin-film technology including photolithographic patterning and the use of wet etching techniques and dry etching techniques for patterning, may be considered.
  • the arrangement of deformation body and substrate has a cavity, preferably in the region of the measuring element.
  • This cavity can be formed by the structure of the connection layer, by a structuring of the substrate and / or by a structuring of the deformation body.
  • the cavity Through, the cavity, the mechanical stresses and strains in the areas of the substrate can be concentrated or strengthened, in which the measuring elements are arranged. This results in an increased linearity of the output signal of the device, and thereby the measuring sensitivity of the device can be increased for a given permissible non-linearity.
  • the substrate is fixed to the deformation element with a mechanical bias so that a significant output signal is obtained even in the unloaded state of the device results.
  • the bias is at least partially compensated or the output signal is smaller. This is advantageous because in the case of overloading the device results in increased overload safety.
  • Such a bias can also be brought about, for example, by temporarily introducing spacer means or spacers into the regions of the cavities between the substrate and the connecting body, for example in the form of polymeric layers which are in accordance with US Pat . Fixing the substrate can be removed, for example by appropriate wet chemical or dry chemical process.
  • the invention also relates to a method for producing a device for measuring forces, wherein the deformation element and the substrate with the measuring elements are produced separately from one another.
  • the substrate belonging to a device with the measuring elements is separated after its production process, which preferably takes place in use, and then fixed to a deformation element, as already described above.
  • the connection between substrate and deformation body can also be made over the entire surface, so that the substrate with the measuring elements forms a kind of coating of the deformation body.
  • the arrangement of the substrate on the deformation body takes place as a rule on the side facing away from the medium to be measured of the deformation body.
  • the electrical contacting of the measuring elements is simplified.
  • Fig. 1 shows a cross section through a first embodiment of the
  • Fig. 2 shows a cross section through a second embodiment of
  • Fig. 3 shows a cross section through a third embodiment of the
  • Fig. 5 shows a cross section through a fifth embodiment of
  • FIG. 6 shows a plan view of a substrate according to the invention
  • FIG. 7 shows the multilayer structure of a substrate according to the invention.
  • Fig. 1 shows a cross section through a first embodiment of the invention.
  • This is a pressure sensor 1 according to the invention with a deformation body 2 and a substrate 6 fixed thereto, on which two measuring elements 4a, 4b are arranged.
  • the Deformation body 2 is made of stainless steel, in particular of a cylindrical body having a blind hole on the side facing the medium to be measured. This results in a circumferential edge region 2 a of the deformation body 2, which has a greater rigidity against deflection compared to the membrane region 2 b therebetween.
  • the thickness of the deformation body 2 is for example in the membrane region 2b between 150 .mu.m and 600 .mu.m, whereas the thickness in the edge region 2a may increase and may be more than 1000 .mu.m, in particular between 2 and 10 mm. • •;
  • the substrate 6 is fixed on the deformation body 2, in the embodiment illustrated by means of a metal solder layer as the bonding layer 8, which is applied over the whole area to the rear side of the substrate 6 which is substantially rectangular in plan view (see FIG. 6), for example by sputtering, evaporation or the like. If necessary or expedient, a corresponding metal solder layer can also be applied to the deformation body 2.
  • the thickness of the metal solder layer 8 is significantly smaller than the thickness of the membrane region 2b and is for example 50 ⁇ m.
  • the substrate 6 is about 250 microns thick and consists of a so-called low temperature cofired ceramic (LTCC) or a glass ceramic or a glass with comparable properties. Overall, the flexural rigidity of the membrane region 2b is not significantly increased by the metal solder layer 8 and the substrate 6. The deformation of the diaphragm portion 2b due to pressurization is transmitted to the substrate 6 through the fixed connection.
  • LTCC low temperature cofired ceramic
  • the measuring elements 4a, 4b are deposited on the substrate 6 by vapor deposition and subsequent evaporation Structuring applied. These are two resistors, which are designed as strain gauges. In the case of pressurization in the direction of the arrow 10, the diaphragm region 2b and thus the substrate 6 also bulges upward in the associated region and the first measuring element 4a disposed close to the edge essentially experiences compressive stresses, whereas the second measuring element 4b disposed near the center undergoes essentially tensile stresses. If the two measuring elements 4a, 4b connected to form a half-bridge, an electrical potential can be removed at the connection point, which is dependent on the applied pressure.
  • the expansion coefficient of the substrate 6 is adapted to the expansion coefficient of the deformation body 2 a.
  • the adjustment can be made in particular by selecting the exact. Material composition for the substrate 6 are ensured.
  • LTCC ceramic In the case of an LTCC ceramic, this can be done, for example, by selecting the ceramic materials and / or the glass components. In particular, by the admixture of glass components with a relatively low glass transition temperature of ceramic materials basically low thermal
  • Expansion coefficient can be increased and adapted to the relatively large thermal expansion coefficient of the metallic deformation body 2.
  • a material for the deformation body 2 instead of stainless steel and titanium, a ceramic or the like may be used, in which case the material of the substrate 6 is selected so that there are small differences in the coefficient of thermal expansion.
  • the adjustment is at least for the Temperature range brought about in which the pressure sensor 1 is to be used. , , , , ,
  • connection layer 8 is formed by an adhesive which is curable at relatively low temperatures, for example by an epoxy adhesive or a polyimide adhesive. It is advantageous if the material of the substrate 6 and / or the connecting layer 8 is a particular. compared to the material of the deformation body 2 has low modulus of elasticity.
  • Fig. 2 shows a cross section through a secondticiansbefspiel the invention.
  • the pressure sensor 101 in turn has a
  • Deformation body 102 made of stainless steel.
  • the bonding layer 108 is applied over the entire surface of the deformation body 102, for example by spin-on of an adhesive or a glass solder, or by dip coating with a metallic brazing or soft solder.
  • the substrate 106 is patterned on the surface facing the deformation body 102 in such a way that first regions 106a with a relatively large layer thickness result and second regions 106b with a reduced layer thickness.
  • the measuring elements 104a, 104b are arranged in the second regions 106b, with the deformations introduced by the deformation element 102 into the substrate 106 being concentrated in the second regions 106b. In addition, this ensures a further decoupling of deformations, which only by Temperature changes and induced due to a difference in the thermal expansion coefficient.
  • cavities 112 are formed, which, however, are open on at least one side, in particular toward the space surrounding the substrate 106 on its side facing away from the deformation body 102. are open.
  • a connection point 106c In the region between the two cavities 1 12a, 112b is a connection point 106c, to which the substrate 106 is additionally connected to the deformation body 102.
  • the deformation body 102 may also be structured at the corresponding locations, in particular have depressions at the corresponding locations.
  • Fig. 3 shows a cross section through a third embodiment of the invention.
  • the pressure sensor 201 has a deformation body 202, which, however, now consists, for example, of an aluminum oxide ceramic.
  • a glass solder layer is applied over the entire surface as a bonding layer 208, for example by a spin-on method.
  • the glass solder layer was patterned, for example using photolithographic techniques with subsequent etching of the glass solder.
  • the substrate 206 is placed on the deformation bodies 202 prepared in this way, the assembly is heated above the glass transition temperature of the glass solder and then cooled again, resulting in a mechanically strong and, if necessary, gas-tight connection between the deformation body 202 and the substrate 206.
  • the structure of the connection layer 208 results in the cavities 212a, 212b.
  • the measuring elements 204a, 204b are arranged on the substrate 206, specifically on the surface facing the deformation element 202.
  • the electrical contacting of the measuring elements 204a, 204b can take place in an edge region of the substrate 106 projecting beyond the deformation element 202, for example by means of a connection element 214 arranged on the substrate 206.
  • the measuring elements 204a, 204b are effective against mechanical damage and / or or protected against dirt and moisture precipitation.
  • the connection between the measuring elements 204a, 204b takes place by conductor tracks which are likewise applied to the substrate 206 in thick-film technology or thin-film technology.
  • signal processing can also take place by means of an integrated circuit, which can be arranged on the substrate 206.
  • Fig. 4 shows a cross section through a fourth embodiment of the invention.
  • the substrate 306 is in turn structured on the surface facing the deformation body 302, so that in the fixed state, the cavities 312a, 312b are formed.
  • the connection layer 308 is only selectively provided in this embodiment.
  • spacers 316a, 316b a soluble polymer, which can be applied to the deformation body 302 and / or the substrate 306 also in thick-film or thin-film technique beyond. After bonding substrate 306 and deformation body 302, such spacers 316a, 316b may, for example, be washed out with solvents or ashed in an oxidizing atmosphere.
  • the regions of the substrate 306 in which the sensing elements 304a, 304b are located bulge and the sensing elements provide a corresponding output signal.
  • this curvature is compensated until, for example, when the nominal pressure is applied, the substrate 306 is also flat in the area of the measuring elements 304a, 304b. This can ensure that in the working range of the pressure sensor 301, only the range of compressive stress is traversed to stress-free, in the overload range are thus given expansion reserves.
  • Fig. 5 shows a cross section through a fifth embodiment of the invention.
  • the substrate 406 is connected to the deformation body 402 only by locating the connection layer 408 in a point-wise manner.
  • a force can be exerted on the substrate 406 in the direction of the arrows 418, so that a bulge of the region in which the measuring elements 404a, 404b are arranged, in the direction of the deformation body 402, which also after the bonding layer 408 solidifies is frozen.
  • a bias voltage which is compensated when pressurized in the direction of arrow 410. Again, this results in a strain reserve in the overload range.
  • FIG. 6 shows a plan view of a substrate 506, as it can be used for all the aforementioned embodiments.
  • the total of four measuring elements 504a, 504b, 504c, 504d are connected to form a bridge, wherein the common electrode of the first measuring element 504a and the third measuring element 504c is guided to the positive voltage supply terminal electrode 520a arranged in a first corner of the substrate 506 , Similarly, the common electrode of the second sensing element 504b and the fourth sensing element 504d is to the negative electrode terminal electrode 520b disposed in a second corner of the substrate 506
  • the measurement voltage can be tapped between the common electrode of the first sensing element 504a and the second sensing element 504b, which leads to the terminal electrode 522a disposed in a third corner of the substrate 506, and the common electrode of the third sensing element 504c and the fourth sensing element 504d is guided to the arranged in a fourth corner of the substrate 506 terminal electrode 522 b.
  • the substrate 506 is substantially rectangular in shape and may advantageously be fabricated on a circular or rectangular wafer in large numbers, or in other words "in use.” Typical dimensions for the length and width are fractions of a mm to a few mm, the thickness of the substrate is typically less than one mm.
  • FIG. 7 shows the multilayer structure of a substrate 6 according to the invention.
  • a first, inner layer 6i is covered on both sides by a second, outer layer 6a.
  • the first, inner layer is made of a glass ceramic with a Weight fraction between 50 and 80% of coarse filler particles 24 formed from zirconium dioxide whose particle size D50 is more than 3 microns.
  • the two second, outer layers 6a are in. formed substantially identical and have fine filler particles 26 made of ceramic and non-crystallizing glasses whose particle size D50 is less than 1 micron.
  • the thickness of the inner and outer layers 6i, 6a is respectively. about 100 ⁇ m.
  • the mechanical properties of the substrate 6 are essentially determined by the first, inner layer 6i, by the coarse filler particles 24, and ensure a high breaking strength of the substrate 6.
  • the second, outer layers 6a ensure, above all, a smooth surface of the substrate 6 to which components such as printed conductors, resistors or the like can be applied in thin-film technology.
  • the stack ratio of outer to inner layers 6a, 6i in the illustrated embodiment is 2: 1.
  • Stack ratios between 2: 2 and 2: 6 are particularly advantageous, in which case up to six first inner layers 6i are arranged one above the other, and the substrate 6 has a second, outer layer 6a only on the outer side.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif de mesure de force, en particulier un capteur de pression (1), comprenant un corps déformable (2) qui peut être déformé lorsqu'il est soumis à une force, notamment à une pression, et au moins un élément de mesure (4a, 4b) qui peut convertir une déformation du corps déformable (2) en un signal de mesure électrique. Selon l'invention, l'élément de mesure (4a, 4b) est disposé sur un substrat plat (6) qui est fixé sur le corps déformable (2), de manière qu'une déformation de celui-ci (2) lorsqu'il est soumis à une force entraîne également une déformation du substrat (6). Cette invention est caractérisée en ce que le substrat (6) est constitué d'un matériau électro-isolant, et en ce que ledit substrat (6) présente une rigidité flexionnelle inférieure à celle du corps déformable (2), en raison du matériau qui le constitue et/ou de sa forme. Cette invention se rapporte en outre à un procédé de production dudit dispositif de mesure de force.
EP05823178A 2005-01-03 2005-12-21 Dispositif de mesure de force, en particulier capteur de pression, et son procédé de production Withdrawn EP1834163A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005001298A DE102005001298A1 (de) 2005-01-03 2005-01-03 Vorrichtung zum Messen von Kräften, insbesondere Drucksensor, und zugehöriges Herstellverfahren
PCT/EP2005/013749 WO2006072391A1 (fr) 2005-01-03 2005-12-21 Dispositif de mesure de force, en particulier capteur de pression, et son procédé de production

Publications (1)

Publication Number Publication Date
EP1834163A1 true EP1834163A1 (fr) 2007-09-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05823178A Withdrawn EP1834163A1 (fr) 2005-01-03 2005-12-21 Dispositif de mesure de force, en particulier capteur de pression, et son procédé de production

Country Status (5)

Country Link
US (1) US20080098820A1 (fr)
EP (1) EP1834163A1 (fr)
JP (1) JP2008527313A (fr)
DE (1) DE102005001298A1 (fr)
WO (1) WO2006072391A1 (fr)

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US20080098820A1 (en) 2008-05-01
DE102005001298A1 (de) 2006-07-13
JP2008527313A (ja) 2008-07-24
WO2006072391A1 (fr) 2006-07-13

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