EP1800341A2 - Jeu ordonne de del - Google Patents

Jeu ordonne de del

Info

Publication number
EP1800341A2
EP1800341A2 EP05789566A EP05789566A EP1800341A2 EP 1800341 A2 EP1800341 A2 EP 1800341A2 EP 05789566 A EP05789566 A EP 05789566A EP 05789566 A EP05789566 A EP 05789566A EP 1800341 A2 EP1800341 A2 EP 1800341A2
Authority
EP
European Patent Office
Prior art keywords
led array
led
temperature sensor
array according
led chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05789566A
Other languages
German (de)
English (en)
Inventor
Georg Bogner
Moritz Engl
Markus Hofmann
Joachim Reill
Thomas Reiners
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP1800341A2 publication Critical patent/EP1800341A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0017—Devices integrating an element dedicated to another function
    • B60Q1/0023—Devices integrating an element dedicated to another function the element being a sensor, e.g. distance sensor, camera
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/18—Controlling the intensity of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H05B45/28—Controlling the colour of the light using temperature feedback
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the invention relates to an LED array according to the preamble of patent claim 1.
  • LED arrays are characterized by high efficiency, a long service life, a fast response time and a comparatively low sensitivity to shocks and vibrations. For this reason, LED arrays are being used more and more frequently in lighting installations in which incandescent lamps have hitherto often been used, in particular in motor vehicle headlamps, reading lamps or flashlights.
  • the LED chips are generally operated with very high operating currents in order to achieve the highest possible luminance.
  • this is a high heat development verbun ⁇ the.
  • beam-shaping optical elements are often integrated, which are arranged very close to the LED chips or even on the LED chips. The heat radiation of the chips is made more difficult.
  • the invention is based on the object of admitting an LED array in which the risk of thermal overload of the LED chips is reduced. This object is achieved by an LED array having the features of patent claim 1. Advantageous embodiments and modifications of the invention are the subject of the dependent claims.
  • An LED array with at least two LED chips comprises a temperature sensor, and it is provided a control of an operating current of the LED chips in response to the temperature detected by the temperature sensor.
  • the temperature detected by the temperature sensor can be evaluated by an evaluation circuit, which is preferably arranged outside the LED array, and the operating current of the LED chips can be reduced as soon as the temperature detected by the temperature sensor reaches a critical value , In this way, the LED chips can advantageously be operated over long periods of operation at the limit of their thermal capacity.
  • an LED array containing a plurality of LED chips the invention is particularly advantageous applicable, since with the number of LED chips and the heat generation increases.
  • an LED array according to the invention preferably contains at least four LED chips.
  • the temperature sensor of an The smallest possible distance to at least one of the LED chips.
  • the distance between the temperature sensor and at least one LED chip of the LED array is 5 mm or less, more preferably 3 mm or less.
  • it is advantageous for the temperature measurement of the LED chips if the individual LED chips of the LED array have no LED housings.
  • the LED array preferably comprises a chip carrier on which the LED chips are arranged, and the temperature sensor is mounted on the chip carrier.
  • the chip carrier is preferably made of a ceramic.
  • the chip carrier may contain AlN.
  • the temperature sensor for example a heat-dependent resistor, is printed on the chip carrier.
  • the temperature sensor for example a heat-dependent resistor
  • a chip carrier on which the LED chips are fastened, may be mounted on a carrier body, and the temperature sensor may be fastened on the carrier body.
  • the Trä ⁇ ger entrepreneurial and the chip carrier are preferably glued mitein ⁇ other.
  • the temperature sensor is attached, for example, on the chip carrier or on the carrier body by soldering or gluing. This ensures a precisely defined temperature measurement, in particular also in environments in which the LED array is exposed to shocks or vibrations, for example when used in a motor vehicle.
  • the invention is particularly advantageous for compact LED arrays in which the chip carrier and / or the carrier body have a base area of 300 mm 2 or less.
  • the chip carrier preferably has a height of less than 1 mm, for example about 0.5 mm to 0.7 mm, and the carrier body has a height of about 1 mm to 1.5 mm.
  • the temperature sensor is preferably a thermocouple.
  • the temperature sensor can also be a temperature-dependent resistor, which can have a negative temperature coefficient (NTC resistance) or a positive temperature coefficient (PTC resistance).
  • NTC resistance negative temperature coefficient
  • PTC resistance positive temperature coefficient
  • a semiconductor component for example a transistor or a diode, as a temperature sensor by detecting a temperature-dependent electrical characteristic of a semiconductor component of this type by an evaluation circuit.
  • the invention is particularly advantageous for LED arrays in which the heat development is very high due to a high power loss of the LED chips, and, for example due to a high ambient temperature or the design of the LED array, the heat dissipation is difficult.
  • the heat dissipation in LED arrays is often complicated by beam-forming opti ⁇ cal elements that are located very close to the LED chips or even on the LED chips.
  • an optical concentrator can be provided as the beam-shaping optical element, with which the emission characteristic of the LED array is advantageously influenced.
  • the optical concentrator is preferably a CPC, CEC or CHC-type optical concentrator, by which is meant a concentrator whose reflective sidewalls at least partially and / or at least largely in the form of a compound parabolic concentrator (CPC), a compound elliptical concentrator (CEC) and / or a composite hyperbolic concentrator (CHC ) exhibit.
  • CPC compound parabolic concentrator
  • CEC compound elliptical concentrator
  • CHC composite hyperbolic concentrator
  • An LED array according to the invention may, for example, be a part of a lighting device, in particular a part of a motor vehicle headlight. Since LED arrays in lighting devices are often exposed to a high ambient temperature, which can amount to about 125 °, for example in a motor vehicle headlight, the invention is particularly advantageous for such lighting devices.
  • Figure Ia is a schematic plan view of the
  • Chip carrier of a first embodiment of an LED array according to the invention
  • FIG. 1 b shows a schematic representation of a cross section along the line AB of the first exemplary embodiment of the invention illustrated in FIG. 1 a
  • FIG. 2 a shows a schematic representation of a plan view of the carrier body of a second exemplary embodiment of an LED array according to the invention
  • Figure 2b is a schematic representation of a cross section along the line CD of the second embodiment of the invention shown in Figure 2a, and
  • Figure 3 is a schematic representation of a cross section through a third embodiment of an LED array according to the invention.
  • the chip carrier 1 of the first exemplary embodiment of an LED array according to the invention shown in cross-section in FIG. 1a in the plan view and in FIG. 1b six LED chips 2 are mounted, the individual LED chips in each case not being a housing exhibit.
  • the LED chips 2 are e.g. White light-emitting LED chips 2.
  • the chip carrier 1 is preferably made of a ceramic.
  • a temperature sensor 3 is attached, which can spielnem be a thermocouple, a temperature-dependent Wi ⁇ resistance or a semiconductor device.
  • the distance d between the temperature sensor 3 and the nearest LED chip 2 is preferably 5 mm or less. Due to the small distance between the thermocouple and at least one of the LED chips 2 and the fact that the individual LED chips 2 each have no LED housing, the temperature at the measuring point of the temperature sensor 3 and the actual temperature of the LED Chips 2 comparatively well correlated.
  • An advantageously small distance between at least one of the LED chips 2 and the temperature sensor 3 can be achieved by applying the temperature sensor 3 to the chip carrier using a printing process. This is especially dere in a chip carrier made of a ceramic, for example AlN, an advantage.
  • a plurality of LED chips 2 are mounted on a common chip carrier 1.
  • the chip carrier 1 is mounted on a carrier body 4, on which the temperature sensor is also fixed.
  • the temperature sensor 3 is spielmik soldered or glued to the carrier body 4.
  • the distance zwi ⁇ tween the temperature sensor 3 and the nearest LED chip 2 is advantageously not more than 5 mm.
  • the carrier body 4 is preferably made of a material with good heat conduction, for example of a metal. As a result, on the one hand, heat dissipation of the heat generated by the LED chips 2 can take place via the carrier body 4, and, on the other hand, good matching of the temperature measured by the temperature sensor 3 with the actual temperature of the LED chips 2 is ensured.
  • the carrier body 4 preferably has a base area of 300 mm 2 or less.
  • the carrier body 4 has a rectangular base surface with a length 1 between and including 10 mm and finally 15 mm and a width b of between 15 mm and 20 mm inclusive.
  • a carrier body 4 on which a chip carrier 1 is fastened with a plurality of LED chips 2 and a temperature sensor 3, is installed in a housing 5.
  • the temperature sensor 3 is via two supply lines 8, 9 connected to a control unit 7, which is arranged outside of the housing 5.
  • the control unit 7 contains an evaluation circuit for evaluation of the measurement signal generated by the temperature sensor 3. Furthermore, the control unit 7 includes a control circuit connected to the evaluation circuit, which supplies the LEDs 2 via the supply lines 10, 11 with an operating current which is regulated in dependence on the temperature measured by the temperature sensor 3.
  • the LED chips 2 are advantageously arranged in their emission direction 13, 14, at least one beam-forming optical element 12 nach ⁇ .
  • the beam-shaping optical element 12 may be a CPC (compound parabolic concentrator) with which the emission characteristic of the LED chips 2 is influenced in an advantageous manner.
  • CPC compound parabolic concentrator
  • the beam divergence of the radiation 13, 14 emitted by the LED chips 2 is reduced.
  • each individual LED 2 can each be followed by a beam-forming element 12.
  • the totality of the LEDs or one or more groups of LEDs 2 can also be arranged downstream of a beam-shaping element 12.
  • the beam-shaping optical element 12 can be arranged very close to the LED chips 2 or even placed on them.
  • additional beam-shaping optical elements may additionally be provided.
  • a lens 15 may be applied to the housing 5 of the LED array.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

Dans un jeu ordonné de DEL comprenant au moins deux puces à DEL (2), se trouve un capteur de température (3), et une régulation du courant de fonctionnement des puces à DEL (2) s'effectue en fonction de la température détectée par la capteur de température (3). Cela rend possible une durée de fonctionnement importante des puces à DEL (2) avec un courant de fonctionnement élevé, ce qui permet d'éviter les risques liés aux surcharges thermiques.
EP05789566A 2004-09-30 2005-09-09 Jeu ordonne de del Withdrawn EP1800341A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004047682A DE102004047682A1 (de) 2004-09-30 2004-09-30 LED-Array
PCT/DE2005/001582 WO2006034668A2 (fr) 2004-09-30 2005-09-09 Jeu ordonne de del

Publications (1)

Publication Number Publication Date
EP1800341A2 true EP1800341A2 (fr) 2007-06-27

Family

ID=35457532

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05789566A Withdrawn EP1800341A2 (fr) 2004-09-30 2005-09-09 Jeu ordonne de del

Country Status (7)

Country Link
US (1) US20080061717A1 (fr)
EP (1) EP1800341A2 (fr)
JP (1) JP2008515207A (fr)
KR (1) KR20070053818A (fr)
CN (2) CN100474583C (fr)
DE (1) DE102004047682A1 (fr)
WO (1) WO2006034668A2 (fr)

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WO2006034668A2 (fr) 2006-04-06
CN101510546B (zh) 2011-03-23
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CN101061583A (zh) 2007-10-24
JP2008515207A (ja) 2008-05-08
KR20070053818A (ko) 2007-05-25
CN101510546A (zh) 2009-08-19
US20080061717A1 (en) 2008-03-13
CN100474583C (zh) 2009-04-01

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