EP1792699B1 - Method of manufacturing a balsa core chipboard - Google Patents

Method of manufacturing a balsa core chipboard Download PDF

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Publication number
EP1792699B1
EP1792699B1 EP06024363A EP06024363A EP1792699B1 EP 1792699 B1 EP1792699 B1 EP 1792699B1 EP 06024363 A EP06024363 A EP 06024363A EP 06024363 A EP06024363 A EP 06024363A EP 1792699 B1 EP1792699 B1 EP 1792699B1
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EP
European Patent Office
Prior art keywords
layer
fine
plates
balsa
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06024363A
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German (de)
French (fr)
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EP1792699A1 (en
Inventor
Hans Günter Isensee
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Guenther Isensee Modellbaubedarf
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Guenther Isensee Modellbaubedarf
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Publication of EP1792699A1 publication Critical patent/EP1792699A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B27N3/143—Orienting the particles or fibres

Definitions

  • the invention is directed to a method for producing a chipboard from at least three layers.
  • a continuous production of chipboard has long been known ( DE-44 34 876-A1 ), taking, as an example, a lower layer in a thickness of 2-5 mm of fine chips with a spall diameter ⁇ 2 mm, a middle layer of chips with a spud diameter of about ⁇ 15 mm and an upper layer, which in turn is formed of fine chips with a spall diameter ⁇ 2 mm, which are exposed to high pressure and temperature to form the chipboard.
  • Lightweight panels which have a core of Balsastirnholz are also known per se. So by a display of the applicant at the Nuremberg Toy Fair in February 2000, as well as from the DE-31 00 094-A or the DE-20 11 865-B which show an end-skin middle layer with under- and over-laid plywood layers or cover layers. This also applies to the DE-36 25 534-A or the DE-39 27 538-A or from 1943 originating US-2 479 342 , However, there is a significant disadvantage in that first all layers, whether covering layer, middle layer or lower layer, manufactured separately and then connected to each other, eg glued, must be.
  • the object of the invention is to make the Balsastirnholztechnologie available for the production of particle board, such that an endless product is formed from a core of Balsastirnholz with underlay and on-laid fine layer in a single manufacturing process.
  • the middle layer is formed from coarse chips, also produce balsa wood chipboard by means of a feeder, the middle layer of Balsastirnholzbrettchen or Balsastirnholzplatten is formed.
  • the fact that the light chipboard is produced in a single work process, manufacturing speed, energy savings and easy control of product quality can be achieved.
  • the invention provides that wood chips or sawdust, wood shavings, grinding chips, grinding flour, abrasive fibers made of wood or other organic materials, such as straw, hemp or the like., Is used as a layer-forming fine granules.
  • glass fibers or fabrics can be used, it goes without saying that even mixtures the above materials can be used.
  • the invention provides in an embodiment that the applied Balsastirnholzbrettchen and / or plates are glued on one side or both sides (for gluing technology s GB-1 439 578 ).
  • At least one of the two outer sides of the endless chipboard produced in this way is provided with a further surface coating.
  • This surface coating may for example consist of a coating, but it can also be formed from other laminated films, veneer wood or the like.
  • a middle balsam wood layer 3 and a lower fine layer 4 wherein a fine layer is a mixture of fine chips with a chip diameter ⁇ 2 mm in connection with adhesive, which via a pressure / heater compacted and hardened, as described below.
  • FIG. 2 A simplified representation of a manufacturing plant for such lightweight chipboard shows Fig. 2 ,
  • fine chips 7 are applied from a reservoir, wherein the carrier tape 5 before, simultaneously or subsequently via a spraying device 8 with glue, glue or the like is acted upon.
  • Fig. 2 generally designated 9, applied, which is indicated by the double arrow 10.
  • the surface of the Balsastirnholzplatten 9 can be sprayed with a further adhesive supply 8a with adhesive. From a further reservoir 6a then trickle on the surface of Balsastirnholzplatten fine chips 7a.
  • the sandwich composite can then be applied from above via another endless belt 5a, as shown in FIG Fig. 2 is indicated, wherein the package of lower endless belt 5 of the lower layer of fine chips, the Balsastirnholzplatten and the upper layer of fine chips of a pressure / heating unit, generally designated 11, is fed, which compresses the entire composite and cures the fine chips with adhesive.
  • endless chipboard 1a produced in this way can be provided with a surface lamination 12, the endless chipboard 1a then being provided with a cutting device, in Fig. 2 indicated and designated 13, is divisible into its final plate length.
  • a multi-layer plate can be produced, for example with two successive and separated by a fine layer of chips Balsastirnholz Anlagenen.
  • a comparable in the load with conventional chipboard light chipboard to 2/3 lighter it is therefore easily used and economically producible for a variety of additional applications.

Abstract

Method involves spreading of layer of fine granulates mixed with glue in width of end product on conveyor belt. A sealing layer of fine granulates mixed with glue is applied on the central layer. The balsa wood slat or balsa wood plate (9) is applied as middle layer to the scattered first lower small layer.

Description

Die Erfindung richtet sich auf ein Verfahren zur Herstellung einer Spanplatte aus wenigstens drei Schichten.The invention is directed to a method for producing a chipboard from at least three layers.

Gemäß dem Oberbegriff des Anspruchs 1, ist eine kontinuierliche Herstellungsweise von Spanplatten seit langem bekannt ( DE-44 34 876-A1 ), wobei, dies als Beispiel, eine untere Schicht in einer Stärke von 2 - 5 mm aus feinen Spänen mit einem Spandurchmesser < 2 mm, eine mittlere Schicht aus Spänen mit einem Spandurchmesser von ca. < 15 mm und eine obere Schicht, die wiederum aus feinen Spänen mit einem Spandurchmesser < 2 mm besteht, gebildet wird, die hohem Druck und Temperatur zur Bildung der Spanplatte ausgesetzt werden.According to the preamble of claim 1, a continuous production of chipboard has long been known ( DE-44 34 876-A1 ), taking, as an example, a lower layer in a thickness of 2-5 mm of fine chips with a spall diameter <2 mm, a middle layer of chips with a spud diameter of about <15 mm and an upper layer, which in turn is formed of fine chips with a spall diameter <2 mm, which are exposed to high pressure and temperature to form the chipboard.

Leichtbauplatten, die einen Kern aus Balsastirnholz aufweisen, sind ebenfalls für sich gesehen bekannt. So durch eine Zurschaustellung des Anmelders auf der Nürnberger Spielwarenmesse im Februar 2000, wie auch aus der DE-31 00 094-A oder der DE-20 11 865-B , die eine Stirnholzmittelschicht mit unter- und übergelegten Sperrholzschichten bzw. Deckschichten zeigen. Dies gilt auch für die DE-36 25 534-A oder die DE-39 27 538-A oder die aus 1943 stammende US-2 479 342 . Dabei besteht allerdings ein wesentlicher Nachteil darin, dass zunächst alle Schichten, ob Deckschicht, Mittelschicht oder Unterschicht, getrennt hergestellt und dann miteinander verbunden, z.B. verleimt, werden müssen.Lightweight panels, which have a core of Balsastirnholz are also known per se. So by a display of the applicant at the Nuremberg Toy Fair in February 2000, as well as from the DE-31 00 094-A or the DE-20 11 865-B which show an end-skin middle layer with under- and over-laid plywood layers or cover layers. This also applies to the DE-36 25 534-A or the DE-39 27 538-A or from 1943 originating US-2 479 342 , However, there is a significant disadvantage in that first all layers, whether covering layer, middle layer or lower layer, manufactured separately and then connected to each other, eg glued, must be.

Aufgabe der Erfindung ist es, die Balsastirnholztechnologie für die Herstellung von Spanplatten nutzbar zu machen, derart, dass ein Endlosprodukt aus einem Kern aus Balsastirnholz mit unter- und aufgelegter Feinschicht in einem einzigen Herstellungsverfahren gebildet wird.The object of the invention is to make the Balsastirnholztechnologie available for the production of particle board, such that an endless product is formed from a core of Balsastirnholz with underlay and on-laid fine layer in a single manufacturing process.

Dies wird mit einem erfindungsgemäßen Verfahren dadurch erreicht, dass auf einem Transportband eine Schicht aus einem Feingranulat gemischt mit Leim in der Breite des Endproduktes aufgestreut, eine weitere Schicht zugeführt und eine Abdeckschicht aus Feingranulat gemischt mit Leim auf die Mittelschicht aufgebracht und der Verbund hohem Druck und Temperatur zur Bildung der Spanplatte ausgesetzt wird, wobei als Mittelschicht auf die aufgestreute erste untere Feinschicht Balsastirnholzbrettchen oder Balsastirnholzplatten aufgebracht werden.This is achieved by a method according to the invention in that sprinkled on a conveyor belt, a layer of a fine granules mixed with glue in the width of the final product, fed a further layer and a cover layer of fine granules mixed with glue applied to the middle layer and the composite high pressure and Temperature is exposed to form the particle board, being applied as a middle layer on the sprinkled first lower layer Balsastirnholzbrettchen or Balsastirnholzplatten.

Erkennbar lassen sich mit dieser Verfahrensweise bereits vorhandene Anlagen zur Herstellung von herkömmlichen Spanplatten, bei denen, wie oben schon angegeben, die Mittelschicht aus Grobspänen gebildet ist, auch Balsaholzleichtspanplatten herstellen, indem mittels einer Zuführeinrichtung die Mittelschicht aus Balsastirnholzbrettchen oder Balsastirnholzplatten gebildet wird. Dadurch, dass die Leichtspanplatte in einem einzigen Arbeitsprozess hergestellt wird, läßt sich Herstellungsgeschwindigkeit, Einsparung von Energie und einfache Steuerung der Produktqualität erreichen.Recognizable can be with this procedure already existing systems for the production of conventional particleboard, in which, as already stated above, the middle layer is formed from coarse chips, also produce balsa wood chipboard by means of a feeder, the middle layer of Balsastirnholzbrettchen or Balsastirnholzplatten is formed. The fact that the light chipboard is produced in a single work process, manufacturing speed, energy savings and easy control of product quality can be achieved.

Als zweckmäßig hat sich erwiesen, das Freingranulat, aus dem die Unterschicht und die Deckschicht in einem einzigen Arbeitsschritt gebildet wird, aus je nach Einsatzzweck variablen Materialien zu gestalten. Hierzu sieht die Erfindung vor, dass als schichtbildendes Feingranulat Hackspäne, Sägespäne, Hobelspäne, Schleifspäne, Schleifmehl, Schleiffasern aus Holz oder anderen organischen Stoffen, wie Stroh, Hanf oder dergl., eingesetzt wird. Je nach Art der Oberflächengestaltung bzw. der Anforderung an die Oberfläche können auch Textil-, Glasfasern oder -gewebe eingesetzt werden, wobei es sich von selbst versteht, dass auch Gemische der oben angegebenen Materialien eingesetzt werden können.It has proven to be useful to design the freed granules, from which the lower layer and the outer layer is formed in a single step, depending on the application variable materials. For this purpose, the invention provides that wood chips or sawdust, wood shavings, grinding chips, grinding flour, abrasive fibers made of wood or other organic materials, such as straw, hemp or the like., Is used as a layer-forming fine granules. Depending on the type of surface design or the requirement for the surface and textile, glass fibers or fabrics can be used, it goes without saying that even mixtures the above materials can be used.

Je nach Art des gewünschten Endproduktes sieht die Erfindung in Ausgestaltung vor, dass die aufgelegten Balsastirnholzbrettchen und/oder -platten einseitig oder beidseitig beleimt werden (zur Verleimtechnologie s. auch GB-1 439 578 ).Depending on the nature of the desired end product, the invention provides in an embodiment that the applied Balsastirnholzbrettchen and / or plates are glued on one side or both sides (for gluing technology s GB-1 439 578 ).

Nach der Erfindung kann auch vorgesehen werden, dass wenigstens eine der beiden Außenseiten der so hergestellten Endlosspanplatte mit einer weiteren Oberflächenbeschichtung versehen wird. Diese Oberflächenbeschichtung kann beispielsweise aus einer Lackierung bestehen, sie kann aber auch aus anderen aufkaschierten Folien, Furnierhölzern oder dergl. gebildet sein.According to the invention it can also be provided that at least one of the two outer sides of the endless chipboard produced in this way is provided with a further surface coating. This surface coating may for example consist of a coating, but it can also be formed from other laminated films, veneer wood or the like.

Weitere Merkmale, Einzelheiten und Vorteile der Erfindung ergeben sich aufgrund der nachfolgenden Beschreibung sowie anhand der Zeichnung. Diese zeigt in:

Fig. 1
einen vereinfachten Schnitt durch eine erfindungsgemäße Balsaholzspanplatte sowie in
Fig. 2
eine schematische Darstellung des Herstellungsverlaufes einer Endlosspanplatte nach der Erfindung.
Further features, details and advantages of the invention will become apparent from the following description and from the drawing. This shows in:
Fig. 1
a simplified section through a Balsaholzspanplatte invention and in
Fig. 2
a schematic representation of the manufacturing process of a continuous chipboard according to the invention.

Die in Fig. 1 dargestellte, allgemein mit 1 bezeichnete Spanplatte besteht aus einer oberen Feinschicht 2, einer mittleren Balsastirnholzschicht 3 und einer unteren Feinschicht 4, wobei mit Feinschicht ein Gemisch aus feinen Spänen mit einem Spandurchmesser < 2 mm in Verbindung mit Klebstoff gemeint ist, die über eine Druck-/Heizeinrichtung verdichtet und gehärtet worden sind, wie dies weiter unten beschrieben ist.In the Fig. 1 1, a middle balsam wood layer 3 and a lower fine layer 4, wherein a fine layer is a mixture of fine chips with a chip diameter <2 mm in connection with adhesive, which via a pressure / heater compacted and hardened, as described below.

Eine vereinfachte Darstellung einer Herstellungsanlage für derartige Leichtspanplatten zeigt Fig. 2.A simplified representation of a manufacturing plant for such lightweight chipboard shows Fig. 2 ,

Auf einem die Breite des Endproduktes vorgebenden Trägerband 5 werden aus einem Reservoir 6 Feinspäne 7 aufgebracht, wobei das Trägerband 5 vorher, gleichzeitig oder nachher über eine Sprüheinrichtung 8 mit Leim, Klebstoff oder dergl. beaufschlagt wird.On a the width of the final product predetermining carrier tape 5 6 fine chips 7 are applied from a reservoir, wherein the carrier tape 5 before, simultaneously or subsequently via a spraying device 8 with glue, glue or the like is acted upon.

Über eine nicht näher dargestellte Fördereinrichtung werden dann auf das so vorbereitete Trägerband 5 mit Feinspanbeschichtung Balsastirnholzbrettchen oder -platten, in Fig. 2 allgemein mit 9 bezeichnet, aufgebracht, was mit dem Doppelpfeil 10 angedeutet ist.About a conveyor not shown are then on the thus prepared carrier tape 5 with Feinspanbeschichtung Balsastirnholzbrettchen or plates, in Fig. 2 generally designated 9, applied, which is indicated by the double arrow 10.

Anschließend kann die Oberfläche der Balsastirnholzplatten 9 mit einer weiteren Klebstoffzuführung 8a mit Klebstoff besprüht werden. Aus einem weiteren Reservoir 6a rieseln dann auf die Oberfläche der Balsastirnholzplatten Feinspäne 7a. Der Sandwichverbund kann dann über ein weiteres Endlosband 5a von oben beaufschlagt werden, wie dies in Fig. 2 angedeutet ist, wobei das Paket aus unterem Endlosband 5 der unteren Schicht aus Feinspänen, der Balsastirnholzplatten und der oberen Schicht aus Feinspänen einer Druck-/Heizeinheit, allgemein mit 11 bezeichnet, zugeführt wird, die den Gesamtverbund verpresst und die Feinspäne mit Klebstoff aushärtet.Subsequently, the surface of the Balsastirnholzplatten 9 can be sprayed with a further adhesive supply 8a with adhesive. From a further reservoir 6a then trickle on the surface of Balsastirnholzplatten fine chips 7a. The sandwich composite can then be applied from above via another endless belt 5a, as shown in FIG Fig. 2 is indicated, wherein the package of lower endless belt 5 of the lower layer of fine chips, the Balsastirnholzplatten and the upper layer of fine chips of a pressure / heating unit, generally designated 11, is fed, which compresses the entire composite and cures the fine chips with adhesive.

Schließlich kann die so hergestellte Endlosspanplatte 1a mit einer Oberflächenkaschierung 12 versehen werden, wobei die Endlosspanplatte 1a dann über eine Schneideinrichtung, in Fig. 2 angedeutet und mit 13 bezeichnet, in seine endgültige Plattenlänge zerteilbar ist.Finally, the endless chipboard 1a produced in this way can be provided with a surface lamination 12, the endless chipboard 1a then being provided with a cutting device, in Fig. 2 indicated and designated 13, is divisible into its final plate length.

Natürlich ist das beschriebene Ausführungsbeispiel der Erfindung noch in vielfacher Hinsicht abzuändern, ohne den Grundgedanken zu verlassen. So kann je nach Einsatzzweck auch eine Mehrschichtplatte hergestellt werden, etwa mit zwei aufeinanderfolgenden und durch eine Feinschicht aus Spänen getrennten Balsastirnholzschichten. Mit der Erfindung wird eine in der Belastung mit herkömmlichen Spanplatten vergleichbare Leichtspanplatte um 2/3 leichter, sie ist daher für eine Vielzahl von zusätzlichen Anwendungsfeldern problemlos einsetzbar und wirtschaftlich herstellbar.Of course, the described embodiment of the invention is still to be modified in many ways, without departing from the spirit. Thus, depending on the application, a multi-layer plate can be produced, for example with two successive and separated by a fine layer of chips Balsastirnholzschichten. With the invention, a comparable in the load with conventional chipboard light chipboard to 2/3 lighter, it is therefore easily used and economically producible for a variety of additional applications.

Claims (5)

  1. A process for the production of a chipboard comprising at least three layers,
    characterised in that
    a layer of a fine granulate material mixed with glue is spread on a conveyor belt in the width of the end product, a further layer is supplied and a cover layer of fine granulate material mixed with glue is applied to the central layer and the assembly is subjected to high pressure and temperature to form the chipboard, wherein balsa end-grain wood slats or balsa end-grain wood plates are applied as the central layer to the spread first, lower fine layer.
  2. A process according to claim 1 characterised in that chopped chips, sawdust, wood shavings, grinding cuttings, grinding dust, grinding fibres of wood or other organic substances such as straw, hemp or the like are used as the layer-forming fine granulate material.
  3. A process according to claim 1 or claim 2 characterised in that the applied balsa end-grain slats and/or plates are glued on one or both sides.
  4. A process according to claim 1, claim 2 or claim 3 characterised in that after the balsa end-grain wood layer with applied lower and upper chip cover layer has passed through at least one further surface coating operation of the resulting lightweight structure sandwich is effected.
  5. A process for the production of a chipboard characterised in that fine chips (7) are applied to a carrier belt (5) which predetermines the width of the end product from a reservoir (6) and the carrier belt (5) is coated with glue, adhesive or the like previously, simultaneously or subsequently by way of a spray device (8), then balsa end-grain wood slats or plates (9) are applied by way of a conveyor device to the carrier belt (5) prepared in that way with the fine chip coating, then the surface of the balsa end-grain wood slats or plates (9) is sprayed with a further adhesive supply (8a) with adhesive, then fine chips (7a) trickle from a further reservoir (6a) on to the surface of the balsa end-grain wood slats or plates (7a), the sandwich assembly is then acted upon from above by way of a further endless belt (5a), wherein the assembly comprising the lower endless belt (5), the lower layer of fine chips, the balsa end-grain wood slats or plates and the upper layer of fine chips is passed to a pressing/heating unit (11) which presses the overall assembly and hardens the fine chips with adhesive.
EP06024363A 2005-12-02 2006-11-24 Method of manufacturing a balsa core chipboard Not-in-force EP1792699B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005057606A DE102005057606A1 (en) 2005-12-02 2005-12-02 Process for producing a balsa wood chipboard

Publications (2)

Publication Number Publication Date
EP1792699A1 EP1792699A1 (en) 2007-06-06
EP1792699B1 true EP1792699B1 (en) 2010-09-08

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EP (1) EP1792699B1 (en)
AT (1) ATE480377T1 (en)
DE (2) DE102005057606A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104289B (en) * 2006-06-19 2014-06-18 迪芬巴赫有限两合公司 Method and device for spreading material to multi-layer extrusion product pads during producing composite wooden material board, and condiment spreader

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DE202007007516U1 (en) * 2007-05-08 2007-10-25 Günther Isensee Modellbaubedarf MDF Balsaholzplatte
DE102008004154A1 (en) * 2008-01-14 2009-07-16 Amorim Revestimentos S.A. Method for producing a multilayer press plate
EP2119540A1 (en) * 2008-05-15 2009-11-18 Alcan Technology &amp; Management Ltd. Mould object with balsa woods and method for its production
ES2524878T3 (en) * 2008-05-15 2014-12-15 3A Technology & Management Ag Molded body of balsa wood and procedure for its manufacture

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104289B (en) * 2006-06-19 2014-06-18 迪芬巴赫有限两合公司 Method and device for spreading material to multi-layer extrusion product pads during producing composite wooden material board, and condiment spreader

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DE502006007822D1 (en) 2010-10-21
EP1792699A1 (en) 2007-06-06
DE102005057606A1 (en) 2007-06-06
ATE480377T1 (en) 2010-09-15

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