EP1790447B1 - Procédé et dispositif d'usinage de pièces en forme de panneau - Google Patents

Procédé et dispositif d'usinage de pièces en forme de panneau Download PDF

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Publication number
EP1790447B1
EP1790447B1 EP05025628A EP05025628A EP1790447B1 EP 1790447 B1 EP1790447 B1 EP 1790447B1 EP 05025628 A EP05025628 A EP 05025628A EP 05025628 A EP05025628 A EP 05025628A EP 1790447 B1 EP1790447 B1 EP 1790447B1
Authority
EP
European Patent Office
Prior art keywords
layer
section
laser
board
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP05025628A
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German (de)
English (en)
Other versions
EP1790447A1 (fr
Inventor
Peter Rathgeber
Achim Gauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Homag GmbH
Original Assignee
Homag Holzbearbeitungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Homag Holzbearbeitungssysteme GmbH filed Critical Homag Holzbearbeitungssysteme GmbH
Priority to DE502005005211T priority Critical patent/DE502005005211D1/de
Priority to ES05025628T priority patent/ES2309641T3/es
Priority to EP05025628A priority patent/EP1790447B1/fr
Priority to PL05025628T priority patent/PL1790447T3/pl
Publication of EP1790447A1 publication Critical patent/EP1790447A1/fr
Application granted granted Critical
Publication of EP1790447B1 publication Critical patent/EP1790447B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
    • B27M1/08—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by multi-step processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
    • B27D5/006—Trimming, chamfering or bevelling edgings, e.g. lists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks

Definitions

  • the invention relates to a method for processing plate-shaped workpieces, which comprise at least a first layer, which consists essentially of wood, wood-based materials or the like, and a second layer, which is harder than the first layer, and an apparatus for performing the method.
  • Plate-shaped workpieces such as furniture fronts or body parts and in particular floor panels (see, for example EP 1 304 427 A ) are often provided with a cover layer which has a high abrasion resistance and, accordingly, a high hardness.
  • cover layers are generally referred to as "overlays" in floor panels and consist for example of a melamine resin layer which is enriched with hard particles, which consist for example of aluminum oxide.
  • the plate-shaped workpieces must normally be machined on their narrow sides, for example to provide there a tongue and groove profile, which can also beseinrastend ("click profile"). Especially with click profiles comparatively much material must be removed from the plate-shaped workpieces to form the spring. It has been shown that the removal of the hard outer layers leads to extremely high wear on the processing tools, usually by milling cutters are formed. After just a short time, grooves in the area of the hard surface layers are formed on the processing tools. This leads first to the fact that the service life of the processing tools compared to a pure woodworking is extremely shortened, resulting in long machine downtime and high costs for re-sharpening or replacing the tools.
  • the DE 199 06 209 A1 a method for separating individual circuit units from a panel using a milling process and a laser cutting process.
  • the post-published EP 1 719 596 A1 a method for producing a panel, wherein the panel has a core made of a fibrous material, preferably an MDF or HDF board.
  • a fibrous material preferably an MDF or HDF board.
  • the present invention is based on the idea to avoid chipping the hard layer (s) of the plate-shaped workpieces as much as possible.
  • the invention provides that at least a portion of the second layer will wear away by means of at least one laser, wherein the at least one laser and the plate-shaped workpieces are moved relative to each other.
  • the at least one cutting tool is largely or completely of a machining of the hard cover layer freed, so that the tool wear is significantly reduced. This results in a significantly longer service life of the cutting tools and correspondingly low breastfeeding and improved quality of the machined workpieces.
  • the second layer is at least partially removed before the first layer. This greatly reduces the likelihood of damaging the cutting tools by the hard second layer.
  • the plate-shaped workpieces can of course also have a larger number of layers, and that, for example, the second layer may also be formed by a plurality of layers, the harder are as at least one other layer of the plate-shaped workpiece.
  • the layers may in principle extend in any way within the plate-shaped workpieces.
  • the method according to the invention has proven to be particularly advantageous when the first and the second layer extend essentially in the plane of the plate-shaped workpieces, as is the case, for example, with furniture parts or floor panels.
  • the method according to the invention is particularly preferably used when such plate-shaped workpieces are to be profiled in the region of its narrow side, for example, in the region of the first section to be provided with a tongue and groove profile.
  • the at least one section of the second layer is removed by at least two lasers, which preferably have different removal widths.
  • a laser in particular the one with the smaller Abtrag Museum be used to produce a sharp and precise separation cut, while another laser, in particular with the larger Abtrag Museum, for a less precise, but flat removal can be used , This results in an economical as well as precise procedure.
  • the at least one section of the first layer is removed in two steps, wherein in the first step the first layer is processed such that a further section of the second layer is separated from the plate-shaped workpiece ,
  • the first layer is processed such that a further section of the second layer is separated from the plate-shaped workpiece .
  • the removal of the chips of the hard second layer is particularly critical, as results in a distortion of the hard second layer, a chip jet, which also leads to significant damage to the chip removal hood or similar chip removal.
  • a particularly economical and rapid method is obtained when the above-mentioned method steps are performed simultaneously on two opposite sides of the plate-shaped frogs. This is particularly suitable for workpieces that should be provided on opposite sides, for example with tongue and groove.
  • a particularly efficient and simply constructed device according to the present invention is defined in claim 8.
  • At least one laser of the device is provided in the conveying direction upstream of the at least one cutting tool. This can reduce the risk that the at least one cutting tool will be damaged by the hard second layer.
  • Fig. 1 schematically shows a plan view of a processing apparatus 10 according to the present invention.
  • the processing device 10 is used for processing plate-shaped workpieces W, for example, to produce floor panels, as in Fig. 2 are shown schematically in a sectional view.
  • the plate-shaped workpieces W each have a first layer 1 and a second layer 2, which extend in the plane of the plate-shaped workpieces W.
  • the second layer 2 has a greater hardness than the first layer 1, wherein the hardness can be measured, for example, as Brinell hardness.
  • first layer 1 and the second layer 2 are not particularly limited in the present invention, however, in many applications, the first layer 1 will be a supporting layer consisting essentially of wood, wood-based materials or the like the second, harder layer 2 will often be an abrasion-resistant cover layer which may be formed, for example, by a melamine resin layer provided with hard particles (such as alumina).
  • Fig. 1 shows in combination two embodiments of the processing apparatus 10, wherein on the right side of Fig. 1 the processing units according to a first embodiment of the present invention are shown while on the left side of FIG Fig. 1 the processing units are shown according to a second embodiment of the present invention.
  • These embodiments may well be as in Fig. 1 shown combined with each other become. It is also possible to use the in Fig. 1 shown processing units each symmetrical on both sides in Fig. 1 or machining units only on one side in Fig. 1 to arrange.
  • the processing device 10 initially comprises a conveying device 20, for example in the form of a chain or belt conveyor, for conveying plate-shaped workpieces W to be processed in a conveying direction indicated by an arrow.
  • a conveying device 20 for example in the form of a chain or belt conveyor, for conveying plate-shaped workpieces W to be processed in a conveying direction indicated by an arrow.
  • a first laser 12 along the conveyor 20 first a first laser 12, then a second laser 14 and finally a cutting tool 18, for example in the form of a profile cutter arranged.
  • the lasers 12, 14 are preferably CO 2 lasers, although other types of lasers such as diode lasers, Nd: YAG lasers, excimer lasers or the like may also be used.
  • the power of the laser is not particularly limited in the present invention, but should be set such that at a predetermined conveying speed of the plate-shaped workpieces, the second layer 2 is completely severed.
  • the lasers 12 and 14 may be identical lasers, but it is preferred that the second laser 14 have a greater ablation width than the first laser 12, as will be explained in more detail below.
  • a second embodiment of the device according to the invention also comprises first a laser 12, as described above, followed by a first cutting tool 16 and a second cutting tool 18.
  • the first cutting tool 16 is a saw blade in the present embodiment whose axis of rotation extends substantially perpendicular to the plane of the plate-shaped workpieces W.
  • Machining tool 18 is here again a profile cutter.
  • a plate-shaped workpiece W conveyed along the conveyor 20 is processed by the first laser 12 such that a first section 2 'of the second layer 2 is removed.
  • the plate-shaped workpiece W is conveyed on to the second laser 14, which completely removes a further section 2 "of the second layer 2 ( Fig. 4a ). It is how a comparison of FIGS.
  • the plate-shaped workpiece W reaches the machining tool or the profile cutter 18, where the profile of the cutter 18 facing narrow side of the plate-shaped workpiece W is provided with a desired profiling, for example with a groove or a spring. Subsequently, the plate-shaped workpiece W is discharged. It should be noted that the plate-shaped workpiece is conveyed by the conveyor 20 continuously (in the pass).
  • the present invention in its most general aspect, aims to laser-ablate the first layer 1 of the plate-shaped workpieces W by a cutting tool and the second layer 2 of the plate-shaped workpieces W.
  • the present invention also includes devices having only a laser 12 and a machining tool 18 in combination with a conveyor 20.
  • the inventive method comprises only in FIGS. 3 and 5 shown process steps.
  • the method or device according to the present invention can be supplemented and combined with a multiplicity of additional method steps or device components.
  • pre-milling units or the like upstream of the first laser 12 in order to remove a portion of the first layer 1 at a suitable location and thus to relieve the profile milling cutter.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Claims (13)

  1. Procédé d'usinage de pièces d'oeuvre (W) en forme de panneau ; comprenant les étapes consistant à :
    fournir des pièces d'oeuvre (W) en forme de panneau, présentant au moins une première couche (1), composée essentiellement de bois, de matériaux ligneux, ou analogue, et une deuxième couche (2), plus dure que la première couche,
    enlever au moins un tronçon (2', 2") de la deuxième couche (2), à l'aide d'au moins un laser (12, 14), le au moins un laser (12, 14) et les pièces d'oeuvre (W) en forme de panneau étant déplacés les uns par rapport aux autres en continu, et
    enlever au moins un tronçon (1', 1") de la première couche (1), à l'aide d'au moins un outil (16, 18) travaillant avec enlèvement de copeaux, le tronçon (1', 1") enlevé de la première couche (1) étant voisin du tronçon (2', 2") enlevé de la deuxième couche (2).
  2. Procédé selon la revendication 1, caractérisé en ce que la deuxième couche (2) est enlevée au moins partiellement avant la première couche (1).
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que les couches (1, 2) s'étendent sensiblement dans le plan de panneau des pièces d'oeuvre (W) en forme de panneau et, de préférence, le au moins un tronçon (1', 1") de la première couche (1) est enlevé dans la zone d'au moins un côté étroit (W') .
  4. Procédé selon l'une des revendications précédentes, caractérisé en ce que le au moins un tronçon (2', 2") de la deuxième couche (2) est enlevé à l'aide d'au moins deux laser (12, 14), présentant des largeurs d'enlèvement de préférence différentes.
  5. Procédé selon l'une des revendications précédentes, caractérisé en ce que le au moins un tronçon (1', 1") de la première couche (1) est enlevé en deux étapes, sachant que, dans la première étape, la première couche (1) est usinée de manière qu'un autre tronçon (2") de la deuxième couche (2) soit séparé de la pièce d'oeuvre (W) en forme de panneau.
  6. Procédé selon l'une des revendications précédentes, caractérisé en ce que, par enlèvement du au moins un tronçon (1', 1") de la première couche (1), un profil, du genre d'une rainure ou du genre d'une languette, en particulier ce que l'on appelle un profil du genre à encliquetage, est produit sur la première couche (1).
  7. Procédé selon l'une des revendications précédentes, caractérisé en ce que les étapes de procédé sont exécutées sensiblement simultanément sur deux côtés opposés des pièces d'oeuvre (W) en forme de panneau.
  8. Dispositif d'usinage (10), pour mettre en oeuvre le procédé selon l'une des revendications précédentes, comprenant :
    au moins un outil (16, 18) travaillant avec enlèvement de copeaux, convenant pour usiner du bois, des matériaux ligneux ou analogue,
    au moins un laser (12, 14), et
    un dispositif de transport continu (20), pour produire un déplacement relatif en continu, entre le au moins un outil (16, 18) travaillant avec enlèvement de copeaux, ou le au moins un laser (12, 14), d'une part, et des pièces d'oeuvre (W) en forme de panneau, à usiner, d'autre part.
  9. Dispositif d'usinage selon la revendication 8, caractérisé en ce qu'au moins un laser (12, 14) est prévu, en amont du au moins un outil (16, 18) travaillant avec enlèvement de copeaux, en observant dans la direction de transport.
  10. Dispositif d'usinage selon la revendication 8 ou 9, caractérisé en ce qu'il présente au moins deux lasers (12, 14), présentant de préférence des largeurs d'enlèvement différentes.
  11. Dispositif d'usinage selon l'une des revendications 8 à 10, caractérisé en ce qu'au moins deux outils (16, 18), travaillant avec enlèvement de copeaux, sont prévus.
  12. Dispositif d'usinage selon la revendication 11, caractérisé en ce qu'un premier outil (16), travaillant avec enlèvement de copeaux, est formé par une scie, et/ou en ce qu'un deuxième outil (18), travaillant avec enlèvement de copeaux, est formé par une fraise à profiler.
  13. Dispositif d'usinage selon l'une des revendications 8 à 12, caractérisé en ce que, sur deux côtés opposés du dispositif de transport (20) sont respectivement prévus au moins un laser (12, 14) et au moins un outil (16, 18) travaillant avec enlèvement de copeaux.
EP05025628A 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau Expired - Fee Related EP1790447B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE502005005211T DE502005005211D1 (de) 2005-11-24 2005-11-24 Verfahren und Vorrichtung zur Bearbeitung plattenförmiger Werkstücke
ES05025628T ES2309641T3 (es) 2005-11-24 2005-11-24 Procedimiento y dispositivo para la mecanizacion de piezas de trabajo en forma de placa.
EP05025628A EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau
PL05025628T PL1790447T3 (pl) 2005-11-24 2005-11-24 Sposób i urządzenie do obróbki płytowych przedmiotów obrabianych

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05025628A EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau

Publications (2)

Publication Number Publication Date
EP1790447A1 EP1790447A1 (fr) 2007-05-30
EP1790447B1 true EP1790447B1 (fr) 2008-08-27

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EP05025628A Expired - Fee Related EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau

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EP (1) EP1790447B1 (fr)
DE (1) DE502005005211D1 (fr)
ES (1) ES2309641T3 (fr)
PL (1) PL1790447T3 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013006262A1 (de) * 2013-04-11 2014-10-16 Ima Klessmann Gmbh Holzbearbeitungssysteme Vorrichtung und Verfahren zur Bearbeitung plattenförmiger Werkstücke
DE102013218483A1 (de) 2013-09-16 2015-03-19 Homag Holzbearbeitungssysteme Gmbh Verfahren zur Laserbearbeitung sowie Bearbeitungsmaschine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1719596A1 (fr) * 2005-05-04 2006-11-08 Berry Finance Nv Procédé de fabrication d'un panneau

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1015682A (ja) * 1996-07-03 1998-01-20 Mitsubishi Heavy Ind Ltd 塗装鋼板のレーザ切断方法
SE515789C2 (sv) * 1999-02-10 2001-10-08 Perstorp Flooring Ab Golvbeläggningsmaterial innefattande golvelement vilka är avsedda att sammanfogas vertikalt
JP2000158256A (ja) * 1998-11-26 2000-06-13 Matsuura Machinery Corp 複合加工装置
DE19906209C2 (de) * 1999-02-15 2003-03-20 Possehl Electronic Gmbh Verfahren zum Heraustrennen einzelner Schaltkreis-Einheiten aus einem Panel
DE29924727U1 (de) * 1999-03-11 2005-03-24 Deckel Maho Pfronten Gmbh Werkzeugmaschine für die Werkstückbearbeitung mit spanenden Werkzeugen und Laserstrahl

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1719596A1 (fr) * 2005-05-04 2006-11-08 Berry Finance Nv Procédé de fabrication d'un panneau

Also Published As

Publication number Publication date
DE502005005211D1 (de) 2008-10-09
PL1790447T3 (pl) 2009-01-30
ES2309641T3 (es) 2008-12-16
EP1790447A1 (fr) 2007-05-30

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