EP1790447A1 - Procédé et dispositif d'usinage de pièces en forme de panneau - Google Patents

Procédé et dispositif d'usinage de pièces en forme de panneau Download PDF

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Publication number
EP1790447A1
EP1790447A1 EP05025628A EP05025628A EP1790447A1 EP 1790447 A1 EP1790447 A1 EP 1790447A1 EP 05025628 A EP05025628 A EP 05025628A EP 05025628 A EP05025628 A EP 05025628A EP 1790447 A1 EP1790447 A1 EP 1790447A1
Authority
EP
European Patent Office
Prior art keywords
layer
plate
laser
shaped workpieces
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05025628A
Other languages
German (de)
English (en)
Other versions
EP1790447B1 (fr
Inventor
Peter Rathgeber
Achim Gauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Homag GmbH
Original Assignee
Homag Holzbearbeitungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Homag Holzbearbeitungssysteme GmbH filed Critical Homag Holzbearbeitungssysteme GmbH
Priority to EP05025628A priority Critical patent/EP1790447B1/fr
Priority to ES05025628T priority patent/ES2309641T3/es
Priority to PL05025628T priority patent/PL1790447T3/pl
Priority to DE502005005211T priority patent/DE502005005211D1/de
Publication of EP1790447A1 publication Critical patent/EP1790447A1/fr
Application granted granted Critical
Publication of EP1790447B1 publication Critical patent/EP1790447B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
    • B27M1/08—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by multi-step processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
    • B27D5/006—Trimming, chamfering or bevelling edgings, e.g. lists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks

Definitions

  • the invention relates to a method for processing plate-shaped workpieces, which at least one first layer, which preferably consists essentially of wood, wood-based materials or the like, and a second layer which is harder than the first layer, and an apparatus for performing the method ,
  • Plate-shaped workpieces such as furniture fronts or body parts and in particular floor panels are often provided with a cover layer which has a high abrasion resistance and, accordingly, a high hardness.
  • cover layers are generally referred to as "overlays" in floor panels and consist for example of a melamine resin layer which is enriched with hard particles, which consist for example of aluminum oxide.
  • the plate-shaped workpieces must normally be machined on their narrow sides, for example to provide there a tongue and groove profile, which can also beseinrastend ("click profile"). Especially with click profiles comparatively much material must be removed from the plate-shaped workpieces to form the spring. It has been shown that the removal of the hard outer layers leads to extremely high wear on the processing tools, usually by milling cutters are formed. After just a short time, grooves in the area of the hard surface layers are formed on the processing tools. This leads first to the fact that the service life of the processing tools compared to a pure woodworking is extremely shortened, resulting in long machine downtime and high costs for re-sharpening or replacing the tools.
  • the present invention is based on the idea to avoid chipping the hard layer (s) of the plate-shaped workpieces as much as possible.
  • the invention provides that at least a portion of the second layer will wear away by means of at least one laser, wherein the at least one laser and the plate-shaped workpieces are moved relative to each other.
  • the at least one cutting tool is largely or completely of a machining of the hard cover layer freed, so that the tool wear is significantly reduced. This results in a significantly longer service life of the cutting tools and correspondingly low breastfeeding and improved quality of the machined workpieces.
  • the second layer is at least partially removed before the first layer. This greatly reduces the likelihood of damaging the cutting tools by the hard second layer.
  • the plate-shaped workpieces can of course also have a larger number of layers, and that, for example, the second layer may also be formed by a plurality of layers, the harder are as at least one other layer of the plate-shaped workpiece.
  • the layers may in principle extend in any way within the plate-shaped workpieces.
  • the method according to the invention has proven to be particularly advantageous when the first and the second layer extend essentially in the plane of the plate-shaped workpieces, as is the case, for example, with furniture parts or floor panels.
  • the method according to the invention is particularly preferably used when such plate-shaped workpieces are to be profiled in the region of its narrow side, for example, in the region of the first section to be provided with a tongue and groove profile.
  • the at least one section of the second layer is removed by at least two lasers, which preferably have different removal widths.
  • a laser in particular the one with the smaller Abtrag Museum be used to produce a sharp and precise separation cut, while another laser, in particular with the larger Abtrag Museum, for a less precise, but flat removal can be used , This results in an economical as well as precise procedure.
  • the at least one section of the first layer is removed in two steps, wherein in the first step the first layer is processed such that a further section of the second layer is separated from the plate-shaped workpiece ,
  • the first layer is processed such that a further section of the second layer is separated from the plate-shaped workpiece .
  • the removal of the chips of the hard second layer is particularly critical, as results in a distortion of the hard second layer, a chip jet, which also leads to significant damage to the chip removal hood or similar chip removal.
  • a particularly economical and rapid method is obtained when the above-mentioned method steps are performed simultaneously on two opposite sides of the plate-shaped frogs. This is particularly suitable for workpieces that should be provided on opposite sides, for example with tongue and groove.
  • a particularly efficient and simply constructed device according to the present invention is defined in claim 8.
  • At least one laser of the device is provided in the conveying direction upstream of the at least one cutting tool. This can reduce the risk that the at least one cutting tool will be damaged by the hard second layer.
  • Fig. 1 shows schematically a top view of a processing apparatus 10 according to the present invention.
  • the processing device 10 is used for processing plate-shaped workpieces W, for example, to produce floor panels, as shown schematically in Fig. 2 in a sectional view.
  • the plate-shaped workpieces W each have a first layer 1 and a second layer 2, which extend in the plane of the plate-shaped workpieces W.
  • the second layer 2 has a greater hardness than the first layer 1, wherein the hardness can be measured, for example, as Brinell hardness.
  • first layer 1 and the second layer 2 are not particularly limited in the present invention, however, in many applications, the first layer 1 will be a supporting layer consisting essentially of wood, wood-based materials or the like the second, harder layer 2 will often be an abrasion-resistant cover layer which may be formed, for example, by a melamine resin layer provided with hard particles (such as alumina).
  • Fig. 1 shows in combination two embodiments of the processing apparatus 10, wherein on the right side of Fig. 1, the processing units are shown according to a first embodiment of the present invention, while on the left side of Fig. 1, the processing units according to a second embodiment of present invention are shown. These embodiments may well be combined as shown in FIG become. It is also possible to provide the machining units shown in FIG. 1 in each case symmetrically on both sides in FIG. 1, or to arrange machining units only on one side in FIG. 1.
  • the processing device 10 initially comprises a conveying device 20, for example in the form of a chain or belt conveyor, for conveying plate-shaped workpieces W to be processed in a conveying direction indicated by an arrow.
  • a conveying device 20 for example in the form of a chain or belt conveyor, for conveying plate-shaped workpieces W to be processed in a conveying direction indicated by an arrow.
  • the lasers 12, 14 are preferably CO 2 lasers, although other types of lasers such as diode lasers, Nd: YAG lasers, excimer lasers or the like may also be used.
  • the power of the laser is not particularly limited in the present invention, but should be set such that at a predetermined conveying speed of the plate-shaped workpieces, the second layer 2 is completely severed.
  • the lasers 12 and 14 may be identical lasers, but it is preferred that the second laser 14 have a greater ablation width than the first laser 12, as will be explained in more detail below.
  • a second embodiment of the device according to the invention also comprises first a laser 12, as described above, and then a first cutting tool 16 and a second cutting tool 18 in the first cutting tool 16
  • this is a saw blade whose axis of rotation extends essentially perpendicular to the plane of the plate-shaped workpieces W.
  • Machining tool 18 is here again a profile cutter.
  • a plate-shaped workpiece W conveyed along the conveyor 20 is processed by the first laser 12 so that a first portion 2 'of the second layer 2 is removed.
  • the plate-shaped workpiece W is further conveyed to the second laser 14, which completely ablates a further section 2 "of the second layer 2 (FIG. 4a).
  • the removal width of the second laser 14 is greater than that of the first laser 12.
  • the plate-shaped workpiece W reaches the machining tool or the profile cutter 18, where the profile of the cutter 18 facing narrow side of the plate-shaped Workpiece W is provided with a desired profiling, for example with a groove or a spring.
  • the plate-shaped workpiece W is discharged. It should be noted that the plate-shaped workpiece can be conveyed by the conveyor 20 continuously (in a continuous) or discontinuously.
  • FIG. 3 a plate-shaped workpiece W conveyed by the conveyor is processed by the first laser 12 such that in the area the second layer 2, a first portion 2 'is removed.
  • a portion 1 'of the first layer is removed by the saw 16 such that the adjacent portion 2 "of the second layer 2 is completely detached from the plate-shaped workpiece W.
  • the end face of the plate-shaped workpiece W is provided by the profile cutter 18 with a desired profile.
  • the present invention in its most general aspect, aims to laser-ablate the first layer 1 of the plate-shaped workpieces W by a cutting tool and the second layer 2 of the plate-shaped workpieces W.
  • the present invention also includes devices having only a laser 12 and a machining tool 18 in combination with a conveyor 20.
  • the method according to the invention comprises only the method steps shown in FIGS. 3 and 5.
  • the method or device according to the present invention can be supplemented and combined with a multiplicity of additional method steps or device components.
  • pre-milling units or the like upstream of the first laser 12 in order to remove a portion of the first layer 1 at a suitable location and thus to relieve the profile milling cutter.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
EP05025628A 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau Expired - Fee Related EP1790447B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05025628A EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau
ES05025628T ES2309641T3 (es) 2005-11-24 2005-11-24 Procedimiento y dispositivo para la mecanizacion de piezas de trabajo en forma de placa.
PL05025628T PL1790447T3 (pl) 2005-11-24 2005-11-24 Sposób i urządzenie do obróbki płytowych przedmiotów obrabianych
DE502005005211T DE502005005211D1 (de) 2005-11-24 2005-11-24 Verfahren und Vorrichtung zur Bearbeitung plattenförmiger Werkstücke

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05025628A EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau

Publications (2)

Publication Number Publication Date
EP1790447A1 true EP1790447A1 (fr) 2007-05-30
EP1790447B1 EP1790447B1 (fr) 2008-08-27

Family

ID=36218521

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05025628A Expired - Fee Related EP1790447B1 (fr) 2005-11-24 2005-11-24 Procédé et dispositif d'usinage de pièces en forme de panneau

Country Status (4)

Country Link
EP (1) EP1790447B1 (fr)
DE (1) DE502005005211D1 (fr)
ES (1) ES2309641T3 (fr)
PL (1) PL1790447T3 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2789434A1 (fr) * 2013-04-11 2014-10-15 IMA Klessmann GmbH Dispositif et procédé d'usinage de pièces en forme de plaques
DE102013218483A1 (de) 2013-09-16 2015-03-19 Homag Holzbearbeitungssysteme Gmbh Verfahren zur Laserbearbeitung sowie Bearbeitungsmaschine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1015682A (ja) * 1996-07-03 1998-01-20 Mitsubishi Heavy Ind Ltd 塗装鋼板のレーザ切断方法
EP1004397A2 (fr) * 1998-11-26 2000-05-31 Matsuura Machinery Co. Ltd Dispositif d'usinage combiné
DE19906209A1 (de) * 1999-02-15 2000-08-31 Possehl Electronic Gmbh Verfahren zum Heraustrennen einzelner Schaltkreis-Einheiten aus einem Panel
EP1304427A2 (fr) * 1999-02-10 2003-04-23 Perstorp Flooring Ab Revêtement de sol comportant des éléments de plancher en forme de lames destinées à être assemblées verticalement
DE29924727U1 (de) * 1999-03-11 2005-03-24 Deckel Maho Pfronten Gmbh Werkzeugmaschine für die Werkstückbearbeitung mit spanenden Werkzeugen und Laserstrahl

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SI1719596T1 (sl) * 2005-05-04 2009-06-30 Berry Finance Nv Postopek izdelave talnega panela

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1015682A (ja) * 1996-07-03 1998-01-20 Mitsubishi Heavy Ind Ltd 塗装鋼板のレーザ切断方法
EP1004397A2 (fr) * 1998-11-26 2000-05-31 Matsuura Machinery Co. Ltd Dispositif d'usinage combiné
EP1304427A2 (fr) * 1999-02-10 2003-04-23 Perstorp Flooring Ab Revêtement de sol comportant des éléments de plancher en forme de lames destinées à être assemblées verticalement
DE19906209A1 (de) * 1999-02-15 2000-08-31 Possehl Electronic Gmbh Verfahren zum Heraustrennen einzelner Schaltkreis-Einheiten aus einem Panel
DE29924727U1 (de) * 1999-03-11 2005-03-24 Deckel Maho Pfronten Gmbh Werkzeugmaschine für die Werkstückbearbeitung mit spanenden Werkzeugen und Laserstrahl

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2789434A1 (fr) * 2013-04-11 2014-10-15 IMA Klessmann GmbH Dispositif et procédé d'usinage de pièces en forme de plaques
DE102013218483A1 (de) 2013-09-16 2015-03-19 Homag Holzbearbeitungssysteme Gmbh Verfahren zur Laserbearbeitung sowie Bearbeitungsmaschine

Also Published As

Publication number Publication date
EP1790447B1 (fr) 2008-08-27
ES2309641T3 (es) 2008-12-16
DE502005005211D1 (de) 2008-10-09
PL1790447T3 (pl) 2009-01-30

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