EP1755892A1 - Structures superficielles 2d/3d continues sur des matrices a estamper rotatives destinees au procede de coulage par ultraviolet - Google Patents

Structures superficielles 2d/3d continues sur des matrices a estamper rotatives destinees au procede de coulage par ultraviolet

Info

Publication number
EP1755892A1
EP1755892A1 EP04739864A EP04739864A EP1755892A1 EP 1755892 A1 EP1755892 A1 EP 1755892A1 EP 04739864 A EP04739864 A EP 04739864A EP 04739864 A EP04739864 A EP 04739864A EP 1755892 A1 EP1755892 A1 EP 1755892A1
Authority
EP
European Patent Office
Prior art keywords
cylinder
structures
embossing
embossing cylinder
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04739864A
Other languages
German (de)
English (en)
Inventor
Peter Reich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hueck Folien GmbH
Original Assignee
Hueck Folien GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hueck Folien GmbH and Co KG filed Critical Hueck Folien GmbH and Co KG
Publication of EP1755892A1 publication Critical patent/EP1755892A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F13/00Common details of rotary presses or machines
    • B41F13/08Cylinders
    • B41F13/10Forme cylinders
    • B41F13/11Gravure cylinders

Definitions

  • the invention relates to a seamless embossing cylinder with seamless 2D / 3D structures.
  • WO 02/20268 describes a method for producing intaglio printing plates, the line structures being generated and processed using a computer program.
  • WO 02/20274 discloses data carriers with a security element which has at least in a partial area a halftone blind embossing produced in non-ink-bearing intaglio printing with the aid of an intaglio printing plate, also described.
  • an embossing cylinder is an endless printing tool and, accordingly, should also have endless structures that cannot be produced using conventional methods.
  • the object of the invention was to provide a seamless embossing cylinder and a method for its production.
  • the invention therefore relates to an embossing cylinder, characterized in that the embossing cylinder is seamless and has any 2D / 3D structural elements.
  • a method is preferably used in which a corresponding cylinder is imaged using laser or electron beam technology in accordance with the shapes, patterns, images, lines, letters, shapes and the like desired on the embossed web.
  • a corresponding data file is generated in a first step.
  • the corresponding grayscale image is, for example, an 8 bit grayscale image via a corresponding detection device, for example a scanner, such as an EBV scanner, such as e.g. Hell Graphics Systems S3300 into an electronic image processing program such as Read in bright Linocolor or Adobe Photoshop.
  • the corresponding grayscale image can also be generated electronically using suitable software, e.g. Adobe Illustrator, Corel Draw, Freehand etc. can be created.
  • the desired grayscale image is then created in a suitable software program, for example in Barco Fortuna, with the corresponding geometric shapes, e.g. Gulliochen, Sinus-Waves, Stripes etc. connected.
  • a suitable software program for example in Barco Fortuna, with the corresponding geometric shapes, e.g. Gulliochen, Sinus-Waves, Stripes etc. connected.
  • the geometric element Via the line thickness function provided by the corresponding software, e.g. Variable Linewith Generator, the geometric element is now modulated depending on the grayscale value.
  • the original grayscale image is converted into a 1 to 4 bit structure, which creates the desired 2D / 3D effect.
  • the image produced in this way is now exposed on a prepared cylinder in a corresponding exposure system.
  • a gravure cylinder with a core of iron tube with a wall thickness of 20 mm, and the following layers: 5-7 ⁇ m nickel layer, 300 ⁇ m copper layer; existing photosensitive layer with the corresponding patterns, shapes, lines, letters illustrated, developed and etched in the form of the previously defined grid.
  • the cylinder is coated in the usual way with a plastic transfer wheel, or by spraying, rolling, brushing, dipping, or by means of a curtain application process, preferably in a layer thickness of 2-10 ⁇ m with a commercially available photosensitive composition, for example LD 100, from OHKA Kogyo Ltd.
  • a commercially available photosensitive composition for example LD 100, from OHKA Kogyo Ltd.
  • compositions are also suitable.
  • the cylinder is then covered with an overcoat with a layer thickness of 1-5 ⁇ m, for example with OC-40 (from OHKA Kogyo Ltd) or with an analogous, similar, commercially available composition.
  • Development takes place after exposure in the usual way, for example without contact with sodium carbonate (0.5% solution), followed by a cleaning process with water and the cylinder is dried.
  • the image, pattern, shapes and the like defined by the laser or electron beam imaging are reflected on the surface of the cylinder by a subsequent conventional etching process following the laser or electron beam imaging.
  • the etching can be carried out in various ways, for example by means of an Fe (III) chloride solution or a Cu (II) chloride solution, optionally with the addition of HCl or H 2 SO 4 . If necessary, commercially available and known additives for flank protection can also be added to the etching solution.
  • the duration of the action of the etchant depends on the etchant used and is, for example when using a Cu chloride solution with the addition of an acid, about 90-2400 sec.
  • an electrochemical etching process can also be used.
  • the cylinder appears dull and optically dark. An impression or embossing of the surface therefore also leads to a very poor impression result.
  • a surface treatment with the electrolytic or chemical shine enhances the impression structure and creates a brilliant surface.
  • Anodizing or polishing is a valuable addition to the various polishing processes, but it is not a universal replacement for other processes. Neither all metals are suitable for this, nor can all desired surface profiles be produced with this process. These restrictive findings are important because failures and disappointments can only be avoided by marking out the limits of the application.
  • the essence of anodic polishing, also electrolytic polishing or electropolishing is that the surface to be polished as a positive pole, anode, in a suitable solution, the electrolyte, which has to be specially matched to the metal to be treated, more or less long, usually a few minutes to a quarter of an hour. The electropolishing process is therefore reversed like the galvanic metal deposition on the cathode.
  • the anodically switched metal dissolves in the electrolyte, but the dissolution takes place more strongly at the micro elevations on the surface than in the depressions. This results in a gradual leveling and smoothing in the micro range, which can lead to a high gloss.
  • the prerequisite for the success of electropolishing is that there is a polishable metal and that the appropriate electrolyte is used. Most homogeneous metals and alloys can be polished well. For example, the process is particularly suitable for stainless chrome-nickel steels, for many hard metals, for pure aluminum and not too high-alloyed aluminum, for copper-rich brass and other copper alloys, for precious metals. Various of the metals mentioned are difficult to bring mechanically to a high gloss.
  • the preferred attack on the areas protruding from the surface means that burrs on the workpiece are removed quickly. Electropolishing is therefore ideal for deburring workpieces, especially those that are difficult to deburr in other ways or that would require a lot of manual work.
  • the composition of the base metal, single-phase or multi-phase is irrelevant for deburring, and metals and alloys that are difficult to polish per se can also be well deburred electrolytically.
  • anodic polishing has no mechanical effect on the surface of the workpiece; rather, they become superficial layers that have been deformed by a previous mechanical treatment and inner ones Tensions were released during electropolishing, so that the unchanged basic structure of the material appears superficially.
  • metal is preferably dissolved at the points protruding from the surface. This leads to progressive smoothing and leveling. Macro roughness or unevenness remain unaffected. It is therefore not possible to produce an ideally flat surface or any other specific geometric profile by anodic polishing. If such a surface is required, the macro profile is to be produced by prior mechanical treatment, including mechanical grinding and polishing, and only then is the elimination of the micro-roughness still present and the production of high gloss by electrolysis.
  • Anodically polished surfaces are characterized primarily by the lack of micro-roughness. This results in various valuable properties of these surfaces, which are used technically: high gloss and excellent reflectivity (optics, decorative use), low friction coefficient, therefore lower friction losses and reduced frictional heat and less frictional wear (gears, bearings, shafts, pistons, piston rings, etc.) ), lower adsorption capacity and absorption capacity for gases and
  • electropolishing Compared to mechanical processes, electropolishing has some very valuable advantages: it does not require expensive manual work by qualified personnel, all sources of accidents and hazards that often occur during mechanical polishing are eliminated, even complicated shapes and metals that are difficult to polish can be electropolished effortlessly, there is no dust pollution.
  • the chemical shine differs from the electrolytic processes in that no external power source is required. However, the surface is removed in the same way as for anodic polishing. Instead of the direct effect of the electric current, correspondingly aggressive chemicals are used, which naturally consume the controlled degradation of the surface, that is to say continuously, and must be constantly supplemented. These solutions must also be specially tailored to each metal to be treated, which is more critical here than with the anodic polishing processes. Since there are no external power sources, the system costs are considerably lower than for electrolytic processes. On the other hand, the ongoing chemical costs, which replace the electricity costs, are usually higher.
  • the embossing cylinder according to the invention has a defined surface relief with different structures in different orientations and depths.
  • the embossing cylinder according to the invention is seamless and can therefore be used to produce embossed sheet-like materials with endless diffraction structures.
  • carrier films are preferably flexible plastic films, for example made of PI, PP, MOPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC in question.
  • the carrier films preferably have a thickness of 5 to 700 ⁇ m, preferably 5 to 200 ⁇ m, particularly preferably 5 to 50 ⁇ m.
  • metal foils for example Al, Cu, Sn, Ni, Fe or stainless steel foils with a thickness of 5-200 ⁇ m, preferably 10 to 80 ⁇ m, particularly preferably 20-50 ⁇ m, can also serve as the carrier substrate.
  • the films can also be surface-treated, coated or laminated, for example with plastics, or painted.
  • carrier substrates also paper or composites with paper, for example, composites with plastics with a grammage 20-500 g / m 2, preferably 40-200 g / m 2. be used.
  • woven or non-woven fabrics such as continuous fiber non-woven fabrics, staple fiber non-woven fabrics and the like, which can optionally be needled or calendered, can be used as carrier substrates.
  • Such fabrics or nonwovens preferably consist of plastics, such as PP, PET, PA, PPS and the like, but fabrics or nonwovens made of natural, optionally treated fibers, such as viscose fibers, can also be used.
  • the fabrics or nonwovens used have a weight per unit area of approximately 20 g / m 2 to 500 g / m 2 .
  • the carrier substrates can additionally have a lacquer layer, which can be unstructured or structured.
  • the lacquer layer can be, for example, an adhesive lacquer layer or a release-capable transfer lacquer layer; it can be thermally or reactive by radiation, for example UV radiation be cross-linked or cross-linkable and have additional properties such as scratch-resistant and / or antistatic finish or chemical resistance.
  • Both aqueous and solvent-based coating systems are suitable, in particular coating systems based on polyester-acrylate, PET-acrylate, urethane-acrylate, PVC, PMMA or epoxyacrylate.
  • the individual layers can be applied by known methods, for example by vapor deposition, sputtering, printing (gravure, flexographic, screen, offset, digital printing and the like), spraying, electroplating and the like.
  • textile materials such as woven or non-woven fabrics, such as continuous fiber non-woven fabrics, staple fiber non-woven fabrics and the like, which can optionally be needled or calendered, can be used as substrates.
  • fabrics or nonwovens preferably consist of plastics, such as PP, PET, PA, PPS and the like, but fabrics or nonwovens made of natural, optionally treated fibers, such as viscose, hemp or kenaf nonwovens and woven fabrics or mixtures thereof, can also be used Plastic fibers are used.
  • the carrier substrates have a corresponding coating, preferably a radiation-curable coating, for producing the diffraction structures.
  • the desired diffraction structure can then be shaped in any known manner by means of the embossing cylinder according to the invention.
  • a method can be used in which a carrier substrate is provided in a first step, in a second step this carrier substrate is coated with a radiation-curable lacquer in a coating method, in a third step this lacquer up to the gel point by excitation with radiation defined wavelength is pre-hardened, and at the same time the surface structure is molded, in a fourth step the further hardening (main hardening) of the radiation-curable lacquer is carried out by excitation of radiation of a wavelength different from that of the pre-hardening step, after which a post-hardening and, if necessary, further coating or finishing steps are carried out.
  • the carrier substrate is coated with a radiation-curable lacquer in a coating process such as, for example, a screen printing, gravure printing or flexographic printing process.
  • a coating process such as, for example, a screen printing, gravure printing or flexographic printing process.
  • the coating can be carried out selectively or over the entire surface.
  • the radiation-curable lacquer can, for example, be a radiation-curable lacquer system based on a polyester, an epoxy or polyurethane system which contains 2 or more different photoinitiators which are known to the person skilled in the art and which can initiate curing of the lacquer system to different extents at different wavelengths.
  • one photoinitiator can be activated at a wavelength of 200 to 400 nm
  • the second photoinitiator can then be activated at a wavelength of 370 to 600 nm.
  • Sufficient difference should be maintained between the activation wavelengths of the two photoinitiators so that the second photoinitiator is not excited too strongly while the first photoinitiator is activated.
  • the range in which the second photoinitiator is excited should be in the transmission wavelength range of the carrier substrate used. Electron radiation can also be used for the main curing (activation of the second photoinitiator).
  • a water-dilutable lacquer can also be used as the radiation-curable lacquer. Polyester-based paint systems are preferred.
  • the surface structure ie the diffraction, diffraction or relief structure, is shaped, for example, at a controlled temperature by means of a Matrix or using the embossing cylinder according to the invention in the radiation-curable lacquer layer which has been pre-cured to the gel point by activation of the first photoinitiator and is in this stage at the time of the impression.
  • a pre-drying may be carried out, for example by
  • the layer thickness of the radiation-curable lacquer applied can vary depending on the requirements of the end product and the thickness of the substrate and is generally between 0.5 and 50 ⁇ m, preferably between 2 and 10 ⁇ m, particularly preferably between 2 and 5 ⁇ m.
  • embossing cylinder according to the invention in any other known embossing process, ie also in known thermoplastic embossing processes.
  • embossing cylinder surface structures for security elements for documents of value or packaging, for printed circuit boards, for support structures for transistors based on metals or semiconductors or conductive polymers, in microelectronics, for conductor tracks for optical elements, for biochips, for basic structures for polymer chips can be used , for reflector systems, for Fresnel lenses, for microcannulas or microchannels, for light guide structures or also for decorative elements in architecture.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un cylindre de gravure continue ayant des structures 2D/3D continues.
EP04739864A 2004-06-14 2004-06-14 Structures superficielles 2d/3d continues sur des matrices a estamper rotatives destinees au procede de coulage par ultraviolet Withdrawn EP1755892A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2004/006383 WO2005120831A1 (fr) 2004-06-14 2004-06-14 Structures superficielles 2d/3d continues sur des matrices a estamper rotatives destinees au procede de coulage par ultraviolet

Publications (1)

Publication Number Publication Date
EP1755892A1 true EP1755892A1 (fr) 2007-02-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP04739864A Withdrawn EP1755892A1 (fr) 2004-06-14 2004-06-14 Structures superficielles 2d/3d continues sur des matrices a estamper rotatives destinees au procede de coulage par ultraviolet

Country Status (2)

Country Link
EP (1) EP1755892A1 (fr)
WO (1) WO2005120831A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015188909A1 (fr) * 2014-06-10 2015-12-17 Hueck Folien Ges.M.B.H. Procédé de production d'un outil d'estampage par lithographie 3d

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983000570A1 (fr) * 1981-07-30 1983-02-17 Müller, Hans Procede de tramage d'images en demi-teinte
JPH06234086A (ja) * 1993-02-10 1994-08-23 Sony Corp レーザ製版装置
JP2889177B2 (ja) * 1995-03-22 1999-05-10 アグフア−ゲヴエルト・ナームローゼ・フエンノートシヤツプ コントーン画像から中間調画像を生成するための方法
US5768425A (en) * 1995-07-14 1998-06-16 Texas Instruments Incorporated Method and system for improved threshold based screening
DE19740778C1 (de) * 1997-09-16 1999-03-18 Juergen Amrhein Verfahren zur Übertragung einer Bildvorlage auf eine Abbildungsfläche
DE19845440A1 (de) 1998-10-02 2000-04-06 Giesecke & Devrient Gmbh Stichtiefdruckverfahren zum vollflächigen Bedrucken großer Flächen
US6414757B1 (en) * 1999-04-13 2002-07-02 Richard Salem Document security system and method
DE10044464B4 (de) 2000-09-08 2011-09-22 Giesecke & Devrient Gmbh Datenträger sowie ein Verfahren zu seiner Herstellung
DE10044403A1 (de) 2000-09-08 2002-03-21 Giesecke & Devrient Gmbh Datenträger mit Stichtiefdruckbild und Verfahren zur Umsetzung von Bildmotiven in Linienstrukturen sowie in eine Stichtiefdruckplatte
DE10159539A1 (de) * 2001-12-05 2003-06-26 Hueck Folien Gmbh & Co Kg Verfahren zur Herstellung eines Druckwerkzeugs, Druckwerkzeug und dessen Verwendung zum Verdrucken von insbesondere hochviskosen und/oder hochpigmentierten Lacken und Farben
DE10324936A1 (de) * 2003-06-03 2005-01-05 Hueck Folien Gmbh & Co. Kg Nahtlose 2D/3D Oberflächenstrukturen auf rotativen Prägeformen für UV Casting Verfahren

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Also Published As

Publication number Publication date
WO2005120831A1 (fr) 2005-12-22

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