EP1658581A1 - Cavaliers de modules pour etiquettes intelligentes - Google Patents

Cavaliers de modules pour etiquettes intelligentes

Info

Publication number
EP1658581A1
EP1658581A1 EP04764400A EP04764400A EP1658581A1 EP 1658581 A1 EP1658581 A1 EP 1658581A1 EP 04764400 A EP04764400 A EP 04764400A EP 04764400 A EP04764400 A EP 04764400A EP 1658581 A1 EP1658581 A1 EP 1658581A1
Authority
EP
European Patent Office
Prior art keywords
module
chip modules
carrier tape
module bridges
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04764400A
Other languages
German (de)
English (en)
Inventor
Ralf God
Volker Brod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10358423A external-priority patent/DE10358423B4/de
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP1658581A1 publication Critical patent/EP1658581A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to module bridges for smart labels for positioning chip modules on supports and for bridging-like connection of connection elements of the chip modules with connection elements of antenna elements arranged on or in the carriers according to the preamble of patent claim 1.
  • Smart labels which in addition to an antenna also comprise an RFID chip (radio frequency identification chip), preferably made of silicon, are produced in large numbers at high production speeds.
  • RFID chip radio frequency identification chip
  • the dimensions of such chips continuously decrease due to their development, so that a precise positioning of the chips on an antenna substrate with respect to connection elements of an antenna element becomes more and more difficult and device-intensive.
  • the RFID chips have been applied to the antenna substrate using a so-called pick-and-place method using a flip-chip technique.
  • a robot operating in the high-precision range removes a silicon chip from a silicon wafer, rotates it by 180 °, so that the top of the silicon chip with connection elements arranged thereon points down, and mounts the chip in this upside-down position on the Antenna and the antenna substrate.
  • the connection elements of the chip which have very small dimensions, must be made to coincide with the connection elements of the antenna with high precision.
  • the antenna substrates with the antennas are usually located on wide, flexible tracks with a width of approximately 500 mm during the smart label production process, a device-complex robot design is required for a precise placement of the chips on the antenna substrates. Placement accuracies in a range of 10 - 20 ⁇ m are usually necessary.
  • module bridges are used as bridging-type connections between the small-dimensioned connection elements of the chip modules and the connection elements of the antenna.
  • Such module bridges have contact lines which extend from the inside to the outside. The inside ends are connected to a chip module arranged on the module bridge and the outside ends are provided for contacting the connection elements of the antenna.
  • the chip modules are preassembled on the module bridges in a locally limited small working area using the high-precision method, which are then mounted on the antenna substrates or the antennas with reduced accuracy and high speed within a large working area.
  • the module bridges conventionally used for this purpose consist of high-priced plastic materials and are manufactured individually before the chip module is preassembled.
  • the object of the present invention is module bridges for smart
  • An essential point of the invention is that in module bridges for smart labels for positioning chip modules on carriers and for bridging-like connection of connection elements of the chip modules with connection elements of antenna elements arranged on or in the carriers, a plurality of module bridges are arranged one behind the other on a carrier tape, wherein the carrier tape has a plurality of depressions arranged one behind the other for receiving a chip module each associated with a module bridge and contact layers covering the connection elements of the chip modules and having dimensions that are larger than the connection element dimensions.
  • the inventive simple design of a large number of module bridges on the carrier tape by means of the contact layers, which extend in a simple manner, for example by means of a printing process, over the previously arranged chip modules, makes it possible to produce a large amount of module bridges quickly and easily without having to do so high material costs arise.
  • inexpensive plastic or paper materials can be used as the carrier tape material, which can be shaped three-dimensionally by using appropriate forming techniques, such as thermoplastic molding or an embossing technique. This technique can also be forming 'continuously carried out quickly and easily within a device, while the carrier tape is traveling or is stopped temporarily.
  • depressions within the carrier tape enables the rapid insertion of the chip modules with their connection elements oriented upwards, which are preferably covered by two band-like contact layers running parallel to one another and having interruptions between the chip modules. Since the contact layers have larger surface expansions than the connection element of the individual chip module, it is possible with greater inaccuracy to assemble a module bridge designed in this way on the connection elements of the antenna element, which are arranged on the carrier, which can be designed as an antenna substrate. This consequently advantageously results in a quick and simple assembly of the module bridges containing the chip modules on the antenna substrates within a large working area.
  • the simple structure of the module bridges also proves to be advantageous when they are separated from the carrier tape, in which the individual module bridges can be exposed quickly and easily, for example by a longitudinal cutting process in the longitudinal direction of the carrier tape or by cutting through remaining half-webs in the transverse direction of the carrier tape. It is essential here that both the carrier tape and the contact layer have interruptions extending in the transport width direction between the chip modules.
  • adhesive layers are attached to the contact layers for the adhesive attachment of individual module bridges on the carriers in the region of the connection elements of the antenna element.
  • the adhesive layers preferably consist of two tape-like adhesive layers running parallel to one another in the longitudinal direction of the carrier tape, with interruptions which correspond to the interruptions within the carrier tape and the contact layers depending on the location.
  • the contact layers can be self-adhesive.
  • they can either consist of prepolymerized epoxy resin with conductive particles contained therein or of a hot melt adhesive with conductive particles contained therein.
  • the contact layers consist of a first, band-like contact layer extending in the carrier tape direction, which covers the first connection elements of the first connection sides of the chip modules, and of a second, band-like contact layer, which extends in the carrier tape longitudinal direction, which covers the second connection elements of the second connection sides of the chip modules.
  • a first, band-like contact layer extending in the carrier tape direction, which covers the first connection elements of the first connection sides of the chip modules
  • a second, band-like contact layer which extends in the carrier tape longitudinal direction, which covers the second connection elements of the second connection sides of the chip modules.
  • the depressions preferably have a sufficient depth to arrange the chip modules in such a way that their upper sides and a surface of the carrier tape surrounding the depression lie in one plane. This ensures that the contact layers, which extend both over the upper sides of the chip modules and over the surface of the carrier tape, extend in one piece without unwanted interruptions within a plane.
  • the depressions are complementary to the outer shapes of the chip modules to be accommodated therein, in order to ensure an optimal and precisely fitting placement of the chip modules within the carrier tape.
  • the carrier tape can be deformed or embossed in such a way that almost any type of chip module can be positioned therein.
  • the chip module is self-centered while the chip module is inserted into the shaped recess.
  • the depressions can optionally be provided on the underside with at least one hole on which the chip module is arranged. Such a punched hole has an advantageous effect on a curing process necessary for the adhesive, since this enables direct action on the adhesive, for example by UV light.
  • Fig.-En 1a - 1f sequentially the structure of the module bridges according to the invention in a plan view
  • FIG. 2 shows a schematic cross-sectional view of the structure of a module bridge including a chip module
  • 3 shows a schematic plan view of the positioning of a module bridge according to the invention with a chip module on connection elements of an antenna element.
  • FIGS. 1a-1c each show a top view sequentially of the structure of the module bridges according to the invention.
  • a carrier tape shown in FIG. 1a made of a plastic and / or paper material has, after a thermoplastic deformation, an embossing process and / or a punching process, depressions 2 arranged one behind the other, which may have through holes, for receiving chip modules.
  • Hole rows 3 arranged on the edge serve to move the carrier tape 1 forward within a device by means of a transport element (not shown here).
  • FIG. 1c shows that chip modules 5 with first and second connection sides 5a and 5b are inserted into the depressions 2. To fix the chip modules, they are used within an adhesive depot arranged in the recess 2, as shown by reference number 6 in FIG. 1d. This adhesive is cured by means of UV radiation, electron beam radiation or thermal radiation.
  • a first band-like contact layer 7a extending over the first connection side 5a of the chip modules 5 is arranged.
  • a second contact layer 7b extends parallel to the first contact layer 7a in a band-like manner over the second connection side of the chip modules.
  • the surface dimensions of the contact layers 7a and 7b are larger than the dimensions of connection elements of the chip modules.
  • Both the first and the second contact layers 7a and 7b have interruptions 4 which are congruent with the interruptions in the carrier tape 1.
  • the on the other arranged module bridges 10 two tape-like adhesive layers 8a and 8b arranged parallel to each other, again with interruptions 4.
  • a module bridge according to the invention with the chip module 5 is shown in a schematic cross-sectional illustration in FIG. 2.
  • the chip module 5 is arranged within the depression 2 of the carrier tape 1 in such a way that its top side 5c is in one plane with a surface 1a of the carrier tape 1 surrounding the depression 2.
  • the chip module 5 fixing adhesive parts 9a and 9b are arranged.
  • the contact layers 7a and 7b extend over the connection elements 5d and 5e of the chip module 5, which are indicated as indicated, and the surface 1a of the carrier tape.
  • the module bridge can advantageously be bent without the contact between the connection elements 5d, 5e and the contact layers 7a and 7b being lost thereby.
  • FIG. 3 shows a schematic illustration of the positioning of an individual module bridge with a chip module on connection elements of an antenna element.
  • a single module bridge 10 including the chip module 5 and a carrier tape portion is cut out of the module bridge assembly and, with the adhesive layers 8a and 8b facing downward, placed and fixed on connection elements 11a and 11b of the antenna 11.
  • An indication of an antenna substrate 12 is shown.
  • connection elements of the chip module hardened adhesive, a first tape-like contact layer, second tape-like contact layer, first tape-like adhesive layer, second tape-like adhesive layer, 9b adhesive components, 0 module bridges, 1 antenna element, 1 a, 11 b, connection element of the antenna element, 2 antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne des cavaliers de modules destinés à des étiquettes intelligentes et servant à positionner des modules puces (5) sur des supports (12) et à relier par pontage des éléments de connexion des modules puces (5) à des éléments de connexion (11a, 11b) d'éléments antennes (11) placés sur ou dans les supports (12). Selon l'invention, plusieurs cavaliers de modules (10) sont placés les uns derrière les autres sur une bande support (1), cette bande support (1) présentant une pluralité d'évidements successifs (2) pour le logement respectif d'un module puce (5) affecté à un cavalier de module (10), ainsi que des couches de contact (7a, 7b) recouvrant les éléments de connexion des modules puces (5) et ayant des dimensions supérieures aux dimensions des éléments de connexion.
EP04764400A 2003-08-26 2004-08-24 Cavaliers de modules pour etiquettes intelligentes Withdrawn EP1658581A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10339547 2003-08-26
DE10358423A DE10358423B4 (de) 2003-08-26 2003-12-13 Modulbrücken für Smart Labels
PCT/EP2004/009420 WO2005022455A1 (fr) 2003-08-26 2004-08-24 Cavaliers de modules pour etiquettes intelligentes

Publications (1)

Publication Number Publication Date
EP1658581A1 true EP1658581A1 (fr) 2006-05-24

Family

ID=34276521

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04764400A Withdrawn EP1658581A1 (fr) 2003-08-26 2004-08-24 Cavaliers de modules pour etiquettes intelligentes

Country Status (4)

Country Link
US (1) US20060289979A1 (fr)
EP (1) EP1658581A1 (fr)
JP (1) JP2007503634A (fr)
WO (1) WO2005022455A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4855849B2 (ja) * 2006-06-30 2012-01-18 富士通株式会社 Ｒｆｉｄタグの製造方法、およびｒｆｉｄタグ
US7759777B2 (en) * 2007-04-16 2010-07-20 Infineon Technologies Ag Semiconductor module
US8739402B2 (en) * 2008-12-17 2014-06-03 Microconnections Sas Method of manufacture of IC contactless communication devices
JP7312355B2 (ja) 2019-03-27 2023-07-21 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、及びｉｃ保持部の製造方法
FR3137194A1 (fr) * 2022-06-23 2023-12-29 Inkjet Engine Technology Bande d’étiquettes d'identification par fréquence radio (« RFID ») sans puce
DE102022003764A1 (de) * 2022-10-12 2024-04-18 Giesecke+Devrient ePayments GmbH Modulträgerband

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CA2171526C (fr) * 1995-10-13 1997-11-18 Glen E. Mavity Element de securite pour article et etiquette imprimee; methode et appareil pour fabriquer et appliquer ces objets
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DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
DE10136359C2 (de) * 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
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Also Published As

Publication number Publication date
US20060289979A1 (en) 2006-12-28
JP2007503634A (ja) 2007-02-22
WO2005022455A1 (fr) 2005-03-10

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