EP1658582A1 - Procede de production de ponts de module - Google Patents

Procede de production de ponts de module

Info

Publication number
EP1658582A1
EP1658582A1 EP04764401A EP04764401A EP1658582A1 EP 1658582 A1 EP1658582 A1 EP 1658582A1 EP 04764401 A EP04764401 A EP 04764401A EP 04764401 A EP04764401 A EP 04764401A EP 1658582 A1 EP1658582 A1 EP 1658582A1
Authority
EP
European Patent Office
Prior art keywords
carrier tape
chip
connection elements
chip modules
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04764401A
Other languages
German (de)
English (en)
Inventor
Dr. Ralf God
Volker Brod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10358422A external-priority patent/DE10358422B3/de
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP1658582A1 publication Critical patent/EP1658582A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for producing module bridges for smart labels for positioning chip modules on supports and for bridging-like, conductive connection of connection elements of the chip modules with connection elements of antenna elements arranged on or in the supports.
  • the manufacture of smart labels includes, among other things, arranging an RFI D chip (radio frequency identification chip), which is generally a silicon chip, on connection elements of an antenna element and an antenna substrate carrying the antenna element.
  • Antenna substrates of this type can be, for example, films, labels or more inflexible plastic elements. Since smart labels are to be produced in large numbers per unit of time, not only the production speed but also the manufacturing costs associated with a mass product are important factors for a more efficient production of smart labels.
  • connection elements of the chips / chip modules which in turn make it difficult to precisely position these connection elements on the connection elements of the antenna element of a later smart label.
  • This also results in a reduction in the assembly speed of the chip module on the antenna substrate and the connection elements of the antenna element and a reduction in the number of pieces per unit of time, since the highly precise positioning of the chip modules requires a slowdown in the work steps.
  • RFID chips are conventionally applied to the antenna substrates in the manufacture of smart labels by means of pick-and-place methods in conventional flip-chip technology.
  • a high-precision robot picks up a silicon chip from a wafer and rotates it by 180 ° in order to then mount it upside down on the antenna substrate.
  • the smallest connection surfaces of the connection elements of the chip must be brought into line with the connection elements of the antenna with the highest precision.
  • connection elements of the antenna element are usually on wide and flexible tracks - typically of the order of 500 mm in width - with the antenna substrates, the chip must be positioned precisely in the order of 10-20 ⁇ m within such a large one Working area only possible with high costs for the robot technology and with increased expenditure of time. As a result, such assembly devices are comparatively slow in their work flow and cannot be used for any small chip size.
  • module bridges are used, the function of which is that they build conductive connections in a bridge-like manner from the connection elements of the chip module to the connection elements of the antenna element arranged on a large area on the antenna substrate.
  • Such module bridges are often known as individual plastic elements, the manufacture and material of which cause additional costs.
  • the high-precision positioning of the chip modules is carried out within a small working area in such a way that the chip modules are initially arranged on the module bridges, for example using a pick-and-place method.
  • the individual module bridges are then mounted within the large working area on the antenna substrate or the connection elements of the antenna element with less accuracy.
  • a manufacturing method for smart labels is known in which an RFID chip is shaken from a vibrator onto the antenna substrate.
  • a method is also known in which a chip with a special geometry suspended in liquid is washed into appropriately designed cavities. Both methods require a special and sometimes complex chip design, which limits their application to certain chip types and manufacturers.
  • the object of the present invention is to provide a method for producing module bridges for smart labels which enables inexpensive, quick and simple production of smart labels.
  • An essential point of the invention is that the following steps are carried out in a method for producing module bridges for smart labels for positioning chip modules on carriers and for bridging-like, conductive connection of connection elements of the chip modules with connection elements of antenna elements arranged on or in the carriers: - Formation of depressions arranged one behind the other within a longitudinally movable endless carrier belt; - Positioning one chip module in each recess with connection elements pointing upwards; and application of tape-like contact layers to the connection elements of the chip modules and a surface of the carrier tape adjacent to the depressions to form enlarged contact areas.
  • the contact layers can either consist of prepolymerized epoxy resin with conductive particles contained therein or of a hot-melt adhesive with conductive particles contained therein.
  • Module bridges of such a simple construction also advantageously have low material and manufacturing costs.
  • a liquid adhesive is filled into this recess in a predetermined amount in a recess before the chip module is positioned and cured by UV, electron and / or thermal radiation after the step of positioning the chip module. This allows each chip module to be fixed easily and quickly within the recesses.
  • the chip modules are preferably positioned within the depressions in such a way that their tops and the surface of the carrier tape lie in a substantially common plane. In this way, the contact layers to be arranged over the top and the surface are formed in one piece without the risk of formation of shoulders or steps.
  • the contact layers are ideally designed as a first band-like contact layer which extends in the longitudinal direction of the carrier tape and which covers the first connection elements of the first connection sides of the chip modules, and as a second band-like contact layer which extends in the longitudinal direction of the carrier band and which covers the second connection elements of the second connection sides of the chip modules.
  • Such tape-like contact layers are continuously printed, for example in the context of a screen printing process or an inkjet printing process, while the carrier tape continues in the longitudinal direction of the carrier tape. emotional. This allows quick and easy formation of enlarged contact areas for a large number of chip modules.
  • the contact layers can consist of a silver conductive paste or another conductive, application and hardenable material.
  • the adhesive layers are also preferably printed on as two preferably conductive adhesive layers running parallel to one another in the longitudinal direction of the carrier tape.
  • the adhesive layers used for the mechanical and / or electrical connection to an antenna substrate can also be applied continuously during further transport of the carrier tape. Hot-melt adhesives are possible as the electrically conductive adhesives used here, which behave sticky in the warm state and solidify on cooling.
  • slots extending in the carrier tape width direction are punched out between the depressions arranged one behind the other in order to enable a later separation of this module bridge assembly by cutting the assembly in the longitudinal direction of the carrier tape.
  • half-webs which lie on a common line with the shooting slats can be cut quickly in the transverse direction of the carrier tape in order to obtain a separation.
  • Such separation of the module bridges can take place with the aid of a compact, cassette-like device in which the module bridges are detached from the endless carrier tape at a speed V 1 , accelerated and preferably continuously mounted on the antenna substrate at the speed V 2 . In this way, it is possible to separate and assemble the module bridges arranged on the endless carrier belt in a fast and continuous process.
  • Both the tape-like contact layers and the tape-like adhesive layers have congruent layer interruptions with the slots arranged in the carrier tape, which are generated automatically during the printing process due to the presence of the slots. A later separation of the module bridges is possible without damaging the layers.
  • the material of the carrier tape is inexpensive and is a plastic and / or paper material. Such materials can be converted three-dimensionally in a simple and quick manner by using known shaping techniques, such as thermoplastic shaping or embossing or punching. By using an appropriate tool, the shape of the recesses can be designed such that they are complementary to the outer shape of the chip module to be accommodated therein. This results in a better fixation of the chip module within the recess.
  • depressions can be used which allow chip modules with a wide variety of surface structures to be arranged therein. A versatile application of the manufacturing method according to the invention is thus possible.
  • the carrier tape is preferably perforated along its edges by a punching process, so that rows of holes are present for engaging transport elements.
  • the depressions can be provided with punched holes on which the chip module comes to rest. Such punched holes can advantageously be used for a later curing process for the adhesive arranged therein due to the direct access to the adhesive.
  • FIG. 2 shows a simplified schematic plan view of the positioning of an individual module bridge on an antenna substrate.
  • Fig. 1 the flow of the manufacturing method according to the invention is shown in simplified form in a functional diagram.
  • a first step 1 there is a carrier tape made of plastic or paper before.
  • the carrier tape is reshaped, for example by thermoplastic shaping, embossing or stamping.
  • a three-dimensionally shaped carrier tape with depressions arranged one behind the other step 3).
  • Step 4 involves positioning the chip modules within the recesses, which are already filled with adhesive in a predetermined amount. For this purpose, each chip module is removed from a wafer and inserted into a recess (step 5).
  • the chip modules are fixed by curing the adhesives by means of UV, electron and / or thermal radiation. Care is taken here that an upper side of the chip modules lies in a common plane with the surface of the carrier tape.
  • a conductive silver paste is printed as contact layers on the connection elements of the chip modules and the surface of the carrier tape surrounding the recess to form enlarged contact connections.
  • step 12 and 13 the module bridges which are present in a composite are separated, for example by means of a cassette-like device, in order to then subsequently arrange them individually on an antenna substrate.
  • the depressions 22 are first arranged in succession in the carrier tape 21 by means of an embossing process. At the same time, rows of holes 23 are punched out on the edges of the carrier tape 21, as are slots 24 which extend in the direction of the carrier tape width between the depressions 22.
  • the adhesive 26 likewise arranged in the depressions for the permanent fixing of the chip modules 25 takes place within the depressions 22.
  • the contact layers 27a and 27b extend in the manner of a band, running in parallel, in each case over the first connection sides 25a of the chip modules 25 and the second connection sides 25b of the chip modules 25.
  • the adhesive layers 28a and 28b printed thereon are arranged in a tape-like manner on the contact layers 27a and 27b in order to obtain an adhesive connection with the antenna substrate or the connection elements of the antenna element.
  • the endless carrier belt shown in sections in this illustration has a large number of module bridges 29 arranged one behind the other.
  • FIG. 2 shows a schematic illustration in a top view of the positioning of individual module bridges 29, including the chip modules 25 connected to them, on the antenna element 30.
  • the antenna element is arranged on the antenna substrate 31, as is hinted at.
  • the antenna element 30 has connection elements 30a and 30b which come into contact with the top and bottom contact layers 27a and 27b when the module bridge 29 is installed.
  • the module bridge is glued onto the antenna substrate by means of the tape-like adhesive layers 28a and 28b.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un procédé permettant de produire des ponts de module (29) conçu pour des étiquettes intelligentes pour positionner des modules de puce (25) sur des supports (31) ainsi que pour relier, par pontage et de manière conductrice, des éléments de connexion des modules de puce (25) avec des éléments de connexion (30a, 30b) d'éléments antenne (30) disposés sur ou dans les supports (31). Le procédé selon l'invention comprend les étapes consistant: à former (2) des cavités (22) successives dans une bande de support continue (21) pouvant être déplacée dans le sens longitudinal; à positionner (4) respectivement un module de puce (25) dans chaque cavité (22), de façon que les éléments de connexion soient orientés vers le haut, et; à appliquer (8) des couches de contact en forme de bandes (27a, 27b) sur les éléments de connexion du module de puce (25) et une surface de la bande de support (21) qui est adjacente aux cavités (22), pour former des surfaces de contact plus grandes.
EP04764401A 2003-08-26 2004-08-24 Procede de production de ponts de module Withdrawn EP1658582A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10339547 2003-08-26
DE10358422A DE10358422B3 (de) 2003-08-26 2003-12-13 Verfahren zur Herstellung von Modulbrücken
PCT/EP2004/009421 WO2005022456A1 (fr) 2003-08-26 2004-08-24 Procede de production de ponts de module

Publications (1)

Publication Number Publication Date
EP1658582A1 true EP1658582A1 (fr) 2006-05-24

Family

ID=34276520

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04764401A Withdrawn EP1658582A1 (fr) 2003-08-26 2004-08-24 Procede de production de ponts de module

Country Status (4)

Country Link
US (1) US20060261957A1 (fr)
EP (1) EP1658582A1 (fr)
JP (1) JP2007503635A (fr)
WO (1) WO2005022456A1 (fr)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
CA2171526C (fr) * 1995-10-13 1997-11-18 Glen E. Mavity Element de securite pour article et etiquette imprimee; methode et appareil pour fabriquer et appliquer ces objets
DE69938929D1 (de) * 1998-09-11 2008-07-31 Motorola Inc Rfid-etikettenvorrichtung und verfahren
US6262692B1 (en) * 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
JP3314304B2 (ja) * 1999-06-07 2002-08-12 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ用の回路基板
US6140146A (en) * 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6147662A (en) * 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
BR0015835A (pt) * 1999-11-25 2002-08-06 Infineon Technologies Ag Suporte plano com ao menos um chip semicondutor
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
DE10136359C2 (de) * 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
FR2828570B1 (fr) * 2001-08-09 2003-10-31 Cybernetix Procede de fabrication de cartes a puce sans contact et/ou mixte
KR20040083527A (ko) * 2002-02-19 2004-10-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 트랜스폰더 및 이의 제조 방법
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005022456A1 *

Also Published As

Publication number Publication date
WO2005022456A1 (fr) 2005-03-10
JP2007503635A (ja) 2007-02-22
US20060261957A1 (en) 2006-11-23

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