EP1577020A2 - Vorrichtung zum Auftragen von Klebstoff - Google Patents
Vorrichtung zum Auftragen von Klebstoff Download PDFInfo
- Publication number
- EP1577020A2 EP1577020A2 EP05004393A EP05004393A EP1577020A2 EP 1577020 A2 EP1577020 A2 EP 1577020A2 EP 05004393 A EP05004393 A EP 05004393A EP 05004393 A EP05004393 A EP 05004393A EP 1577020 A2 EP1577020 A2 EP 1577020A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- sonotrode
- channel
- outlet opening
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
Definitions
- the invention relates to a device for applying adhesive to a particular contaminated joining surface of a joining part.
- the joining method "gluing” is characterized by an increasing number of Applications and a high innovation potential. Gluing is predestined for Lightweight construction applications and especially for the repair sector.
- the achievable The strength of an adhesive bond is determined by the "adhesion" between the adhesive and the adhesive Adhesive part surface determined. The strength results from the adsorption work, which in the interface at the atomic level through short-range interactions becomes.
- One problem of the adhesive technique is adhesion-reducing contamination. Despite all Care can not be safely excluded in practice and the resulting Defective adhesion is unfortunately not destructively testable. Avoiding Adhesion-reducing contamination is already under the new part manufacturing under Controlled industrial conditions are problematic, it becomes even more difficult due to the higher number of possible unknown sources of contamination Repair applications on aged and media-loaded parts.
- the Contamination tolerance of the adhesive process is therefore an indispensable Demand of quality assurance and a challenge for the adhesive Research. Not new high strength adhesives and the achievable strength of a Adhesive bond are in the foreground, which is the criterion for the application Reliability.
- the application of document number DE 103 12 815 A1 describes a method for the Adhesion of contaminated parts, in which the contaminating components of the Joining part surfaces by introducing vibration energy / ultrasound in the not yet cured adhesive matrix are removed from the interface and in the Adhesive matrix are dissolved or dispersed, thereby wetting the Surface is improved.
- the device for applying adhesive be directly coupled to the sonotrode.
- the invention is based on the object, a device for applying adhesive To create a joining surface of a joining part, the costly cleaning and Surface pretreatment steps before applying the adhesive to the Substrate surface avoids or with the even with unavoidable contamination or recontamination ensures a sufficient quality of bonding and which also works effectively.
- the vibrations of the sonotrode are on the out of the adhesive outlet transferred outgoing adhesive. This will be the contaminating components the joining part surface by the introduction of the vibration energy or the ultrasound in the not yet cured adhesive matrix removed from the interface and in the Adhesive matrix dissolved or dispersed, which improves the wetting of the surface becomes.
- the coupling of ultrasound into the uncured adhesive results in that the adhesive absorbs the contamination and an undisturbed interaction between adhesive and adherend arises.
- the last crucial for the strength of the adhesive joint cleaning process is transferred directly to the adhesive used and there will be more Rekontaminationsde safely excluded.
- the fine cleaning of Bonding surface occurs in the adhesive under the influence of the power ultrasound Horn.
- the adhesive serves simultaneously as a coupling and cleaning medium. Adhesion-reducing interface contaminations are thereby removed from the interface away. Only then does the adhesive harden and create a load-bearing Connection.
- the contamination tolerant effect of the process is based on several effects.
- the Coupling of ultrasound leads to an improved Fügeeteilbenetzung, the release and removal of contamination under cavitation, the removal of Kapillarein Beingn from the adherend surface and a homogenization of the Adhesive.
- the device for applying adhesive is generally pasty adhesives used. It is suitable for both hot and especially for cold curing Adhesive systems that are designed as one-component as well as two-component can.
- the apparatus for applying adhesive is both manually applicable, e.g. For the repair area, as well as any automatable.
- the channel for the supply of adhesive is and the channel has an adhesive outlet opening, which is in the area of the free Head end of the sonotrode is arranged, one achieves a high degree of effectiveness and Economics.
- the sonotrode can be designed that it floats over the adherend on an adhesive film of defined thickness during operation. With the supply of the adhesive through the sonotrode occurs in the sonotrode one improved mixing and homogenization of the adhesive. This process in turn, additionally improves the properties of the joint connection. Furthermore improves the quality of the adhesive bead in terms of shape and required Volume. Since the amount of adhesive to be applied can be set accurately, the amount of adhesive reduces to the required level. One avoids that unnecessary Glue is squeezed out of the glue joint.
- the channel has an adhesive inlet opening in the lateral surface of the Sonotrode is arranged in the region of the vibration node.
- the adhesive outlet opening in the End face of the free head end of the sonotrode is arranged. This allows one a simple mechanical construction. Because during operation of the device enters the adhesive out of the face of the free head end and gets contaminated Applied joining surface of a joining part. At the same time, the Ultrasonic treatment also via the floating on the adhesive face of the free head end of the sonotrode.
- the channel is made up of a the adhesive outlet opening extending longitudinal bore and a through a Adhesive inlet opening extending transverse bore formed. Because of this simple Construction achieves a low-cost sonotrode with integrated channel for the feeding and application of glue.
- the device has a Adhesive pump connected to a control circuit to regulate the flow rate the adhesive is connected.
- a Adhesive pump connected to a control circuit to regulate the flow rate the adhesive is connected.
- the control circuit is so designed so that it is applied during operation with an input value that is the value the power consumption of the ultrasonic generator corresponds.
- the power consumption of Sonotrode is a direct measure of the coupling of the ultrasound into the adhesive and the quality of the treatment of the adhesive / adherend interface. Therefore, the Power consumption is a very important input for controlling the flow rate of the adhesive to ensure that, based on the flow rate of the Adhesive also a sufficiently high energy is coupled. The primarily through the delivery rate and viscosity resulting film thickness can thus with a reproducible interfacial treatment by a sufficient Power input of ultrasound to be treated.
- a temperature sensor is arranged in the region of the free top end of the sonotrode.
- the temperature sensor is arranged in the region of the adhesive outlet opening in order to be able to detect the adhesive temperature as accurately as possible.
- the control circuit can be acted upon in operation with a further input variable, which corresponds to the temperature, as determined by the temperature sensor.
- the temperature magnitude determined by the temperature sensor also represents a measure of the power consumption of the sonotrode. The diffusion, dissolution and / or dispersion of the contaminating contaminants of the substrate surface in the adhesive matrix are promoted by an increase in the temperature of the adhesive.
- the size of the power consumption of the sonotrode is also determined by the temperature sensor temperature size to ensure the quality of the adhesive bond. For example, it may be specified that a temperature range of 50 ° C to 60 ° C must be maintained. In automated operation, the size of the temperature and / or the size of the power consumption of the sonotrode can be recorded as part of quality assurance.
- the sole figure shows a device for applying adhesive to a in particular contaminated joining surface 50 of a joining part 5.
- the device comprises a sonotrode 1, in which a channel 10 for the supply of adhesive arranged is.
- This channel 10 has an adhesive outlet opening 11 which is in the area of the free Head end of the sonotrode 1 is arranged.
- the sonotrode 1 is designed so that In operation, the vibrations of the sonotrode 1 on the from the adhesive outlet opening 11th Be transferred adhesive.
- the sonotrode 1 is part of an ultrasonic head, in addition to the sonotrode 1 still a Piezo-resonator 3 and a coupling piece 2 has.
- the channel has an adhesive inlet opening 12, which in the lateral surface of the sonotrode is arranged in the region of the vibration node 81.
- the vibration node 81 is illustrated by a graph in which the vibration amplitudes on the Length of the ultrasound head are applied.
- the adhesive outlet opening 11 is in the end face of the free head end of the sonotrode. 1 arranged. Below the adhesive outlet opening 11, an adhesive bead 7 is shown, which has been applied to a contaminated joining surface 50.
- the channel 10 is made of a through the adhesive outlet opening 11 extending longitudinal bore 13 and a through the adhesive inlet opening 12 extending transverse bore 14 formed.
- the device has an adhesive pump 70, which via a line 63 to a Control circuit 60 connected to regulate the flow rate of the adhesive is.
- the control circuit 60 is designed to operate with a Input value is applied, which is the value of the power consumption of the sonotrode equivalent. This illustrates the input line 61.
- a temperature sensor 16th In the area of the free head end of the sonotrode 1 is a temperature sensor 16th arranged. As shown, the temperature sensor 16 is in the range the adhesive outlet opening 11.
- the control circuit 60 is in operation with a applied further input quantity, which corresponds to the temperature, as of the Temperature sensor 16 was determined. This illustrates the input line 62.
- the quality assurance is the control circuit 60 with an electronic storage provided the magnitude of the temperature as well as the size of the power consumption of the Record sonotrode.
- the example below is intended to make it clear that it is possible to achieve a high-strength adhesive bond even with a contaminated joining surface using the device for applying adhesive.
- the example uses a double cantilever beam (DCB) sample consisting of two legs to be glued together. One of the legs has on the joining surface residues of hydraulic oil, namely 3 grams / m 2 .
- the adhesive used is Terokal 5045®. The adhesive was applied to the device shown in the figure with the simultaneous application of ultrasound to the joining surface of the contaminated leg.
- the sonotrode had a power consumption of 100 watts during adhesive application.
- the adhesive outlet 11 had a diameter of 3 mm.
- the head of the sonotrode 1 floated to an adhesive thickness of about 0.9 mm.
Landscapes
- Coating Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
Description
- die Vorrichtung umfasst eine Sonotrode,
- in der Sonotrode ist ein Kanal für die Zuführung von Klebstoff angeordnet,
- der Kanal weist eine Kleberaustrittsöffnung auf, die im Bereich des freien Kopfendes der Sonotrode angeordnet ist,
- die Sonotrode ist so ausgebildet, dass im Betrieb die Schwingungen der Sonotrode auf den aus der Kleberaustrittsöffnung heraustretenden Klebstoff übertragen werden.
Beispielsweise kann vorgegeben sein, dass ein Temperaturbereich von 50°C bis 60°C einzuhalten ist. Im automatisierten Betrieb kann die Größe der Temperatur und/oder die Größe der Leistungsaufnahme der Sonotrode im Rahmen der Qualitätssicherung aufgezeichnet werden.
Im Beispiel wird eine DCB(double cantilever beam)-Probe verwendet, die aus zwei miteinander zu verklebenden Schenkeln besteht. Einer der Schenkel weist auf der Fügeoberfläche Rückstände von Hydrauliköl auf, und zwar 3 Gramm/m2. Als Klebstoff wird Terokal 5045® verwendet. Der Klebstoff wurde mit der in der Fig. dargestellten Vorrichtung unter gleichzeitiger Aufbringung von Ultraschall auf die Fügeoberfläche des kontaminierten Schenkels aufgetragen. Die Sonotrode hatte während des Klebstoffauftrags eine Leistungsaufnahme von 100 Watt. Die Kleberaustrittsöffnung 11 hatte einen Durchmesser von 3 mm. Der Kopf der Sonotrode 1 schwamm auf einer Klebstoffdicke von ungefähr 0,9 mm. Danach wurde der nicht kontaminierte Schenkel auf den kontaminierten Schenkel gedrückt und fixiert. Nach der Aushärtung wurde die Qualität der Verklebung im DCB-Versuch ermittelt. Hierbei trat ein Kohäsionsbruch auf, der auf eine ungestörte Adhäsionswirkung zwischen Klebstoff und Fügeteil schließen lässt. Eine weitere DCB-Probe wurde zum Vergleich ohne eine Ultraschalleinkoppelung hergestellt. Diese zeigte im DCB-Versuch gegenüber der zuvor beschriebenen, mit Ultraschall behandelten Probe einen Adhäsionsbruch an der kontaminierten Fügeoberfläche des kontaminierten Schenkels. Die Energiefreisetzungsrate der nicht mit Ultraschall behandelten Probe betrug weniger als 1/5 (0,109 N/mm2) als die der mit Ultraschall behandelten Probe (0,590 N/mm2).
- 1
- Sonotrode
- 10
- Kanal für Klebstoff
- 11
- Kleberaustrittsöffnung
- 12
- Klebereintrittsöffnung
- 13
- Längsbohrung
- 14
- Querbohrung
- 15
- Stirnfläche
- 2
- Koppelstück
- 3
- Piezoresonator
- 5
- Fügeteil
- 50
- Fügeoberfläche
- 60
- Regelungsschaltung
- 61
- Eingangsleitung (Größe der Leistungsaufnahme des Ultraschallerzeugers)
- 62
- Eingangsleitung (Temperaturgröße)
- 63
- Leitung (Beaufschlagung der Klebstoffpumpe)
- 7
- Klebstoffraupe
- 70
- Klebstoffpumpe 71 Klebstoffbehälter
- 81
- Schwingungsknoten
Claims (7)
- Vorrichtung zum Auftragen von Klebstoff auf eine insbesondere kontaminierte Fügeoberfläche (50) eines Fügeteils (5), mit folgenden Merkmalen:die Vorrichtung umfasst eine Sonotrode (1),in der Sonotrode (1) ist ein Kanal (10) für die Zuführung von Klebstoff angeordnet,der Kanal (10) weist eine Kleberaustrittsöffnung (11) auf, die im Bereich des freien Kopfendes der Sonotrode (1) angeordnet ist,die Sonotrode (1) ist so ausgebildet, dass im Betrieb die Schwingungen der Sonotrode (1) auf den aus der Kleberaustrittsöffnung (11) heraustretenden Klebstoff übertragen werden.
- Vorrichtung nach Anspruch 1, bei der der Kanal (10) eine Klebereintrittsöffnung (12) aufweist, die in der Mantelfläche der Sonotrode (1) im Bereich des Schwingungsknotens (81) angeordnet ist.
- Vorrichtung nach Anspruch 1 oder 2, bei der die Kleberaustrittsöffnung (11) in der Stirnfläche des freien Kopfendes der Sonotrode (1) angeordnet ist.
- Vorrichtung nach einem der Ansprüche 1 bis 3, bei der der Kanal (10) sich aus einer durch die Kleberaustrittsöffnung (11) erstreckende Längsbohrung (13) und einer sich durch eine bzw. sich durch die Klebereintrittsöffnung (12) erstreckende Querbohrung (14) gebildet ist.
- Vorrichtung nach einem der Ansprüche 1 bis 4, die eine Klebstoffpumpe (70) aufweist, die an eine Regelungsschaltung (60) zur Regelung der Fördermenge des Klebstoffes angeschlossen ist.
- Vorrichtung nach Anspruch 5, bei der die Regelungsschaltung (60) so ausgebildet ist, dass sie im Betrieb mit einer Eingangsgröße beaufschlagt wird, die dem Wert der Leistungsaufnahme der Sonotrode (1) entspricht.
- Vorrichtung nach einem der Ansprüche 1 bis 6, bei der im Bereich des freien Kopfendes der Sonotrode (1) ein Temperatursensor (16) angeordnet ist.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004013845A DE102004013845B3 (de) | 2004-03-20 | 2004-03-20 | Vorrichtung und Verfahren zum Auftragen von Klebstoff |
DE102004013845 | 2004-03-20 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1577020A2 true EP1577020A2 (de) | 2005-09-21 |
EP1577020A3 EP1577020A3 (de) | 2008-03-19 |
EP1577020B1 EP1577020B1 (de) | 2009-08-26 |
Family
ID=34833222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05004393A Not-in-force EP1577020B1 (de) | 2004-03-20 | 2005-03-01 | Verfahren zum Auftragen von Klebstoff |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050238819A1 (de) |
EP (1) | EP1577020B1 (de) |
AT (1) | ATE440675T1 (de) |
DE (2) | DE102004013845B3 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8215359B2 (en) * | 2009-03-05 | 2012-07-10 | Branson Ultrasonics Corporation | Part sensing horn |
JP5491081B2 (ja) * | 2009-06-22 | 2014-05-14 | 株式会社アルテクス | 超音波振動金属接合用共振器 |
DE102010039339A1 (de) | 2010-08-16 | 2012-08-09 | Steffen Möglich | Klebesystem |
DE102016000064A1 (de) * | 2016-01-06 | 2017-07-06 | Baumer Hhs Gmbh | Klebstoffauftragsvorrichtung |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD205180A1 (de) | 1982-05-10 | 1983-12-21 | Klaus Ruhsland | Verfahren zur herstellung von klebverbindungen |
JPS63132788A (ja) | 1986-11-21 | 1988-06-04 | Miyachi Electric Co | 板体の接合方法 |
JPH01259080A (ja) | 1988-04-09 | 1989-10-16 | Morikawa Sangyo Kk | 物体の接着方法及び装置 |
DE4226312A1 (de) | 1992-08-08 | 1994-02-10 | Ralph Kerstner | Verfahren zur Herstellung einer Klebeverbindung zwischen flächigen Bauelementen |
JPH0657229A (ja) | 1992-08-08 | 1994-03-01 | Kanegafuchi Chem Ind Co Ltd | 接着剤の攪拌混合方法 |
DE19502381A1 (de) | 1995-01-26 | 1996-08-01 | Teroson Gmbh | Strukturelle Rohbauklebstoffe auf Kautschukbasis |
JP2000073031A (ja) | 1998-08-31 | 2000-03-07 | Mitsui High Tec Inc | 絶縁性テ−プ貼着方法及びその装置 |
DE19858921A1 (de) | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Schlagfeste Epoxidharz-Zusammensetzungen |
US6544364B2 (en) | 1999-12-24 | 2003-04-08 | Ykk Corporation | Ultrasonic adhering method and apparatus |
DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3317139A (en) * | 1965-04-13 | 1967-05-02 | Simms Group Res Dev Ltd | Devices for generating and delivering mechanical vibrations to a nozzle |
EP0242460A1 (de) * | 1985-01-18 | 1987-10-28 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Zerstäuber zum Verdampfen eines Monomers |
DE4103740A1 (de) * | 1991-02-07 | 1992-08-13 | Branson Ultraschall | Verfahren und vorrichtung zum plastifizieren von kunststoff |
DE19707407A1 (de) * | 1996-03-08 | 1997-09-11 | Brodbeck Maschb Gmbh | Vorrichtung zur Herstellung eines Röhrchens |
GB9805176D0 (en) * | 1998-03-12 | 1998-05-06 | Rosslyn Precision Ltd | Ultrasonic seam bonding method and apparatus |
GB0007716D0 (en) * | 2000-03-31 | 2000-05-17 | Rosslyn Precision Ltd | Fabric joining by fibre encapsulation |
JP2002096013A (ja) * | 2000-09-26 | 2002-04-02 | Fujitsu Ltd | 樹脂塗布方法 |
-
2004
- 2004-03-20 DE DE102004013845A patent/DE102004013845B3/de not_active Expired - Fee Related
-
2005
- 2005-03-01 DE DE502005007969T patent/DE502005007969D1/de not_active Expired - Fee Related
- 2005-03-01 EP EP05004393A patent/EP1577020B1/de not_active Not-in-force
- 2005-03-01 AT AT05004393T patent/ATE440675T1/de not_active IP Right Cessation
- 2005-03-18 US US11/084,530 patent/US20050238819A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD205180A1 (de) | 1982-05-10 | 1983-12-21 | Klaus Ruhsland | Verfahren zur herstellung von klebverbindungen |
JPS63132788A (ja) | 1986-11-21 | 1988-06-04 | Miyachi Electric Co | 板体の接合方法 |
JPH01259080A (ja) | 1988-04-09 | 1989-10-16 | Morikawa Sangyo Kk | 物体の接着方法及び装置 |
DE4226312A1 (de) | 1992-08-08 | 1994-02-10 | Ralph Kerstner | Verfahren zur Herstellung einer Klebeverbindung zwischen flächigen Bauelementen |
JPH0657229A (ja) | 1992-08-08 | 1994-03-01 | Kanegafuchi Chem Ind Co Ltd | 接着剤の攪拌混合方法 |
DE19502381A1 (de) | 1995-01-26 | 1996-08-01 | Teroson Gmbh | Strukturelle Rohbauklebstoffe auf Kautschukbasis |
JP2000073031A (ja) | 1998-08-31 | 2000-03-07 | Mitsui High Tec Inc | 絶縁性テ−プ貼着方法及びその装置 |
DE19858921A1 (de) | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Schlagfeste Epoxidharz-Zusammensetzungen |
US6544364B2 (en) | 1999-12-24 | 2003-04-08 | Ykk Corporation | Ultrasonic adhering method and apparatus |
DE10312815A1 (de) | 2003-03-22 | 2004-10-07 | Henkel Kgaa | Verfahren zum Kontaminationstoleranten Kleben von Fügeteilen |
Also Published As
Publication number | Publication date |
---|---|
EP1577020A3 (de) | 2008-03-19 |
US20050238819A1 (en) | 2005-10-27 |
DE102004013845B3 (de) | 2005-11-03 |
EP1577020B1 (de) | 2009-08-26 |
DE502005007969D1 (de) | 2009-10-08 |
ATE440675T1 (de) | 2009-09-15 |
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