Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
  • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
  • B29C65/526—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by printing or by transfer from the surfaces of elements carrying the adhesive, e.g. using brushes, pads, rollers, stencils or silk screens
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
  • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
  • B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
  • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
  • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
  • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
  • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/01—General aspects dealing with the joint area or with the area to be joined
  • B29C66/05—Particular design of joint configurations
  • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
  • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
  • B29C66/112—Single lapped joints
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/01—General aspects dealing with the joint area or with the area to be joined
  • B29C66/05—Particular design of joint configurations
  • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
  • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
  • B29C66/112—Single lapped joints
  • B29C66/1122—Single lap to lap joints, i.e. overlap joints
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/01—General aspects dealing with the joint area or with the area to be joined
  • B29C66/05—Particular design of joint configurations
  • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
  • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
  • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
  • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
  • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
  • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
  • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
  • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
  • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
  • B32B37/1284—Application of adhesive
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
  • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
  • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
  • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
  • B81C1/00349—Creating layers of material on a substrate
  • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C3/00—Assembling of devices or systems from individually processed components
  • B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
  • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
  • B01J2219/00781—Aspects relating to microreactors
  • B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
  • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
  • B01J2219/00781—Aspects relating to microreactors
  • B01J2219/00819—Materials of construction
  • B01J2219/00833—Plastic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
  • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
  • B01J2219/00781—Aspects relating to microreactors
  • B01J2219/00851—Additional features
  • B01J2219/00858—Aspects relating to the size of the reactor
  • B01J2219/0086—Dimensions of the flow channels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
  • B01L2200/06—Fluid handling related problems
  • B01L2200/0689—Sealing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
  • B01L2200/12—Specific details about manufacturing devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/04—Closures and closing means
  • B01L2300/041—Connecting closures to device or container
  • B01L2300/044—Connecting closures to device or container pierceable, e.g. films, membranes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
  • B01L2300/00—Additional constructional details
  • B01L2300/08—Geometry, shape and general structure
  • B01L2300/0809—Geometry, shape and general structure rectangular shaped
  • B01L2300/0819—Microarrays; Biochips
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/01—General aspects dealing with the joint area or with the area to be joined
  • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
  • B29C66/024—Thermal pre-treatments
  • B29C66/0242—Heating, or preheating, e.g. drying
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
  • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/756—Microarticles, nanoarticles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2201/00—Specific applications of microelectromechanical systems
  • B81B2201/02—Sensors
  • B81B2201/0214—Biosensors; Chemical sensors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2201/00—Specific applications of microelectromechanical systems
  • B81B2201/05—Microfluidics
  • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C2201/00—Manufacture or treatment of microstructural devices or systems
  • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
  • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
  • B81C2201/019—Bonding or gluing multiple substrate layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
  • B81C2201/00—Manufacture or treatment of microstructural devices or systems
  • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
  • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
  • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer

Definitions

• the invention relates to a method for producing a component, comprising a micro-structured substrate and a complementary element assembled by means of an assembly joint. It also relates to a component made by this method.
• micro-structured components in particular micro-fluidic devices (bio-chips, "lab-on-chip”, etc.) or micro-mechanical devices (MEMS, OEMS, etc.), generally involves micro-structuring. at the surface or in volume of at least one substrate where free spaces are created which allow the circulation or the storage of fluids.
• the cavities and channels thus created are open on at least one side and therefore need to be connected or assembled to another structure (open or closed hood, capillaries, other microfluidic substrate ).
• micro-structured components require assembly joints and possibly microstructured seals.
• manipulation and positioning of micro-structured joints is very difficult.
• these techniques require high temperatures or chemical preparations which limit the possibility of functionalizing the components to be assembled (for example by biological grafting) and are limiting in the choice of materials.
• thermal welding also limits the choice of materials.
• pre-bonded adhesive films has the disadvantage of the presence of glue in contact with fluids to handle and poses problems of biological compatibility.
• the object of the invention is to remedy these drawbacks and, more particularly, to propose a process for manufacturing micro-structured components, minimizing the problems of biological compatibility, while reducing the complexity and the manufacturing cost. According to the invention, this object is achieved by the fact that the method comprises the manufacture of the assembly joint by:
• the transfer substrate is flexible and the withdrawal of the transfer substrate is carried out by pulling it at one end.
• the method comprises a step of chemical activation of the complementary element and / or, after the third step, a step of chemical activation of the assembly joint disposed on the micro-structured substrate.
• the invention also relates to a component, made by the above method, and comprising a complementary element assembled to the micro-structured substrate by the assembly joint, the element being a cover, another micro-structured substrate, a capillary or a matrix of capillaries integral with each other.
• Figures 1 to 6 show different stages of a particular embodiment of a method according to the invention.
• FIG. 7 represents a particular embodiment of the invention with support zones on the micro-structured substrate.
• FIG. 8 represents a particular embodiment of a component according to the invention, in which the complementary element is a capillary.
• Figure 9 shows an embodiment variation of a transfer substrate.
• a thin layer of polymer 2 is deposited on a transfer substrate 1.
• a deposition technique typically used is spinning.
• the polymer of the thin layer 2 and the material of the transfer substrate 1 must have a chemical affinity for the second and third steps described below.
• the materials of the transfer substrate 1 and the polymer thin film 2 are both polydimethylsiloxane (PDMS).
• PDMS polydimethylsiloxane
• An advantageous property of a transfer substrate 1 in PDMS is its flexibility.
• an additional intermediate step of crosslinking for example by heating, can be added just after the deposit.
• the second step (FIG. 3) consists of contacting the thin polymer layer 2 carried by the transfer substrate 1 with the micro-structured substrate.
• the chemical affinity between the thin polymer layer 2 and the microstructured substrate 3 must be stronger than the chemical affinity between the thin polymer layer 2 and the transfer substrate 1.
• the adaptation of the affinity between the thin polymer layer 2 and the micro-structured substrate 3 can be carried out, before the second step, by additional intermediate steps of chemical activation. As shown in FIG. 2, the chemical activation steps can be applied to the polymer layer 2 and / or the micro-structured substrate 3.
• a chemical activation means used is an oxygen plasma.
• FIG. 2 a simultaneous plasma oxidation of the thin polymer layer 2 and the micro-structured substrate 3 is shown.
• the toughness of the thin polymer layer 2 decreases after plasma oxidation, facilitating the third step of the method described below.
• the thin layer of polymer can be irreversibly bonded to the micro-structured substrate by suitably adapting the chemical affinity by chemical activation steps prior to the second step (Fig. 2).
• the transfer substrate 1 is removed. Only the zones of the thin polymer layer 2 in contact with the micro-structured substrate 3 during the second step remain on the micro-structured substrate 3. In fact, the chemical affinity between the micro-structured substrate 3 and the thin layer of polymer 2 being stronger than the chemical affinity between the thin polymer layer and the transfer substrate 1, the thin polymer layer 2 tears, a part 4 remaining attached to the micro-structured substrate 3, the rest 6 leaving with the transfer substrate 1. The areas of the thin layer of polymer 2 which were not in contact with the micro-structured substrate 3 during the second step thus remain as residues 6 on the transfer substrate 1. The assembly joint 4 is thus formed by the zones of the layer remaining polymer on the micro-structured substrate 3.
• the second step requires no alignment, the micro-structured substrate 3 itself defining the contact areas with the layer 2.
• the toughness of the thin polymer layer 2 must be very low. The tenacity can be reduced in particular by plasma oxidation preceding the second step (FIG. 2).
• the method described above allows the formation of an assembly joint 4 conforming to the micro-structured substrate 3 to be connected or assembled, without leaving a dead space and without adding material above cavities 5 formed in the substrate. micro-structured 3.
• the surface of the joint 4 in contact with the materials (fluids, liquids, etc. ..) contained in the cavities 5 is minimized, which allows to minimize the possible interaction between the material of the assembly joint 4 and the materials contained in the cavities 5.
• the biological compatibility of the component is thus optimized.
• This method allows simultaneous formation of a multitude of assembly micro-joints, each of which can be very small ( ⁇ 20 ⁇ m), on micro-structured substrates of large area (treatment of a complete wafer), the micro-substrate structured delimiting itself the joint assembly.
• the process is fast, inexpensive and requires no alignment for joint formation.
• performing the third step is facilitated by the use of a flexible transfer substrate that can be removed by one end (Figure 4). This avoids the use of excessive force that can damage the component.
• a complementary element 7 can be fixed on the micro-structured substrate 3 by means of the joint 4, possibly reversibly, by keeping the complementary element 7 by a device (not shown) providing contact intimate with the joint assembly 4. It is also possible to fix the complementary element 7 irreversibly on the micro-structured substrate 3 by adding one or more steps of chemical activation of the joint 4 and / or the complementary element 7, for example by plasma oxidation (FIG. 5).
• the micro-structured substrate 3 comprises a support zone 8 serving to support the transfer substrate 1 during the second step in the case where zones intended to define the joint joint 4 are relatively distant from each other.
• the bearing zones 8 thus prevent the polymer thin film 2 from sticking to lower surfaces 9 of the micro-structured substrate 3 between two zones defining the jointing joint, while ensuring the parallelism between the transfer substrate and the the micro-structured substrate during the second step.
• the complementary element 7 is a cover 7 closing the cavities 5 of the microstructured substrate 3.
• complementary element is constituted by a capillary 10 or a matrix of capillaries integral with each other.
• the complementary element 7 is another micro-structured substrate.
• the transfer substrate is a micro-structured substrate 11, making it possible to avoid the contact of the thin polymer layer 2 on certain zones 12 of the surface of the micro-structured substrate. 3.
• the formation of such a microstructured transfer substrate 11 can be made by molding for example.
• a micro-structured transfer substrate 11 requires alignment with the micro-structured substrate 3 during the second process step, making the process more complicated.
• the material of the joining joint will be selected from thermo-hard resins, elastomers or elastomeric thermoplastics meeting the following criteria:
• PDMS polydimethylsiloxane
• rank Sylgard ® 184 Dow Corning ® is particularly suitable, thanks to its optical qualities and biological compatibility.
• Dow Corning ® Sylgard ® 184 Grade PDMS can be activated with low energy oxygen plasma
• the material of the transfer substrate is preferably chosen so as to form covalent bonds (free methacryl groups, for example, which bind to the methacryl groups of the PDMS of the thin layer) with the material of the jointing joint and for its flexibility. For this reason, a preferred choice is a PDMS transfer substrate, freshly made to avoid storage-related dusting problems, since PDMS is very dust-hungry.
• the thin layer of PDMS is preferentially heat-cured to save time (4 hours at 60 °).
• the use of a spinner makes it possible to choose the thickness of the joint (typically between a few micrometers and 50 ⁇ m).
• the material of the micro-structured substrate to be assembled or connected, or at least of the surfaces dedicated to the formation of the joint, must be able to be activated to form covalent bonds with said jointing joint. Similarly, covalent bonds can be made between said seal and the complementary element. Under these conditions, the assembled final component can be fluid tight.
• the micro-structured substrate In the manufacture of enzymatic digestion reactors on silicon, the micro-structured substrate consists of channels several millimeters long and 1 mm wide, in which are milled 5 ⁇ m or 10 ⁇ m diameter column matrices (several millions of columns). This makes it possible to increase the surface / volume ratio of said reactors, the enzymatic digestion reaction taking place between wall-grafted enzymes and proteins carried in these reactors.
• the present invention has notably allowed the formation of an assembly joint on very small patterns (square columns of

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Dispersion Chemistry (AREA)
• Analytical Chemistry (AREA)
• Health & Medical Sciences (AREA)
• General Health & Medical Sciences (AREA)
• Clinical Laboratory Science (AREA)
• Hematology (AREA)
• Organic Chemistry (AREA)
• Physical Or Chemical Processes And Apparatus (AREA)
• Micromachines (AREA)
• Application Of Or Painting With Fluid Materials (AREA)
• Adhesive Tapes (AREA)
• Adhesives Or Adhesive Processes (AREA)

Applications Claiming Priority (3)

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• 2002
  • 2002-11-08 FR FR0213998A patent/FR2846906B1/fr not_active Expired - Fee Related
• 2003
  • 2003-11-04 WO PCT/FR2003/003288 patent/WO2004043849A2/fr active Application Filing
  • 2003-11-04 US US10/533,296 patent/US20060048885A1/en not_active Abandoned
  • 2003-11-04 JP JP2004550736A patent/JP2006505418A/ja active Pending
  • 2003-11-04 EP EP03767900A patent/EP1558518A2/de not_active Withdrawn

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