EP1490894A1 - Procede de traitement de composants electriques, notamment de puces a semi-conducteur et dispositif pour mettre ledit procede en oeuvre - Google Patents

Procede de traitement de composants electriques, notamment de puces a semi-conducteur et dispositif pour mettre ledit procede en oeuvre

Info

Publication number
EP1490894A1
EP1490894A1 EP03745743A EP03745743A EP1490894A1 EP 1490894 A1 EP1490894 A1 EP 1490894A1 EP 03745743 A EP03745743 A EP 03745743A EP 03745743 A EP03745743 A EP 03745743A EP 1490894 A1 EP1490894 A1 EP 1490894A1
Authority
EP
European Patent Office
Prior art keywords
components
carrier
conveyor
separation
carrier material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03745743A
Other languages
German (de)
English (en)
Inventor
Georg Sillner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10225097A external-priority patent/DE10225097A1/de
Application filed by Individual filed Critical Individual
Publication of EP1490894A1 publication Critical patent/EP1490894A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Definitions

  • the invention relates to a method according to the preamble of claim 1 and to a device according to the preamble of claim 22.
  • Semiconductor wafer which is then used for further processing of the semiconductor chips on a carrier, i. H. is releasably attached to a carrier film (blue foil) clamped in a carrier frame, in such a way that the electrical connections or contact surfaces of the chips are located on the side of the wafer facing away from the carrier film.
  • a carrier film blue foil
  • the wafer is then cut into the individual semiconductor chips, the chips still adhering to the carrier film.
  • the semiconductor chips If, for example, a substrate or another semiconductor chip is to be contacted, it is necessary for the semiconductor chips to be turned over, i. H. are placed with their contact areas in advance on the respective substrate or on contact areas there. According to the previous technology, the chips have to be gripped individually with a first pick-up element on one side and from the carrier film
  • the object of the invention is to demonstrate a method with which it is possible to process a group consisting of a multiplicity of electrical components or semiconductor chips together and preferably to deposit them again in the multiple use 5, for example on a carrier (second carrier).
  • a method according to claim 1 is designed to achieve this object.
  • a device for performing the method is designed according to claim 22.
  • the processing of the components and preferably also the placement of the components are carried out, for example, in multiple uses. If the processing causes a turning, the components can be removed from the storage in their already turned form using simple means, for example using conventional dies.
  • processing in the sense of the invention means transporting the components.
  • processing also means, in particular, turning the components and / or placing the components in multiple use, O i.e. as a group of several components on a shelf or a support.
  • tray or carrier generally means any tray that is suitable for storing and / or placing components, in particular also a carrier film, a belt, a conveyor, a tableau for .5 holding several components, etc.
  • use in multiple use means that a group of at least two components or chips, for example an entire one, is already in individual chips of semiconductor wafers that have been separated but still held together on a carrier material or a carrier foil (blue foil) are turned over and the individual components are then deposited again as an entire group or as part of the group or individually.
  • Fig. 1 is a simplified schematic diagram for explaining an embodiment of the
  • FIG. 2 shows a schematic representation of a section through a transfer element
  • FIGS. 6-8 show the separation and transfer station of a further possible embodiment of the invention in different working states and in a view corresponding to FIG. 3; 9 shows a schematic illustration of the separation and transfer station of FIGS. 6-7 in a view perpendicular to the transport direction of the components or
  • Fig. 10 is a plan view of a part length of the further conveyor;
  • Figure 1 1 in a perspective view of the conveyor of Figures 9 and 10, together with another transport element.
  • 12 shows a simplified representation of a top view of the conveyor belt with the components arranged there in front of the separation and transfer unit of FIGS. 6-8 in a further possible embodiment;
  • Embodiment of the transfer element for separating the carrier film part carrying the components and for applying this carrier film part with the components to the conveyor belt of the transporter.
  • the method shown in FIG. 1 and the device shown there serve to turn the semiconductor chips 2, which are each formed by a semiconductor wafer 1 and are already separated and held on a carrier foil 3 (blue foil) in a carrier frame 4, in multiple and in for a further processing of the semiconductor chips 2 again on a carrier foil 3a (blue-foil) held in a carrier frame 4a, while maintaining their order predetermined by the wafer.
  • the semiconductor chips 2 are originally arranged on the carrier film 3 such that the contact surfaces 2 'of the semiconductor chips 2 are located on the upper side of the respective chip 2 facing away from the carrier film 3, the semiconductor chips 2 are at the end of the method shown in FIG can also be referred to as a flip-chip process, arranged on the carrier film 3a in such a way that their side bearing the contact surfaces 2 'abuts against the carrier film 3a.
  • the chips 2 can then be processed particularly easily, for example using a pick-and-place unit, for example when populating a printed circuit board or another semiconductor chip (chip-on-chip technology), in a die bonder, etc.
  • the carrier foils 3 and 3a are formed by a self-adhesive foil (blue foil), as is used in semiconductor production.
  • the wafers 1, each adhering to a part 3 ′ of the carrier film 3 and already separated into the individual semiconductor chips 2, are placed on a conveyor 6 or its belt 7 at a feed station 5, specifically in such a way that that the part 3 'of the carrier film 3 cut out with the wafer 1 with its underside facing away from the wafer 1 on the upper side of the conveyor belt 7
  • the conveyor belt 7 is formed by a belt-shaped transport film which is self-adhesive on its upper side and can only be used once and is pulled off, for example in a clocked manner, from a supply 8 in the transport direction A of the transporter 6 via a drive (not shown).
  • a pick-up and separating element 10 is provided at the feed station 5, which u. a. has a suction head 10 'which forms on its underside a recess 11 which is open towards this underside and otherwise closed. To pick up a wafer 1, the suction head 10 'is included
  • Carrier film 3 of the uppermost carrier frame 4 in stack 9 is moved up (removal position 12), so that the suction head 10 'or its opening 11 completely receives the wafer 1 and the carrier film 3 with an edge region surrounding the wafer 1 against an opening of the recess 1 1 surrounding edge 1 3 of
  • the carrier film 3 is then removed with the associated carrier frame 4 and the wafer 1 from the stack 9 and moved to a cutting position 12a, at which, by means of a cutting tool 15, the part 3 'of the carrier film 3 held on the suction head 10' of that via the suction head 10 'radially protruding remainder 3 "of this carrier foil 3 and thus also separated from the carrier frame 4, so that only the part 3' with the wafer 1 is held on the suction head 10 '.
  • the carrier frame 4 with the carrier foil remnants 3" are accordingly Arrow B is conveyed away from the cutting position 12a and is used again.
  • the carrier film part 3 'carrying the wafer 1 is then placed with the suction head 10' at the transfer position of the station 5 on the top of the section 6 'of the conveyor 6 or the conveyor belt 7 arranged there in a horizontal plane.
  • the conveyor belt 7 or the conveyor film forming this conveyor belt is guided over a turning area 16, which in the simplest case is formed by a deflecting roller or roller or an arcuate guide rotating about a horizontal axis perpendicular to the transport direction A and on which the conveyor belt 7 is turned the way that the carrier film parts 3 'with the wafers 1 are held hanging on the underside of the conveyor belt 7 on the section 6 "of the conveyor 6 following the turning device 16 in the transport direction A.
  • a turning area 16 which in the simplest case is formed by a deflecting roller or roller or an arcuate guide rotating about a horizontal axis perpendicular to the transport direction A and on which the conveyor belt 7 is turned the way that the carrier film parts 3 'with the wafers 1 are held hanging on the underside of the conveyor belt 7 on the section 6 "of the conveyor 6 following the turning device 16 in the transport direction A.
  • the length 6 "of the conveyor 6 is again in a horizontal plane, but below the length 6 '. Below the length 6" and parallel to this, the upper length 17' of an endless conveyor belt 17 is arranged.
  • the conveyor belt 1 7 is part of a second conveyor and driven endlessly and synchronously with the conveyor belt 7 in such a way that in each case one wafer held on the underside of the length 6 " 1 is brought together with a carrier film 3a arranged on the upper length 17 'or in a receptacle 18 there with its carrier frame 4a.
  • the support frames 4a with their support foils 3a are each removed from a stack 20 at a feed station by means of a pick-and-place element and inserted into a receptacle 18 of the conveyor belt 17.
  • a roller 21 or 22 is provided in each case. With the roller 21, the wafer 1 and the carrier film parts 3 'are pressed against the conveyor belt 7.
  • the roller 22 is used to press the wafer 1 or the semiconductor chip 2 with its side facing away from the carrier film part 3 ′ against the respective carrier film 3a.
  • the separation and transfer station 23 has a deflection element 24, on the deflection edge 25 running perpendicular to the transport direction A and parallel to the plane of the conveyor belt 7, the transport film is deflected by almost 180 °, so that the chips 2 are retained while maintaining their order in Detach wafer 1 from the respective carrier film part 3 '.
  • the semiconductor chips 2 are then releasably held on the respective carrier film 3a, and continue to do so while maintaining their original order in the wafer 1.
  • the conveyor belt 7 or the transport film, together with the carrier film parts 3 ′ adhering to this transport film, is wound up into a roll 26 after the deflection edge 25 for disposal.
  • a chamber-like structure formed by several knife-edge-like projections 27 is provided there.
  • the projections 27 serve as hold-down devices for the semiconductor chips 2 and prevent the semiconductor chips 2 from lifting off from the respective carrier film 3a at the deflection edge 25.
  • the projections 27 protrude in the transport direction C of the conveyor belt 1 7 over the deflecting edge 25 and are designed and arranged such that the underside of the projections 27 and the top side, which extends parallel or substantially parallel to the length 1 7 'of the conveyor belt 1 7 this conveyor belt 17 or the top of the respective carrier film 3a yields a guide gap for each semiconductor chip 2, the height of which is equal to or approximately the same as the thickness of the wafer 1.
  • the projections 27 can protrude over the deflection edge 25 in the transport direction and nevertheless the conveyor belt 7 is guided directly over the deflection edge 25, the projections 27 are designed as knives and cut the conveyor belt 7 into a plurality of strips before being wound onto the roll 26.
  • the carrier foils 3a held in their supporting frames 4a and provided with the wafers 1 in a reversible form are removed from the conveyor belt 17 and stacked for further processing (stack 29).
  • FIG. 4 shows, in a very simplified representation and in section, the assembly of an inverted semiconductor chip 2 on a substrate 30, which is made from an insulating material in the manner of a plate or plate and is provided with contact areas and conductor tracks at least on the surface side thereof which is at the top in FIG , for example in the form of a structured metallization.
  • the substrate 30 consists, for example, of plastic or ceramic.
  • the conductor tracks 31 are connected to external connections 32.
  • the respective semiconductor chip 2 is after the The above-described turning or flip-chip process at a corresponding work station by means of a pick-and-place element (not shown) is removed from the wafer 1 turned and placed on a carrier film 3a held in a supporting frame 4a and deposited on the substrate 30 such that the chip contacts 2 'are in contact with the associated contact surfaces 31. Applying heat then results in bonding, ie, for example, soldering the connections 2 ′ to the contact surfaces 31.
  • the contacts 2 'and / or the contact surfaces 31 are provided with an appropriate solder.
  • the semiconductor chip 2 is additionally mechanically anchored on the substrate 30 by means of an insulating mass 33, for example before the connections 2 ′ are bonded or soldered to the contact surfaces or conductor tracks 31.
  • the advantage is, inter alia, that complex wire bonding for connecting the contact surfaces 2 ′ to external connections 32 is not necessary.
  • the pick-and-place element for placing the respective semiconductor chip 2 in an inverted form is, for example, part of a die-bonder with which the semiconductor chips 2 are placed on the substrates 30 pre-assembled in a lead frame and then connected to the conductor tracks 31 of these substrates, the outer connections 32 then being formed by webs of the lead frame.
  • FIGS. 8-10 show a further possible embodiment of the invention. These figures again show the conveyor 6 with its section 6 'preceding the separating and transfer unit or station 23a. In this embodiment too, the transporter 6 is essentially of the self-adhesive type
  • the separating and transfer unit 23 again comprises the deflection element 24 with the deflection edge 25 via which the conveyor belt 7 with the
  • each chip of a row R lies in a line parallel to the transport direction A with a chip 2 of an adjacent row R.
  • Part of the separation and transfer unit 23a is also a storage element 34, .5, which then forms a storage area 35 at the deflection edge 25 in the conveying direction A, with a storage area that is parallel or approximately parallel to the transport plane TE, which the conveyor belt 7 in Has area of the deflecting element 24 or the deflecting edge 25, at the level of this transport plane or slightly below the level.
  • the shelf or the area formed by this shelf is selected so that a predetermined number of chip rows R can be accommodated on the shelf 35, ie two rows R in the embodiment shown.
  • the shelf 35 or the area formed by this shelf is with vacuum openings
  • the storage element 34 is furthermore in an axial direction parallel to the transport direction A by a predetermined horizontal stroke (double arrow
  • 0 D can be moved from a starting position, in which the tray 35 connects to the deflecting element 24 in the region of the deflecting edge 25 almost without gaps, into a further position in which there is a somewhat greater distance between the deposit 35 and the deflecting edge 25.
  • the storage element 34 is formed by a rectangular plate, which lies with its surface sides parallel to the transport plane TE and with a longer circumferential side parallel to the deflection edge 25, i.e. arranged parallel to an axis lying in the transport plane T and perpendicular to the transport direction A.
  • the tray 35 is one
  • Part of the separation and transfer unit 23a is also a plate-shaped .5 slide 38, which can be moved according to the double arrow E in an axial direction parallel to the transport direction A between an initial position and a disfigurement, the slide 38 in its initial position, which is shown in FIG is shown, the deflection element 24 or the respective to the deflection edge 25 with the Conveyor belt 7 conveyed chip arrangement on the top of these chips 2 covers a number of chip rows R, which is at least equal to the number of chip rows R received by the tray 35, and at the same time also covers the tray 35. With its underside, the slider 38 thus forms a guide for the> chip rows R. When it is separated from the carrier film parts 3 'and when it is transferred to the tray 35. In the disfigurement shown in FIGS. 7 and 8, the slider 38 pushed back so far that he also releases the tray 35.
  • Part of the separation and transfer unit 23a is also a pick-up unit 39,) which has two strip-like pick-up elements 40 or vacuum holders 40, with each of which the two rows of chips R provided on the tray 35 are located in one operation have the distance x, removed and then the chips 2 of these rows are placed on a further conveyor 41, on which the chips are held by adhesion, preferably using a vacuum, and via which the chips 2 are fed for further use.
  • the chip rows R are arranged one behind the other in the transport direction F of this conveyor 41, which is formed by an endlessly rotating conveyor belt, namely two chip rows R at right angles to the transport direction F spaced apart from one another by the greater distance X and parallel to each other.
  • the transport plane TE 41 of the transporter 41 is parallel to the transport plane TE 6 of the transporter 6.
  • the transport directions A and F run perpendicular to one another.
  • the operation of the separation and transfer unit 23 can be described as follows: When the slider 38 is in the starting position, by moving the conveyor belt 7 over the deflection edge 25, the two front chip rows R in the transport direction A are separated from the respective carrier film part 3 'and by the Slide 38 guided on the tray 35.
  • the storage element 34 is in its initial position. Subsequently, the slide 38 is moved back from its effective position to its inactive position and at the same time the contact element 34 is moved by the stroke D away from the deflection edge 35, so that the distance between the two chip rows R deposited on the tray 35 and the in Transport direction A front, chip row R still present on the carrier film part 3 'in the region of the deflecting edge 25 is somewhat enlarged. This state is shown in FIG. 7.
  • the pick-up unit 39 is moved towards the tray 35 in such a way that one row of chips R is detected by the vacuum holder 40.
  • the vacuum at the vacuum openings 36 is switched off, the chip rows are then carried along with the vacuum holder 40 moving upward, as is shown in FIG.
  • the two vacuum holders 40 are moved apart perpendicular to their longitudinal extent, so that the smaller center distance x, which the chip rows R on the conveyor belt 7 have according to the arrangement of the chips in the semiconductor wafer 1, to the larger center distance X enlarged (see Figure 6).
  • the rows of chips (R) are then placed on the conveyor 41 with the vacuum holder 40.
  • the larger distance X then corresponds, for example, to the machine distance of a subsequent device.
  • two further rows of chips R can be pushed onto the shelf 35 while the vacuum holders 40 are being moved apart or during the expansion of the chip rows R held on these vacuum holders with the slider 38 moved back into the working position their starting position has already been moved back.
  • vacuum holders 40 which are arranged with their longitudinal extension parallel to the transport plane TE 6 and perpendicular to the transport direction A, on their underside form a contact surface 41 for the chips 2 of the row of chips R.
  • the vacuum holder 40 are offset in the longitudinal direction Vacuum openings 42 are provided.
  • Part of the pick-up unit 39 is also a pick-up head, not shown in the figures, on which the vacuum holders 40 can be moved relative to one another in an axial direction perpendicular to their longitudinal extent and parallel to the transport plane TE 6, specifically from an initial position , in which the vacuum holders 40 essentially connect directly to one another and in which the center distance of each vacuum opening 42 of one vacuum holder 40 with the adjacent vacuum opening 42 of the other vacuum holder 40 has the center distance x, in a spread position, in which adjacent vacuum openings 42 of the vacuum holder 40 den have a larger center distance X from each other.
  • the vacuum holders 40 are provided on a head 43 of the pick-up unit 39, on which a drive for spreading the vacuum holders 40 is provided and which in turn is provided with a drive for the controlled movement of the pick-up unit 39 or the vacuum holder 40 is connected.
  • FIG. 1 1 again shows a perspective view of the conveyor 44 formed by a rotating conveyor belt, on which the two rows R of the components 2 are formed, which in this embodiment are again semiconductor chips or semiconductor components having such semiconductor chips.
  • a turning or transfer unit 45 Row R removed a component 2 and finally transferred the two components 2 to a conveyor 46 moving in the direction of arrow G or to vacuum holder 47 there, specifically one component 2 each to one of the vacuum holders 47 following one another in transport direction G.
  • a belt-like transport element 48 of which only a shortened length is shown, but which forms a self-contained, endless loop.
  • Both the conveyor 44 and the turning unit 45, as well as the conveyor 46 are each moved synchronously in a clocked manner.
  • the turning unit 45 has a parallel to about a horizontal axis
  • Transport direction G revolving drum 49 (arrow H), on the circumference of which vacuum holders 51 are provided, each offset by 90 ° about the drum axis 50, in each case offset in pairs in the direction of the drum axis 50.
  • the vacuum holder 51 and also the vacuum holder 47 are controlled such that two components 2 are removed from the transporter 44 in each work cycle with two vacuum holders 51 and at the same time two components 2 held on the vacuum holders 50 are transferred to two vacuum holders 47. After two turning steps in each case, the two components 2 removed from the conveyor 44 and the associated vacuum holders 51 reach the conveyor 46 for transfer to the vacuum holders 47 there.
  • the drum axis 50 is perpendicular to the transport direction F.
  • FIG. 12 again shows the bottom view of the conveyor belt 7 in section 6 ′′ of the conveyor 6, specifically in the transport direction C shortly before the separating and transfer unit 23a, in which the components or semiconductor chips 2 are removed in rows from the carrier foils rest 3 ′ (peeled off) and moved away with the aid of the pick-up unit 39, for example placed on the conveyor 44. While in the embodiment shown in FIGS. 6-10, the components or semiconductor chips 2 are arranged in an arrangement corresponding to the shape of the semiconductor wafer 1 FIG.
  • FIG. 12 shows an embodiment in which the components or semiconductor chips 2 are arranged in a rectangular arrangement 57 on the carrier film remainder 3 ', ie in an arrangement in which the rows R running perpendicular to the transport direction C have different lengths
  • the carrier foils rest 3 ' also have a substantially rectangular cut.
  • FIGS 1 3 and 14 show a simplified representation of a function of the separating and transfer element 10 corresponding separating and transfer element 53.
  • This in turn consists essentially of a suction head 53 'with an opening 54 on the underside of this suction head and one this opening surrounding and provided with a seal edge 55.
  • the opening 54 can be acted upon with negative pressure in a controlled manner.
  • At least one roller 57 is driven by a drive 58 so that the belt 56 moves in the direction of arrow I.
  • a cutting edge 59 is formed, which projects beyond the plane of the underside of the suction head 53 ′ defined by the edge 55.
  • the suction head 53 ′ is lowered onto the top of the carrier film 3 in such a way that the part of the carrier film 3 comprising the components 2 is received in the opening 54. whose depth is equal to or slightly greater than the height of the components or semiconductor chips 2.
  • the suction head 53 ' is lowered onto the carrier film 3, the cutting edge 59 pierces it.
  • a vacuum is then applied to the opening 54, so that the carrier film 3 with the components or semiconductor chips there is held by vacuum on the suction head 53 '.
  • Components are supported with their top side facing away from the carrier film 3 against the bottom of the opening 54.
  • the belt 56 rotates fully with the cutting edge 59, which then cuts the carrier film 3 at an essentially rectangular dividing line which corresponds to the arrangement of the components 2 and surrounds this arrangement, thus obtaining the essentially rectangular carrier film part 3 ' is and can be placed on the conveyor belt 7.
  • loading position 20 stacks of support frame 4a and support film 3a
  • A, B, C transport direction

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un procédé d'un genre nouveau permettant de traiter des composants électriques, notamment des puces à semi-conducteur, lesdits composants étant maintenus de manière détachable sur un premier matériau support d'un premier support, dans chaque cas sous forme de groupe d'au moins deux composants, par une première face.
EP03745743A 2002-04-04 2003-04-02 Procede de traitement de composants electriques, notamment de puces a semi-conducteur et dispositif pour mettre ledit procede en oeuvre Withdrawn EP1490894A1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE10214969 2002-04-04
DE10214969 2002-04-04
DE10218384 2002-04-24
DE10218384 2002-04-24
DE10225097A DE10225097A1 (de) 2002-04-04 2002-06-05 Verfahren zum Verarbeiten von elektrischen Bauelementen, insbesondere von Halbleiterchips, sowie Vorrichtung zum Durchführen des Verfahrens
DE10225097 2002-06-05
PCT/DE2003/001058 WO2003085702A1 (fr) 2002-04-04 2003-04-02 Procede de traitement de composants electriques, notamment de puces a semi-conducteur et dispositif pour mettre ledit procede en oeuvre

Publications (1)

Publication Number Publication Date
EP1490894A1 true EP1490894A1 (fr) 2004-12-29

Family

ID=28794618

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03745743A Withdrawn EP1490894A1 (fr) 2002-04-04 2003-04-02 Procede de traitement de composants electriques, notamment de puces a semi-conducteur et dispositif pour mettre ledit procede en oeuvre

Country Status (5)

Country Link
US (1) US20050204554A1 (fr)
EP (1) EP1490894A1 (fr)
JP (1) JP2005522046A (fr)
AU (1) AU2003232588A1 (fr)
WO (1) WO2003085702A1 (fr)

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US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
NL1034087C2 (nl) * 2007-07-03 2009-01-06 Assembleon Bv Werkwijze voor het opnemen van een component alsmede inrichting geschikt voor het uitvoeren van een dergelijke werkwijze.
JP5851878B2 (ja) * 2012-02-21 2016-02-03 ルネサスエレクトロニクス株式会社 半導体モジュールの製造方法
US9331230B2 (en) * 2012-10-30 2016-05-03 Cbrite Inc. LED die dispersal in displays and light panels with preserving neighboring relationship
TWI786447B (zh) * 2020-10-15 2022-12-11 均華精密工業股份有限公司 生產設備及預接合裝置
EP4227981A1 (fr) * 2022-02-15 2023-08-16 Nexperia B.V. Platine de tranche incurvée

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US20050204554A1 (en) 2005-09-22
WO2003085702A1 (fr) 2003-10-16
JP2005522046A (ja) 2005-07-21

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