EP1443455A2 - Carte à puce électronique mince - Google Patents

Carte à puce électronique mince Download PDF

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Publication number
EP1443455A2
EP1443455A2 EP03025837A EP03025837A EP1443455A2 EP 1443455 A2 EP1443455 A2 EP 1443455A2 EP 03025837 A EP03025837 A EP 03025837A EP 03025837 A EP03025837 A EP 03025837A EP 1443455 A2 EP1443455 A2 EP 1443455A2
Authority
EP
European Patent Office
Prior art keywords
chip card
adhesive
thin electronic
electronic chip
card according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03025837A
Other languages
German (de)
English (en)
Other versions
EP1443455B1 (fr
EP1443455A3 (fr
Inventor
Stefan FÜRST
Claudia Rathmann
Ulrich Bosch
Michael Moser
Fatima Dr. Birke-Salam
Thomas Dr. Woehrle
Heinrich Stelzig
Dejan Dr. Ilic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VARTA Microbattery GmbH
Original Assignee
VARTA Microbattery GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VARTA Microbattery GmbH filed Critical VARTA Microbattery GmbH
Publication of EP1443455A2 publication Critical patent/EP1443455A2/fr
Publication of EP1443455A3 publication Critical patent/EP1443455A3/fr
Application granted granted Critical
Publication of EP1443455B1 publication Critical patent/EP1443455B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/22—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a thin electronic chip card an IC chip and a galvanic element as energy storage, which has at least one lithium intercalating electrode and a thin, flexible housing made of two metal foils, attached directly to the electrodes apply to each other via an adhesive or sealing layer are tightly connected.
  • Extremely thin, flexible galvanic elements with a total thickness of less than 0.5 mm, for example, are required as energy stores in "Active Smart Cards".
  • the flat energy store is provided for the power supply of the IC chip or other components such as integrated miniature sensors or transponders.
  • the overall characteristics of such a smart card, consisting of card body, components and energy storage, must be ISO-compliant in accordance with ISO - bending strength DIN - ISO7816 - 1 and DIN ISO / IEC 10'373, i.e. the ISO bending test in accordance with DIN - ISO 7816-1 and the test specification according to DIN ISO / IEC 10'373 must be met.
  • Document EP 0 997 959 B1 also describes galvanic elements a non-aqueous electrolyte, which have housings made of laminate films.
  • Such laminates usually consist of a double-sided coated aluminum composite film, which can easily be deep drawn up to 5 mm leaves and immediately inspected the ISO test due to this property. The plastic coating prevents tearing.
  • German patent application 102 26 848.7 Another possibility for stabilizing the metal housing is proposed in German patent application 102 26 848.7.
  • a galvanic element with at least one lithium-intercalating electrode and a thin, flexible housing made of two metal foils which lie directly on the electrodes and which are tightly connected to one another by means of an adhesive or sealing layer
  • at least one of the metal foils on the outside has one Provide stability and strength increasing plastic layer and an adhesive layer is arranged between the metal foil and plastic layer.
  • a galvanic element must be converted into a film composite in further process steps.
  • the invention is particularly based on the object of an active Chipcard indicate which the high demands on mechanical Stability against bending and torsional stresses fulfilled and which is easy to manufacture and from just a few Layers is built up.
  • a galvanic element is laminated with at least one lithium intercalating electrode and a thin, flexible housing made of two metal foils that attach directly to the electrodes apply to each other via an adhesive or sealing layer are tightly connected in a smart card at ambient temperature using an elastic glue.
  • a smart card or chip card is included a multilayer, flexible plastic composite that functions, such as Has sensors, data storage and retrieval.
  • the galvanic element is arranged in a recess in the chip card and chip card and element are covered on both sides by an overlay plastic film covered that with chip card and element via an elastic stress-relieving adhesive that simultaneously on metals and plastics adheres, is firmly connected.
  • the overlay plastic films are applied by cold lamination.
  • a one-component adhesive according to the invention is a flowable, viscous mass that is the galvanic element encapsulated, embedded in the smart card and after polymerizing (Curing) a permanent surface adhesion to the card foils and the metallic housing surface of the galvanic element causes.
  • the adhesive should have a glass transition temperature between 35 ° C and 70 ° C and an elongation at break of 40 - 52% according to DIN ISO 527 and be light-curing.
  • the adhesive is an epoxy resin or a thermoplastic polyurethane-based material.
  • the overlay plastic film is preferably made of PVC. All surface liability in the card -overlay- to the core foil, metallic surface of the housing for overlay film and metallic housing for Core film - are made by cold lamination.
  • Adhesive combined with a curing process Room temperature takes place, the entire system can be smartcard - adhesive - flat cells are converted into a mechanically stable system, which all in all points to a high load capacity during the ISO bending tests is coordinated.
  • the glass transition temperature (T g ) is the temperature at which amorphous or partially crystalline polymers change from the rubber-elastic or liquid state to a hard-elastic or glassy state or vice versa.
  • the phenomenon is based on the freezing or thawing of the Brownian molecular motion of longer chain segments of the polymer ball.
  • the physical properties are changed significantly. Examples of this are viscosity or hardness.
  • Particularly advantageous for the property in the bending test is the fact that the epoxy resins preferably used according to the invention, which showed advantageous properties in the tests, have a relatively low glass transition temperature, which is approximately 50 ° C. These hardened epoxy resins are therefore more elastic than those which have a glass transition temperature of, for example, 140 ° C.
  • Epoxy resins are organic, mostly oligomeric compounds, which in particular have an epoxy group and can be converted into so-called thermosets by polymerization processes ("hardening"). The shrinkage in the hardening process is low, the hardened products are stress-free and tear-resistant, which is of great advantage for the bending test. Furthermore, these epoxy resins adhere or stick to metallic surfaces, such as copper, and convert a mechanically unstable, thin copper considered in itself into an elastic and stable overall composite of epoxy resin with copper.
  • a thin electronic chip card according to the invention with an IC chip and a galvanic element as an energy store is schematic shown in the figure.
  • a core foil 1 made of PVC / ABS blend (PVC polyvinyl chloride, ABS acrylonitrile-butadiene-styrene copolymer) serves as card material and contains a galvanic element 3 in a recess.
  • the overlay film 2 is made of PVC.
  • An advantageous adhesive 4 is a modified one-component epoxy resin (for example the product Katiobond® from DELO, Germany). The curing takes place by activating light with visible light.
  • An outstanding property that is important for the use of galvanic elements with a copper housing in the smartcard is the excellent adhesion to metallic surfaces. The final strength is reached after 24 h.
  • Epoxy resins have good chemical resistance and are physiologically harmless. These special epoxy resins show little shrinkage during the hardening process and tension-free and tear-resistant plastics are produced after hardening; this gives a significant advantage in the bending test.
  • thermoplastic can be used as an alternative adhesive according to the invention
  • Polyurethane-based adhesive e.g. Henkel TPU QR 4663, used with success.
  • the core film is used to manufacture the thin electronic chip card 1 punched out so that the galvanic element 3 can be inserted. Then a metered amount of glue is applied across the entire surface by a squeegee Spread core film 1; the adhesive 4 also flows into a cavity between core film 1 and the galvanic element 3. Then the overlay film 2 is placed, this preliminary stage for the laminated card turned, the squeegee process is repeated and the second overlay film 2 hung up. After pressing the card (without heat) it is exposed to initiate the curing process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Laminated Bodies (AREA)
  • Battery Mounting, Suspending (AREA)
EP03025837A 2003-01-31 2003-11-11 Carte à puce électronique mince Expired - Lifetime EP1443455B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10304824A DE10304824A1 (de) 2003-01-31 2003-01-31 Dünne elektronische Chipkarte
DE10304824 2003-01-31

Publications (3)

Publication Number Publication Date
EP1443455A2 true EP1443455A2 (fr) 2004-08-04
EP1443455A3 EP1443455A3 (fr) 2004-08-25
EP1443455B1 EP1443455B1 (fr) 2006-08-02

Family

ID=32603178

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03025837A Expired - Lifetime EP1443455B1 (fr) 2003-01-31 2003-11-11 Carte à puce électronique mince

Country Status (8)

Country Link
US (1) US7073723B2 (fr)
EP (1) EP1443455B1 (fr)
JP (1) JP2004234638A (fr)
KR (1) KR20040069955A (fr)
CN (1) CN100363950C (fr)
AT (1) ATE335254T1 (fr)
DE (2) DE10304824A1 (fr)
ES (1) ES2269895T3 (fr)

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WO2009115324A1 (fr) * 2008-03-20 2009-09-24 Varta Microbattery Gmbh Élément galvanique à joint en feuille
EP3782805A1 (fr) * 2019-08-19 2021-02-24 Thales Dis France SA Procédé de fabrication d'une structure multicouche pour coller des couches à un ou plusieurs films adhésifs

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JP7011705B2 (ja) * 2018-03-27 2022-01-27 日本碍子株式会社 リチウム二次電池
CN112216622B (zh) * 2019-07-10 2022-09-30 广东精毅科技股份有限公司 一种用冷胶粘贴芯片的装置及其工作方法
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US7073723B2 (en) 2006-07-11
EP1443455B1 (fr) 2006-08-02
CN100363950C (zh) 2008-01-23
DE50304455D1 (de) 2006-09-14
JP2004234638A (ja) 2004-08-19
KR20040069955A (ko) 2004-08-06
ES2269895T3 (es) 2007-04-01
EP1443455A3 (fr) 2004-08-25
CN1519774A (zh) 2004-08-11
US20040182939A1 (en) 2004-09-23
DE10304824A1 (de) 2004-08-12

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