EP1439563A2 - Procédé de traitement thermique et four de traitement thermique pour un substrat d'un panneau d'affichage à plasma - Google Patents

Procédé de traitement thermique et four de traitement thermique pour un substrat d'un panneau d'affichage à plasma Download PDF

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Publication number
EP1439563A2
EP1439563A2 EP04000787A EP04000787A EP1439563A2 EP 1439563 A2 EP1439563 A2 EP 1439563A2 EP 04000787 A EP04000787 A EP 04000787A EP 04000787 A EP04000787 A EP 04000787A EP 1439563 A2 EP1439563 A2 EP 1439563A2
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EP
European Patent Office
Prior art keywords
temperature
heating
heat treatment
substrate
heating chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04000787A
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German (de)
English (en)
Other versions
EP1439563A3 (fr
Inventor
Michiro Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
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NGK Insulators Ltd
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Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of EP1439563A2 publication Critical patent/EP1439563A2/fr
Publication of EP1439563A3 publication Critical patent/EP1439563A3/fr
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/46—Machines having sequentially arranged operating stations
    • H01J9/48—Machines having sequentially arranged operating stations with automatic transfer of workpieces between operating stations

Definitions

  • the present invention relates to a heat treatment method for a substrate containing a film-forming material typified by a glass substrate for a plasma display panel and a heat treatment furnace usable therefor.
  • FPD large-screen flat panel display
  • PDP plasma display panel
  • the manufacturing of PDP is done by means of a thick film method, where each step of printing, drying, and burning is repeated in a plural number of times on surfaces of both front glass and rear glass for a glass substrate of a large-size display in order to form a variety of members such as electrodes, dielectric substances, fluorescent substances, etc. thereon. Thereafter, thus processed front glass and rear glass are sealed each other at the final step.
  • a substrate In heat treatment of a substrate containing a film-forming material such as this PDP glass substrate, a substrate is continuously transported during steps when the temperature difference between the front portion and the rear portion of the substrate in the transporting direction thereof is not so serious.
  • steps where the temperature difference between the front portion and the rear portion of the substrate in the transporting direction thereof is thought to be serious it is a common practice to employ a method wherein temperature is raised, kept at a given level, or lowered in accordance with a desired temperature curve for heat treatment by separately controlling the temperature of each heating chamber, in a finance being provided with a plurality of heating chambers sectioned in a transportation direction of an object to be thermally treated, and transporting means for transporting the object to be thermally treated in an intermittent manner to a next heating chamber.
  • each heating chamber has a space enough to house one plate of a setter which carries a substrate, and there is provided with a certain number of separated heating means at predetermined positions therein in the transporting direction of the object to be thermally treated (i. e., the direction of the length of the furnace; hereinafter referred to as the transporting direction of the object to be thermally treated) and in the direction of the width of the furnace.
  • These separated heating means are generally configured to allow each of themselves to be separately controlled in terms of temperature with an independent control system, whereas conventional temperature control of each heating device has been done in such a way that the atmosphere temperature (hereinafter often simply referred to as temperature) in each sectioned heating chamber becomes uniform according to the conventional heat treatment method of a substrate containing a film-forming material (See Japanese Patent No. 3011366).
  • the present invention has been developed in view of such conventional circumstances, and an object of the present invention is to provide a substrate heat treatment method which makes it possible to suppress the development of the deviation in the temperature distribution within the substrate due to thermal effects derived from a preceding adjacent heating chamber having a different inner chamber average temperature and to achieve a uniform heat treatment on the entire surface of the substrate when subjecting the substrate containing a film-forming material to a heat treatment in a heating chamber.
  • Another object of the present invention is to provide a heat treatment furnace suitably applicable to such a heat treatment method.
  • a heat treatment method of a substrate containing a film-forming material by use of a heat treatment furnace comprising a plurality of heating chambers sectioned in a transporting direction of an object to be thermally treated; transporting means for transporting the object to be thermally treated to a next heating chamber; and a predetermined number of separated heating means in each heating chamber at predetermined positions in the transporting direction of the object to be thermally treated, each heating means being capable of separately controlling a temperature by an independent control system; wherein among the plurality of heating chambers, in a heating chamber required to be different in inside average temperature from that of at least one of the adjacent heating chambers on both sides, the substrate is uniformly thermally treated by carrying out temperature control in such a manner that temperature each of the respective heating means provided in the heating chamber is set at different values in the transporting direction of the object to be thermally treated and atmosphere temperatures at an entrance side and an exit side of the transporting direction of the substrate may be maintained in the heating chamber at such a level that it is larger
  • a heat treatment furnace having a plurality of heating chambers each of which is sectioned in a transporting direction of an object to be thermally treated, transporting means for transporting the object to be thermally treated to a next adjacent heating chamber, and a predetermined number of separated heating means located at predetermined positions in each heating chamber in the transporting direction of the object to be thermally treated, each heating means being capable of separately controlling a temperature of a target position of a substrate to be thermally treated by an independent control system, the heat treatment furnace further comprising a temperature control device being controllable in such a manner that temperature each of the respective heating means provided at the predetermined position in the heating chamber may be set at different values in the transporting direction of the object to be thermally treated; and a radiant heater for mainly generating radiant heat which is heating means for heating a side lower in temperature between an entrance side and an exit side of the substrate to be treated in the transporting direction of the substrate in the heating chamber; wherein a substrate is uniformly thermally treated by
  • a heat treatment furnace to be employed in the present invention has a plurality of heating chambers sectioned in the transporting direction of an object to be thermally treated, and transporting means for transporting the object to be thermally treated to a next heating chamber.
  • Each heating chamber is provided with a predetermined number of separated heating means at predetermined positions in the transporting direction of the object to be thermally treated.
  • Each of the heating means is configured to be capable of separately controlling a temperature by an independent control system.
  • the transporting means it is preferable to adopt an intermittent transport mode transporting means, which transports an object to be thermally treated to a next heating chamber in an intermittent manner.
  • the expression "transports (something) in an intermittent manner” means a manner of a transportation which repeats the procedures which comprise the step of subjecting an object to be thermally treated to heat treatment for a predetermined period of time in the n-th heating chamber, counted from the entrance side of a furnace, while having the object to be thermally treated standing still thereat, subsequently moving the object to be thermally treated to the n+1-th heating chamber, counted from the entrance side of the furnace, as soon as possible thereafter, and subjecting the object to be thermally treated a heat treatment for a predetermined period of time by having the object to be thermally treated standing still again.
  • a transport method there is no specific limitation on the type of transporting means, and for example, a walking beam may be used, or a roller conveyor or a
  • a heat treatment method of the present invention among a plurality of heating chambers sectioned as described above, in a heating chamber required to be different in an inside average temperature of the heating chamber from that of at least one of adjacent heating chambers on both sides (either one of a heating chamber which is adjacent thereto in the entrance side direction of a furnace and another heating chamber which is adjacent thereto in the exit side direction of the furnace, or both of them), temperature of each heating means provided in the heating chamber is controlled in such a manner that temperature each of the heating means provided in the heating chamber is set at different values in the transporting direction of the object to be thermally treated, and by such controlling, in the heating chamber, the deviation in the distribution of atmosphere temperatures at the entrance side and that at the exit side of the transporting direction of the substrate are tolerated to be larger distribution than a target temperature distribution in the substrate.
  • the radiant heat of heating means such as a radiant heater, etc., is utilized for applying heat to a substrate at the side lower in the inner temperature so as to offset thermal effects from adjacent heating chambers on both sides on a substrate containing a film-forming material under heat treatment in the heating chamber.
  • a substrate containing a film-forming material such as a PDP glass substrate is subjected to heat treatment by going through steps of raising temperature, keeping it at a given level, and lowering temperature (cooling) in accordance with a desired temperature curve while moving it through each heating chamber sequentially, and for example, in a heating chamber in a temperature-lowering region where the temperature of a substrate is dropped, the closer to the exit side of a furnace, the lower the inner temperature is set therein, and accordingly, a substrate transported to a heating chamber in a temperature-lowering region receives thermal effects from its preceding adjacent heating chamber having a higher inner chamber average temperature located on the position closer to the entrance side of the furnace, thereby the substrate temperature tending to become higher than a target value, and contrarily, it receives thermal effects from its next adjacent heating chamber having a lower inner chamber average temperature on the position closer to the exit side of the furnace, thereby the substrate temperature tending to become lower than a target value.
  • the set temperature of each heating means provided at a predetermined position in a specified heating chamber is controlled to become a different value from each other in the transporting direction of an object to be thermally treated, which is achieved in such a manner that, for heating means that applies heat to a portion where the substrate temperature tends to become lower than a target value due to thermal effects from the adjacent heating chamber(s) at either side or both sides, the set temperature thereof is controlled to become a higher value in order to offset a drop in temperature due to its thermal effects, thereby raising the atmosphere temperature surrounding the portion, and contrarily, for heating means that applies heat to a portion where the substrate temperature tends to become higher than a target value due to thermal effects from the adjacent heating chamber(s) at either side or both sides, the set temperature thereof is controlled to become a lower value in order to offset a raise in temperature due to its thermal effects, thereby lowering the atmosphere temperature surrounding the portion.
  • the inventors have conceived that, instead of attempting to uniform the distribution of atmosphere temperature in a heating chamber, it is possible to carry out a uniform heat treatment of a substrate, which is consequently achieved by utilizing the radiant heat by means of heating means such as a radiant heater, etc., more heavily for applying heat to the side of the substrate which is lower in the inner atmosphere temperature.
  • each heating means being capable of separately controlling a temperature by an independent control system, located at the top side (furnace ceiling) of a heating chamber in a temperature-lowering region having a deviation in its inner chamber average temperature of 30°C from its preceding adjacent heating chamber, the temperature distribution of a substrate after heat application for a predetermined time duration is studied under a condition as illustrated in FIG. 1(b), where all of the set temperatures for the separated heating means A - I are equal (flat setting) and under a condition as illustrated in FIG.
  • the set temperature of each separated heating means is controlled so that values thereof differ in the transporting direction of an object to be thermally treated, and in the heating chamber, the temperatures at the entrance side and at the exit side of the transporting direction of the substrate are controlled to have a larger distribution than a target temperature distribution in the substrate, for example, the set temperature of each heating means is controlled so that they have a temperature difference of ⁇ 30°C between at the entrance side and at the exit side, and by such controlling, a temperature difference of ⁇ 17°C between the entrance side and the exit side is tolerated as the atmosphere temperature distribution in the heating chamber, that is, without attempting to make the distribution in atmosphere temperature in the heating chamber evenly, and instead, the radiant heat of heating means such as a radiant heater, etc., is utilized for applying heat to a substrate at the lower inner temperature side more heavily than for applying heat to other substrate portions with other heating means for the purpose of achieving a uniform heat application, thereby ensuring that the difference in
  • ⁇ T the difference in the temperature of the substrate portion having the highest temperature and the temperature of the substrate portion having the lowest temperature
  • ⁇ T the difference in the temperature of the substrate portion having the highest temperature and the temperature of the substrate portion having the lowest temperature
  • a heat treatment method of the present invention as it is possible to offset thermal effects from the preceding adjacent heating chamber.
  • thermal separation between a heating chamber and its adjacent heating chambers on both sides there is a further advantage in that it is possible to transport a substrate from a heating chamber to the next adjacent heating chamber in a speedy and effective manner.
  • a heat treatment method of the present invention if an attempt were made to uniform the atmosphere temperature distribution in the heating chamber within a range of ⁇ 6°C by setting the set temperature(s) of heating means at the lower inner temperature side higher to make the temperature difference larger than ⁇ 30°C, it would be undesirable due to excessive thermal effects from adjacent heating chamber(s) at either side or both sides. It is noted that, as for a heating chamber in a temperature-raising region where temperature is raised on a substrate, it is possible to achieve a uniform heat application by making settings contrary to the above example, that is, by controlling the set temperature(s) of heating means at the entrance side to be a higher value(s) while controlling the set temperature(s) of heating means at the exit side to be a lower value(s).
  • a heat treatment furnace suitable for a heat treatment method according to the present invention comprises, as its basic configuration components, a plurality of sectioned heating chambers provided in the transporting direction of an object to be thermally treated, and transporting means for transporting the object to be thermally treated to a next heating chamber.
  • a predetermined number of heating means located at predetermined positions in the transporting direction of the object to be thermally treated, where each of the separated heating means is capable of separately controlling a temperature by an independent control system.
  • this heat treatment furnace further comprises, as its characteristic configuration components, a temperature control device capable of controlling temperature each of a plural number of separated heating means provided at the predetermined position in the heating chamber so as to set temperature at a value different each other in the transporting direction of an object to be thermally treated, and a radiant heater that mainly emits radiant heat as heating means employed at a side lower in temperature in the heating chamber, and with such a configuration, it is possible to achieve the objective of a uniform heat treatment on a substrate by utilizing the radiant heat of the radiant heater for applying heat to the side lower in inner chamber temperature without controlling the distribution of atmosphere temperature evenly in the heating chamber.
  • a muffle capable of covering each area between each heating means and each moving zone for an object to be thermally treated, and more preferably, it is ideal that the part of or the entirety of the muffle is made up of a material having a high infrared rays irradiation rate. This is because, with such a muffle once absorbing heat emitted from the heating means and then radiating far-infrared rays or near-infrared rays, it is possible to speedily heat the object to be thermally treated. Furthermore, it produces an additional effect of ensuring cleanness in the moving area of the object to be thermally treated by isolating the moving area of the object to be thermally treated from the heating means hermetically with the muffle.
  • Si-impregnated SiC is obtained by sintering a compact containing silicon carbide and carbon as its main component in a pressure-reduced inert gas atmosphere with metal silicon existent therein or in a vacuum while impregnating it with metal silicon; and as illustrated in FIG. 4, this material shows a remarkably higher infrared rays irradiation rate in comparison with, for example, glass ceramics, and in addition to that, it also features a very high thermal conductivity.
  • intermittent transport mode transporting means which intermittently transports an object to be thermally treated
  • continuous transport mode transporting means which transports an object to be thermally treated continuously with the object moving constantly without standing still in each heating chamber.
  • intermittent transport mode transporting means is suitably adopted in the present invention, it may alternatively be configured so that both of the different transport modes are used suitably according to regions, as in a case where continuous transport mode transporting means is used for transporting between heating chambers in a temperature-raising region where temperature is raised on an object to be thermally treated and in a temperature-keeping region where temperature is maintained on an object to be thermally treated, whereas intermittent transport mode transporting means is used for transporting between heating chambers in a temperature-lowering region where temperature is lowered (cooled down) on an object to be thermally treated.
  • FIG. 5 is a sectional view taken along the direction perpendicular to the substrate transporting direction, which specifically indicates one embodiment of a heat treatment furnace according to the present invention
  • FIG. 6 is a transverse sectional view taken along the direction parallel to the substrate transporting direction of the present embodiment.
  • a heat treatment furnace 10 comprises a furnace can 11 formed mainly from a steel plate, a heat insulating layer 12 disposed in the furnace can 11, and a muffle 13 disposed in the heat insulating layer 12 and at a position facing a space in the furnace.
  • heating electric heaters 14 are provided at the top side and the bottom side of the heat treatment furnace 10.
  • thermoelectric couples 15 as thermometers in the device shown in these figures for controlling the heat value of the heating electric heaters 14 are disposed in such positions where each of their tips is in contact with the muffle 13. Outside the furnace can 11, a return conveyor 16 for transporting an object to be thermally treated 22 is disposed below the furnace can 11, and a control panel 17 and a wiring pipe 18 are disposed at the sides of the furnace can 11, with all these elements covered with a decorative sheet 19.
  • the heat treatment furnace 10 has a plurality of heating chambers wherein the chambers are shown with the referential numbers 25, 26, 27, and the like, and they are sectioned in the transporting direction of the object to be thermally treated 22, and in each of the heating chambers, the heating electric heaters 14, which are sectioned into three, as shown for the heating chamber 26, in the transporting direction of the object to be thermally treated 22, are provided.
  • reference numeral 30 denotes a partition wall, which is provided in between each of the heating chambers 25, 26, 27, and the like to serve the function of heat separation between a heating chamber and its adjacent heating chamber on both sides to a predetermined degree. Note that the number of the heating chambers to be provided may be properly chosen, depending the number of heating treatment, heat treatment conditions and the like.
  • the temperature of the muffle 13 measured with the thermoelectric couple 15 is inputted into a temperature controller TIC provided in the control panel 17, and its control output is inputted into a control unit SSC. Then, at the control unit SSC, the temperature of the muffle 13 is maintained at a target temperature by feeding required power to the heating electric heaters 14.
  • the temperature controller TIC and the control unit SSC are individually disposed for each of the heating electric heaters 14, or for each group of a plurality of the heating electric heaters 14. In this way, in each of the heating chambers 25, 26, 27, and the like, it is possible to perform an individual temperature control by three separated heating electric heaters 14, each controlled by means of an independent control system.
  • the present invention when heat-treating a substrate containing a film-forming material in a heating chamber, it is possible to suppress the development of a temperature distribution in the substrate due to thermal effects from its adjacent heating chamber on both sides having a different inner chamber average temperature, which makes it further possible to perform a uniform heat treatment on the whole substrate. Moreover, according to a heat treatment method and a heat treatment furnace of the present invention, it is possible to offset thermal effects from adjacent heating chambers on both sides, and accordingly, it is also possible to sacrifice thermal separation between a heating chamber and adjacent heating chambers on both sides to some degree to offer a further advantage in that it is possible to transport a substrate from a heating chamber to its adjacent heating chamber in a speedy and effective manner.
  • a heat treatment method for performing a uniform heat treatment on the whole substrate which comprises carrying out temperature control in such a manner that temperature each of the respective heating means provided in the heating chamber by setting temperature of them at different values in the transporting direction of the object to be thermally treated, and maintaining temperatures in the chamber larger in deviation in temperature distribution than a target temperature distribution within the substrate by using a heat treatment furnace.
  • the furnace comprises a plurality of sectioned heating chambers; transporting means for transporting the substrate to next heating chamber; and separated heating means provided in each heating chamber in the transporting direction; each heating means being separately controllable a temperature by an independent control system; and a radiant heating means for selectively

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Tunnel Furnaces (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
EP04000787A 2003-01-16 2004-01-15 Procédé de traitement thermique et four de traitement thermique pour un substrat d'un panneau d'affichage à plasma Withdrawn EP1439563A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003007793A JP2004218956A (ja) 2003-01-16 2003-01-16 基板の熱処理方法及び熱処理炉
JP2003007793 2003-01-16

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EP1439563A2 true EP1439563A2 (fr) 2004-07-21
EP1439563A3 EP1439563A3 (fr) 2007-07-11

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EP04000787A Withdrawn EP1439563A3 (fr) 2003-01-16 2004-01-15 Procédé de traitement thermique et four de traitement thermique pour un substrat d'un panneau d'affichage à plasma

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EP (1) EP1439563A3 (fr)
JP (1) JP2004218956A (fr)
CN (1) CN1517962A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102721288A (zh) * 2012-07-05 2012-10-10 河北新烨工程技术有限公司 一种加热炉高效智能化控制方法
CN104654819A (zh) * 2014-05-23 2015-05-27 柳州钢铁股份有限公司 大型燃气窖炉的温度控制方法
US10502487B2 (en) 2011-09-05 2019-12-10 Ihi Corporation Heating furnace and continuous heating furnace
US11280547B2 (en) 2017-10-30 2022-03-22 Boe Technology Group Co., Ltd. Sintering device and sintering method thereof

Families Citing this family (8)

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Publication number Priority date Publication date Assignee Title
CN100413020C (zh) * 2004-10-04 2008-08-20 日本碍子株式会社 连续式热处理炉
JP5216246B2 (ja) * 2007-06-04 2013-06-19 光洋サーモシステム株式会社 連続焼成炉
KR101225785B1 (ko) 2010-09-29 2013-01-23 현대제철 주식회사 가열로의 온도 조절 방법
CN103543258B (zh) * 2012-07-12 2015-09-02 艾博生物医药(杭州)有限公司 一种自动化快速烘干样品接收垫的方法
GB201317194D0 (fr) * 2013-09-27 2013-11-13 Ebner Ind Ofenbau
CN104515383A (zh) * 2013-09-30 2015-04-15 江苏高皓工业炉有限公司 一种安全稳定式台车式电阻炉
CN104048503B (zh) * 2014-06-30 2016-01-20 四川珩必鑫电子科技有限公司 一种电路板隧道烘烤炉
KR20170043936A (ko) * 2015-10-14 2017-04-24 현대자동차주식회사 블랭크 가열 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306322A (en) * 1989-06-29 1994-04-26 Sumitomo Electric Industries, Ltd. Process for thermal treatment of glass fiber preform
JPH1137660A (ja) * 1997-07-17 1999-02-12 Chugai Ro Co Ltd ローラハース型連続封着炉
FR2767813A1 (fr) * 1997-08-29 1999-03-05 Chugai Ro Kogyo Kaisha Ltd Procede et appareil de traitement d'un panneau de verre

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306322A (en) * 1989-06-29 1994-04-26 Sumitomo Electric Industries, Ltd. Process for thermal treatment of glass fiber preform
JPH1137660A (ja) * 1997-07-17 1999-02-12 Chugai Ro Co Ltd ローラハース型連続封着炉
FR2767813A1 (fr) * 1997-08-29 1999-03-05 Chugai Ro Kogyo Kaisha Ltd Procede et appareil de traitement d'un panneau de verre

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10502487B2 (en) 2011-09-05 2019-12-10 Ihi Corporation Heating furnace and continuous heating furnace
CN102721288A (zh) * 2012-07-05 2012-10-10 河北新烨工程技术有限公司 一种加热炉高效智能化控制方法
CN102721288B (zh) * 2012-07-05 2014-12-31 河北新烨工程技术有限公司 一种加热炉高效智能化控制方法
CN104654819A (zh) * 2014-05-23 2015-05-27 柳州钢铁股份有限公司 大型燃气窖炉的温度控制方法
CN104654819B (zh) * 2014-05-23 2017-03-01 柳州钢铁股份有限公司 大型燃气窖炉的温度控制方法
US11280547B2 (en) 2017-10-30 2022-03-22 Boe Technology Group Co., Ltd. Sintering device and sintering method thereof

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CN1517962A (zh) 2004-08-04
JP2004218956A (ja) 2004-08-05
EP1439563A3 (fr) 2007-07-11

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