EP1437209A1 - Dispositif de sciage par fil - Google Patents
Dispositif de sciage par fil Download PDFInfo
- Publication number
- EP1437209A1 EP1437209A1 EP20030029548 EP03029548A EP1437209A1 EP 1437209 A1 EP1437209 A1 EP 1437209A1 EP 20030029548 EP20030029548 EP 20030029548 EP 03029548 A EP03029548 A EP 03029548A EP 1437209 A1 EP1437209 A1 EP 1437209A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sawing
- sawing device
- slices
- support
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/748—With work immobilizer
- Y10T83/7487—Means to clamp work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/748—With work immobilizer
- Y10T83/7487—Means to clamp work
- Y10T83/7533—With biasing or counterbalancing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/748—With work immobilizer
- Y10T83/7487—Means to clamp work
- Y10T83/754—Clamp driven by yieldable means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Definitions
- the present invention relates to a wire sawing device comprising at least one ply of wires stretched between at least two wire guide cylinders and held in position by grooves provided on the surface of said cylinders thread guides which define the interval between the threads of said ply of threads, therefore the thickness of the sawn slices separated from each other by interstices sawing, the wires being able to move in an alternating movement or continuous pressing against at least one workpiece to be sawn fixed on a support table.
- Wire sawing devices of the aforementioned type with displacement of the wires of the ply of wire or of the workpiece are already known, especially in the electronic components industry of ferrites, quartz and silicas, for obtaining thin slices of materials such as poly- or monocrystalline or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, ceramic materials.
- materials such as poly- or monocrystalline or new materials such as GaAs, InP, GGG or also quartz, synthetic sapphire, ceramic materials.
- the high price of these materials makes wire sawing more attractive compared to others techniques such as diamond disc sawing.
- the sawing zone consists of an assembly at least two cylinders placed in parallel. These cylinders, called wire guides, are engraved with grooves defining the interval between the wires of the tablecloth, that is the thickness of the slices.
- the workpiece is fixed on a support table which moves perpendicular to the wire layer. Travel speed defines cutting speed.
- the renewal of the thread, as well as the control of its tension is done in a part called wire management zone located outside the zone sawing proper.
- the agent which will govern the cutting is either an abrasive fixed on the wire, a free abrasive brought in the form of slip.
- the wire only acts as carrier.
- sawn wafers are very thin compared to the diameter of the workpiece.
- the slices sawn so have significant flexibility and can bend and bend to come into contact with neighboring slices. These deflections are harmful for the precision and flatness of the cut and can induce undulations, unwanted streaks and irregularities on the surface of sawn edges. These irregularities, even a few micrometers are enough to make the wafers for certain applications, such as silicon for the solar industry and semiconductors.
- the deformations of the edges can even induce micro-cracks and breaks, especially near the fixing of the slices to their support.
- the object of the present invention is to remedy these major drawbacks and the invention is characterized for this purpose by the fact that the sawing device comprises a holding device arranged so as to maintain, during the sawing, the partially or entirely sawn slices substantially parallel between them and so that the width of the sawing gaps is preserved substantially constant during sawing of the slices.
- the wire is also worn regularly, so it is less subject to disruptions.
- the device according to the invention can also help with easy wire repair and wire replacement in the sawing gaps, therefore to avoid rejection of the workpiece following a wire break.
- the holding device comprises organs of holding likely to cooperate with at least a portion of the slices in sawing track.
- the holding device comprises guide elements arranged on the support table, the holding members being movably mounted on the guide members to be moved from an inactive position to an active position, in which they cooperate with the slices being sawed, and vice versa.
- the holding members are stressed by elastic elements in the direction of stationary stops.
- the holding organs are on the one hand in the position inactive, pressing against the stationary stops and, on the other hand, in the position active, away from stationary stops to cooperate with the part or parts to cut.
- the holding members include at least one bar extending along the workpiece in a direction substantially parallel to the wire guide cylinders, this bar being provided at least one elastomer coating intended to be applied against slices of the workpiece.
- said bar is pivotally mounted along an axis of pivoting parallel to the wire guide cylinders on cross members mounted so sliding on the guide elements.
- the holding device allows a particularly efficient and reliable operation and simple construction and inexpensive.
- the holding members include a thick liquid or gel with a higher density than the machining liquid used, the thick liquid or gel being contained in a container maintained in the active position so that said portion of the slices is at least partially submerged in thick liquid or gel so that the slices are immobilized.
- the holding device may also include as that members for holding the separation elements intended to be introduced into the less partially in the sawing gaps between the slices for maintain the latter, these separating elements being mounted on at least a support.
- the gap between the slices can be maintained constant very precisely, even in the case of external forces acting on the slices in process of sawing.
- the separating elements consist of wires, strips, strips or walls of adequate thickness to be able to be introduced into said sawing gaps.
- Maintaining and separating the sawn edges is thus achieved by simple and efficient way.
- said at least one support is arranged in at least one tray mounted on said frame.
- Another embodiment is characterized in that the device for support is constituted by a U-shaped frame whose branches longitudinal are intended to be applied laterally against sawn edges by means of elastic parts.
- Such a frame can be mounted and removed by lateral displacement during sawing of the room; this mode of execution is therefore particularly useful in the event of a break saw wire.
- the gaps between the sections can be kept constant thanks to this device and the wire can be easily replaced and reintroduced between sections after repair.
- the frame can also be used for transporting the workpiece after sawing it before and during heel cutout by which the slices are held on a support temporary cutting. The slices, separated from each other by a gap regular, do not adhere to neighboring slices and can be cleaned and detached very easily.
- Figure 1 is a front view of a first embodiment of the invention.
- Figure 2 is an enlarged partial front view of this first mode execution.
- FIG. 3 is a side view of the holding device in FIG. 2.
- Figure 4 is a partial front view of a second embodiment.
- Figures 5 and 6 show a third embodiment for partial face and partial perspective.
- FIG. 7 is a partial front view of a variant combining the first and third embodiments.
- Figures 8 and 9 illustrate a fourth perspective embodiment and in partial front view.
- Figures 10 to 13 show a fifth embodiment in perspective, side view, front view at the start and end of sawing.
- Figure 14 shows a variant of the previous embodiment.
- the sawing device includes a frame 10 and wire guide cylinders 11, 12, here in number two, mounted on this frame with their axes arranged in parallel, being well understood that the device could have more than two wire guide cylinders.
- the wire 14 is unwound from a supply reel, not shown, and then wound around the wire guide cylinders in any possible winding mode to form at least one ply of parallel wires 15 in a sawing zone.
- the wire is then recovered in a suitable device not illustrated, such as a coil receptor or a drip tray.
- This support table 18 can be moved vertically in the direction Z thanks to a column 21 and a motor 20 to support the pieces to be sawed 17 against the ply of wires 15.
- the periphery of the wire guide cylinders 11, 12 is engraved with grooves which define the interval between the neighboring wires of the wire layer 15, therefore the thickness sawn slices. These are separated from each other by sawing slots or gaps.
- the wire 14 is tensioned and both guided and pulled by the wire guide cylinders to move in an alternating back and forth or continuous movement.
- This thread is favorably made of spring steel with a diameter between 0.1 and 0.2 mm in order to saw blocks of hard materials or more composition particular, such as silicon, ceramic, composed of elements of groups III-V and II-VI, GGG (Gadolinium-Gallium Garnet), sapphire, etc., in 0.1 increments about 5 mm thick.
- the abrasive agent is a commercial product and can be diamond, silicon carbide, alumina, etc., in a form attached to the wire or in free form suspended in a liquid which serves as a transporter for abrasive particles.
- the sawing device is, in accordance with the invention, provided with a device holding 22 arranged so as to maintain, during sawing, the edges 23 partially or entirely sawn substantially parallel to each other and so that the width of the lumber gaps 24 is kept substantially constant during sawing of the slices.
- the holding device 22 for this purpose comprises holding members 25 capable of cooperating with at least a portion 26 of the slices in the process of sawing. This portion 26 is here opposite to the part 27 of the workpiece 17 by which the latter is fixed to the support table 18.
- These holding members 25 include in the embodiment of the Figures 1 to 3 a longitudinal bar 30 per workpiece extending along the latter in a direction substantially perpendicular to the wires of the ply of wires 15.
- the bars 30 are provided with coatings 31 of elastomer intended to be applied against the edges of the pieces to be sawed.
- Each bar 30 is pivotally mounted along a pivot axis 32 parallel to the wire guide cylinders 11, 12 on crosspieces 33.
- the coverings 31 can optimally adapt to the workpiece 17.
- the sleepers 33 slide on rods 34 serving as integral guide elements of the support table 18.
- Elastic means in the form of coil springs 35 urge the crosspieces 33 and the longitudinal bars 30 towards one hand sawing parts 17 and secondly stationary stops 40 integral with the frame 10.
- Sawing can then continue to the opposite end of the workpiece, while the sawed edges 23 are held in position, to avoid ripples, streaks and other irregularities due to transverse movements of the sections.
- Saw slots or gaps 24 have a constant width allowing a regular supply of abrasive particles and a constant sawing speed.
- FIG. 4 is similar to that of FIGS. 1 to 3, except that the holding device 22 is of a different type.
- the retaining members 25 in this case comprise a thick liquid or a gel 45 higher density than the machining fluid used.
- This thick liquid or gel is contained in a tray 46 which is fixed on the cross members 33 mounted sliding on the rods 34. It is possible, for example, to use silicones with a viscosity adequate.
- the cross members 33 are subjected to the action of the coil springs 35 and locked in the active position by locking washers 47 so that the portion lower 26 of the slices is at least partially immersed in the liquid thick or the gel which partially penetrates into the sawing gaps 24 and thus immobilizes the sawn slices in parallel position.
- a third embodiment illustrated in Figures 5 and 6 includes as that retaining member 25 of the separation elements 54 intended to be introduced at least partially in the interstices 24 between the sections 23 to maintain these last.
- a series of wires 50 is stretched over a frame 51 and arranged parallel to the wires of the wire web 15. In the active position, these wires 50 are introduced into the sawing gaps 24 between the edges 23 to maintain exactly the gap between them.
- Frame 51 cooperates in an inactive position with the stationary stops 40 to separate the wires 50 from the workpiece against the effect of the springs 35.
- the frame 51 rests on the lock washers 47 provided on the rods 34 and thus remains in a fixed position relative to the parts to be sawed 17 so as to cooperate with the lower portion 26 of the parts to be sawed.
- the sons 50 could also be replaced by blades, ribbons, strips, walls of a adequate thickness to be inserted into the sawing gaps 24 slices which are thus held in position without touching each other.
- the variant illustrated in FIG. 7 is a combination of the holding 22 according to the first and third embodiment.
- This variant comprises as holding members 25 on the one hand, two bars longitudinal 30 with elastomeric coatings 31 biased against pieces to be sawed 17 thanks to the springs 35, and on the other hand, a frame 51 with wires 50 which are arranged inside the sawing gaps 24.
- the frame 51 is fixed by means of intermediate pieces 52 on the sleepers 33 which cooperate with the springs 35 and the stationary stops 40.
- This variant is particularly effective since it ensures double support of the slices sawn by external support and by intercalation of wires.
- the fourth embodiment illustrated in Figures 8 and 9 includes a holding device 22 comprising a U-shaped frame 60.
- the branches longitudinal 61 of this frame are intended to be applied laterally against sawn edges 23 of the workpiece 17 by means of elastic parts 62.
- the force of application and maintenance can be obtained by means of a device pneumatic 63 comprising an inlet duct 64 and internal ducts 65 allow the elastic parts 62 to be inflated.
- the application force may also be obtained by other means, such as mechanical tightening of longitudinal branches 61 towards each other by means of a control mechanical, pneumatic or hydraulic.
- the frame 60 can be put in place easily thanks to the handle 66 and then blocked by application of the tightening.
- FIG. 10 to 13 A fifth embodiment is illustrated in Figures 10 to 13.
- the holding device 22 is mounted on the frame 10 of the device saw 10 and comprises a bin 70 whose bottom and / or walls can be perforated or provided with a flow so that the sawing liquid and the abrasive can be removed from the bin.
- This bin is maintained thanks to elements of fixing 71 on the frame 10 and provided with separation elements 72 intended to be introduced into the sawing gaps 24 between the sawed edges 23 for maintain exactly the gap between them.
- the separation elements 72 are in this embodiment constituted by a series of wires 73 stretched over a frame 74.
- the embodiment shown has two superimposed frames 74, but any other number of frames from 1 to 5 can be mounted in tray 70.
- sawing can be carried out up to the temporary support 19 (FIG. 13), while the sawn slices 23 are maintained with a regular spacing, this which ensures high product quality without ripples, streaks and irregularities.
- the sawn slices are already separated from each other, which allows easier treatment and subsequent conditioning.
- These slices can, for example, be removed from the sawing device directly in tray 70.
- two drawers 81, 82 can be slidably housed in a tray 80 fixed to the frame 10.
- Each of the drawers contains a holding device 22 for the slices of one or the other of the sawed ingots 17.
- the bottom and the side walls of these drawers 81, 82 can be perforated for the flow of sawing liquid.
- the latter can be retained in the bin 80 and evacuated by a flow 84 with a valve 85.
- the holding device 22 also comprises elements of separation 72 intended to be introduced into the sawing gaps. These separating elements may consist of horizontal, oblique wires and / or diagonals stretched over one, two or more frames 86. The wires can thus constitute two layers of crossed threads.
- the separation elements may also be constituted by vertical walls fixed to the side walls of the drawers. After sawing, the drawers 81, 82 with the sawn slices of each ingot can be removed from the device sawing.
- one, two or more support tables 18 can support one or more than two workpieces 17.
- the relative movement between the support table or tables 18 and the ply of wires 15 could also be achieved by moving the ply of wires and by any adequate mechanical, pneumatic, hydraulic means.
- the movement of sawing can also be carried out in any other spatial direction than the vertical.
- the first embodiment of Figures 1 to 3 may also include lateral clamping means instead of vertical means.
- the holding device 22 can be adapted to the shape of the part to be cut.
- the support may be obtained by a bar 30 adapting to the cylindrical surface.
- the application force control can be carried out by any means mechanical, pneumatic and hydraulic with or without stationary stops.
- the frame 51 of FIG. 6 with its wires or bands can also be mounted above figure 4 of the tank 46, combining the second and the third modes of execution.
- the separating elements 72 provided in the tank 70 or in the drawers 80 may be of any kind horizontal, oblique, diagonal, wall wires complete or partial, transverse bands, etc.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Surgical Instruments (AREA)
Abstract
Description
Claims (17)
- Dispositif de sciage par fil comprenant au moins une nappe de fils (15) tendue entre au moins deux cylindres guide-fils (11, 12) et maintenue en position par des gorges prévues sur la surface desdits cylindres guide-fils (11, 12) qui définissent l'intervalle entre les fils de ladite nappe de fils, donc l'épaisseur des tranches (23) sciées séparées les unes des autres par des interstices de sciage (24), les fils étant susceptibles de se déplacer selon un mouvement alternatif ou continu en appui contre au moins une pièce à scier (17) fixée sur une table support (18), des moyens (20, 21) étant prévus pour effectuer un mouvement d'avance relatif entre la pièce à scier (17) et la nappe de fils (15), caractérisé par le fait que le dispositif de sciage comprend un dispositif de maintien (22) agencé de façon à maintenir, au cours du sciage, les tranches (23) partiellement ou entièrement sciées sensiblement parallèles entre elles et de façon que la largeur des interstices de sciage (24) est conservée sensiblement constante pendant le sciage des tranches.
- Dispositif de sciage selon la revendication 1, caractérisé par le fait que le dispositif de maintien (22) comprend des organes de maintien (25) susceptibles de coopérer avec au moins une portion des tranches en voie de sciage.
- Dispositif de sciage selon la revendication 2, caractérisé par le fait que le dispositif de maintien (22) comprend des éléments de guidage (34) agencés sur la table support (18), les organes de maintien (25) étant montés de façon mobile sur les éléments de guidage (34) pour être déplacés d'une position inactive vers une position active, dans laquelle ils coopèrent avec les tranches (23) en cours de sciage, et vice versa.
- Dispositif de sciage selon la revendication 3, caractérisé par le fait que les organes de maintien (25) sont sollicités par des éléments élastiques (35) en direction de butées stationnaires (40).
- Dispositif de sciage selon la revendication 4, caractérisé par le fait que les organes de maintien (25) sont, d'une part dans la position inactive, en appui contre les butées stationnaires (40) et, d'autre part dans la position active, écartés des butées stationnaires (40) pour coopérer avec la ou les pièces à scier (17).
- Dispositif de sciage selon la revendication 5, caractérisé par le fait que les organes de maintien (25) comprennent au moins une barre (30) s'étendant le long de la pièce à scier (17) suivant une direction sensiblement parallèle aux cylindres guide-fils (11, 12), cette barre (30) étant munie d'au moins un revêtement (31) en élastomère destiné à être appliqué contre les tranches (23) de la pièce à scier.
- Dispositif de sciage selon la revendication 6, caractérisé par le fait que ladite barre (30) est montée pivotant suivant un axe de pivotement (32) parallèle aux cylindres guide-fils (11, 12) sur des traverses (33) montés de façon coulissante sur les éléments de guidage (34).
- Dispositif de sciage selon la revendication 5, caractérisé par le fait que les organes de maintien (25) comportent un liquide épais ou gel (45) d'une densité plus élevée que le liquide d'usinage utilisé, le liquide épais ou gel (45) étant contenu dans un bac (46) maintenu dans la position active telle que ladite portion (26) des tranches est au moins partiellement immergée dans le liquide épais ou le gel (45) de façon que les tranches (23) soient immobilisées.
- Dispositif de sciage selon la revendication 1 ou 2, caractérisé par le fait que le dispositif de maintien (22) comprend en tant qu'organe de maintien (25) des éléments de séparation (54, 72) destinés à être introduits au moins partiellement dans les interstices de sciage (24) entre les tranches (23) pour maintenir ces dernières, ces éléments de séparation étant montés sur au moins un support (51, 74, 86).
- Dispositif de sciage selon la revendication 9, caractérisé par le fait que les éléments de séparation sont constitués par des fils (50, 73), des bandes, des lames ou des parois d'une épaisseur adéquate pour pouvoir être introduits dans lesdits interstices de sciage (24).
- Dispositif de sciage selon les revendications 5 et 9, caractérisé par le fait que ledit au moins un support (51) est monté sur la table support (18) et peut être déplacé de la position inactive vers la position active.
- Dispositif de sciage selon les revendications 6 et 11, caractérisé par le fait que ledit au moins un support (51) est monté au-dessus de ladite barre (30).
- Dispositif de sciage selon les revendications 8 et 11, caractérisé par le fait que ledit au moins un support (51) est monté au-dessus dudit bac (46).
- Dispositif de sciage selon la revendication 9, caractérisé par le fait que ledit au moins un support (74, 86) est agencé dans au moins un bac (70, 80) monté sur ledit bâti (10).
- Dispositif de sciage selon la revendication 14, caractérisé par le fait qu'il comprend au moins deux supports (86) agencés dans au moins deux tiroirs (81) montés de façon coulissante dans le bac (80).
- Dispositif selon la revendication 10, caractérisé par le fait que les fils (50, 73) sont tendus sur le support (74, 86) suivant des directions horizontales et/ou obliques et/ou pour former des nappes de fils croisées.
- Dispositif de sciage selon la revendication 1, caractérisé par le fait que le dispositif de maintien est constitué par un cadre (60) en forme de U dont les branches longitudinales (61) sont destinées à s'appliquer latéralement contre les tranches (23) sciées par l'intermédiaire de pièces élastiques (62).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00043/03A CH696159A5 (fr) | 2003-01-13 | 2003-01-13 | Dispositif de sciage par fil. |
CH432003 | 2003-01-13 | ||
CH12632003 | 2003-07-18 | ||
CH01263/03A CH696807A5 (fr) | 2003-01-13 | 2003-07-18 | Dispositif de sciage par fil. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1437209A1 true EP1437209A1 (fr) | 2004-07-14 |
EP1437209B1 EP1437209B1 (fr) | 2006-08-16 |
Family
ID=32509222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20030029548 Expired - Lifetime EP1437209B1 (fr) | 2003-01-13 | 2003-12-22 | Dispositif de sciage par fil |
Country Status (7)
Country | Link |
---|---|
US (1) | US7114424B2 (fr) |
EP (1) | EP1437209B1 (fr) |
JP (1) | JP4510473B2 (fr) |
AT (1) | ATE336349T1 (fr) |
CH (1) | CH696807A5 (fr) |
DE (1) | DE60307588T2 (fr) |
ES (1) | ES2269905T3 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013098070A1 (fr) * | 2011-12-28 | 2013-07-04 | Robert Bosch Gmbh | Dispositif de séparation et procédé de séparation d'une ébauche métallique ou céramique |
CN102049818B (zh) * | 2009-10-28 | 2013-09-11 | 上海日进机床有限公司 | 晶体硅锭的切割方法 |
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DE102005028112A1 (de) | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung |
DE102006050330B4 (de) * | 2006-10-25 | 2009-10-22 | Siltronic Ag | Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben |
US20100126488A1 (en) * | 2008-11-25 | 2010-05-27 | Abhaya Kumar Bakshi | Method and apparatus for cutting wafers by wire sawing |
US20110265621A1 (en) * | 2010-04-29 | 2011-11-03 | Schmidt Richard F | Profile Loaf Cutting System for Food Products |
DE102010031364A1 (de) * | 2010-07-15 | 2012-01-19 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung |
JP5185419B2 (ja) * | 2011-08-22 | 2013-04-17 | コマツNtc株式会社 | ワイヤソー |
EP2711978A1 (fr) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Méthode de fabrication de plaquettes |
EP2944444A1 (fr) | 2014-05-16 | 2015-11-18 | Meyer Burger AG | Procédé de traitement de plaque |
KR101841551B1 (ko) * | 2016-11-23 | 2018-03-23 | 에스케이실트론 주식회사 | 잉곳 가압 장치 및 이를 포함하는 잉곳 절단 장치 |
JP6926864B2 (ja) * | 2017-09-12 | 2021-08-25 | 住友金属鉱山株式会社 | 単結晶の切断方法、固定冶具、及び、単結晶基板の製造方法 |
NL2021522B1 (en) * | 2018-08-30 | 2020-04-24 | Sdd Holding B V | Cutting device and method for cutting paper |
KR102097585B1 (ko) * | 2018-11-19 | 2020-04-06 | 이충석 | 수직형 멀티 와이어 쏘우용 잉곳 로딩언로딩 장치 |
JP7302213B2 (ja) * | 2019-03-19 | 2023-07-04 | 住友金属鉱山株式会社 | 単結晶の押さえ治具、ワイヤソー装置、及び、単結晶の切断方法 |
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JPH03281309A (ja) * | 1990-03-30 | 1991-12-12 | Osaka Titanium Co Ltd | マルチワイヤソーによる加工方法 |
JPH09272122A (ja) * | 1996-04-05 | 1997-10-21 | Sumitomo Metal Ind Ltd | マルチワイヤソーによる切断方法 |
US6119673A (en) * | 1998-12-02 | 2000-09-19 | Tokyo Seimitsu Co., Ltd. | Wafer retrieval method in multiple slicing wire saw |
JP2002205255A (ja) * | 2001-01-09 | 2002-07-23 | Denso Corp | ワイヤソーによる切断方法およびそれに用いる切断装置 |
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DE69526038T2 (de) * | 1994-12-15 | 2002-10-31 | Sharp Kk | Drahtgittersäge und Sägeverfahren |
JP3427956B2 (ja) * | 1995-04-14 | 2003-07-22 | 信越半導体株式会社 | ワイヤーソー装置 |
JPH11198017A (ja) * | 1998-01-14 | 1999-07-27 | Tokyo Seiko Co Ltd | ワイヤ式切断加工装置におけるウエハの隙間維持装置および方法 |
US6832606B2 (en) * | 2001-11-30 | 2004-12-21 | Dowa Mining Co., Ltd. | Wire saw and cutting method thereof |
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2003
- 2003-07-18 CH CH01263/03A patent/CH696807A5/fr not_active IP Right Cessation
- 2003-12-22 EP EP20030029548 patent/EP1437209B1/fr not_active Expired - Lifetime
- 2003-12-22 AT AT03029548T patent/ATE336349T1/de not_active IP Right Cessation
- 2003-12-22 DE DE2003607588 patent/DE60307588T2/de not_active Expired - Lifetime
- 2003-12-22 ES ES03029548T patent/ES2269905T3/es not_active Expired - Lifetime
-
2004
- 2004-01-08 US US10/752,524 patent/US7114424B2/en not_active Expired - Fee Related
- 2004-01-09 JP JP2004004251A patent/JP4510473B2/ja not_active Expired - Fee Related
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JPH03281309A (ja) * | 1990-03-30 | 1991-12-12 | Osaka Titanium Co Ltd | マルチワイヤソーによる加工方法 |
JPH09272122A (ja) * | 1996-04-05 | 1997-10-21 | Sumitomo Metal Ind Ltd | マルチワイヤソーによる切断方法 |
US6119673A (en) * | 1998-12-02 | 2000-09-19 | Tokyo Seimitsu Co., Ltd. | Wafer retrieval method in multiple slicing wire saw |
JP2002205255A (ja) * | 2001-01-09 | 2002-07-23 | Denso Corp | ワイヤソーによる切断方法およびそれに用いる切断装置 |
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PATENT ABSTRACTS OF JAPAN vol. 1998, no. 02 30 January 1998 (1998-01-30) * |
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 11 6 November 2002 (2002-11-06) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102049818B (zh) * | 2009-10-28 | 2013-09-11 | 上海日进机床有限公司 | 晶体硅锭的切割方法 |
WO2013098070A1 (fr) * | 2011-12-28 | 2013-07-04 | Robert Bosch Gmbh | Dispositif de séparation et procédé de séparation d'une ébauche métallique ou céramique |
Also Published As
Publication number | Publication date |
---|---|
JP4510473B2 (ja) | 2010-07-21 |
CH696807A5 (fr) | 2007-12-14 |
DE60307588D1 (de) | 2006-09-28 |
US20040159316A1 (en) | 2004-08-19 |
EP1437209B1 (fr) | 2006-08-16 |
DE60307588T2 (de) | 2007-08-16 |
ES2269905T3 (es) | 2007-04-01 |
ATE336349T1 (de) | 2006-09-15 |
US7114424B2 (en) | 2006-10-03 |
JP2004216549A (ja) | 2004-08-05 |
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