EP1412983A2 - Electronic device and relative fabrication method - Google Patents

Electronic device and relative fabrication method

Info

Publication number
EP1412983A2
EP1412983A2 EP02741171A EP02741171A EP1412983A2 EP 1412983 A2 EP1412983 A2 EP 1412983A2 EP 02741171 A EP02741171 A EP 02741171A EP 02741171 A EP02741171 A EP 02741171A EP 1412983 A2 EP1412983 A2 EP 1412983A2
Authority
EP
European Patent Office
Prior art keywords
electronic device
heat
absorbent material
dimensional
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02741171A
Other languages
German (de)
French (fr)
Inventor
Mario Palazzetti
Eugenio Faggioli
Riccardo Groppo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centro Ricerche Fiat SCpA
Original Assignee
Centro Ricerche Fiat SCpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centro Ricerche Fiat SCpA filed Critical Centro Ricerche Fiat SCpA
Publication of EP1412983A2 publication Critical patent/EP1412983A2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips

Definitions

  • the present invention relates to an electronic device and relative fabrication method, and in particular to a three-dimensional electronic device comprising integrated circuits .
  • a three-dimensional electronic device is defined by a number of electronic circuits stacked and housed in a package made of plastic material, typically epoxy resin, and from which connecting pins project.
  • the fabrication method comprises a step of stacking a number of integrated electronic circuits 1 - only three of which are shown for the sake of simplicity.
  • each integrated electronic circuit 1 comprises a so-called die 2 glued or soldered to a flexible support 3 having a structure similar to that of a printed circuit board, and on which are formed leads 4 connected electrically at one end to respective test pads 5 equally spaced along a peripheral portion of flexible support 3, and, at the other end, to respective regions of die 2 by means of connecting wires .
  • the stacking step is followed by a step of depositing an absorbent material 10 between each integrated electronic circuit 1 and the next.
  • absorbent material 10 is deposited in the gaps between integrated electronic circuits 1, which may, for example, be located 0.2 mm apart, and each be, for example, roughly 1 cm 2 in size.
  • Absorbent material 10 is then soaked with a two- phase mixture of a thermally stable insulating liquid, which impregnates and spreads by capillarity inside absorbent material 10.
  • absorbent material 10 may be a fibrous-structure material capable of forming capillary vessels, such as cotton or cloth or powder.
  • the thermally stable insulating liquid used is a nonionic liquid, preferably an organic solvent, such as a hydrocarbon or a mixture of appropriately selected hydrocarbons, preferably with a boiling point of 50°C to
  • the step of depositing the absorbent material is followed by a molding step, in which a substantially parallelepiped- shaped package 7 made of epoxy resin and enclosing integrated electronic circuits 1 is formed.
  • Package 7 is then sawed to expose leads 4.
  • a plating step is then performed, in which the lateral walls of package 7 are plated with conducting material, e.g. a nickel and gold alloy.
  • the plating step is followed by a connecting step, in which a laser beam defines conducting tracks 8 electrically connecting leads 4 as required, so as to obtain the three-dimensional electronic device indicated as a whole by 9.
  • the liquid serves as a means of transferring heat. That is, the liquid permeates absorbent material 10 contacting integrated circuits 1, is converted to vapor, and then comes into contact with, and transfers heat to, the walls of package 7, which serve as heat-dissipating means .
  • the vapor then cools and returns to the liquid state.
  • the liquid is then reabsorbed by absorbent material 10 and, exploiting the capillarity of the absorbent material, is again brought into contact with integrated circuits 1.
  • Three-dimensional electronic device 9 has the following advantages :
  • the method of fabricating three-dimensional electronic device 9 provides for further miniaturization of the electronic circuits of three-dimensional electronic device 9.
  • the heat-dissipating means may be external to package 7.
  • the present invention may be used for dissipating heat in any type of electronic device, even other than three-dimensional, or comprising even only one electronic circuit.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

There is described a three-dimensional electronic device (9) having a number of integrated electronic circuits (1) stacked and forming respective gaps in which are deposited an absorbent material (10) and a liquid impregnating the absorbent material (10). The integrated electronic circuits (1) are enclosed in a hermetic package (7); and, during operation of the electronic device (9), the heat produced by the integrated electronic circuits (1) causes the liquid to evaporate, the vapor comes into contact with, and transfers heat to, the walls of the package (7), and, on cooling, condenses once more to the liquid state, which, by virtue of the capillarity of the absorvent material (10), is brought once more into contact with the integrated electronic circuits (1).

Description

ELECTRONIC DEVICE AND RELATIVE FABRICATION METHOD
TECHNICAL FIELD The present invention relates to an electronic device and relative fabrication method, and in particular to a three-dimensional electronic device comprising integrated circuits .
BACKGROUND ART As is known, a three-dimensional electronic device is defined by a number of electronic circuits stacked and housed in a package made of plastic material, typically epoxy resin, and from which connecting pins project.
Recent developments in electronics have led to the production of increasingly small three-dimensional electronic circuits, in particular integrated circuits. Circuit miniaturization, however, is limited by the need to dissipate the heat produced during operation of the electronic circuits. More specifically, in the case of conventional three-dimensional electronic circuits, the heat produced by each circuit is dissipated by straightforward heat exchange between the circuit and the surrounding air. Such a simple structure, however, fails to provide for optimum dissipation, and often results in failure of the circuits .
The above limitation currently prevents widespread use of three-dimensional electronics and adequate exploitation of all the advantages it affords. DISCLOSURE OF THE INVENTION
It is an object of the present invention to provide an electronic device and relative fabrication method, designed to at least partly eliminate the aforementioned drawbacks, and which, in particular, provide for rapid dissipation of the heat produced by electronic circuits, and therefore greater circuit miniaturization.
According to the present invention, there is provided an electronic device as claimed in Claim 1.
According to the present invention, there is also provided a method of fabricating an electronic device, as claimed in Claim 11.
BRIEF DESCRIPTION OF THE DRAWING A preferred, non-limiting embodiment of the invention will be described, purely by way of example, with reference to the accompanying drawing showing the steps in a method of fabricating a three-dimensional electronic device. BEST MODE FOR CARRYING OUT THE INVENTION
As shown in the accompanying drawing, the fabrication method comprises a step of stacking a number of integrated electronic circuits 1 - only three of which are shown for the sake of simplicity.
More specifically, each integrated electronic circuit 1 comprises a so-called die 2 glued or soldered to a flexible support 3 having a structure similar to that of a printed circuit board, and on which are formed leads 4 connected electrically at one end to respective test pads 5 equally spaced along a peripheral portion of flexible support 3, and, at the other end, to respective regions of die 2 by means of connecting wires . The stacking step is followed by a step of depositing an absorbent material 10 between each integrated electronic circuit 1 and the next.
More specifically, absorbent material 10 is deposited in the gaps between integrated electronic circuits 1, which may, for example, be located 0.2 mm apart, and each be, for example, roughly 1 cm2 in size.
Absorbent material 10 is then soaked with a two- phase mixture of a thermally stable insulating liquid, which impregnates and spreads by capillarity inside absorbent material 10.
More specifically, absorbent material 10 may be a fibrous-structure material capable of forming capillary vessels, such as cotton or cloth or powder.
The thermally stable insulating liquid used is a nonionic liquid, preferably an organic solvent, such as a hydrocarbon or a mixture of appropriately selected hydrocarbons, preferably with a boiling point of 50°C to
100°C. With reference to the accompanying drawing, the step of depositing the absorbent material is followed by a molding step, in which a substantially parallelepiped- shaped package 7 made of epoxy resin and enclosing integrated electronic circuits 1 is formed.
Package 7 is then sawed to expose leads 4.
A plating step is then performed, in which the lateral walls of package 7 are plated with conducting material, e.g. a nickel and gold alloy. The plating step is followed by a connecting step, in which a laser beam defines conducting tracks 8 electrically connecting leads 4 as required, so as to obtain the three-dimensional electronic device indicated as a whole by 9. In actual use, when integrated electronic circuits 1 heat up, the liquid serves as a means of transferring heat. That is, the liquid permeates absorbent material 10 contacting integrated circuits 1, is converted to vapor, and then comes into contact with, and transfers heat to, the walls of package 7, which serve as heat-dissipating means .
The vapor then cools and returns to the liquid state.
The liquid is then reabsorbed by absorbent material 10 and, exploiting the capillarity of the absorbent material, is again brought into contact with integrated circuits 1.
This therefore substantially exploits the principle that two-phase mixtures are isothermal, and the materials are therefore selected according to the size of three- dimensional electronic device 9 and, hence, the amount of heat to be dissipated. The heat produced by the electronic circuits of three-dimensional electronic devices can therefore be dissipated rapidly and effectively by appropriately combining a nonpolar solvent absorbed by an absorbent material as described above. Three-dimensional electronic device 9 has the following advantages :
Firstly, by improving heat dispersion, the method of fabricating three-dimensional electronic device 9 provides for further miniaturization of the electronic circuits of three-dimensional electronic device 9.
Secondly, improving dissipation of the heat produced by the circuits also reduces the failure rate, and provides for optimum operating conditions , of conventional three-dimensional electronic devices. Clearly, changes may be made to the three- dimensional electronic device as described herein without, however, departing from the scope of the present invention.
In particular, as opposed to being defined by the walls of package 7, the heat-dissipating means may be external to package 7.
Moreover, the present invention may be used for dissipating heat in any type of electronic device, even other than three-dimensional, or comprising even only one electronic circuit.

Claims

1) A three-dimensional electronic device (9) comprising at least one electronic circuit (1) ; heat- dissipating means (7) for dissipating the heat produced by said electronic circuit (1) ; and heat-transferring means (10) for transferring heat from the electronic circuit (1) to said heat-dissipating means (7); characterized in that said heat-transferring means (10) comprise an absorbent material (10) ; and a two-phase mixture defined by a liquid in the presence of its own vapor.
2) A three-dimensional electronic device as claimed in Claim 1, characterized in that said absorbent material (10) comprises fibers.
3) A three-dimensional electronic device as claimed in Claim 2, characterized in that said absorbent material (10) is of vegetable fibers.
4) A three-dimensional electronic device as claimed in Claim 2, characterized in that said absorbent material
(10) is cotton.
5) A three-dimensional electronic device as claimed in Claim 1, characterized in that said absorbent material (10) is rock wool or glass wool. 6) A three-dimensional electronic device as claimed in Claim 5, characterized in that said two-phase mixture is a hydrocarbon or a mixture of hydrocarbons .
7) A three-dimensional electronic device as claimed in Claim 6, characterized in that said hydrocarbon or said mixture of hydrocarbons boils at a temperature of 50°C to 100°C.
8) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said package (7) is hermetic.
9) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized in that said electronic circuit (1) is an integrated circuit. 10) A three-dimensional electronic device as claimed in any one of the foregoing Claims, characterized by comprising a second electronic circuit (1) ; and in that said first and said second electronic circuit (1) are stacked, spaced apart, inside a package (7) . 11) A method of fabricating an electronic device comprising at least a first electronic circuit (1) ; said method comprising a step of depositing heat-transferring means for transferring heat to heat-dissipating means; and being characterized in that said heat-transferring means comprise a two-phase mixture.
12) A method of fabricating an electronic device (9) as claimed in Claim 11, said device comprising at least a second electronic circuit (1) stacked with and spaced apart from said first electronic circuit (1) inside a package (7) ; said method being characterized by comprising a step of stacking said first and said second electronic circuit (1) ; and in that said step of depositing heat-transferring means comprises a step of depositing an absorbent material (10) during said step of stacking said first and said second electronic circuit (1) , and is followed by a step of soaking said absorbent material (10) .
EP02741171A 2001-06-05 2002-06-05 Electronic device and relative fabrication method Withdrawn EP1412983A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITTO20010540 2001-06-05
IT2001TO000540A ITTO20010540A1 (en) 2001-06-05 2001-06-05 ELECTRONIC DEVICE AND RELATED MANUFACTURING PROCESS.
PCT/IT2002/000367 WO2002099883A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Publications (1)

Publication Number Publication Date
EP1412983A2 true EP1412983A2 (en) 2004-04-28

Family

ID=11458933

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02741171A Withdrawn EP1412983A2 (en) 2001-06-05 2002-06-05 Electronic device and relative fabrication method

Country Status (4)

Country Link
EP (1) EP1412983A2 (en)
AU (1) AU2002314532A1 (en)
IT (1) ITTO20010540A1 (en)
WO (1) WO2002099883A2 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673306A (en) * 1970-11-02 1972-06-27 Trw Inc Fluid heat transfer method and apparatus for semi-conducting devices
US5270571A (en) * 1991-10-30 1993-12-14 Amdahl Corporation Three-dimensional package for semiconductor devices
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
JP2001183080A (en) * 1999-12-24 2001-07-06 Furukawa Electric Co Ltd:The Method for producing compressed mesh wick, and flat heat pipe provided with compressed mesh wick

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02099883A3 *

Also Published As

Publication number Publication date
ITTO20010540A1 (en) 2002-12-05
WO2002099883A2 (en) 2002-12-12
WO2002099883A3 (en) 2004-03-04
ITTO20010540A0 (en) 2001-06-05
AU2002314532A1 (en) 2002-12-16

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