Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04B—TRANSMISSION
  • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
  • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
  • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04B—TRANSMISSION
  • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
  • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
  • H04B1/40—Circuits
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
  • G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
  • G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/70—Coupling devices
  • H01R12/71—Coupling devices for rigid printing circuits or like structures
  • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
  • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/02—Contact members
  • H01R13/22—Contacts for co-operating by abutting
  • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
  • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members

Definitions

• the present invention relates to a Subscriber Identity Module (SIM) card socket and its manufacturing method, in which the SIM card socket is mounted in a mobile communication device and receives a SIM card, so as to enable the mobile communication device to be used in making or receiving a phone call.
• SIM Subscriber Identity Module
• SIM Subscriber Identity Module
• a SLM card socket is disposed within a mobile communication device, so that the SLM card can be assembled in the SIM card socket, thereby enabling the owner to use the mobile communication device. Fees for the use of the mobile communication device are ascribed to the owner of the SIM card on the basis of the information in the SIM card.
• the SIM card socket in which the SLM card is seated, has a corresponding tendency toward a reduced size and a higher quality.
• FIG 1 is a perspective view of a conventional SIM card socket
• Figure 2 is a perspective view of a conventional SIM card socket and a conventional SIM card
• Figure 3 is an exploded perspective view of a mobile communication device in which a conventional SLM card socket is disposed.
• a conventional SIM card socket 20 includes a socket housing 22, a card-receiving surface 24, and a plurality of connector pin contacts 26.
• Socket housing 22 defines the external appearance of the conventional SLM card socket 20.
• the card- receiving surface 24 is defined by the upper surface of socket housing 22, and a SIM card 30 is mounted on this surface 24.
• Pin contacts 26 are supported at surface 24 of socket housing 22.
• each of pin contact 26 forms a solder end 26a adapted to be soldered to a connection node of a printed circuit board (not shown), while the other end of each of pin contact 26 forms a contact end 26b to be electrically connected to a corresponding contact 32 of SIM card 30.
• Contact ends 26b of pin contacts 26 are adapted to be elastically deformed.
• Conventional SLM card socket 20 having the construction as described above is received in the mobile communication device, in such a manner as shown in Figures 2 and 3.
• a socket seating recess 14 dimensioned to accommodate SIM card socket 20 is formed on a surface of mobile communication device 10, for example, on a battery seat 12 on which a battery 16 is assembled, and SIM card socket 20 is assembled in socket seating recess 14.
• Solder ends 26a of pin contacts 26 are soldered to corresponding connection nodes of the printed circuit board, which is exposed in socket seating recess 14 of mobile communication device 10, so that the SIM card socket is fixed in socket seating recess 14.
• SIM card 30 is inserted from above and placed on SIM card socket 20 fixed within socket seating recess 14.
• SIM card 30 placed on SIM card socket 20 in socket seating recess 14 is supported by contact ends 26b of pin contacts 26, which are adapted to be elastically deformed. That is, SIM card 30 is not completely assembled, but is held at an elevated position by contact ends 26b of pin contacts 26.
• battery 16 is then assembled on battery seat 12, so that SIM card 30 is completely seated on SIM card socket 20 in socket seating recess 14 and contacts 32 of SIM card 30 are electrically connected to pin contacts 26 of SIM card socket 20.
• solder ends 26a for fixing SIM card socket 20 to the printed circuit board protrudes outside of the dimensions of socket housing 22, the presence of solder end 26a is a main factor in making it difficult to reduce the overall dimension of the mobile communication device. Further, in the conventional SIM card socket 20 described above, since solder ends 26a for fixing SIM card socket 20 to the printed circuit board protrudes outside of the dimensions of socket housing 22, the presence of solder end 26a is a main factor in making it difficult to reduce the overall dimension of the mobile communication device. Further, in the conventional SIM card socket 20 described above, since solder ends
• an object of the present invention is to provide a SIM card socket and its manufacturing method, in which the board-engaging free ends and the card-engaging free ends of the pin contacts of the SIM card socket, which electrically connect to corresponding contacts of the SIM card and the printed circuit board in a mobile communication device, are located inside the dimensions defined by the SIM card socket, so as to reduce the dimensions of elements of the mobile communication device, thereby reducing the entire dimension of the mobile communication device.
• a SIM card socket which is adapted to be mounted in a mobile communication device, so that a SIM card can be mounted on the SIM card socket and the mobile communication device can be used in making or receiving a phone call
• the SIM card socket comprises: a plurality of pin contacts, each of the pin contacts having a bight portion, a board-engaging free end and a card- engaging free end, the pin contacts being arranged in two mirror image rows in such a manner as that the pin contacts arranged in one row are opposed to the pin contacts arranged in the other row, wherein the board-engaging free end and the card-engaging free end extend in the same general direction away from the bight portion and define an acute angle therebetween; and a generally rectangular socket housing having through holes windows formed therethrough, the bight portion of the pin contacts being mounted generally along two side edges of the socket housing, wherein the board-engaging free end and the card-engaging free end of each of the pin contacts are positioned within the through hole windows of the socket housing
• the socket housing comprises an upper plate portion and a lower plate portion, and the bight portion of each of the pin contacts is insert-molded between the upper plate portion and the lower plate portion of the socket housing.
• the socket housing may further comprise a metal reinforcement insert-molded between the upper plate portion and the lower plate portion in two longitudinal side portions and a central transverse portion of the socket housing, so as to reinforce a strength of the socket housing. It is preferred that the socket housing further comprises partitions disposed in the through hole windows of the socket housing spaced in regular intervals to separate adjacent pin contacts from each other.
• a method of manufacturing a SIM card socket comprising the steps of: stamping and forming a metal plate portion to produce a pin contact frame, the pin contact frame including an H-shaped metal reinforcement and a plurality of pin contacts connected integrally through the metal reinforcement, each of the pin contacts having a bight portion, a board-engaging free end and a card-engaging free end, the board-engaging free end and the card-engaging free end extending from the bight portion in the same general direction and defining an acute angle therebetween, wherein the metal reinforcement includes two side longitudinal extensions and a central transverse extension and the board-engaging free ends and card-engaging free ends of the pin contacts are arranged in two rows on opposite sides of the central transverse extension; molding a socket
• a SIM card socket according to the above invention may further comprise engagement protuberances formed on longer side portions of the socket housing; alignment protuberances formed on the longer side portions of the socket housing, wherein the alignment protuberances have different dimensions to facilitate mounting the socket in the mobile communication device, wherein the alignment protuberances are adapted to engage alignment grooves of the mobile communication device and the engagement protuberances are adapted to engage engagement thresholds of mobile communication device.
• the engagement protuberances of the socket housing and the engagement thresholds of the socket seat may comprise a chamfered surface, so as to enable the SIM card socket to be easily assembled on the mobile communications device.
• FIGURE 1 is a perspective view of a conventional SLM card socket
• FIGURE 2 is a perspective view of a conventional SLM card socket and a conventional SLM card
• FIGURE 3 is an exploded perspective view of a mobile communication device in which a conventional SIM card socket is disposed;
• FIGURE 4 is a perspective view of a SIM card socket according to an embodiment of the present invention.
• FIGURE 5 is a front view of the SLM card socket shown in FIG. 4;
• FIGURE 6 is a sectional view taken along line A-A in FIG. 5;
• FIGURE 7 is an exploded perspective view of a mobile communication device employing the SIM card socket shown in FIG. 4;
• FIGURE 8 is a partial sectional view of a mobile communication device, in which the SIM card socket shown in FIG. 4 is assembled;
• FIGURE 9 is a perspective view of a pin contact frame employed in the SLM card socket shown in FIG. 4;
• FIGURE 10 is an exploded perspective view of the pin contact frame shown in FIG. 9 and a socket housing shown in FIG. 4, for showing an assembly between them;
• FIGURE 11 is a perspective view of the SIM card socket of FIG. 4 in states just before and when it is completely manufactured;
• FIGURE 12 is a perspective view of a SIM card socket according to another embodiment of the present invention.
• FIGURE 13 is a front view of the SIM card socket shown in FIG. 12;
• FIGURE 14 is a rear view of the SIM card socket shown in FIG. 12;
• the metal reinforcement is fixed, such as by insert molding or the like.
• SIM card socket 100 having the construction shown in Figures 4 to 6 is assembled as shown in Figures 7 and 8.
• a SIM card seating recess 322 for seating the SIM card 200 is foraied in a predetermined portion of a battery seat 320 over which a battery 330 is subsequently assembled.
• printed circuit board 310 is exposed within SIM card seating recess 322.
• SIM card seating recess 322 is mounted in SIM card seating recess 322 while alignment protuberance 126 of socket housing 120 is inserted in alignment groove 314 of printed circuit board 310, SIM card 200 is inserted in SIM card seating recess 322 and mounted on SIM card socket 100, so that SIM card 200 is electrically connected with printed circuit board 310 of mobile communication device 300.
• SIM card 200 is mounted in SIM card seating recess 322 in the way described above, battery 330 is assembled on battery seat 320, so as to fix SIM card socket 100 and SIM card 200 to each other. Then, mobile communication device 300 can be used in making and receiving a phone call.
• SIM card 200 when it is necessary to disassemble and replace SIM card 200, after battery 330 is separated from battery seat 320, SIM card 200 can be detached from SIM card seating recess 322.
• SIM card socket 100 according to the present invention as described above does not require a solder portion, but is mounted by inserting alignment protuberance 126 of SIM card socket 100 into corresponding alignment groove 314 of printed circuit board 310, so that board-engaging free end 110a of pin contact 110 is mechanically and electrically in contact with contact 312 of printed circuit board 310. That is, SIM card socket 100 according to an embodiment of the present invention can be easily assembled and disassembled in and from a mobile communication device.
• SIM card socket 100 does not have a solder construction but has a contacting construction, so as to reduce the thickness or the height of SIM card socket 100 and the mobile communication device.
• board-engaging free end 110a and card-engaging free end 110b of pin contact 110 are not located outside the dimensions of socket housing 120 but are located within the dimensions defined by the rectangular socket housing 120, so as to reduce the overall outside dimension of socket housing 120, thereby reducing the entire dimension of SIM card socket 100.
• Figure 9 is a perspective view of a pin contact frame employed in the SIM card socket shown in Figure 4
• Figure 10 is an exploded perspective view of the pin contact frame shown in Figure 9 and a socket housing shown in Figure 4, for showing an assembly between them
• Figure 11 is a perspective view of the SIM card socket of Figure 4 in states just before and after it is completely fabricated.
• SIM card socket 100 shown in Figures 9 to 11 the same reference numerals as those in Figures 4 to 8 are used, but elements not provided with reference numerals in Figures 9 to 11 may be referred to by the reference numerals in Figures 4 to 8.
• pin contact frame 140 is insert-molded between upper plate portion 120a and lower plate portion 120b of socket housing 120.
• the insert molding is carried out after the pin contact frame 140 is positioned between the upper and lower plate portions of the socket housingl20. Specifically, the insert molding is carried out such that portions of the bight portions 110c of pin contacts 110 of pin contact frame 140 partially protrude out from the side edges of socket housing 120.
• portions of bight portions 110c of pin contacts 110 protruding out of the side edges of socket housing 120 are cut, so that pin contacts 110 and metal reinforcement 130 are mechanically and electrically isolated from each other. Then, the process of manufacturing SIM card socket 100 according to the present embodiment is completed.
• SIM card socket 400 shown in Figures 12 to 16 has the same construction as that of SIM card socket 100 shown in Figures 4 to 11, in which SIM card socket 400 includes a socket housing 410 having a rectangular shape.
• SIM card socket 400 As in SIM card socket 100 shown in Figures 4 to 11, in SIM card socket 400, board- engaging free end 420a and card-engaging free end 420b of pin contact 420 positioned within the dimensions of socket housing 410.
• Upper plate portion 410a and lower plate portion 410b are placed over each other and molded together while through holes 412 formed through upper plate portion 410a are aligned with through holes 412 formed through lower plate portion 410b, to complete socket housing 410.
• upper plate portion 410a is placed atop of lower plate portion 410b and through holes 412 of upper plate portion 410a are aligned with through holes 412 formed through lower plate portion 410b, longer side portions of lower plate portion 410b partially protrude out from longer side portions of upper plate portion 410a.
• engagement protuberances 414a may be formed on the longer side portions of upper plate portion 410a, and engagement protuberances 414a are located on both sides of aligmnent grooves 414b of lower plate portion 410b.
• Front upper comers of engagement protuberances 414a may be chamfered to form first chamfered surfaces 416a which facilitate the engagement between engagement protuberances 414a with engagement thresholds 626 formed on socket seat 622.
• SLM card socket 400 having the construction shown in Figures 12 to 21 according to the present embodiment is assembled as shown in Figures 15 to 21.
• socket receiving hole 620 is formed through a portion of rear case 602 of mobile communication device 600, which has a battery seat 630 for seating a battery 632, and socket seat 622 on which SIM card socket 400 is mounted is foraied at a boundary surface forming socket receiving hole 620.
• Socket receiving hole 620 and socket seat 622 are formed to correspond to the dimension and shape of SIM card socket 400.
• Alignment protuberances 624 which are adapted to engage with corresponding alignment grooves 414b of lower plate portion 410b of socket housing 410, are formed at along the longer sides of socket seat 622, and engagement thresholds 626, which are adapted to engage with corresponding engagement protuberances 414a of upper plate portion 410a of socket housing 410, are formed at corresponding locations on the longer sides of socket seat 622.
• rear corners of engagement thresholds 626 are chamfered to forai second chamfered surfaces 626a.
• SIM card socket 400 When SIM card socket 400 is mounted on socket seat 622, alignment grooves 414b formed at lower plate portion 410b of socket housing 410 are located on alignment protuberances 624 of socket seat 622. SLM card socket 400 is then pressed in toward the socket, so that engagement protuberances 414a formed on upper plate portion 410a engage with engagement thresholds 626 of socket seat 622. At this point SIM card socket 400 is completely mounted on socket seat 622, and upper surface of SIM card socket 400 is exposed to a space above battery seat 630 formed on rear case 602 of mobile communication device 600.
• rear case 602 is assembled with front case 604 of mobile communication device 600, so that board-engaging free end 420a of pin contacts 420 come into contact and electrically connect to co ⁇ esponding contacts of the printed circuit board.
• Figure 22 is an exploded perspective view of a pin contact frame and a socket housing employed in the SLM card socket shown in Figure 12, for showing an assembly between them
• Figure 23 is a perspective view of the SIM card socket of Figure 12 in states before and after being fabricated.
• Figures 22 and 23 show a process of manufacturing the SLM card socket 400 according to the present embodiment, which is the same as the process of manufacturing SIM card socket 100 shown in Figures 4 to 11, except for the alignment grooves 414b formed at lower plate portion 410b and the engagement protuberances 414a formed at upper plate portion 410a of socket housing 410.
• reference numerals 440 and 450 not described above respectively designate a pin contact frame and an insert molding portion.
• the board-engaging free ends and the card-engaging free ends of the pin contacts of the SIM card socket which electrically connect with corresponding contacts of the SIM card and the printed circuit board in a mobile communication device, are disposed within the dimensions defined by the rectangular shape and extend inward of the SIM card socket, so as to reduce the dimensions of elements of the mobile coimriunication device.
• the board-engaging free ends and the card-engaging free ends of the pin contacts of the SLM card socket do not necessitate a solder construction but can effect an electrical and mechanical contact by simply putting the free ends of the pin contacts in contact with corresponding contacts of a printed circuit board and SIM card respectively. Accordingly, this design reduces the thickness or the height of the SIM card socket.
• a SIM card socket and its manufacturing method according to the present invention enables the entire dimension of the mobile communication device to be reduced, since the dimensions of elements of the mobile communication device can be reduced in the way as described above.

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• Engineering & Computer Science (AREA)
• Computer Networks & Wireless Communication (AREA)
• Signal Processing (AREA)
• Artificial Intelligence (AREA)
• Computer Vision & Pattern Recognition (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Telephone Set Structure (AREA)

Applications Claiming Priority (3)

Publications (1)

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ID=19706757

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Country Status (3)

Families Citing this family (17)

Family Cites Families (9)

• 2001
  • 2001-03-12 KR KR10-2001-0012542A patent/KR100383744B1/ko not_active Expired - Fee Related
• 2002
  • 2002-03-12 EP EP02723432A patent/EP1368903A2/de active Pending
  • 2002-03-12 WO PCT/US2002/007717 patent/WO2002073819A2/en not_active Ceased

Non-Patent Citations (1)

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