WO2002073819B1 - Sim card socket and manufacturing method therefor - Google Patents

Sim card socket and manufacturing method therefor

Info

Publication number
WO2002073819B1
WO2002073819B1 PCT/US2002/007717 US0207717W WO02073819B1 WO 2002073819 B1 WO2002073819 B1 WO 2002073819B1 US 0207717 W US0207717 W US 0207717W WO 02073819 B1 WO02073819 B1 WO 02073819B1
Authority
WO
WIPO (PCT)
Prior art keywords
socket
plate portion
sim card
free end
socket housing
Prior art date
Application number
PCT/US2002/007717
Other languages
French (fr)
Other versions
WO2002073819A2 (en
WO2002073819A3 (en
Inventor
Sung Hyuk Joo
Original Assignee
Molex Inc
Sung Hyuk Joo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc, Sung Hyuk Joo filed Critical Molex Inc
Priority to EP02723432A priority Critical patent/EP1368903A2/en
Publication of WO2002073819A2 publication Critical patent/WO2002073819A2/en
Publication of WO2002073819A3 publication Critical patent/WO2002073819A3/en
Publication of WO2002073819B1 publication Critical patent/WO2002073819B1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
    • G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Telephone Set Structure (AREA)

Abstract

Disclosed are a SIM card socket and its manufacturing method, in which board-engaging free ends and card-engaging free ends of pin contacts of the SIM card socket are disposed within the outer dimensions and extend inwardly of the SIM card socket, thereby reducing the dimension of the mobile communication device. The SIM card socket has a plurality of U-shaped pin contacts mounted in a socket housing. Each of the pin contacts has a bight portion, a board-engaging free end and a card-engaging free end. The board-engaging free end and the card-engaging free end extend in the same direction away from the bight portion and define an acute angle therebetween. The socket housing has through hole windows, in which the board-engaging free ends and the card-engaging free ends of the pin contacts are located, so that the board-engaging free end and the card-engaging free end are located within the dimensions of the socket housing. The board-engaging free ends and the card-engaging free ends elastically come into contact with contacts of a printed circuit board of the mobile communication device and the SIM card, respectively. The card socket further includes a metal reinforcement to strengthen the socket housing.

Claims

AMENDED CLAIMS[received by the International Bureau on 23 December 2002 (23.12.02); original claims 1-20 replaced by amended claims 1-18 (4 pages)]
1. A SIM card socket (100) for receiving a SIM card and adapted to be mounted on a printed circuit board (310) in a mobile communication device comprising: a plurality of pin contacts (110), each contact being generally U-shaped and including a fixed bigh portion (110c) and two free end portions extending in the same direction away from the bight portion, the free end portions including a board-engaging free end (110a) extending downwardly from the bight portio and adapted to engage a corresponding contact (312) of the printed circuit board (310) and a card- engaging free end (110b) extending upwardly from the bight portion and adapted to engage a corresponding contact of the SIM card, wherein the board-engaging free end and the card-engaging free end of each contact define an acute angle therebetween, a generally rectangular socket housing ( 120) for mounting the contacts (110) therein in two generally parallel mirror image rows, wherein the housing includes windows (122) formed though the housing, and wherein the bight portion of the contacts are mounted generally along two opposite outside edges of the housing and the free ends of each contact extend inwardly toward a free end of an oppositely positioned mirror-image contact and are positioned within the windows, wherein the housing has outer dimensions which define the rectangular shape of the housing and t card-engaging free end and the board-engaging free end of the contacts are positioned inside of the outer dimensions of the housing, and wherein each card-engaging free end (110b) of the pin contact extends further away from the fixed bight portion (110c) than the adjacent board-engaging free end (110a).
2. A SIM card socket (100) as claimed in claim 1, wherein the socket housing comprises an upper plate portion (120a) and a lower plate portion (120b), and the bight portion (110c) of each of the pin contacts is fixed between the upper plate portion and the lower plate portion of the socket housing.
3. A SIM card socket (100) as claimed in claim 2, wherein the socket housing further comprises a metal reinforcement (130) located between the upper plate portion (120a) and the lower plate portion (120b).
4. A SIM card socket (100) as claimed in claim 3, wherein the metal reinforcement (130) is generally H-shaped and is located in two longitudinal side portions and a central transverse portion of the
22 socket housing.
5. A SIM card socket (100) as claimed in claim 4, wherein the contacts (110) and the metal reinforcement (130) are insert-molded between the upper plate portion and the lower plate portion of the socket housing.
6. A SIM card socket (100) as claimed in claim 1, wherein the socket housing (120) further comprises spaced-apart partitions (124) disposed in the windows of the socket housing, each of the partitions separating two adjacent pin contacts from each other.
7. A SIM card socket (100) as claimed in claim 1, wherein the socket housing further comprises an alignment protuberance (126) formed on a lower surface of the lower portion of the socket housing, so that the SIM card socket can be mounted at a predetermined location on the printed circuit board of the mobile communication device.
8. A method of manufacturing a SIM card socket (100), the SIM card socket being mounted in a mobile communication device and being adapted to receive a SIM card, the method comprising the steps of: stamping and forming a metal plate portion to produce a pin contact frame ( 140), the pin contact frame including a metal reinforcement (130) and a plurality of pin contacts (110), each of the pin contact being generally U-shaped and having a bight portion (110c), a board-engaging free end (110a) and a card-engaging free end (110b), the board-engaging free end and the card-engaging free end extending in the same direction away from the bight portion and defining an acute angle therebetween; molding a generally rectangular socket housing (120) with an upper plate portion (120a) and a lower plate portion (120b), each of the upper plate portion and the lower plate portion being formed with a window portion (122) such that the board-engaging free ends and the card-engaging free ends of the pi contacts are adapted to be located in the through hole windows; placing the pin contact frame between the upper plate portion and the lower plate portion, insert-molding the pin contact frame ( 140) between the upper plate portion ( 120a) and the lower plate portion (120b); and cutting portions of the pin contact frame to mechanically and electrically isolate the pin contacts from each other and from the metal reinforcement (130), wherein the step of stamping and forming the metal plate portion includes stamping and forming the pin contact frame so that the metal reinforcement (130) and the pin contact frame (140) are integrally connected.
9. The method of manufacturing a SIM card socket as set forth in claim 8, wherein the step of stamping and forming the metal plate portion includes stamping and forming the metal reinforcement (130) in the shape of an "H" with two side longitudinal extensions and a central transverse extension, and wherein the pin contacts (110) are stamped and formed on opposite sides of the central transverse extension in two mirror image rows.
10. The method of manufacturing a SIM card socket as set forth in claim 8, wherein the socket housing (120) is molded to be shorter than the pin contact frame (140) so as to allow a portion of the pin contact frame to protrude out of the socket housing when the pin contact frame is placed between the upper plate portion and the lower plate portion.
11. A SIM card socket (100) adapted to be mounted in a mobile communication device for receiving a SIM card, comprising: a rectangular socket housing (120) including an upper plate portion and a lower plate portion and having through hole windows (122) formed therethrough; and a plurality of generally U-shaped pin contacts (110) mounted in the socket housing in two parallel mirror image rows, each of the pin contacts having a bight portion (110c), a board-engaging free end (110a)and a card-engaging free end (110b), wherein the free ends of each of the pin contacts extend away from the bight portion (1 10c) in the same general direction and define an acute angle therebetween, the bight portions (110c) of the pin contacts being fixed generally along two outside edges of the socket housing between the upper plate portion and the lower plate portion of the socket housing and the free ends of each contact extend inwardly toward the free ends of an oppositely positioned mirror image contact, so that board-engaging free ends and card-engaging free ends of the pin contacts are located in the through hole windows of the socket housing, wherein each card-engaging free end (110b) of the pin contact extends further away from the fixed bight portion ( 110c) than the adj acent board-engaging free end ( 110a).
24
12. The SEVI card socket as claimed in claim 11 wherein the socket housing has outer dimensions which define the rectangular shape of the socket housing and wherein both the card-engaging free ends (110b) and the board-engaging free ends of the pin contacts are positioned inside of the outer dimensions of the socket housing (110a).
13. A SIM card socket as claimed in claim 11 wherein the upper plate portion (120a) is longer than the lower plate portion (120b), such that the longer side portions of the upper plate portion extend past the longer side portions of the lower plate portion.
14. A SIM card socket as claimed in claim 11, wherein the card socket further comprises a generally "H" shaped metal reinforcement (130) between the upper plate portion (120a) and the lower plate portion (120b).
15. A SIM card socket as claimed in claim 11 , wherein the socket housing further comprises spaced apart partitions (124) disposed in the through hole windows (122) of the socket housing (120) separating adjacent pin contacts (110).
16. A SIM card socket as claimed in claim 11 wherein the socket housing further comprises an alignment protuberance (126) formed on two opposite sides thereof, wherein the alignment protuberances have different dimensions and are adapted to engage corresponding alignment grooves (314) within the mobile communication device.
17. A SIM card socket as claimed in claim 11 wherein the socket housing (120) further comprises engagement protuberances (414a) formed on two opposing sides of the socket housing for engaging corresponding engagement thresholds (626) within the mobile communication device.
18. A SIM card socket as claimed in claim 17, wherein each of the engagement protuberances (414a) of the socket housing includes a chamfered surface.
25
PCT/US2002/007717 2001-03-12 2002-03-12 Sim card socket and manufacturing method therefor WO2002073819A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP02723432A EP1368903A2 (en) 2001-03-12 2002-03-12 Sim card socket and manufacturing method therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2001/12542 2001-03-12
KR10-2001-0012542A KR100383744B1 (en) 2001-03-12 2001-03-12 Subscriber identity module card socket and thereof manufacturing method

Publications (3)

Publication Number Publication Date
WO2002073819A2 WO2002073819A2 (en) 2002-09-19
WO2002073819A3 WO2002073819A3 (en) 2002-12-19
WO2002073819B1 true WO2002073819B1 (en) 2003-03-06

Family

ID=19706757

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/007717 WO2002073819A2 (en) 2001-03-12 2002-03-12 Sim card socket and manufacturing method therefor

Country Status (3)

Country Link
EP (1) EP1368903A2 (en)
KR (1) KR100383744B1 (en)
WO (1) WO2002073819A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101228539A (en) 2004-06-30 2008-07-23 Nxp股份有限公司 Chip card for insertion into a holder
KR100698542B1 (en) * 2005-12-16 2007-03-21 한국몰렉스 주식회사 Terminal's manufacturing method of dual card type connector of mobile phone
KR101418284B1 (en) * 2007-07-25 2014-07-10 엘지전자 주식회사 Terminal unit for sim-card socket and mobile terminal having the same
KR100849034B1 (en) 2008-06-09 2008-07-29 주식회사 시무텍 Apparatus inserting contact of socket of ic card reader
WO2010039758A2 (en) * 2008-09-30 2010-04-08 Trw Automotive U.S. Llc Pressure relief valve
CN104505623B (en) * 2014-07-01 2017-01-04 富士康(昆山)电脑接插件有限公司 Card connector
TWM630230U (en) 2020-03-13 2022-08-01 大陸商安費諾商用電子產品（成都）有限公司 Reinforcing member, electrical connector, circuit board assembly and insulating body
US11973286B2 (en) 2020-06-01 2024-04-30 Amphenol Commercial Products (Chengdu) Co., Ltd. Electrical connector and manufacturing method thereof
US11710923B2 (en) 2020-07-31 2023-07-25 Amphenol Commercial Products (Chengdu) Co., Ltd. Compact, reliable card edge connector
CN212874843U (en) 2020-08-31 2021-04-02 安费诺商用电子产品(成都)有限公司 Electrical connector
CN114597707A (en) 2020-12-04 2022-06-07 安费诺商用电子产品(成都)有限公司 Card edge connector with locking system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257414A (en) * 1990-11-26 1993-10-26 Motorola, Inc. Apparatus for accepting and retaining a memory card
DE69700909T2 (en) * 1996-02-29 2000-05-11 The Whitaker Corp., Wilmington DEVICE FOR ELECTRICALLY CONNECTING A CHIP CARD TO A CIRCUIT BOARD
JPH10187896A (en) * 1996-12-24 1998-07-21 Smk Corp Connector for ic card
US5883786A (en) * 1996-12-31 1999-03-16 Ericsson, Inc. SIM card containment assembly for an electronic apparatus
KR200171949Y1 (en) * 1997-01-07 2000-03-02 정진택 A socket for sim - card
EP0965937B1 (en) * 1998-06-15 2006-08-09 Molex Incorporated IC card connector
DE29815072U1 (en) * 1998-08-21 1998-11-05 Karl Lumberg GmbH & Co, 58579 Schalksmühle Card reader for a mobile device
FR2783947B1 (en) * 1998-09-29 2003-05-23 Framatome Connectors Int CONNECTOR FOR MICROCIRCUIT CARD READER IN PARTICULAR FOR SMALL FORMAT CARD
KR100360901B1 (en) * 1999-12-18 2002-11-18 엘지전자 주식회사 Mobile station having cassette type memory

Also Published As

Publication number Publication date
KR20020084846A (en) 2002-11-13
WO2002073819A2 (en) 2002-09-19
KR100383744B1 (en) 2003-05-14
WO2002073819A3 (en) 2002-12-19
EP1368903A2 (en) 2003-12-10

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