EP1365880A1 - Herstellung von mustern von mikrostrukturen in halbleitern mit uv-laser - Google Patents

Herstellung von mustern von mikrostrukturen in halbleitern mit uv-laser

Info

Publication number
EP1365880A1
EP1365880A1 EP02707453A EP02707453A EP1365880A1 EP 1365880 A1 EP1365880 A1 EP 1365880A1 EP 02707453 A EP02707453 A EP 02707453A EP 02707453 A EP02707453 A EP 02707453A EP 1365880 A1 EP1365880 A1 EP 1365880A1
Authority
EP
European Patent Office
Prior art keywords
laser
laser system
substrate
chuck
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02707453A
Other languages
English (en)
French (fr)
Other versions
EP1365880A4 (de
Inventor
Brian W. Baird
Michael J. Wolfe
Richard J. Harris
Kevin P. Fahey
Lian-Cheng Zou
Thomas R. Mcneil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/803,382 external-priority patent/US20020033558A1/en
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP1365880A1 publication Critical patent/EP1365880A1/de
Publication of EP1365880A4 publication Critical patent/EP1365880A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
EP02707453A 2001-01-31 2002-01-10 Herstellung von mustern von mikrostrukturen in halbleitern mit uv-laser Withdrawn EP1365880A4 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US26555601P 2001-01-31 2001-01-31
US265556P 2001-01-31
US803382 2001-03-09
US09/803,382 US20020033558A1 (en) 2000-09-20 2001-03-09 UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses
PCT/US2002/000867 WO2002060636A1 (en) 2001-01-31 2002-01-10 Ultraviolet laser ablative patterning of microstructures in semiconductors

Publications (2)

Publication Number Publication Date
EP1365880A1 true EP1365880A1 (de) 2003-12-03
EP1365880A4 EP1365880A4 (de) 2008-04-16

Family

ID=26951292

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02707453A Withdrawn EP1365880A4 (de) 2001-01-31 2002-01-10 Herstellung von mustern von mikrostrukturen in halbleitern mit uv-laser

Country Status (7)

Country Link
EP (1) EP1365880A4 (de)
JP (1) JP4634692B2 (de)
CN (1) CN1301178C (de)
CA (1) CA2436736A1 (de)
GB (1) GB2389811B (de)
TW (1) TW525240B (de)
WO (1) WO2002060636A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6949449B2 (en) 2003-07-11 2005-09-27 Electro Scientific Industries, Inc. Method of forming a scribe line on a ceramic substrate
US7985942B2 (en) * 2004-05-28 2011-07-26 Electro Scientific Industries, Inc. Method of providing consistent quality of target material removal by lasers having different output performance characteristics
US20060108327A1 (en) * 2004-11-23 2006-05-25 Chng Kiong C Method of manufacturing a microstructure
DE102005042072A1 (de) * 2005-06-01 2006-12-14 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern
JP2007067082A (ja) * 2005-08-30 2007-03-15 Disco Abrasive Syst Ltd ウエーハの穿孔方法
DE102005042074A1 (de) 2005-08-31 2007-03-08 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von Durchkontaktierungen in Halbleiterwafern
US7767595B2 (en) * 2006-10-26 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
CN101041415B (zh) * 2006-11-07 2010-08-11 东南大学 硅片上制作纳米孔的方法
JP2008155274A (ja) * 2006-12-26 2008-07-10 Disco Abrasive Syst Ltd ウエーハの加工方法
KR101041140B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 방법
CN101850981A (zh) * 2010-06-23 2010-10-06 东北林业大学 一种激光烧蚀制备氧化硅纳米泡沫的方法
JP5860219B2 (ja) * 2011-03-10 2016-02-16 株式会社ディスコ レーザー加工装置
TWI587957B (zh) * 2011-08-18 2017-06-21 奧寶科技有限公司 用於電路之一檢測/維修/檢測系統之透鏡總成及用於電路之一檢測/維修/檢測系統之組合器總成
CN102956239A (zh) * 2011-08-29 2013-03-06 新科实业有限公司 磁头、磁头折片组合以及磁盘驱动单元
CN103567642B (zh) * 2012-08-08 2017-07-11 赛恩倍吉科技顾问（深圳）有限公司 蓝宝石切割装置
CN103962727B (zh) * 2013-01-28 2018-03-02 深圳市裕展精密科技有限公司 蓝宝石切割装置
US10118250B1 (en) 2017-09-15 2018-11-06 International Business Machines Corporation In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method
CN108326435B (zh) * 2017-12-29 2022-08-30 大族激光科技产业集团股份有限公司 一种模具钢的激光打标方法
CN108637472B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗激光焊接线平台
CN108637473B (zh) * 2018-06-05 2023-12-08 昆山宝锦激光拼焊有限公司 一种天窗板一次定位焊接成型的装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JPH11224866A (ja) * 1997-12-03 1999-08-17 Ngk Insulators Ltd レーザ割断方法
WO2000073013A1 (en) * 1999-05-28 2000-12-07 Electro Scientific Industries, Inc. Beam shaping and projection imaging with solid state uv gaussian beam to form vias
WO2001017001A1 (en) * 1999-08-27 2001-03-08 Jmar Research, Inc. Method and apparatus for laser ablation of a target material

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534804A (en) * 1984-06-14 1985-08-13 International Business Machines Corporation Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer
JP2621599B2 (ja) * 1990-07-05 1997-06-18 日本電気株式会社 コンタクトホール形成装置及び方法
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
JPH09107168A (ja) * 1995-08-07 1997-04-22 Mitsubishi Electric Corp 配線基板のレーザ加工方法、配線基板のレーザ加工装置及び配線基板加工用の炭酸ガスレーザ発振器
JPH11773A (ja) * 1997-06-11 1999-01-06 Nec Corp レーザ加工装置およびその方法
JP3395141B2 (ja) * 1998-03-02 2003-04-07 住友重機械工業株式会社 レーザ加工装置
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
US6063695A (en) * 1998-11-16 2000-05-16 Taiwan Semiconductor Manufacturing Company Simplified process for the fabrication of deep clear laser marks using a photoresist mask
JP2000164535A (ja) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp レーザ加工装置
US6255621B1 (en) * 2000-01-31 2001-07-03 International Business Machines Corporation Laser cutting method for forming magnetic recording head sliders
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
DE10026066A1 (de) * 2000-05-25 2001-11-29 Deere & Co Vorrichtung zum Umhüllen eines Rundballens

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JPH11224866A (ja) * 1997-12-03 1999-08-17 Ngk Insulators Ltd レーザ割断方法
WO2000073013A1 (en) * 1999-05-28 2000-12-07 Electro Scientific Industries, Inc. Beam shaping and projection imaging with solid state uv gaussian beam to form vias
WO2001017001A1 (en) * 1999-08-27 2001-03-08 Jmar Research, Inc. Method and apparatus for laser ablation of a target material

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CABLE A: "NEW LASER PROCESSES AND WAVELENGTHS FOR DRILLING THROUGH-HOLE AND BLIND VIAS IN A WIDE RANGE OF CIRCUIT BOARD MATERIALS" PROCEEDINGS OF THE TECHNICAL CONFERENCE IPC PRINTED CIRCUITS EXPO, 3 March 1996 (1996-03-03), pages S18-5, XP000889527 *
J. GOLDEN: "GREEN LASERS SCORE GOOD MARKS IN SEMICONDUCTOR MATERIAL PROCESSING" LASER FOCUS WORLD, PENNWELL, TULSA, OK, US, vol. 28, no. 6, 1 June 1992 (1992-06-01), pages 75-76,78,80,, XP000281915 ISSN: 1043-8092 *
See also references of WO02060636A1 *

Also Published As

Publication number Publication date
TW525240B (en) 2003-03-21
JP4634692B2 (ja) 2011-02-16
GB0317853D0 (en) 2003-09-03
CA2436736A1 (en) 2002-08-08
EP1365880A4 (de) 2008-04-16
CN1301178C (zh) 2007-02-21
CN1527754A (zh) 2004-09-08
GB2389811B (en) 2004-10-27
JP2004526575A (ja) 2004-09-02
WO2002060636A1 (en) 2002-08-08
GB2389811A (en) 2003-12-24

Similar Documents

Publication Publication Date Title
US7157038B2 (en) Ultraviolet laser ablative patterning of microstructures in semiconductors
US20060091126A1 (en) Ultraviolet laser ablative patterning of microstructures in semiconductors
US6676878B2 (en) Laser segmented cutting
WO2002060636A1 (en) Ultraviolet laser ablative patterning of microstructures in semiconductors
US8198566B2 (en) Laser processing of workpieces containing low-k dielectric material
EP1631415B1 (de) Fokussierung eines optischen strahles auf zwei fokusse
US7364986B2 (en) Laser beam processing method and laser beam machine
US7482554B2 (en) Laser beam processing machine
EP1341638B1 (de) Laserbearbeitung von halbleitermaterialen
JP2004528991A5 (de)
US7482553B2 (en) Laser beam processing machine
WO2003002289A1 (en) Multistep laser processing of wafers supporting surface device layers
US7396780B2 (en) Method for laser processing of wafer
KR100853827B1 (ko) 반도체의 마이크로구조에 대한 자외선 레이저 절제 패터닝

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030805

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIN1 Information on inventor provided before grant (corrected)

Inventor name: MCNEIL, THOMAS, R.

Inventor name: ZOU, LIAN-CHENG

Inventor name: FAHEY, KEVIN, P.

Inventor name: HARRIS, RICHARD, J.

Inventor name: WOLFE, MICHAEL, J.

Inventor name: BAIRD, BRIAN, W.

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566

A4 Supplementary search report drawn up and despatched

Effective date: 20080318

17Q First examination report despatched

Effective date: 20081230

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090710