EP1322941A2 - Identificateur de sources de d fauts - Google Patents

Identificateur de sources de d fauts

Info

Publication number
EP1322941A2
EP1322941A2 EP01977451A EP01977451A EP1322941A2 EP 1322941 A2 EP1322941 A2 EP 1322941A2 EP 01977451 A EP01977451 A EP 01977451A EP 01977451 A EP01977451 A EP 01977451A EP 1322941 A2 EP1322941 A2 EP 1322941A2
Authority
EP
European Patent Office
Prior art keywords
defect
source identifier
information
defect source
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP01977451A
Other languages
German (de)
English (en)
Inventor
Amos Dor
Maya Radzinski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/905,607 external-priority patent/US6701259B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1322941A2 publication Critical patent/EP1322941A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Procédé et dispositif associé d'analyse de défauts de plaquettes de semi-conducteurs. Le procédé comporte les étapes consistant à : identifier les défauts sur la plaquette de semi-conducteur ; produire des informations d'inspection de défauts destinées à un client d'identification de source de défauts, ces informations contenant des informations relatives aux défauts identifiés ; transmettre les informations d'inspection de défauts par un réseau à un serveur d'identification de source de défauts ; obtenir audit serveur des informations de source de défaut en réponse aux informations d'inspection de défauts ; transmettre les informations de source de défaut, du serveur vers le client d'identification de source de défauts ; utiliser les informations de source de défauts au lieu où se trouve le client. Dans un aspect, l'utilisation des informations de solutions aux défauts comprend l'affichage de ces solutions au lieu où se trouve le client d'identification de source de défauts, en réponse aux informations de solutions. Dans un autre aspect, l'utilisation des informations de solutions aux défauts comprend une modification du fonctionnement du système de traitement des plaquettes.
EP01977451A 2000-10-02 2001-10-02 Identificateur de sources de d fauts Ceased EP1322941A2 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23729700P 2000-10-02 2000-10-02
US237297P 2000-10-02
US09/905,607 US6701259B2 (en) 2000-10-02 2001-07-13 Defect source identifier
US905607 2001-07-13
PCT/US2001/031029 WO2002029392A2 (fr) 2000-10-02 2001-10-02 Identificateur de sources de défauts

Publications (1)

Publication Number Publication Date
EP1322941A2 true EP1322941A2 (fr) 2003-07-02

Family

ID=26930528

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01977451A Ceased EP1322941A2 (fr) 2000-10-02 2001-10-02 Identificateur de sources de d fauts

Country Status (5)

Country Link
EP (1) EP1322941A2 (fr)
KR (1) KR20020063582A (fr)
CN (1) CN1398348A (fr)
TW (1) TWI256468B (fr)
WO (1) WO2002029392A2 (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031690A (ja) * 2002-06-26 2004-01-29 Agilent Technologies Japan Ltd データ解析装置
US6885977B2 (en) * 2002-12-20 2005-04-26 Applied Materials, Inc. System to identify a wafer manufacturing problem and method therefor
US7208328B2 (en) * 2004-03-16 2007-04-24 Macronix International Co., Ltd. Method and system for analyzing defects of an integrated circuit wafer
WO2006044426A2 (fr) * 2004-10-12 2006-04-27 Kla-Tencor Technologies Corp. Procedes et systemes informatiques de classification des defauts deceles sur un specimen
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP4882505B2 (ja) * 2006-05-19 2012-02-22 東京エレクトロン株式会社 異物分布パターンの照合方法及びその装置
KR101841897B1 (ko) 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
KR101674698B1 (ko) * 2009-02-13 2016-11-09 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 결함들 검출
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
TWI386643B (zh) * 2009-04-17 2013-02-21 Chipmos Technologies Inc 晶圓缺陷標示系統
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US10114368B2 (en) * 2013-07-22 2018-10-30 Applied Materials Israel Ltd. Closed-loop automatic defect inspection and classification
CN103606529B (zh) * 2013-10-23 2016-08-24 上海华力微电子有限公司 一种提升缺陷分类准确度的方法及装置
US9286675B1 (en) 2014-10-23 2016-03-15 Applied Materials Israel Ltd. Iterative defect filtering process
KR102468184B1 (ko) * 2017-01-18 2022-11-17 에이에스엠엘 네델란즈 비.브이. 결함 검토를 위한 정보 추천
WO2018213487A1 (fr) * 2017-05-17 2018-11-22 Applied Materials Israel Ltd. Procédé, produit-programme informatique et système de détection de défauts de processus de fabrication
US10620135B2 (en) * 2017-07-19 2020-04-14 Kla-Tencor Corp. Identifying a source of nuisance defects on a wafer
TWI757907B (zh) * 2020-10-07 2022-03-11 財團法人國家實驗研究院 一種在真空環境中叢集式即時線上製程暨分析傳輸系統
TWI815195B (zh) * 2021-10-13 2023-09-11 瑞霸生技股份有限公司 電化學檢測之起始時間判斷方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
WO1997035337A1 (fr) * 1996-03-19 1997-09-25 Hitachi, Ltd. Systeme de commande de processus
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0229392A2 *

Also Published As

Publication number Publication date
KR20020063582A (ko) 2002-08-03
TWI256468B (en) 2006-06-11
CN1398348A (zh) 2003-02-19
WO2002029392A2 (fr) 2002-04-11
WO2002029392A3 (fr) 2002-06-06

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20020510

AK Designated contracting states

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RBV Designated contracting states (corrected)

Designated state(s): AT BE CH CY DE FR GB IT LI NL

17Q First examination report despatched

Effective date: 20070509

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20090323