EP1309447A4 - Alliages sans plomb a proprietes d'agent mouillant ameliorees - Google Patents

Alliages sans plomb a proprietes d'agent mouillant ameliorees

Info

Publication number
EP1309447A4
EP1309447A4 EP01984406A EP01984406A EP1309447A4 EP 1309447 A4 EP1309447 A4 EP 1309447A4 EP 01984406 A EP01984406 A EP 01984406A EP 01984406 A EP01984406 A EP 01984406A EP 1309447 A4 EP1309447 A4 EP 1309447A4
Authority
EP
European Patent Office
Prior art keywords
lead
wetting properties
improved wetting
free alloys
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01984406A
Other languages
German (de)
English (en)
Other versions
EP1309447A1 (fr
Inventor
Jianxing Li
Michael Pinter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP1309447A1 publication Critical patent/EP1309447A1/fr
Publication of EP1309447A4 publication Critical patent/EP1309447A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
EP01984406A 2000-07-31 2001-07-18 Alliages sans plomb a proprietes d'agent mouillant ameliorees Withdrawn EP1309447A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22182000P 2000-07-31 2000-07-31
US221820P 2000-07-31
PCT/US2001/022778 WO2002009936A1 (fr) 2000-07-31 2001-07-18 Alliages sans plomb a proprietes d'agent mouillant ameliorees

Publications (2)

Publication Number Publication Date
EP1309447A1 EP1309447A1 (fr) 2003-05-14
EP1309447A4 true EP1309447A4 (fr) 2005-11-09

Family

ID=22829529

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01984406A Withdrawn EP1309447A4 (fr) 2000-07-31 2001-07-18 Alliages sans plomb a proprietes d'agent mouillant ameliorees

Country Status (4)

Country Link
EP (1) EP1309447A4 (fr)
JP (1) JP2004514559A (fr)
AU (1) AU2002227489A1 (fr)
WO (1) WO2002009936A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
US20130045131A1 (en) * 2011-08-17 2013-02-21 Honeywell International Inc. Lead-Free Solder Compositions
CN102632347B (zh) * 2012-01-09 2014-07-02 西安交通大学 一种铝基复合材料及铝合金用钎料及钎焊方法
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
JP2017509489A (ja) 2014-02-20 2017-04-06 ハネウェル・インターナショナル・インコーポレーテッド 鉛フリーはんだ組成物
JP6119909B1 (ja) * 2016-07-27 2017-04-26 千住金属工業株式会社 溶射用合金、溶射用合金線、フィルムコンデンサ、およびはんだ合金
CN106271193B (zh) * 2016-09-23 2018-06-15 河南科技大学 一种铜/铝合金钎焊用钎料及其制备方法
WO2019229653A1 (fr) * 2018-05-28 2019-12-05 Ecole Polytechnique Federale De Lausanne (Epfl) Dispositif excitonique et procédés de fonctionnement de celui-ci

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019336A (en) * 1989-03-13 1991-05-28 Allied-Signal Inc. Micro-additions to tin alloys
EP0855242A1 (fr) * 1995-09-29 1998-07-29 Matsushita Electric Industrial Co., Ltd. Soudure sans plomb
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
DE19904765A1 (de) * 1998-02-05 1999-08-12 Fuji Electric Co Ltd Lötmittel-Legierungen
EP0976489A1 (fr) * 1996-12-17 2000-02-02 Sony Corporation Matériau pour soudure tendre
JP2000061686A (ja) * 1998-08-25 2000-02-29 Sumitomo Metal Mining Co Ltd はんだ用Ｚｎ合金
EP0988920A1 (fr) * 1998-09-14 2000-03-29 Murata Manufacturing Co., Ltd. Article soudé
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911748A (fr) * 1972-05-16 1974-02-01
JPS6032975B2 (ja) * 1977-04-05 1985-07-31 日本電気株式会社 半導体装置
JPS6038457B2 (ja) * 1979-07-16 1985-08-31 三菱アルミニウム株式会社 ブレ−ジングシ−トのろう材用アルミニウム合金
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
SU1731547A1 (ru) * 1990-08-17 1992-05-07 Московский вечерний металлургический институт Припой дл пайки и лужени медных сплавов
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
US6027575A (en) * 1997-10-27 2000-02-22 Ford Motor Company Metallic adhesive for forming electronic interconnects at low temperatures
JP3878305B2 (ja) * 1997-12-04 2007-02-07 住友金属鉱山株式会社 高温はんだ付用Ｚｎ合金
JP2000006186A (ja) * 1998-06-29 2000-01-11 Nissha Printing Co Ltd インサート成形品の製造方法
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019336A (en) * 1989-03-13 1991-05-28 Allied-Signal Inc. Micro-additions to tin alloys
EP0855242A1 (fr) * 1995-09-29 1998-07-29 Matsushita Electric Industrial Co., Ltd. Soudure sans plomb
EP0976489A1 (fr) * 1996-12-17 2000-02-02 Sony Corporation Matériau pour soudure tendre
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen
DE19904765A1 (de) * 1998-02-05 1999-08-12 Fuji Electric Co Ltd Lötmittel-Legierungen
JP2000061686A (ja) * 1998-08-25 2000-02-29 Sumitomo Metal Mining Co Ltd はんだ用Ｚｎ合金
EP0988920A1 (fr) * 1998-09-14 2000-03-29 Murata Manufacturing Co., Ltd. Article soudé
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
CSANADY A ET AL: "The influence of some alloying additions (Cr, Cu and Li) on the thermal oxidation of Al-Zn-Mg alloys", CORROSION SCIENCE UK, vol. 22, no. 7, 1982, pages 689 - 713, XP002343390, ISSN: 0010-938X *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 07 29 September 2000 (2000-09-29) *
See also references of WO0209936A1 *
SHIMIZU T; ISHIKAWA H; OHNUMA I; ISHIDA K: "Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use", JOURNAL OF ELECTRONIC MATERIALS TMS USA, vol. 28, no. 11, November 1999 (1999-11-01), pages 1172 - 1175, XP009053240, ISSN: 0361-5235 *

Also Published As

Publication number Publication date
WO2002009936A1 (fr) 2002-02-07
EP1309447A1 (fr) 2003-05-14
AU2002227489A1 (en) 2002-02-13
JP2004514559A (ja) 2004-05-20

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20030204

AK Designated contracting states

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

RIC1 Information provided on ipc code assigned before grant

Ipc: 7H 05K 3/34 B

Ipc: 7H 01L 23/488 B

Ipc: 7B 23K 35/28 B

Ipc: 7B 23K 35/26 B

Ipc: 7C 22C 18/04 B

Ipc: 7C 22C 13/02 B

Ipc: 7H 01L 29/02 B

Ipc: 7B 32B 15/20 A

A4 Supplementary search report drawn up and despatched

Effective date: 20050926

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100202