AU2002227489A1 - Lead-free alloys with improved wetting properties - Google Patents

Lead-free alloys with improved wetting properties

Info

Publication number
AU2002227489A1
AU2002227489A1 AU2002227489A AU2748902A AU2002227489A1 AU 2002227489 A1 AU2002227489 A1 AU 2002227489A1 AU 2002227489 A AU2002227489 A AU 2002227489A AU 2748902 A AU2748902 A AU 2748902A AU 2002227489 A1 AU2002227489 A1 AU 2002227489A1
Authority
AU
Australia
Prior art keywords
lead
wetting properties
improved wetting
free alloys
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002227489A
Other languages
English (en)
Inventor
Jianxing Li
Michael Pinter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2002227489A1 publication Critical patent/AU2002227489A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
AU2002227489A 2000-07-31 2001-07-18 Lead-free alloys with improved wetting properties Abandoned AU2002227489A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22182000P 2000-07-31 2000-07-31
US60221820 2000-07-31
PCT/US2001/022778 WO2002009936A1 (fr) 2000-07-31 2001-07-18 Alliages sans plomb a proprietes d'agent mouillant ameliorees

Publications (1)

Publication Number Publication Date
AU2002227489A1 true AU2002227489A1 (en) 2002-02-13

Family

ID=22829529

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002227489A Abandoned AU2002227489A1 (en) 2000-07-31 2001-07-18 Lead-free alloys with improved wetting properties

Country Status (4)

Country Link
EP (1) EP1309447A4 (fr)
JP (1) JP2004514559A (fr)
AU (1) AU2002227489A1 (fr)
WO (1) WO2002009936A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9735126B2 (en) * 2011-06-07 2017-08-15 Infineon Technologies Ag Solder alloys and arrangements
US20130045131A1 (en) * 2011-08-17 2013-02-21 Honeywell International Inc. Lead-Free Solder Compositions
CN102632347B (zh) * 2012-01-09 2014-07-02 西安交通大学 一种铝基复合材料及铝合金用钎料及钎焊方法
KR20160003078A (ko) 2013-05-03 2016-01-08 허니웰 인터내셔날 인코포레이티드 무연 솔더 접속을 위한 리드 프레임 구조체
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
JP6119909B1 (ja) * 2016-07-27 2017-04-26 千住金属工業株式会社 溶射用合金、溶射用合金線、フィルムコンデンサ、およびはんだ合金
CN106271193B (zh) * 2016-09-23 2018-06-15 河南科技大学 一种铜/铝合金钎焊用钎料及其制备方法
US20210217919A1 (en) * 2018-05-28 2021-07-15 Ecole Polytechnique Federale De Lausanne (Epfl) Excitonic device and operating methods thereof

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911748A (fr) * 1972-05-16 1974-02-01
JPS6032975B2 (ja) * 1977-04-05 1985-07-31 日本電気株式会社 半導体装置
JPS6038457B2 (ja) * 1979-07-16 1985-08-31 三菱アルミニウム株式会社 ブレ−ジングシ−トのろう材用アルミニウム合金
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
US5019336A (en) * 1989-03-13 1991-05-28 Allied-Signal Inc. Micro-additions to tin alloys
SU1731547A1 (ru) * 1990-08-17 1992-05-07 Московский вечерний металлургический институт Припой дл пайки и лужени медных сплавов
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
CN1087994C (zh) * 1995-09-29 2002-07-24 松下电器产业株式会社 无铅钎料合金
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
JP3601278B2 (ja) * 1996-12-17 2004-12-15 ソニー株式会社 はんだ材料
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
US6027575A (en) * 1997-10-27 2000-02-22 Ford Motor Company Metallic adhesive for forming electronic interconnects at low temperatures
JP3878305B2 (ja) * 1997-12-04 2007-02-07 住友金属鉱山株式会社 高温はんだ付用Ｚｎ合金
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
JP2000006186A (ja) * 1998-06-29 2000-01-11 Nissha Printing Co Ltd インサート成形品の製造方法
JP3945915B2 (ja) * 1998-08-25 2007-07-18 住友金属鉱山株式会社 はんだ用Ｚｎ合金
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders

Also Published As

Publication number Publication date
EP1309447A4 (fr) 2005-11-09
EP1309447A1 (fr) 2003-05-14
WO2002009936A1 (fr) 2002-02-07
JP2004514559A (ja) 2004-05-20

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