HK1045824A1 - 焊料或涉及焊料的改進 - Google Patents

焊料或涉及焊料的改進

Info

Publication number
HK1045824A1
HK1045824A1 HK02107460.4A HK02107460A HK1045824A1 HK 1045824 A1 HK1045824 A1 HK 1045824A1 HK 02107460 A HK02107460 A HK 02107460A HK 1045824 A1 HK1045824 A1 HK 1045824A1
Authority
HK
Hong Kong
Prior art keywords
solders
improvements relating
relating
Prior art date
Application number
HK02107460.4A
Other languages
English (en)
Inventor
K‧H‧楚
P‧W‧赤
Original Assignee
量子化學技術(新加坡)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 量子化學技術(新加坡)股份有限公司 filed Critical 量子化學技術(新加坡)股份有限公司
Publication of HK1045824A1 publication Critical patent/HK1045824A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
HK02107460.4A 2000-11-16 2002-10-15 焊料或涉及焊料的改進 HK1045824A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG2000068411 2000-11-16

Publications (1)

Publication Number Publication Date
HK1045824A1 true HK1045824A1 (zh) 2002-12-13

Family

ID=71993755

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107460.4A HK1045824A1 (zh) 2000-11-16 2002-10-15 焊料或涉及焊料的改進

Country Status (5)

Country Link
US (1) US20020057986A1 (zh)
JP (1) JP2002153991A (zh)
CN (1) CN1354065A (zh)
HK (1) HK1045824A1 (zh)
MY (1) MY134159A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8005880B2 (en) * 2007-08-24 2011-08-23 International Business Machines Corporation Half width counting leading zero circuit
US7654471B2 (en) 2008-01-23 2010-02-02 Bruce Johnson Waterfall apparatus
JP5343566B2 (ja) * 2009-01-08 2013-11-13 富士通株式会社 接合方法及びリフロー装置
JP2010219241A (ja) * 2009-03-16 2010-09-30 Fujitsu Ltd 電子部品のはんだ付け方法及び電子部品
EP2937432B1 (en) * 2012-12-18 2017-11-22 Senju Metal Industry Co., Ltd Lead-free solder alloy
US10424529B2 (en) * 2014-02-21 2019-09-24 Denka Company Limited Ceramic circuit board
CN105215569A (zh) * 2015-10-30 2016-01-06 苏州优诺电子材料科技有限公司 一种无铅焊料合金
CN108672979B (zh) * 2018-06-06 2020-02-14 上海莜玮汽车零部件有限公司 一种无铅焊料合金及其应用、玻璃组件

Also Published As

Publication number Publication date
US20020057986A1 (en) 2002-05-16
JP2002153991A (ja) 2002-05-28
MY134159A (en) 2007-11-30
CN1354065A (zh) 2002-06-19

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