EP1290346B1 - Regulation thermique pour dispositif de generation de vide - Google Patents

Regulation thermique pour dispositif de generation de vide Download PDF

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Publication number
EP1290346B1
EP1290346B1 EP01945446A EP01945446A EP1290346B1 EP 1290346 B1 EP1290346 B1 EP 1290346B1 EP 01945446 A EP01945446 A EP 01945446A EP 01945446 A EP01945446 A EP 01945446A EP 1290346 B1 EP1290346 B1 EP 1290346B1
Authority
EP
European Patent Office
Prior art keywords
liquid
heat exchange
heat
thermal communication
pump body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01945446A
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German (de)
English (en)
French (fr)
Other versions
EP1290346A1 (fr
Inventor
François HOUZE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
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Alcatel Lucent SAS
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Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Publication of EP1290346A1 publication Critical patent/EP1290346A1/fr
Application granted granted Critical
Publication of EP1290346B1 publication Critical patent/EP1290346B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04—Heating; Cooling; Heat insulation

Definitions

  • the present invention relates to vacuum generation devices as defined in the preamble of claim 1.
  • Such a device is known from the document JP-A-01008388 or JP-A-07174099 .
  • vacuum generation devices One of the common uses of vacuum generation devices is the generation of vacuum in a semiconductor processing chamber.
  • the vacuum generating devices comprise at least one primary pump which delivers the pumped gases at atmospheric pressure or at a relatively high pressure.
  • the pumped gases tend to condense and solidify in the form of deposits when their temperature is too low, or when the temperature variations are too great. These deposits disrupt the operation of the pump and the quality of the vacuum generation, which can cause pollution by back-diffusion in the semiconductor processing chamber.
  • the thermal regulation of the pump body is ensured by a temperature control system of the vacuum pump comprising at least one heat exchange circuit in which circulates a heat-transfer liquid and of which at least a first circuit portion is thermally connected with the pump empty and a second circuit portion is connected to a thermal source. Means are provided for circulating the heat transfer liquid in the heat exchange circuit.
  • control means make it possible to vary the flow rate of the heat transfer liquid in the heat exchange circuit, thus modulating the heat exchange capacity of the heat exchange circuit as a function of a control signal to adapt it if necessary heat exchange for maintaining the temperature of the pump in a suitable temperature range.
  • the thermal exchanges required for the thermal regulation of the pump lead to a large variation in the flow rate of the coolant.
  • the speed of the heat transfer liquid is variable, and is low during certain operating steps, and its temperature is also variable and is high during certain operating steps.
  • control means make it possible to vary the power of the thermal source, for example by adjusting an electric heating current as described in the document JP 01 008388 , or by speed adjustment of a cooling fan as described in the document JP 07 174099 .
  • the temperature of the coolant is very variable depending on the heat output to be transmitted.
  • a problem encountered in these known temperature control systems is the formation of deposits in the pipes and in the rooms to be cooled when using water networks as a heat transfer liquid.
  • the limestone naturally present in suspension in the water solidifies and forms deposits in the pipes and in the rooms to be cooled, initially altering the quality of heat exchange, and can even obstruct said pipes or parts.
  • the problem proposed by the present invention is to design a new temperature control system structure in the vacuum generation devices, allowing to ensure an efficient thermal regulation while avoiding the calcareous deposits mentioned above.
  • the idea underlying the present invention is to circulate in the heat exchange circuit a heat transfer liquid permanently having a relatively high speed and a relatively low temperature, regardless of the operating steps of the generating device. vacuum, by providing other means than a speed variation to ensure the regulation of the temperature of the pumps.
  • the proposed principle is based on an adjustable thermal conductance between the coolant and the vacuum pump. It is thus possible to maintain continuously a flow of heat transfer liquid at a maximum flow rate and a low temperature, the flow rate being at least equal to the flow rate necessary to ensure sufficient heat exchange under the extreme operating conditions of the vacuum pump.
  • the heat exchange circuit is adapted to heat the vacuum pump.
  • the device is then used in areas of the vacuum generation device in which it is necessary to heat the vacuum line to avoid solid deposits.
  • the heat exchange circuit is adapted to cool the vacuum pump.
  • the device is then used in the vacuum generation device areas in which the pump produces excessive heating.
  • a combination of the two applications can be provided, allowing to sometimes heat, sometimes to cool the same area of the vacuum generation device.
  • the thermal bonding liquid source may comprise a thermal bonding liquid passage pipe, a heat bond liquid reservoir, and liquid control means for causing the thermal bonding fluid to pass between the chamber. of adjustment and the reserve of thermal bonding liquid.
  • the liquid control means may comprise a piston disposed in the reserve of thermal connection liquid and biased by an actuator controlled by a control member as a function of a temperature setpoint signal and as a function of measured pump temperature signals from temperature sensors associated with the pump body.
  • the adjustment chamber may be a cavity made in the pump body, traversed by an exchange pipe forming said first circuit portion, and closed by closure means making it airtight, the exchange pipe having at least one ascending portion between two different extreme levels defining the extreme levels of adjustment of the thermal bonding liquid.
  • control chamber may comprise two opposite ends and may be traversed by the exchange pipe between a lower orifice and an upper orifice.
  • the adjustment chamber may be closed at one or both ends by one or more sealed plugs, or by crimps around the exchange pipe.
  • a vacuum generating device comprises at least one vacuum pump 100 and a temperature control system 2 for controlling the temperature of the vacuum pump 100.
  • the pump Vacuum 100 comprises a pump body 1 having a suction inlet 3 connected directly or indirectly to a vacuum chamber 4, for example a process enclosure for the treatment of semiconductor wafers.
  • the vacuum pump 100 delivers an outlet 5 at a higher pressure, for example at atmospheric pressure.
  • the temperature control system 2 comprises a heat exchange circuit 6 in which circulates a heat transfer liquid such as water, oil, glycol, for example.
  • the heat exchange circuit 6 comprises an external pipe 7 connected to at least a first circuit portion 8 and to at least a second circuit portion 9.
  • the first circuit portion 8 is thermally connected to the pump body 1 of the circuit the vacuum pump 100.
  • the second circuit portion 9 is thermally connected with a heat source 10.
  • Circulation means such as a circulation pump 11 are provided for circulating the heat transfer liquid in the heat exchange circuit 6. Control means make it possible to control the heat exchange capacity of the heat exchange circuit 6 as a function of a control signal.
  • the variation of heat exchange capacity of the heat exchange circuit 6 is achieved by interposing thermal conduction means with adjustable thermal conductance at the interface between the first circuit portion 8 and the pump body 1 of the vacuum pump 100.
  • thermo conductance means with adjustable thermal conductance thermally connecting the pump body 1 to each first circuit portion such as the first portion 8.
  • the thermal conduction means with adjustable thermal conductance comprise at least one adjustment chamber 12, interposed between the first circuit portion 8 and the pump body 1.
  • a source of thermal connection liquid 13 is connected to the adjustment chamber 12 and is adapted to feed the adjustment chamber 12 with a thermal bonding liquid 15 such as water, oil or glycol, for example, in an adjustable amount.
  • the first circuit portion 8 for example in the form of a rectilinear tubular exchange pipe 14, is in contact with the thermal bonding liquid 15 in a portion of its lateral surface, the bonding liquid thermal 15 itself being in contact with a portion of the peripheral surface of the control chamber 12 constituted by the pump body 1.
  • the thermal connection liquid thus ensures the thermal connection between the pump body 1 and the coolant contained in the exchange pipe 14 of the heat exchange circuit 6.
  • the source of thermal connection liquid 13 is adapted to supply the control chamber 12 with heat-transfer liquid 15 in an adjustable quantity, so as to adjust the heat exchange surface occupied by the thermal connection liquid 15 between the first portion circuit 8 and the pump body 1.
  • the heat-binding liquid source 13 includes a heat-connecting liquid passage conduit 16, a heat-binding liquid reservoir 17, and liquid control means for causing the thermal connecting liquid to flow in both directions passing between the adjustment chamber 12 and the reserve of thermal connection liquid 17.
  • the liquid control means comprise a piston 18 arranged in the reserve of thermal connection liquid 17 and biased by an actuator 19 controlled by a control member 20 ( figures 1 and 2 ).
  • the control member is for example an electrical circuit for controlling the actuator 19 as a function of a temperature setpoint signal and as a function of measured pump temperature signals from temperature sensors 21 associated with the pump body 1 .
  • the actuator 19 moves the piston 18, thus changing the amount of thermal bonding liquid 15 contained in the adjusting chamber 12, which modifies the upper level 22 of the thermal connection liquid 15 and thus the heat exchange surface occupied by the thermal connection liquid 15 between the pump body 1 and the exchange pipe 14 of the first circuit portion 8 in which circulates coolant liquid.
  • the control member 20, the actuator 19, the piston 18, the reserve of thermal connection liquid 17, the thermal connecting liquid passage pipe 16, the adjustment chamber 12 and the thermal bonding liquid 15 constitute control means which are adapted to vary the thermal conductance of the thermal conduction means between the pump body 1 and the first circuit portion 8, so as to maintain the temperature of the pump body 1 in the vicinity of a temperature predetermined setpoint.
  • circulation means such as the circulation pump 11 are advantageously chosen, which are adapted to circulate the heat-transfer liquid permanently in the heat exchange circuit 6 in a permanent flow rate at least equal to the flow rate necessary to ensure the exchange.
  • sufficient thermal under the extreme operating conditions of the vacuum pump 100.
  • the vacuum pump 100 indeed needs a maximum heat exchange, and this maximum heat exchange is ensured, at the chosen permanent flow rate coolant liquid, when the control chamber 12 is full of thermal bonding liquid 15.
  • the steady flow may advantageously be a constant flow.
  • the figure 3 illustrates two embodiments of the control chamber 12 in a pump body 1.
  • the adjustment chamber 12 is a cavity made directly in the pump body 1, and traversed by an exchange pipe 14 whose outer section is smaller than the cross-section of the pump. the adjustment chamber 12.
  • the cavity constituting the adjustment chamber 12 is traversed by the exchange pipe 14 forming said first circuit portion 8 in which circulates the heat transfer liquid.
  • the adjustment chamber 12 is closed by closure means which make it impermeable with respect to the external atmosphere, while allowing the exchange line 14 to pass through.
  • the exchange line 14 comprises in the adjustment chamber 12 at least an ascending portion 23 between two extreme levels 24 and 25 which define the extreme levels of adjustment of the level 22 of the thermal connection liquid in the control chamber 12.
  • control chamber 12 is open at two opposite ends, namely a lower end 24 and an upper end 25, and is crossed by the exchange pipe 14.
  • each of the lower 24 and upper ends 25 is closed off by a respective sealing cap 26 and 27.
  • the thermal connecting liquid passage duct 16 communicates with the adjustment chamber 12 in the vicinity of its lower end 24.
  • the adjustment chamber 112 communicates with the heat transfer liquid passage pipe 116 in the vicinity of its lower end 124, and is closed at its lower end 124 and its upper end 125 by respective crimps 126 and 127 around the pipe exchange 114.
  • the vacuum pump 100 comprises, in the pump body 1, for example cast iron, two pumping chambers 28 and 29 each receiving a rotor driven by a shaft such as the shafts 30 and 31.
  • the adjustment chambers 12 and 112 may for example be oriented in a substantially vertical direction.
  • the walls of the adjustment chamber 12 or 112 are smooth, as well as the outer face of the exchange pipe 14 or 114.
  • the peripheral of the regulating chamber 12 constituted by the pump body 1 comprises radial fins such as the fin 32.
  • the outer surface of the exchange pipe 14 comprises radial fins such as the fin 33.
  • the structure of the temperature control system 2 according to the invention makes it possible to maximize the circulation velocity of the heat-transfer liquid, while at the same time minimizing its temperature, so that the risks of occurrence of deposits in the heat exchange circuit are minimized. 6.
  • the thermal conduction means with adjustable thermal conductance make it possible to obtain efficient regulation of the temperature of the vacuum pump 1, with inexpensive and effective means.
  • the actuator 19, the reserve of thermal connection liquid 17 and its piston 18, as well as the control member 20 can be moved away from the adjustment chambers 12 or 112, and can therefore be positioned in any appropriate location, for example in unused areas around the pump body 1, to reduce the overall volume of the vacuum generating device.
  • the crimping in the end zones 124 and 125 of the regulating chamber 112 may be effected by radial expansion or expansion of the exchange pipe 114 in the housing constituting the adjustment chamber 112.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Physical Vapour Deposition (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
EP01945446A 2000-06-15 2001-06-15 Regulation thermique pour dispositif de generation de vide Expired - Lifetime EP1290346B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0007627 2000-06-15
FR0007627A FR2810375B1 (fr) 2000-06-15 2000-06-15 Regulation thermique a debit et temperature de refroidissement constants pour dispositif de generation de vide
PCT/FR2001/001866 WO2001096744A1 (fr) 2000-06-15 2001-06-15 Regulation thermique a debit et temperature de refroidissement constants pour dispositif de generation de vide

Publications (2)

Publication Number Publication Date
EP1290346A1 EP1290346A1 (fr) 2003-03-12
EP1290346B1 true EP1290346B1 (fr) 2008-04-02

Family

ID=8851283

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01945446A Expired - Lifetime EP1290346B1 (fr) 2000-06-15 2001-06-15 Regulation thermique pour dispositif de generation de vide

Country Status (7)

Country Link
US (1) US6679676B2 (ko)
EP (1) EP1290346B1 (ko)
JP (1) JP2004503713A (ko)
AT (1) ATE391237T1 (ko)
DE (1) DE60133459D1 (ko)
FR (1) FR2810375B1 (ko)
WO (1) WO2001096744A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149949A (zh) * 2013-01-09 2013-06-12 上海空间推进研究所 一种基于帕尔贴效应的气体微流量控制器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5172615B2 (ja) * 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
CN117846931B (zh) * 2024-03-08 2024-05-14 江苏纬恩复材科技有限公司 一种真空泵管道连接结构、热压罐及其工作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236123A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd 真空処理装置
JPS648388A (en) * 1987-06-30 1989-01-12 Oki Electric Ind Co Ltd Vacuum pump device
JPS6419198A (en) * 1987-07-15 1989-01-23 Hitachi Ltd Vacuum pump
FR2634829B1 (fr) * 1988-07-27 1990-09-14 Cit Alcatel Pompe a vide
KR950007378B1 (ko) * 1990-04-06 1995-07-10 가부시끼 가이샤 히다찌 세이사꾸쇼 진공펌프
JPH04164188A (ja) * 1990-10-26 1992-06-09 Hitachi Ltd 半導体製造装置排気用ターボ分子ポンプ
JPH05118296A (ja) * 1991-10-25 1993-05-14 Hitachi Ltd ドライ真空ポンプ
WO1994000694A1 (de) * 1992-06-19 1994-01-06 Leybold Aktiengesellschaft Gasreibungsvakuumpumpe
JPH07174099A (ja) * 1992-08-14 1995-07-11 Hitachi Ltd 真空ポンプの冷却装置
JP3831113B2 (ja) * 1998-03-31 2006-10-11 大晃機械工業株式会社 真空ポンプ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149949A (zh) * 2013-01-09 2013-06-12 上海空间推进研究所 一种基于帕尔贴效应的气体微流量控制器
CN103149949B (zh) * 2013-01-09 2016-08-03 上海空间推进研究所 一种基于帕尔贴效应的气体微流量控制器

Also Published As

Publication number Publication date
DE60133459D1 (de) 2008-05-15
ATE391237T1 (de) 2008-04-15
US20020106285A1 (en) 2002-08-08
EP1290346A1 (fr) 2003-03-12
FR2810375B1 (fr) 2002-11-29
FR2810375A1 (fr) 2001-12-21
WO2001096744A1 (fr) 2001-12-20
JP2004503713A (ja) 2004-02-05
US6679676B2 (en) 2004-01-20

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