EP1276030A3 - Dispositif de contrôle pour fluides - Google Patents

Dispositif de contrôle pour fluides Download PDF

Info

Publication number
EP1276030A3
EP1276030A3 EP02018943A EP02018943A EP1276030A3 EP 1276030 A3 EP1276030 A3 EP 1276030A3 EP 02018943 A EP02018943 A EP 02018943A EP 02018943 A EP02018943 A EP 02018943A EP 1276030 A3 EP1276030 A3 EP 1276030A3
Authority
EP
European Patent Office
Prior art keywords
control device
fluid control
subchannel
communicating
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02018943A
Other languages
German (de)
English (en)
Other versions
EP1276030A2 (fr
Inventor
Tadahiro Ohmi
Keiji c/o Fujikin Inc. Hirao
Yukio c/o Fujikin Inc. Minai
Michio c/o Fujikin Inc. Yamaji
Takashi c/o FUJIKIN INC. Hirose
Nobukazu c/o Fujikin Inc. Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikin Inc
Original Assignee
Fujikin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikin Inc filed Critical Fujikin Inc
Publication of EP1276030A2 publication Critical patent/EP1276030A2/fr
Publication of EP1276030A3 publication Critical patent/EP1276030A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y10T137/4259—With separate material addition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Lift Valve (AREA)
  • Flow Control (AREA)
EP02018943A 1996-05-10 1997-05-07 Dispositif de contrôle pour fluides Withdrawn EP1276030A3 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11620496 1996-05-10
JP11620496A JP3726168B2 (ja) 1996-05-10 1996-05-10 流体制御装置
EP97107532A EP0806573B1 (fr) 1996-05-10 1997-05-07 Dispositif de commande de fluide

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP97107532A Division EP0806573B1 (fr) 1996-05-10 1997-05-07 Dispositif de commande de fluide

Publications (2)

Publication Number Publication Date
EP1276030A2 EP1276030A2 (fr) 2003-01-15
EP1276030A3 true EP1276030A3 (fr) 2003-02-05

Family

ID=14681423

Family Applications (2)

Application Number Title Priority Date Filing Date
EP02018943A Withdrawn EP1276030A3 (fr) 1996-05-10 1997-05-07 Dispositif de contrôle pour fluides
EP97107532A Expired - Lifetime EP0806573B1 (fr) 1996-05-10 1997-05-07 Dispositif de commande de fluide

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP97107532A Expired - Lifetime EP0806573B1 (fr) 1996-05-10 1997-05-07 Dispositif de commande de fluide

Country Status (9)

Country Link
US (2) US5975112A (fr)
EP (2) EP1276030A3 (fr)
JP (1) JP3726168B2 (fr)
KR (1) KR970075396A (fr)
CA (1) CA2204939A1 (fr)
DE (1) DE69727419T2 (fr)
IL (1) IL120804A (fr)
SG (1) SG50019A1 (fr)
TW (1) TW377387B (fr)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3726168B2 (ja) 1996-05-10 2005-12-14 忠弘 大見 流体制御装置
JP3737869B2 (ja) * 1997-05-13 2006-01-25 シーケーディ株式会社 プロセスガス供給ユニット
JP4235759B2 (ja) * 1997-08-05 2009-03-11 忠弘 大見 流体制御装置
WO1999035422A1 (fr) * 1998-01-09 1999-07-15 Swagelok Company Joint pour dispositif a ecoulement modulaire
US6345642B1 (en) * 1999-02-19 2002-02-12 Applied Materials, Inc. Method and apparatus for removing processing liquid from a processing liquid path
FR2794844B1 (fr) * 1999-06-08 2001-08-03 Air Liquide Procede et dispositif de mise en gaz d'une ligne de distribution de gaz corrosif
US6817381B2 (en) * 1999-08-24 2004-11-16 Tokyo Electron Limited Gas processing apparatus, gas processing method and integrated valve unit for gas processing apparatus
US6729353B2 (en) 1999-09-01 2004-05-04 Asml Us, Inc. Modular fluid delivery apparatus
IT249485Y1 (it) * 2000-03-17 2003-05-19 Dalmec Spa Elemento di supporto e distribuzione per una valvola pneumatica.
FR2819198B1 (fr) * 2001-01-05 2003-09-26 Yves Lecoffre Procede et dispositif pour constituer par evaporation une substance volatile
CN100396980C (zh) * 2002-08-27 2008-06-25 迅捷公司 在公共平面中有歧管连接的模块式衬底配气板
JP4555052B2 (ja) * 2004-11-04 2010-09-29 シーケーディ株式会社 ガス供給集積ユニット
JP4742762B2 (ja) * 2005-09-12 2011-08-10 株式会社フジキン 流体制御装置
US7677236B2 (en) 2006-05-17 2010-03-16 David Deng Heater configured to operate with a first or second fuel
US7434447B2 (en) 2006-05-17 2008-10-14 David Deng Oxygen depletion sensor
US7607426B2 (en) * 2006-05-17 2009-10-27 David Deng Dual fuel heater
US20070277803A1 (en) * 2006-05-17 2007-12-06 David Deng Heater
US8152515B2 (en) 2007-03-15 2012-04-10 Continental Appliances Inc Fuel selectable heating devices
US8011920B2 (en) 2006-12-22 2011-09-06 David Deng Valve assemblies for heating devices
US8241034B2 (en) 2007-03-14 2012-08-14 Continental Appliances Inc. Fuel selection valve assemblies
US7654820B2 (en) 2006-12-22 2010-02-02 David Deng Control valves for heaters and fireplace devices
US8545216B2 (en) 2006-12-22 2013-10-01 Continental Appliances, Inc. Valve assemblies for heating devices
US8057219B1 (en) 2007-03-09 2011-11-15 Coprecitec, S.L. Dual fuel vent free gas heater
US7766006B1 (en) 2007-03-09 2010-08-03 Coprecitec, S.L. Dual fuel vent free gas heater
US8118590B1 (en) 2007-03-09 2012-02-21 Coprecitec, S.L. Dual fuel vent free gas heater
US8403661B2 (en) 2007-03-09 2013-03-26 Coprecitec, S.L. Dual fuel heater
US8434522B2 (en) * 2007-05-31 2013-05-07 Tokyo Electron Limited Fluid control apparatus
US20080302426A1 (en) * 2007-06-06 2008-12-11 Greg Patrick Mulligan System and method of securing removable components for distribution of fluids
US8122903B2 (en) 2007-07-26 2012-02-28 Parker-Hannifin Corporation Close-coupled purgeable vaporizer valve
US8307854B1 (en) 2009-05-14 2012-11-13 Vistadeltek, Inc. Fluid delivery substrates for building removable standard fluid delivery sticks
WO2010144541A2 (fr) * 2009-06-10 2010-12-16 Vistadeltek, Llc Substrats d'amenée de fluide pour débits extrêmes et / ou hautes températures
US8506290B2 (en) * 2009-06-29 2013-08-13 David Deng Heating apparatus with air shutter adjustment
US8517718B2 (en) 2009-06-29 2013-08-27 David Deng Dual fuel heating source
US9829195B2 (en) 2009-12-14 2017-11-28 David Deng Dual fuel heating source with nozzle
US10073071B2 (en) 2010-06-07 2018-09-11 David Deng Heating system
EP2584258A3 (fr) 2010-06-07 2013-06-12 David Deng Système de chauffage
CN202328495U (zh) 2011-11-16 2012-07-11 普鲁卡姆电器（上海）有限公司 带有360度风门调节装置的多气源平衡式燃气取暖器
US8899971B2 (en) 2010-08-20 2014-12-02 Coprecitec, S.L. Dual fuel gas heater
WO2012099825A2 (fr) 2011-01-18 2012-07-26 David Deng Système de chauffage à régulateur de pression
US9739389B2 (en) 2011-04-08 2017-08-22 David Deng Heating system
US9200802B2 (en) * 2011-04-08 2015-12-01 David Deng Dual fuel heater with selector valve
US8985094B2 (en) 2011-04-08 2015-03-24 David Deng Heating system
US9523497B2 (en) 2012-07-04 2016-12-20 David Deng Dual fuel heater with selector valve
US10222057B2 (en) 2011-04-08 2019-03-05 David Deng Dual fuel heater with selector valve
WO2012151292A2 (fr) 2011-05-02 2012-11-08 Advantage Group International Inc. Système de conduits pour le transport de gaz et de fluides
WO2013046660A1 (fr) 2011-09-30 2013-04-04 株式会社フジキン Dispositif d'alimentation en gaz
CN102506198B (zh) 2011-10-20 2013-05-22 南京普鲁卡姆电器有限公司 双气源燃气自适应主控阀
US9170016B2 (en) 2012-08-22 2015-10-27 David Deng Dual fuel heater with selector valve
US9175848B2 (en) * 2011-12-05 2015-11-03 David Deng Dual fuel heater with selector valve
US9022064B2 (en) 2012-05-10 2015-05-05 David Deng Dual fuel control device with auxiliary backline pressure regulator
US9091431B2 (en) 2012-09-13 2015-07-28 David Deng Dual fuel valve with air shutter adjustment
US9752779B2 (en) 2013-03-02 2017-09-05 David Deng Heating assembly
US20140248567A1 (en) 2013-03-02 2014-09-04 David Deng Safety pilot
US9454158B2 (en) 2013-03-15 2016-09-27 Bhushan Somani Real time diagnostics for flow controller systems and methods
US10429074B2 (en) 2014-05-16 2019-10-01 David Deng Dual fuel heating assembly with selector switch
US10240789B2 (en) 2014-05-16 2019-03-26 David Deng Dual fuel heating assembly with reset switch
KR102491004B1 (ko) * 2015-01-16 2023-01-19 가부시키가이샤 깃츠 에스시티 블록 밸브와 원료 용기용 블록 밸브
TW201634738A (zh) * 2015-01-22 2016-10-01 應用材料股份有限公司 用於在空間上分離之原子層沉積腔室的經改良注射器
US10983537B2 (en) 2017-02-27 2021-04-20 Flow Devices And Systems Inc. Systems and methods for flow sensor back pressure adjustment for mass flow controller

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4281683A (en) * 1978-12-11 1981-08-04 Poly-Glas Systems Modular multiple-fluid component selection and delivery system
FR2628501A1 (fr) * 1988-03-09 1989-09-15 Eferel Sa Procede pour la realisation d'un dispositif d'obturation a obturateurs multiples et a circuits d'interconnexion integres adaptables selon les fonctionnalites desirees par l'utilisateur et dispositifs d'obturation realises conformement audit procede.
US5224513A (en) * 1991-06-04 1993-07-06 Cselt - Centro Studi E Laboratori Telecomunicazioni S.P.A. Device for introducing reagents into an organometallic vapor phase deposition apparatus
US5368062A (en) * 1992-01-29 1994-11-29 Kabushiki Kaisha Toshiba Gas supplying system and gas supplying apparatus

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JP3726168B2 (ja) 1996-05-10 2005-12-14 忠弘 大見 流体制御装置
JP3650859B2 (ja) 1996-06-25 2005-05-25 忠弘 大見 遮断開放器およびこれを備えた流体制御装置
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Publication number Priority date Publication date Assignee Title
US4281683A (en) * 1978-12-11 1981-08-04 Poly-Glas Systems Modular multiple-fluid component selection and delivery system
FR2628501A1 (fr) * 1988-03-09 1989-09-15 Eferel Sa Procede pour la realisation d'un dispositif d'obturation a obturateurs multiples et a circuits d'interconnexion integres adaptables selon les fonctionnalites desirees par l'utilisateur et dispositifs d'obturation realises conformement audit procede.
US5224513A (en) * 1991-06-04 1993-07-06 Cselt - Centro Studi E Laboratori Telecomunicazioni S.P.A. Device for introducing reagents into an organometallic vapor phase deposition apparatus
US5368062A (en) * 1992-01-29 1994-11-29 Kabushiki Kaisha Toshiba Gas supplying system and gas supplying apparatus

Also Published As

Publication number Publication date
US5975112A (en) 1999-11-02
JPH09303308A (ja) 1997-11-25
JP3726168B2 (ja) 2005-12-14
EP0806573A2 (fr) 1997-11-12
DE69727419T2 (de) 2004-12-16
IL120804A (en) 2000-07-26
SG50019A1 (en) 1998-06-15
EP0806573B1 (fr) 2004-02-04
KR970075396A (ko) 1997-12-10
DE69727419D1 (de) 2004-03-11
EP1276030A2 (fr) 2003-01-15
IL120804A0 (en) 1997-09-30
TW377387B (en) 1999-12-21
EP0806573A3 (fr) 1999-07-07
CA2204939A1 (fr) 1997-11-10
US6257270B1 (en) 2001-07-10

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