EP1275273A1 - Dispositif electrique presentant un polymere conducteur ctp - Google Patents

Dispositif electrique presentant un polymere conducteur ctp

Info

Publication number
EP1275273A1
EP1275273A1 EP01917935A EP01917935A EP1275273A1 EP 1275273 A1 EP1275273 A1 EP 1275273A1 EP 01917935 A EP01917935 A EP 01917935A EP 01917935 A EP01917935 A EP 01917935A EP 1275273 A1 EP1275273 A1 EP 1275273A1
Authority
EP
European Patent Office
Prior art keywords
conductive polymer
electrical device
ptc
electrodes
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01917935A
Other languages
German (de)
English (en)
Other versions
EP1275273A4 (fr
Inventor
Soo-An Choi
Jong-Ho Lee
Chang-Hee Choi
Tae-Sung Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LS Corp
Original Assignee
LG Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Cable Ltd filed Critical LG Cable Ltd
Publication of EP1275273A1 publication Critical patent/EP1275273A1/fr
Publication of EP1275273A4 publication Critical patent/EP1275273A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient

Definitions

  • the present invention relates to an electrical device having a positive temperature coefficient (PTC) conductive polymer, and more particularly to an electrical device having PTC conductive polymer, which is made by combining electrodes in which electroless nickel plating is formed on an electrolytic copper foil, with PTC conductive polymer, so ensuring improved PTC characteristics and good chemical and mechanical binding capacity between the electrodes and the PTC conductive polymer.
  • PTC positive temperature coefficient
  • the conductive polymer shows PTC characteristics that conductive fillers are dispersed on organic polymer.
  • PTC means a characteristic that electrical resistance rapidly increases at a relatively narrow temperature range due to increase of temperature.
  • High molecular substances having PTC characteristics are generally used in a constant- temperature wire, a protection device for blocking over current, a circuit protection element, a heater and so on.
  • Such conductive polymer is mechanically chemically combined with at least one electrode in an electrical device.
  • a metal plate is generally used as the electrode combined with the conductive polymer.
  • Such metal plate acts a role of connecting the conductive polymer to an external electrode and should not deteriorate the PTC characteristics of the conductive polymer. For such a reason, the conductive polymer should have good binding capacity to ensure electrical and mechanical combination with the metal plate.
  • the binding capacity between the metal plate and the conductive polymer generally has two characteristics: mechanical binding capacity and chemical binding capacity.
  • mechanical binding capacity a process of increasing surface roughness of the metal plate is required to restrain separation of the metal plate and the conductive polymer.
  • metal plates show significantly different binding capacities to the polymer depending on their kinds, which are originated from difference of chemical binding capacities between the metal and the polymer.
  • the chemical binding capacity increases in order of copper, iron, nickel, aluminum, zinc and so on. Therefore, the metal plate to be combined with polymer might be processed by scaling, surface-treatment using brass or zinc, or adhesive application using silane group.
  • the electroplating is a representative method to increase surface roughness of the metal plate for restraining separation of the metal plate and the conductive polymer.
  • a copper plating foil used in a printed circuit boards (hereinafter, referred to as PCB) and a metal plate used in an electrical device having PTC characteristics are manufactured using such method.
  • the copper plating foil for the PCB is made to have 10 to 150 ⁇ m
  • a copper foil is laminated on a base plate and then given heat and pressure thereto.
  • the copper foil should have chemical resistance, such as against an acid, and resistance against discoloration of the board after etching after being attached to the base plate, and is required not to rust after etching.
  • a surface of the copper foil for the PCB may be coated by a layer containing zinc, indium, brass or the like (Japanese Patent Publication No. 51-35711), or use an electrodeposited copper layer having two layers (Japanese Patent Publication No. 53-39376).
  • the copper-zinc layer may be formed by electrolyzing one surface of the copper foil in a copper-zinc electrolytic bath containing copper ion, zinc ion, tartar acid and alkali with the cathode and then treating chromate on the cupper foil (U.S. Patent No. 5,304,428).
  • the conventional electrode made by electrolytic plating or electrodeposition shows uneven thickness, which causes the electrode to be separated from the PTC polymer. Therefore, inventors of the present invention have endeavored to solve such problems and developed an electrode with even thickness by executing electroless plating to the electrolytic cupper foil used for the PCB.
  • An object of the present invention is to provide an electrical device, which is made by combining metal electrodes, in which electroless nickel plating with even thickness is formed on an electrolytic copper foil, with PTC conductive polymer, so ensuring improved PTC characteristics and good chemical and mechanical binding capacity between the electrodes and the PTC conductive polymer.
  • the present invention provides an electrical device having Positive Temperature Coefficient (PTC) conductive polymer, which includes electrodes having electroless-plated nickel layers at both sides of an electrolytic copper foil, and PTC conductive polymer welded between the electrodes, wherein the electroless-plated nickel has even thickness to ensure sufficient binding capacity to the PTC conductive polymer.
  • PTC Positive Temperature Coefficient
  • the electrolytic copper foil has surface roughness
  • the electroless-plated nickel layer has a
  • FIG. 1 is a surface photograph of an electrolytic copper foil used in the present invention
  • FIG. 2 is a surface photograph of a specimen that the electrolytic copper foil is electroless nickel-plated of l ⁇ m in thickness;
  • FIG. 3 shows an electrical device according to the present invention.
  • FIG. 4 is a resistance-temperature graph of the electrical devices according to first to third embodiments of the present invention.
  • the present invention suggests an electrical device including conductive polymer with PTC (Positive Temperature Coefficient) characteristics and electroless-plated metal electrodes.
  • the PTC conductive polymer is welded between the electrodes in a sandwich type.
  • the conductive polymer with PTC characteristics may be obtained by mixing conductive filler, cross-linking agent, antioxidant, etc. to organic polymer.
  • the organic polymer can be one of polyethylene or ethylene-acrylic acid copolymer, ethylene-ethyl aciylate copolymer, ethylene-vinyl acetate copolymer and ethylene-butyl aciylate copolymer. Among them, polyethylene is most preferred.
  • the conductive filler powder nickel, gold dust, powder copper, silvered powder copper, metal-alloy powder, carbon black, carbon powder or carbon graphite can be used. Among them, carbon black is most preferred.
  • the metal electrode is made by electroless-plating a metal, which has good chemical binding capacity to the PTC conductive polymer, on the electrolytic copper foil having good mechanical binding capacity.
  • the surface roughness Rz of the electrolytic copper foil is set to be l-20 ⁇ m through electrolytic plating in its manufacturing process.
  • the electrolytic copper foil can be commercially acquired from LG Industry Co., which is specially used in this invention.
  • the electrolytic copper foil is electroless-plated with nickel.
  • the electroless nickel-plating procedure includes a degreasing process, a pickling process, an actuating and sensitizing treatment, an electroless nickel-plating process and a rinsing process.
  • FIG. 2 a specimen, which is electroless-plated with nickel of l ⁇ m in thickness, is shown in FIG. 2. Seeing FIG. 2, it can be easily known that the surface roughness and shape of the specimen have no significant difference.
  • the metal electrodes 2, in which the nickel is electroless-plated on the copper, are welded at both side of the PTC conductive polymer 1 to make the electrical device. This is well shown in FIG. 3.
  • Polyethylene and carbon black are mixed to make PTC conductive polymer.
  • electroless nickel-plating layer of l ⁇ m in thickness is formed on the electrolytic copper foil through a degreasing process, a pickling process, an actuating and sensitizing treatment, an electroless nickel-plating process and a rinsing process, to make electrodes.
  • the electrodes are welded to both sides of the PTC conductive polymer in a sandwich type, so making the PTC electrical device as shown in FIG. 3.
  • Embodiment 2 Polyethylene and carbon black are mixed to make PTC conductive polymer.
  • An electrolytic copper foil having a surface roughness of 5 to
  • nickel-plating layer of lO ⁇ m in thickness is formed on the electrolytic copper foil through a degreasing process, a pickling process, an actuating and sensitizing treatment, an electroless nickel-plating process and a rinsing process, to make electrodes.
  • the electrodes are welded to both sides of the PTC conductive polymer in a sandwich type, so making the PTC electrical device as shown in FIG. 3.
  • An electrical device is prepared in a similar method to the Embodiment 1. However, the actuating and sensitizing treatment is excluded from the electroless-plating procedure, and the electroless nickel-plating process is executed just after the pickling process. And then, chromium is coated on the electroless nickel-plating layer through substitution plating in a chromium bath. Comparative Example
  • FIG. 4 Resistance changes depending on temperature of the electrical devices according to the embodiments 1 to 3 are shown in FIG. 4.
  • the electrical devices of the present invention show no significant difference in resistance-temperature characteristics, compared with an electrical device using a conventional electrolytic copper foil. It means that the electrical device of the present invention not only strengthens binding capacity between the PTC conductive polymer and the electrodes but also maintains its resistance-temperature characteristics as much as the electrical device using the conventional electrolytic copper foil.
  • the electrical device using copper electrodes of the comparative example shows significant difference in its resistance value before and after the humidity test. But, a resistance value of the electrical device using the electroless nickel plating according to the embodiment 1 does not decrease more than 10m ⁇ after the humidity
  • the electrical device of the present invention gives more improved PTC characteristics and better binding capacity between the PTC conductive polymer and the electrodes than the conventional electrical device employing electrolytic plating or electrodeposition.
  • the electroless plating employed in the present invention has an advantage that it may plate an object having uneven surfaces more uniformly than the electrolytic plating or the electrodeposition. Therefore, the electrical device of the present invention employing the electrodes, in which nickel is electroless-plated on the electrolytic copper foil, gives the advantages of better mechanical and chemical binding capacity to the PTC conductive polymer and more improved PTC characteristics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemically Coating (AREA)
  • Thermistors And Varistors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Resistance Heating (AREA)

Abstract

La présente invention concerne un dispositif électrique présentant un polymère conducteur CTP (coefficient de température positif), obtenu par combinaison d'électrodes dans lesquelles un dépôt autocatalytique de nickel est formé sur un film électrolytique de cuivre, avec le polymère conducteur CTP. Les électrodes présentent des couches de dépôt de nickel autocatalytique sur les deux côtés d'un film électrolytique de cuivre et le polymère conducteur CTP est soudé entre les électrodes sous forme d'une structure de type sandwich. Le dépôt autocatalytique de nickel du dispositif électrique ayant une épaisseur uniforme, le dispositif électrique a des propriétés CTP améliorées et une bonne aptitude à la liaison chimique et mécanique entre les électrodes et le polymère conducteur CTP.
EP01917935A 2000-04-08 2001-03-30 Dispositif electrique presentant un polymere conducteur ctp Withdrawn EP1275273A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR2000018453 2000-04-08
KR1020000018453A KR100330919B1 (ko) 2000-04-08 2000-04-08 피티씨 전도성 폴리머를 포함하는 전기장치
PCT/KR2001/000523 WO2001078453A1 (fr) 2000-04-08 2001-03-30 Dispositif electrique presentant un polymere conducteur ctp

Publications (2)

Publication Number Publication Date
EP1275273A1 true EP1275273A1 (fr) 2003-01-15
EP1275273A4 EP1275273A4 (fr) 2007-11-28

Family

ID=19662812

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01917935A Withdrawn EP1275273A4 (fr) 2000-04-08 2001-03-30 Dispositif electrique presentant un polymere conducteur ctp

Country Status (7)

Country Link
EP (1) EP1275273A4 (fr)
JP (1) JP3833538B2 (fr)
KR (1) KR100330919B1 (fr)
CN (1) CN1210994C (fr)
AU (1) AU2001244810A1 (fr)
TW (1) TW480496B (fr)
WO (1) WO2001078453A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965293B2 (en) 2000-04-08 2005-11-15 Lg Cable, Ltd. Electrical device having PTC conductive polymer
EP1327995A3 (fr) * 2002-01-11 2005-10-12 Shipley Co. L.L.C. Structure à résistance
JP4942333B2 (ja) * 2005-11-29 2012-05-30 住友金属鉱山株式会社 ニッケル粉およびその製造方法、ならびに該ニッケル粉を用いたポリマーｐｔｃ素子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952591A1 (fr) * 1996-09-20 1999-10-27 Matsushita Electric Industrial Co., Ltd. Thermistance a coefficient de temperature positif
EP0955643A1 (fr) * 1996-12-26 1999-11-10 Matsushita Electric Industrial Co., Ltd Thermistance ctp et son procede de fabrication

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4689475A (en) * 1985-10-15 1987-08-25 Raychem Corporation Electrical devices containing conductive polymers
JPH01236601A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd セラミック電子部品
JPH01236602A (ja) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd 正特性サーミスタ
JPH05343201A (ja) * 1992-06-11 1993-12-24 Tdk Corp Ｐｔｃサーミスタ
DE69513656T2 (de) * 1994-06-08 2000-07-13 Raychem Corp., Menlo Park Leitfähige polymere enthaltende elektrische vorrichtungen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952591A1 (fr) * 1996-09-20 1999-10-27 Matsushita Electric Industrial Co., Ltd. Thermistance a coefficient de temperature positif
EP0955643A1 (fr) * 1996-12-26 1999-11-10 Matsushita Electric Industrial Co., Ltd Thermistance ctp et son procede de fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO0178453A1 *

Also Published As

Publication number Publication date
EP1275273A4 (fr) 2007-11-28
CN1418451A (zh) 2003-05-14
CN1210994C (zh) 2005-07-13
WO2001078453A1 (fr) 2001-10-18
JP3833538B2 (ja) 2006-10-11
KR20010090933A (ko) 2001-10-22
KR100330919B1 (ko) 2002-04-03
TW480496B (en) 2002-03-21
AU2001244810A1 (en) 2001-10-23
JP2003530718A (ja) 2003-10-14

Similar Documents

Publication Publication Date Title
JP3020843B2 (ja) 回路保護デバイスの製造方法
US5358793A (en) PTC device
US6522237B1 (en) Electrode for PTC thermistor and method for producing the same, and PTC thermistor
EP1410406B1 (fr) Dispositifs electriques contenant des polymeres conducteurs
CN110739569A (zh) 电接触端子及其制备方法和应用
WO2001078453A1 (fr) Dispositif electrique presentant un polymere conducteur ctp
US20030020591A1 (en) Electrical device having ptc conductive polymer
CN109104851B (zh) 电磁屏蔽膜的制备方法
JP2003530718A5 (fr)
CN111201842A (zh) 印刷电路板和制造印刷电路板的方法
EP1126478A1 (fr) Dispositif a coefficient de temperature positif et son procede de fabrication
JPS6387703A (ja) Ｐｔｃ素子
WO2023171668A1 (fr) Matériau composite, procédé de production de matériau composite et terminal
KR100673684B1 (ko) 전극 구조가 개선된 ｐｔｃ 소자
JP2000156550A (ja) プリント配線板
KR100820588B1 (ko) 단면 도금박으로 이루어진 판상 전극체를 포함하는 도전성시트 및 이를 포함하는 표면 실장형 고분자 ｐｔｃ 소자
JPS6387705A (ja) Ｐｔｃ素子
JP2002275699A (ja) 局部的にめっき厚さの異なるめっき体、そのめっき層の形成方法、ｐｔｃ素子、およびｐｔｃ素子のめっき層の形成方法。
EP3428324A1 (fr) MATÉRIAU EN CUIVRE OU ALLIAGE DE CUIVRE PLAQUÉ DE Ni, ET BORNE DE CONNECTEUR, ET CONNECTEUR ET COMPOSANT ÉLECTRONIQUE DANS LESQUELS LEDIT MATÉRIAU EN CUIVRE OU LEDIT ALLIAGE DE CUIVRE EST UTILISÉ
JPH0426521B2 (fr)
JP2002124402A (ja) Ｐｔｃ素子及びその製造方法
JPS6387704A (ja) Ｐｔｃ素子
JPS6133080B2 (fr)
JP2000183235A (ja) 電子電気用部品
JPH043083B2 (fr)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20021108

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RBV Designated contracting states (corrected)

Designated state(s): AT BE CH DE FR GB LI

A4 Supplementary search report drawn up and despatched

Effective date: 20071029

17Q First examination report despatched

Effective date: 20080219

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20080701