EP1269798A1 - Ansteuerung von leuchtdioden (led's) - Google Patents
Ansteuerung von leuchtdioden (led's)Info
- Publication number
- EP1269798A1 EP1269798A1 EP01921322A EP01921322A EP1269798A1 EP 1269798 A1 EP1269798 A1 EP 1269798A1 EP 01921322 A EP01921322 A EP 01921322A EP 01921322 A EP01921322 A EP 01921322A EP 1269798 A1 EP1269798 A1 EP 1269798A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- transistor
- control circuit
- light
- emitting diode
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 34
- 239000004020 conductor Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 238000003491 array Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
Definitions
- LEDs Light emitting diodes
- the present invention relates to a control circuit for at least one light-emitting diode.
- the invention relates generally to the field of light-emitting diodes (LEDs) and - more precisely - to the field of using such LEDs for lighting purposes.
- LEDs light-emitting diodes
- the reason for this is, among other things, that the yield (light output per watt) has only recently reached such values that the efficiency of LED lighting devices is satisfactory. In particular, the blue LEDs necessary for the generation of white light have only recently achieved a satisfactory degree of efficiency.
- FIG. 12 shows a control circuit as it is present in products which are sold by the Color Kinetics company and which essentially correspond to the US patent mentioned.
- the LED LED is controlled by a constant current source KSQ.
- the constant current source has a bipolar transistor, the light-emitting diode LED being connected to the collector of an NPN transistor.
- the emitter of the transistor Ql of the constant current source KSQ is connected to ground by means of an ohmic resistor R2 and is fed back via the PWM circuit for regulating the current to the control connection of the transistor Ql.
- the NPN transistor represents a switchable current drain (also known as a current sink or "current sink” in English).
- the diode current is detected by means of the ohmic resistor R2 and regulated to a setpoint value by changing the base voltage.
- a pulse width modulated (PWM) signal is applied to the base connection of the transistor Q1 for dimming the light-emitting diode LED.
- PWM pulse width modulated
- a control circuit is therefore provided for at least one light-emitting diode, which has a constant current source.
- the constant current source has an operational amplifier, the output of which is connected to the control connection of an (external) transistor.
- the light-emitting diode is connected in series with a first output-side connection of the transistor.
- a second output-side connection of the transistor is fed back to the inverting input of the operational amplifier.
- a component is provided on the feedback side of the transistor that raises the potential of the feedback side of the transistor by at least the value of an offset voltage of the operational amplifier if no or only an infinitesimal current flows through the light-emitting diode.
- this definition also includes a component that always increases the potential on the feedback side of the transistor by a predetermined value greater than or equal to the offset voltage of the operational amplifier.
- a component is typically a voltage source.
- the component on the feedback side can be a further diode and in particular a light-emitting diode, which converts the voltage drop and the current flow into a further light output.
- the light-emitting diode on the feedback side is advantageously a red light-emitting diode, since the forward voltage of red light-emitting diodes is lower than that of green or blue light-emitting diodes.
- a drive circuit for a light-emitting diode which has a constant current source with a transistor.
- the light emitting diode is connected in series to a first output-side connection of the transistor.
- a second connection on the output side of the transistor is fed back to the control connection (base or gate) of the transistor.
- a further light-emitting diode is provided on the feedback side of the transistor.
- This further light-emitting diode can be connected in series to form an ohmic resistor.
- the further light-emitting diode is advantageously a red light-emitting diode, the advantages of which have already been explained above.
- the transistor can be a bipolar transistor.
- pulse width modulated voltage signals can be applied to the control terminal of the transistor.
- the at least one light-emitting diode is then dimmed by changing the pulse duty factor and / or the frequency of the pulse width modulated (PWM) voltage signals at the control connection of the transistor.
- PWM pulse width modulated
- the control circuit consists at least partially of a multi-layer circuit in which passive components - for example resistors, conductor tracks and the like - are integrated.
- passive components for example resistors, conductor tracks and the like - are integrated.
- This integration is possible in particular if the light-emitting diodes are operated at high frequencies, since then correspondingly lower capacitance or inductance values can be used in the circuit.
- a frequency range from 200 kHz to 1 MHz has proven to be particularly suitable.
- An increased radiation of electromagnetic high-frequency fields, which is initially caused by the frequency increase can be avoided by suitable shielding measures which, owing to the reduced dimensions of the circuit, can be carried out simply.
- the integration of components can take place, for example, using a multilayer printed circuit board technology.
- the multilayer circuit is preferably implemented by an LTCC (Low Temperature Cofired Ceramic) structure, which consists of a plurality of low-sintered ceramic layers or foils arranged one above the other, between which there are conductor tracks.
- LTCC Low Temperature Cofired Ceramic
- this miniaturization of the circuit can be achieved again with this LTCC technology, which has been newly developed in recent years and is known, for example, from EP 0 581 206 A2.
- inductors and capacitors in particular can also be integrated into the multilayer circuit.
- the ceramic material has the advantage that it conducts heat relatively well, which means that larger outputs can be achieved with the same construction volume, since heat loss is better radiated.
- the heat dissipation is preferably increased again by embedding the ceramic structure in a metallic housing. In this way, an effective shielding of the high-frequency fields emitted by the control circuit into the environment can also be achieved.
- the semiconductor modules are preferably mounted on the ceramic substrate using the known flip-chip (FC) technology.
- FC flip-chip
- a plastic layer is introduced between the semiconductor, which is mounted without a housing, and the contacts on the surface of the carrier substrate, which on the one hand is electrically conductive perpendicular to the contacting plane and is insulating in the contacting plane, and on the other hand, which results from a different thermal expansion of the semiconductor assembly and the ceramic substrate Absorbs voltages and thus prevents destruction of the semiconductor module.
- FIG. 1 shows a schematic view of a drive circuit for an LED
- LEDs light emitting diodes
- R, G, B Array with light emitting diodes
- FIG. 3 shows a modification of the embodiment of FIG. 2,
- 5a-10 show the manufacturing steps of a multilayer ceramic (LTCC)
- Fig. 12 shows a control circuit for a light emitting diode according to the prior art
- FIG. 1 a general view of a drive circuit for LED arrays, i.e. more specifically, of arrays with LEDs of different colors (R, G, B) are explained.
- An AC / DC converter provides an essentially regulated output voltage V +.
- a constant current source KSQ_R, KSQ_G, KSQ B is provided for each of the different colors of LEDs (R, G, B), which are controlled by a PWM (pulse width modulation) control circuit PWM_R, PWM_G or PWM_B. It is also possible to provide a constant current source for LED arrays of different colors.
- the PWM control circuits PWM_R, PWM G, PWM_B are supplied with an external control signal, for example from a bus, which specifies dimming positions for the various LED arrays LED_R, LED_G and LED_B.
- FIG. 2 shows a control circuit for at least one LED 1, which uses an operational amplifier OP.
- the current flow through the LED1 corresponds to the current flow through the emitter resistor R3.
- the output of the operational amplifier OP is connected to the control terminal of the external transistor Ql.
- the output of the operational amplifier is connected to the base of an NPN bipolar transistor Q1.
- the feedback causes the voltage difference V r -V IN at the emitter resistor R3 on, so that the current through the resistor R3 and thus through the LED LED1 (the base current is negligible)
- the potential of the negative feedback side of transistor Ql is raised by a constant current source V c .
- the potential increase is at least as large as an average offset voltage, as typically occurs in operational amplifiers, and is therefore in the range of at least about 2 mV.
- the circuit of FIG. 2 has the following advantages when dimming the light-emitting diode LED by means of pulse width modulated signals (PWM signals):
- the potential on the negative feedback (emitter) side of the transistor Ql is raised to a higher potential than the potential of the control terminal.
- the potential of the emitter of the transistor Q1 is therefore at a higher potential than the base of the transistor Q1, so that any current flow is reliably prevented (the “diode” base-emitter blocks).
- the voltage V must be a significantly above the potential of the constant voltage source V c during the ON phases of the PWM signals.
- FIG. 3 shows a modification of the embodiment of Figure 2, in which instead of the constant voltage source V c an electronic component with non-linear current Voltage characteristic, ie more precisely, a diode LED2 is used.
- a component is used on the feedback side of the transistor, which at zero current or infinitesimally small current through the light-emitting diode LED1 already raises the potential on the feedback side.
- this component can be a diode and in particular a light-emitting diode LED2, which serves to increase the light generation of the LED arrangement.
- This further light-emitting diode LED2 on the feedback side of the transistor can serve as a complete or, as shown in FIG. 3, partial replacement of the current detector resistor R3 in the constant current source.
- the second LED2 on the feedback side of the transistor Q1 represents a current detector light-emitting diode, so to speak.
- This component which causes a voltage rise on the feedback side at zero current or very low current, reliably suppresses the current flow through the LED1 in the switch-off phases.
- any component that has a very large resistance value in the area of low currents can be used.
- the LED 1 which, in the case of constant current sources KSQ with operational amplifier OP, in the switch- off phases T off of the controlling PWM signals, which varies for dimming the LED arrays will occur due to offset voltages of the operational amplifier OP.
- the residual LED currents hinder the implementation of low dimming levels.
- the emitter or source potential of the bipolar or MOSFET transistor is raised according to the invention by means of a voltage source to such an extent that the offset voltages of the operational amplifier are compensated or overcompensated during the switch- off phase T off .
- FIG. 4 shows another aspect of the present invention.
- the state of the art shown in FIG. 5 is again assumed, and in so far as the components are the same, reference is made to the detailed description of FIG. 5.
- the current detector resistor on the feedback side is partially replaced by a light-emitting diode LED2, which converts part of the voltage occurring on the feedback side into light.
- the light yield is thus improved while reducing the heat development.
- the current detector resistor R2 in the feedback loop can alternatively also be completely replaced by the LED2.
- red light-emitting diode As light-emitting diode LED2 in the feedback loop, since the forward voltage, i.e. the necessary voltage drop across the diode, which is minimally necessary for the light to be emitted by the light-emitting diode, is lower for red light-emitting diodes than for green, blue or white.
- control circuits according to the invention will now be discussed below, which is particularly suitable when using control frequencies in the range from 200 kHz to 1 MHz.
- the LTCC multilayer circuit already mentioned is ideal for integrating the passive components. The production of such a ceramic multilayer structure will now be explained with reference to FIGS. 5a-10.
- the basic building block of an LTCC structure is an approx. 100-130 ⁇ m thick, low-sintering ceramic film - for example made of aluminum oxide, which is mixed with glass particles and other filler material - as shown in plan view in FIG. 5a.
- the first processing step consists in punching via holes 11 in the ceramic film 10.
- 5b shows the correspondingly processed ceramic film 10 in section I-I of FIG. 5a.
- the diameter of the via holes 11 is approximately 250 ⁇ m.
- the plated-through holes 11 are then filled with a conductive material, usually with a conductor paste, which contains a relatively high solids content.
- 10 conductor tracks 12 are then printed on the top of the ceramic film (FIG. 7). This is usually done using a screen printing process. Silver, silver / palladium, gold or copper pastes are used for the plated-through holes and for the conductor tracks. In order to avoid deflections, the material composition of the conductor pastes is selected such that they shrink to the same extent as the ceramic layers 10 themselves during subsequent sintering.
- the processing steps just described are first carried out separately for each ceramic film 10.
- the individual layers of punched and printed ceramic films 10 are then stacked and aligned as shown in FIG. 8. They are then stacked in a press mold and laminated with the application of heat and pressure, so that a coherent ceramic structure is formed. This is finally sintered into a high-strength ceramic structure, a homogeneous ceramic substrate 13 with a connected interconnect network 14 being integrated therein, as shown in FIG. 9.
- the components that cannot be integrated into the ceramic circuit for example various semiconductor assemblies 15, are then attached and contacted on the upper side of the ceramic substrate 13.
- conductor tracks 16 can also be subsequently applied to the upper side.
- the entire complex is provided with connections and surrounded by a metallic housing, which on the one hand increases heat dissipation and on the other hand shields the high-frequency electromagnetic fields that arise during operation.
- FIG. 11 again shows an area of the LTCC structure in section on an enlarged scale.
- the dividing lines between the individual original ceramic layers are also shown, even if — as described above — a homogeneous ceramic structure 13 is formed after the lamination and sintering.
- the vertically running conductor tracks 11, which are formed by the via holes punched out in the first method step can also extend over several levels.
- the main advantage of using an LTCC structure is that not only conductor tracks 11 or 12 but also other passive components can be integrated in the multilayer circuit. In the course of the processing step shown in FIG.
- an inductance within the ceramic structure 13 could be realized by a spiral-like conductor track printed on an individual ceramic layer 10. However, it would also be conceivable to distribute the different windings of the inductance over several conductor track levels. Such structures are also called planar inductors. To increase the inductance, an opening or recess could also be provided in the ceramic substrate 13, which is filled with a suitable core material, for example ferrite.
- the operational amplifier is formed by a semiconductor module 15, which cannot be integrated into the ceramic layer 13.
- semiconductor assemblies 15 are then preferably contacted on the upper side of the multilayer circuit 13 by means of flip-chip technology.
- an anisotropically electrically conductive plastic is introduced between the top of the ceramic substrate 13 and the unhoused semiconductor circuit 15, which is electrically conductive perpendicular to the flip-chip contacting plane and has an insulating effect in the contacting plane.
- the plastic contains, for example, irregularly shaped metal pieces or else smaller balls or fibers, which bring about contact between the surface contacts 18 of the ceramic substrate 13 and the connection pads 17 of the semiconductor assembly 15. Furthermore, this plastic 18 also absorbs voltages which can result from a different thermal expansion of the ceramic material and the semiconductor module 15.
- This flip-chip technology enables a very high contact density, so that it also contributes to a volume reduction of the entire circuit.
- the light-emitting diodes themselves can also be applied to the top of the multilayer circuit 15 using this technology.
- resistors 22 or inductances of the circuit can also be arranged on the surface as discrete parts.
Landscapes
- Led Devices (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Optical Communication System (AREA)
Description
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10013208A DE10013208A1 (de) | 2000-03-17 | 2000-03-17 | Ansteuerung von Leuchtdioden (LED`s) |
| DE10013208 | 2000-03-17 | ||
| PCT/EP2001/002639 WO2001069979A1 (de) | 2000-03-17 | 2001-03-08 | Ansteuerung von leuchtdioden (led's) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1269798A1 true EP1269798A1 (de) | 2003-01-02 |
| EP1269798B1 EP1269798B1 (de) | 2004-06-02 |
Family
ID=7635237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01921322A Expired - Lifetime EP1269798B1 (de) | 2000-03-17 | 2001-03-08 | Ansteuerung von leuchtdioden (led's) |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1269798B1 (de) |
| AT (1) | ATE268538T1 (de) |
| AU (1) | AU2001248339A1 (de) |
| DE (2) | DE10013208A1 (de) |
| WO (1) | WO2001069979A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1713053A2 (de) | 2005-04-14 | 2006-10-18 | THOMSON Licensing | Aktivmatrixanzeige mit über spannungsgesteuerte Stromgeneratoren versorgten Emittern |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231470A (ja) | 2001-02-05 | 2002-08-16 | Pioneer Electronic Corp | 発光ダイオード駆動回路 |
| US6596977B2 (en) * | 2001-10-05 | 2003-07-22 | Koninklijke Philips Electronics N.V. | Average light sensing for PWM control of RGB LED based white light luminaries |
| JP2004235498A (ja) * | 2003-01-31 | 2004-08-19 | Anden | 発光ダイオードの制御装置 |
| US8791644B2 (en) | 2005-03-29 | 2014-07-29 | Linear Technology Corporation | Offset correction circuit for voltage-controlled current source |
| EP1864553B1 (de) * | 2005-03-29 | 2015-08-26 | Linear Technology Corporation | Offset-korrekturschaltung für eine spannungsgesteuerte stromquelle |
| TWI455645B (zh) | 2006-12-08 | 2014-10-01 | 皇家飛利浦電子股份有限公司 | 光源、照明器具及照明器具系統 |
| TWI487430B (zh) | 2008-01-15 | 2015-06-01 | 皇家飛利浦電子股份有限公司 | 光源 |
| DE102009044058A1 (de) * | 2009-09-18 | 2011-03-31 | Müller, Dietmar | Dimmbare Lichterkette und Schalter hierfür |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305837A (ja) * | 1987-06-05 | 1988-12-13 | Katsuyuki Miyasaka | 電子機器 |
| US6016038A (en) * | 1997-08-26 | 2000-01-18 | Color Kinetics, Inc. | Multicolored LED lighting method and apparatus |
| JPH11214183A (ja) * | 1998-01-22 | 1999-08-06 | Hochiki Corp | 発光回路 |
-
2000
- 2000-03-17 DE DE10013208A patent/DE10013208A1/de not_active Withdrawn
-
2001
- 2001-03-08 WO PCT/EP2001/002639 patent/WO2001069979A1/de not_active Ceased
- 2001-03-08 DE DE50102479T patent/DE50102479D1/de not_active Expired - Lifetime
- 2001-03-08 EP EP01921322A patent/EP1269798B1/de not_active Expired - Lifetime
- 2001-03-08 AT AT01921322T patent/ATE268538T1/de active
- 2001-03-08 AU AU2001248339A patent/AU2001248339A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0169979A1 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1713053A2 (de) | 2005-04-14 | 2006-10-18 | THOMSON Licensing | Aktivmatrixanzeige mit über spannungsgesteuerte Stromgeneratoren versorgten Emittern |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2001248339A1 (en) | 2001-09-24 |
| ATE268538T1 (de) | 2004-06-15 |
| EP1269798B1 (de) | 2004-06-02 |
| DE10013208A1 (de) | 2001-09-20 |
| DE50102479D1 (de) | 2004-07-08 |
| WO2001069979A1 (de) | 2001-09-20 |
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