EP1266046A1 - Procede et dispositif de mise en oeuvre d'une reaction chimique - Google Patents
Procede et dispositif de mise en oeuvre d'une reaction chimiqueInfo
- Publication number
- EP1266046A1 EP1266046A1 EP01913997A EP01913997A EP1266046A1 EP 1266046 A1 EP1266046 A1 EP 1266046A1 EP 01913997 A EP01913997 A EP 01913997A EP 01913997 A EP01913997 A EP 01913997A EP 1266046 A1 EP1266046 A1 EP 1266046A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- species
- gas
- carrier gas
- reaction
- excitation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using dc or ac discharges
Definitions
- the present invention relates to a process for carrying out chemical reactions between gaseous species, according to a selective reaction path, as well as to a corresponding device, and to an application of these process and device for the generation of a compound. chemical for a surface treatment process.
- Such an application is particularly interested in treatments making it possible to modify the surface characteristics of a material, in particular a polymer film, with a view, for example, to modifying its wettability, or to graft chemical bonds on the surface of 'a substrate capable of improving the adhesion of a subsequent coating.
- the invention relates to a method and a device for carrying out chemical reactions between gaseous species according to a selective reaction path, according to which the species are excited by means of an electrical discharge maintained in an appropriate initial gas, such that the desired reaction paths (taking into account the technical objective sought) between the chemical species are initialized and maintained.
- Electric discharges make it possible to carry out chemical reactions which are difficult to envisage when using conventional means such as activation by heating or even catalysis, ... Indeed, a plasma generated under the action of such an electric discharge being a partially ionized medium, it contains chemical species excited at sometimes very high energetic levels (metastable species).
- An electrical discharge is generally governed by successive electronic collisions on the compounds of the gas or the gas mixture.
- the reaction processes generated by electronic collisions create many species with very different energy levels. This results in multiple reaction paths leading to the creation of a multitude of species, including unwanted reaction paths, leading to undesirable compounds (by way of illustration to the formation of silica powder in the case of a discharge produced in a gas mixture comprising a siiane and an oxidant).
- Attempts have been made to overcome the aforementioned drawbacks by improving the selectivity of the process of creation of the excited species by control, either of the composition of the initial mixture, or of the alternating excitation voltage.
- Improving the selectivity by controlling the composition of the gas mixture makes it possible either to favor certain chemical reactions or reaction paths - for example by providing in the mixture an excess compound -, or to limit certain reaction paths by adding, for example example, of a compound ensuring the trapping function of a targeted chemical species.
- this technique has a relatively low selectivity insofar as it does not completely avoid the reaction paths leading to undesirable products.
- the improvement in selectivity by controlling the excitation voltage is generally obtained by using an alternating voltage with a very fast high-voltage signal. The species with a high energy level are then excited and the reaction paths using the species with a low energy level are avoided.
- the latter technique has very low selectivity for reaction mechanisms involving species with a high energy level.
- the object of the invention is to overcome the aforementioned drawbacks.
- the initial gas comprises at least one carrier gas and at least one reaction gas
- the conditions of electrical supply of the electrodes are adapted to allow the creation of metastable species among the gaseous species of said carrier gas, so that the ratio, in the inter-electrode space, between the concentration of said metastable species and the electron concentration is greater than or equal to 1.
- This process can also include one or more of the following characteristics, taken in isolation or in all technically possible combinations:
- the carrier gas is chosen so that the energy level of its metastable species thus created by electrical discharge is equal to or slightly higher than the energy level of excitation of the species of said at least one reaction gas.
- the frequency of the supply voltage is less than 15 kHz.
- the carrier gas comprises at least one of the gases chosen from Nitrogen, Argon, Helium, Krypton and Xenon.
- the carrier gas comprises nitrogen or argon
- said at least one reaction gas comprises on the one hand oxygen or a gas capable of releasing oxygen, for example N 2 O and, on the other hand, a gaseous precursor of silicon, for example monosilane SiH 4 .
- the invention also relates to a device for carrying out chemical reactions between gaseous species according to a selective reaction path, comprising two excitation electrodes, means for supplying power to the excitation electrodes and means for supplying space inter-electrodes in an initial gas in which a discharge must be created under the action of the excitation electrodes, capable of causing an excitation of at least part of the gaseous species of said initial gas, characterized by the implementation of the following measures:
- said initial gas comprises at least one carrier gas and at least one reaction gas
- - Said electrical supply means are adapted to allow the creation of metastable species among the gaseous species of said carrier gas, so that the ratio, in the inter-electrode space, between the concentration of said metastable species and the concentration of electrons is greater than or equal to 1.
- the carrier gas is chosen so that the energy level of its metastable species thus created by electrical discharge is equal to or slightly greater than the energetic level of excitation of the species of said at least one reacting gas !.
- said electrical supply means are adapted to create a peak-to-peak supply voltage comprised between approximately 1 kV and 30 kV, and a frequency of the latter which is comprised between approximately 200 Hz and 100 kHz.
- said electrical supply means are adapted to create a supply voltage whose frequency is less than 15 kHz.
- Another object of the invention is a method of surface treatment by depositing a silicon oxide thereon, characterized in that the deposited compound is obtained by implementing a method such as that previously described - implementing chemical reactions according to a selective reaction path between N 2 O and SiH 4 , using a carrier gas consisting of nitrogen, said selective reaction path making it possible to avoid nucleation of silica powder in the inter-electrode space.
- FIG. 1 is a schematic sectional view of a device for the implementation of selective chemical reactions according to the invention
- FIG. 1 schematically shows a device for carrying out chemical reactions according to the invention, designated by the general reference 10.
- the device 10 includes a reactor 16 provided with a first injection orifice 18 in communication with a carrier gas supply source (not shown), for example consisting of nitrogen, argon or even helium. Furthermore, the reactor 16 is provided with an inlet 21 of a reaction gas mixture, for example a mixture of a silane and an oxidizing gas. It is clearly understood that the overall mixture of carrier gas + reaction gas mixture could be introduced into the reactor at a single gas inlet, and not at two separate inlets as is the case in FIG. 1. We also note the presence in the device shown of two gas outlets 20 and 22 (here again it will be understood that the installation could - without departing at any time from the scope of the present invention - only include one means of evacuation of gas).
- Two excitation electrodes 23 and 24 extend parallel to the interior of the reactor 16.
- They are for example each made up of a metal disc, and are each connected to a source 26 of AC voltage supply, the applied voltage and the excitation frequency are adjustable according to a predetermined range. They are also each carried by an adjustable bar, respectively 28 and 30, accessible from the outside of the reactor 16 so as to adjust the inter-electrode gas space according to a range for example between approximately 0.5 and 5 mm.
- the discharge 12 is obtained by excitation of the electrodes 23 and 24, by means of the power source 26.
- the supply voltage is fixed at a value for example between approximately 1 kV and 30 kV considered peak to peak, and the frequency of the excitation voltage supplied between the electrodes 23 and 24 is between approximately 200 Hz and 100 kHz, preferably less than 15 kHz, depending on the thickness of the inter-electrode gas space, the flow of the initial gas, as well as the composition of the latter.
- a control of the discharge operating conditions according to the present invention makes it possible to create in the electric discharge quantities of metastable species of the initial gas such as the concentration of these metastable species in the inter-electrode space is greater than the concentration electrons.
- the reaction mechanisms generated between the species of gas or gas mixtures are then, for the most part, managed by the interactions which involve the metastable species of the carrier gas.
- metastable species being neutral chemical species, they are not sensitive, unlike charged species, neither to the value nor to the variations of the electric field. Thus, while between two alternations of the excitation voltage, the charged species see their concentration decrease very quickly and their speed become substantially zero, the metastable species remain present in significant maintained proportions and are uniformly distributed in the reactor 16.
- each metastable species being fixed and specific to the gases from which they come, the reactions requiring a contribution of energy equal to or slightly lower than the energy level of this metastable species are - statistically - very strong majority.
- the selectivity of the reaction paths implemented is considerably increased: the choice of metastable species created conditions the possibilities of energy transfer to the species of the reaction mixture, therefore the ions and metastables created within of this reaction mixture, and therefore therefore the reaction paths within the initial gas mixture which may or may not take place.
- the carrier gas comprises nitrogen
- the reaction gas mixture comprises on the one hand oxygen or a gas capable of releasing oxygen, such as N 2 O and, d on the other hand, a precursor of silicon, in particular of SiH. (example of application for depositing a layer of silicon oxide on a substrate).
- an initial gas consisting of N 2 is used , comprising approximately 50 ppm of SiH 4 and 800 ppm of N 2 0.
- the first reaction (1) is the very source of plasma homogeneity.
- the second reaction (2) is the initiation reaction of the reaction mechanisms implemented in the plasma.
- the three excited species produced by this reaction (2) namely N 2 , N * and NO * can theoretically themselves react with other species present in the plasma to produce new excited species.
- N is the molecule in its ground state, it cannot transfer energy to another species, and is therefore not at the origin of other reaction mechanisms.
- NO ' is capable of reacting in high proportion with the SiH molecule to form an intermediate species of general formula SiHyNOx.
- Such a capacity measurement makes it possible to highlight the continuous nature or not of the deposit of SiOx. Indeed, if the deposition of SiOx is not continuous, the metallization carried out on this deposition comes into contact with a part of the silicon substrate, the application of the voltage then creates a short circuit making it impossible to measure the capacitance dielectric of the SiOx deposit. This situation is observed when the deposition of SiOx is carried out by a filamentary discharge. On the other hand, as it has been shown here, when the deposition of SiOx is obtained according to the invention, that is to say by a homogeneous discharge, no short circuit is observed and the measurement of the dielectric capacity deposition is then made possible, which shows that the deposition of SiOx obtained according to the invention is indeed continuous.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0003306A FR2806324B1 (fr) | 2000-03-15 | 2000-03-15 | Procede et dispositif de mise en oeuvre d'une reaction chimique et procede de traitement de surface utilisant de tels procede et dispositif |
FR0003306 | 2000-03-15 | ||
PCT/FR2001/000746 WO2001068941A1 (fr) | 2000-03-15 | 2001-03-13 | Procede et dispositif de mise en oeuvre d'une reaction chimique |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1266046A1 true EP1266046A1 (fr) | 2002-12-18 |
Family
ID=8848107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01913997A Ceased EP1266046A1 (fr) | 2000-03-15 | 2001-03-13 | Procede et dispositif de mise en oeuvre d'une reaction chimique |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030047442A1 (fr) |
EP (1) | EP1266046A1 (fr) |
JP (1) | JP2003527748A (fr) |
AU (1) | AU782275B2 (fr) |
CA (1) | CA2402150A1 (fr) |
FR (1) | FR2806324B1 (fr) |
WO (1) | WO2001068941A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5034245B2 (ja) * | 2005-02-10 | 2012-09-26 | コニカミノルタホールディングス株式会社 | プラズマ放電処理装置およびプラズマ放電処理方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335160A (en) * | 1978-11-21 | 1982-06-15 | Neary Michael P | Chemical process |
US4550961A (en) * | 1984-07-26 | 1985-11-05 | Ndm Corporation | Electrosurgical electrode connector |
JPH0660412B2 (ja) * | 1986-08-21 | 1994-08-10 | 東京瓦斯株式会社 | 薄膜形成法 |
JP2749630B2 (ja) * | 1989-04-24 | 1998-05-13 | 住友電気工業株式会社 | プラズマ表面処理法 |
JPH04337076A (ja) * | 1991-05-14 | 1992-11-25 | Yuuha Mikakutou Seimitsu Kogaku Kenkyusho:Kk | 高圧力下でのプラズマ及びラジカルcvd法による高速成膜方法 |
MX9303141A (es) * | 1992-05-28 | 1994-04-29 | Polar Materials Inc | Metodos y aparatos para depositar recubrimientos de barrera. |
JP3190745B2 (ja) * | 1992-10-27 | 2001-07-23 | 株式会社東芝 | 気相成長方法 |
FR2704558B1 (fr) * | 1993-04-29 | 1995-06-23 | Air Liquide | Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement. |
US5414324A (en) * | 1993-05-28 | 1995-05-09 | The University Of Tennessee Research Corporation | One atmosphere, uniform glow discharge plasma |
CA2306568C (fr) * | 1997-10-20 | 2007-08-07 | Steve E. Babayan | Depot de revetements a l'aide d'un jet de plasma a pression atmospherique |
US6112697A (en) * | 1998-02-19 | 2000-09-05 | Micron Technology, Inc. | RF powered plasma enhanced chemical vapor deposition reactor and methods |
US6124675A (en) * | 1998-06-01 | 2000-09-26 | University Of Montreal | Metastable atom bombardment source |
JPH11354507A (ja) * | 1998-06-09 | 1999-12-24 | Hitachi Ltd | ドライエッチング方法および半導体装置 |
FR2782837B1 (fr) * | 1998-08-28 | 2000-09-29 | Air Liquide | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
-
2000
- 2000-03-15 FR FR0003306A patent/FR2806324B1/fr not_active Expired - Fee Related
-
2001
- 2001-03-13 US US10/221,762 patent/US20030047442A1/en not_active Abandoned
- 2001-03-13 WO PCT/FR2001/000746 patent/WO2001068941A1/fr not_active Application Discontinuation
- 2001-03-13 AU AU39389/01A patent/AU782275B2/en not_active Ceased
- 2001-03-13 JP JP2001567816A patent/JP2003527748A/ja active Pending
- 2001-03-13 CA CA002402150A patent/CA2402150A1/fr not_active Abandoned
- 2001-03-13 EP EP01913997A patent/EP1266046A1/fr not_active Ceased
Non-Patent Citations (1)
Title |
---|
See references of WO0168941A1 * |
Also Published As
Publication number | Publication date |
---|---|
CA2402150A1 (fr) | 2001-09-20 |
AU3938901A (en) | 2001-09-24 |
WO2001068941A1 (fr) | 2001-09-20 |
FR2806324B1 (fr) | 2002-09-27 |
US20030047442A1 (en) | 2003-03-13 |
JP2003527748A (ja) | 2003-09-16 |
AU782275B2 (en) | 2005-07-14 |
FR2806324A1 (fr) | 2001-09-21 |
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