EP1215690A3 - Keramischer Kondensatormodul - Google Patents
Keramischer Kondensatormodul Download PDFInfo
- Publication number
- EP1215690A3 EP1215690A3 EP01128045A EP01128045A EP1215690A3 EP 1215690 A3 EP1215690 A3 EP 1215690A3 EP 01128045 A EP01128045 A EP 01128045A EP 01128045 A EP01128045 A EP 01128045A EP 1215690 A3 EP1215690 A3 EP 1215690A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- ceramic condenser
- substrate
- condenser module
- layered ceramic
- excluding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 title abstract 7
- 239000000758 substrate Substances 0.000 abstract 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000363317 | 2000-11-29 | ||
JP2000363317A JP2002170739A (ja) | 2000-11-29 | 2000-11-29 | 積層セラミックコンデンサモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1215690A2 EP1215690A2 (de) | 2002-06-19 |
EP1215690A3 true EP1215690A3 (de) | 2006-03-01 |
Family
ID=18834443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01128045A Withdrawn EP1215690A3 (de) | 2000-11-29 | 2001-11-26 | Keramischer Kondensatormodul |
Country Status (3)
Country | Link |
---|---|
US (1) | US6583981B2 (de) |
EP (1) | EP1215690A3 (de) |
JP (1) | JP2002170739A (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100371A (ja) * | 2001-09-19 | 2003-04-04 | Matsushita Electric Ind Co Ltd | 端子付き配線基板 |
US7248268B2 (en) * | 2004-04-09 | 2007-07-24 | Clairvoyante, Inc | Subpixel rendering filters for high brightness subpixel layouts |
US7411590B1 (en) * | 2004-08-09 | 2008-08-12 | Apple Inc. | Multimedia file format |
US7212395B2 (en) * | 2004-12-28 | 2007-05-01 | Intel Corporation | Capacitor design for controlling equivalent series resistance |
USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
US8767408B2 (en) * | 2012-02-08 | 2014-07-01 | Apple Inc. | Three dimensional passive multi-component structures |
JP2015153891A (ja) * | 2014-02-14 | 2015-08-24 | 矢崎総業株式会社 | コイルユニット及び給電システム |
KR102149789B1 (ko) * | 2015-01-20 | 2020-08-31 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
CN108288653B (zh) * | 2018-01-10 | 2020-01-21 | 嘉善品智联科技有限公司 | 一种具有参考电容的传感器件及其制造方法 |
US11839068B2 (en) * | 2019-02-18 | 2023-12-05 | Nissan Motor Co., Ltd. | Electric power converter |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588616A (en) * | 1969-01-24 | 1971-06-28 | Sprague Electric Co | Compensation substrate for dual in line package |
US4499524A (en) * | 1983-11-07 | 1985-02-12 | North American Philips Corporation | High value surface mounted capacitor |
WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
US4930045A (en) * | 1989-10-26 | 1990-05-29 | Sundstrand Corporation | High power, high temperature disassemblable ceramic capacitor mount |
US4941067A (en) * | 1989-04-07 | 1990-07-10 | Motorola Inc. | Thermal shunt for electronic circuits |
US5134094A (en) * | 1991-07-22 | 1992-07-28 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
JPH07283071A (ja) * | 1994-04-11 | 1995-10-27 | Meidensha Corp | 電力変換装置 |
JPH08213278A (ja) * | 1995-02-03 | 1996-08-20 | Murata Mfg Co Ltd | 高周波電力用積層セラミックコンデンサブロック |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5773871A (en) * | 1993-06-24 | 1998-06-30 | Northern Telecom Limited | Integrated circuit structure and method of fabrication thereof |
JP3461204B2 (ja) * | 1993-09-14 | 2003-10-27 | 株式会社東芝 | マルチチップモジュール |
MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
JP2573809B2 (ja) * | 1994-09-29 | 1997-01-22 | 九州日本電気株式会社 | 電子部品内蔵のマルチチップモジュール |
JPH10223473A (ja) | 1997-02-05 | 1998-08-21 | Mitsubishi Materials Corp | 複合セラミックコンデンサ |
JPH10241989A (ja) | 1997-02-26 | 1998-09-11 | Hitachi Aic Inc | コンデンサ |
US5973928A (en) * | 1998-08-18 | 1999-10-26 | International Business Machines Corporation | Multi-layer ceramic substrate decoupling |
EP1075004A4 (de) * | 1999-02-17 | 2007-05-02 | Tdk Corp | Kondensator |
-
2000
- 2000-11-29 JP JP2000363317A patent/JP2002170739A/ja active Pending
-
2001
- 2001-11-26 EP EP01128045A patent/EP1215690A3/de not_active Withdrawn
- 2001-11-27 US US09/993,566 patent/US6583981B2/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3588616A (en) * | 1969-01-24 | 1971-06-28 | Sprague Electric Co | Compensation substrate for dual in line package |
US4499524A (en) * | 1983-11-07 | 1985-02-12 | North American Philips Corporation | High value surface mounted capacitor |
WO1989005570A1 (en) * | 1987-12-08 | 1989-06-15 | Rogers Corporation | Mounting substrate for leadless ceramic chip carrier |
US4941067A (en) * | 1989-04-07 | 1990-07-10 | Motorola Inc. | Thermal shunt for electronic circuits |
US4930045A (en) * | 1989-10-26 | 1990-05-29 | Sundstrand Corporation | High power, high temperature disassemblable ceramic capacitor mount |
US5134094A (en) * | 1991-07-22 | 1992-07-28 | Silicon Power Corporation | Single inline packaged solid state relay with high current density capability |
JPH07283071A (ja) * | 1994-04-11 | 1995-10-27 | Meidensha Corp | 電力変換装置 |
JPH08213278A (ja) * | 1995-02-03 | 1996-08-20 | Murata Mfg Co Ltd | 高周波電力用積層セラミックコンデンサブロック |
Non-Patent Citations (3)
Title |
---|
MCGUIGGAN M F ET AL: "THERMALLY CONDUCTIVE ADHESIVES FOR SURFACE MOUNT APPLICATIONS", WESCON TECHNICAL PAPERS, WESTERN PERIODICALS CO. NORTH HOLLYWOOD, US, vol. 31, January 1987 (1987-01-01), pages 23 - 201, XP000003670 * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 02 29 February 1996 (1996-02-29) * |
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12 26 December 1996 (1996-12-26) * |
Also Published As
Publication number | Publication date |
---|---|
US6583981B2 (en) | 2003-06-24 |
JP2002170739A (ja) | 2002-06-14 |
US20020084091A1 (en) | 2002-07-04 |
EP1215690A2 (de) | 2002-06-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20011126 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H02M 7/00 20060101ALI20060109BHEP Ipc: H01G 2/08 20060101ALI20060109BHEP Ipc: H01G 4/38 20060101AFI20020422BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20060424 |