EP1201367B1 - Appareil ébarbeur pour tampon de polissage et son procédé de fabrication - Google Patents

Appareil ébarbeur pour tampon de polissage et son procédé de fabrication Download PDF

Info

Publication number
EP1201367B1
EP1201367B1 EP20010305243 EP01305243A EP1201367B1 EP 1201367 B1 EP1201367 B1 EP 1201367B1 EP 20010305243 EP20010305243 EP 20010305243 EP 01305243 A EP01305243 A EP 01305243A EP 1201367 B1 EP1201367 B1 EP 1201367B1
Authority
EP
European Patent Office
Prior art keywords
grit
dresser
bonding material
polishing cloth
diamond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP20010305243
Other languages
German (de)
English (en)
Other versions
EP1201367A1 (fr
Inventor
Kenichii Kimura
Moriyasu c/o Read Co. Ltd. Kaenanri
Hidemi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Read Co Ltd
Original Assignee
Read Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Co Ltd filed Critical Read Co Ltd
Publication of EP1201367A1 publication Critical patent/EP1201367A1/fr
Application granted granted Critical
Publication of EP1201367B1 publication Critical patent/EP1201367B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings

Definitions

  • the present invention relates to dressers for a polishing cloth in Chemical and Mechanical Polishing (hereinafter referred to as CMP) and to manufacturing methods therefor, as per the preamble of claims 1, 2, 5 and 7. Examples of such dressers and methods are disclosed by JP 2000 141 204 A .
  • CMP processing is generally used to remove surface defects such as protrusions, crystal lattice defects, scoring, or roughness on a conductive layer, a dielectric layer or an insulation layer formed on a substrate or wafer.
  • CMP processing a wafer is pressed on an abrasive cloth made of polyurethane foam or the like by a predetermined load, adhered to a disk surface plate, and the wafer is polished by rotating both the wafer and the cloth with an abrasive fluid called a chemical slurry.
  • an abrasive fluid such as potassium hydroxide, dilute hydrochloric acid, aqueous hydrogen peroxide, or iron nitrate
  • CMP is performed many times in steps for stacking various kinds of electronic circuits on a substrate or a wafer.
  • the number of CMPs is increased, particles of polishing dust burrows into minute cracks, causing clogging, and this reduces the polishing rate.
  • an operation by which the surface of the polishing cloth is replaced to restore the polishing speed, called dressing, is required to be executed often or regularly.
  • an instrument called a dresser for a CMP polishing cloth is used.
  • the nickel plating material or the metallic-brazing material is dissolved by strongly acidic chemical slurry, and the slurry is contaminated and the diamond grit is peeled, potentially causing scoring on the surface of the wafer. Therefore, a dresser for CMP abrasive cloth in which dissolution of metal or peeling-off of diamond grit will not occur in CMP is desired.
  • grit such as diamond grit is usually randomly arranged.
  • Japanese Unexamined Patent Application Publication No. 2000-141204 shows an example in which diamond grit is arranged substantially uniformly, approximate in concentric circles. In this case, the distance between the pieces of grit is not equal and the grit is arranged irregularly. Therefore, stable polishing performance cannot be exhibited and a uniform surface of the polishing cloth cannot be obtained, and furthermore, the polishing speed cannot be adjusted arbitrarily.
  • the distance between the pieces grit is small, swarf or polished particles generated by grinding adhere among the grit and are not discharged, or a part of the polishing cloth is melted due to frictional heat on grinding, thus causing clogging, and this causes a decrease in performance of the dresser and the surface of the polishing cloth becomes a mirror surface resulting in a decrease in the polishing speed.
  • a dresser for a polishing cloth has a dressing face comprising a sintered product obtained by mixing a bonding material comprising silicon and/or silicon alloy with diamond grit, and forming and sintering the mixture such that a carbide film generated by sintering the silicon in the bonding material into the diamond is provided on the surface of said diamond grit, whereby the diamond grit is firmly bonded with the bonding material, wherein the sintered product is attached on the surface of a pedestal, the product is finished into specified size by planarizing and dressing the dressing surface thereof, and the diamond grit is exposed.
  • a dresser for a polishing cloth according to a second aspect of the present invention has a dressing face comprising a sintered product obtained by mixing a bonding material comprising silicon and/or silicon alloy with diamond grit coated with a film of a carbide of a metal in the group IV, V or VI of the periodic table, and forming and sintering the mixture, such that the diamond grit is firmly bonded with the bonding material with said carbide film, wherein the sintered product is attached on the surface of a pedestal, the product is finished into specified size by planarizing and dressing the dressing surface thereof, and the diamond grit is exposed.
  • the sintered product is formed by arranging each particle on the surface of the bonding member so as to have two-dimensional regularity, the distance between adjacent pieces of grit on the smallest lattice constructed by the arrangement is within a range between 10 ⁇ m and 3,000 ⁇ m and each piece of grit is arranged in a substantially uniform distribution.
  • a first method of making a dresser for a polishing cloth according to the present invention comprises mixing bonding material comprising silicon and/or silicon alloy with diamond grit, sintering the mixture such that a carbide film is generated by sintering the silicon in the bonding material on the surface of the diamond grit, and the diamond is firmly bonded with the bonding material by the carbide film, wherein the sintered product is attached on the surface of a pedestal, the product is finished into specified size by planarizing and dressing the dressing surface thereof, and the diamond grit is exposed.
  • a bonding material comprising silicon and/or silicon alloy is mixed with diamond grit coated with carbide film of metal in group IV, V or VI of the periodic table, and the mixture is formed and sintered whereby the diamond grit is firmly bonded with the bonding material by the carbide film, wherein the sintered product is attached on the surface of a pedestal, the product is finished into specified size by planarizing and dressing the dressing surface thereof, and the diamond grit is exposed.
  • adhesive regions whose size is almost the same as that of the grit are provided on the surface of the planar bonding material comprising silicon or a silicon alloy or a sheet placed thereon in positions which are uniformly distributed with two-dimensional regularity, and after each grit particle is adhered on the adhesive regions, they are pressed down and sintered. Also in this case, a carbide film is generated on the surface of the diamond grit by reactive sintering of the diamond and the silicon in the bonding material, and thus, the diamond grit is firmly bonded to the bonding material with the carbide film.
  • the diamond grit When adhering the diamond grit on the adhesive regions, the diamond grit may be coated with carbide film of a metal in group IV, V, or VI in the periodic table in advance, and the diamond grit may be firmly bonded to the bonding material with the carbide film.
  • the adhesive regions may be formed by non-masked parts of an adhesive sheet masked with a non-adhesive material.
  • the bonding material comprising silicon and/or silicon alloy has excellent acid-resistance in acidic solutions such as nitric acid. As a result, polishing fluid is not contaminated, and this simplifies the wafer cleaning step after CMP.
  • the diamond grit regularly with the appropriate grit distance, stable grinding characteristics can be maintained, surface roughness on the surface of the polishing cloth creates a uniform dresser surface, stable polishing can be always carried out with a constant polishing speed, and the grit distance of the diamond grit or the like which is arranged with regularity can be appropriately adjusted.
  • the surface state of the dresser for the polishing cloth can be created according to a workpiece, and the polishing efficiency can be adjusted at will.
  • the dressing face thereof comprises a sintered product obtained by mixing a bonding member comprising silicon or silicon alloy with diamond grit coated with a carbide film generated by the diamond grit or the above-described metal from the periodic table, and by forming and sintering the mixture.
  • the sintered product is adhered to the surface of a pedestal made of ceramic, plastic or the like, then the dressing face is subjected to planarizing and dressing processing to finish it into specified size as well as exposing the diamond grit.
  • the sintered product is obtained by mixing the bonding material comprising silicon or silicon alloy with the diamond grit and forming and sintering the mixture, a carbide film is formed on the surface of the diamond grit by sintering of the silicon in the bonding material into the diamond. Thereby, the diamond grit is bonded firmly with the bonding material.
  • FIG. 1 and FIG. 2 show embodiments of a dresser for a CMP polishing cloth according to the present invention.
  • FIG. 1 shows the overall constitution.
  • FIG. 2 shows a cross-section of the dresser that is sectioned at the face through a central axis of rotation.
  • a plurality of sintered products 2 are adhered to the working face 1a of the cup-shaped pedestal 1 made of metal, ceramic, or plastic.
  • the diamond grit 3 in the sintered product 2 has the carbide film 5 generated on the surface thereof.
  • the diamond grit 3 is bounded firmly with the bonding material 4 by the carbide film 5.
  • the bonding material 4 comprising silicon and/or silicon alloy
  • the mixture is formed and sintered, the carbide film 5 is generated on the surface of the diamond grit by sintering the silicon in the bonding material 4 into the diamond grit 3.
  • the carbide film 5 can be formed by coating the surface of the diamond grit 3 with the carbide film 5 of a metal from group IV, V, or VI in the periodic table.
  • Grain size of the diamond grit 3 is not limited. Generally, it is preferable that the grit having a grain size of #325/#400 to #30/#40 according to JIS B4130 be used. If the grain size of the diamond grit is less than #325/400, exposure amount at the dressing face of the diamond grit is lower, and this cause imperfect dressing of a CMP polishing cloth or slower dressing speed. If the grain size of the diamond grit exceeds #30/#40, it might cause a rough face of the CMP polishing cloth when dressing or cause a lower rate of removal.
  • silicon alloy is used as at least a part of the bonding member 4, preferably it has a silicon content of 15 percent by weight.
  • Metals in groups IV, V, or VI of the periodic table may be used as alloy metal.
  • titanium, chrome, tantalum, tungsten, or molybdenum is preferably used. If the silicon content is less than 15 percent by weight, the obtained sintered product 2 might have poor acid-resistance.
  • sintering method employable in the present invention there are many methods including hot-pressing using graphite, pressure sintering with current, pressure sintering with discharge, hot isostatic pressing (HIP), or sintering with an ultrahigh pressure device.
  • Sintering according to the present invention is not limited to certain sintering methods, but a preferable sintering method may be chosen and employed as required.
  • a method of coating the carbide film 5 on the diamond grit 3 there is a PVD method, a CVD method, a plating method, or an immersion method using a melted salt bath.
  • a preferable method may be chosen and employed as required.
  • the sintered product 2 is used as a dresser, as shown in FIG. 1 and FIG. 2, the sintered product is fixed on the working face 1a around the pedestal 1 by an adhesive 6, then the dressing face 2a is planarized and is dressed. Thereby, the product is finished into a specified size and the diamond grit is exposed for dressing.
  • the dresser for a CMP polishing cloth constituted accordingly has a bonding material employing acid-resistant silicon or silicon alloy, metal never dissolves and the diamond grit is never peeled off by strongly acidic chemical slurry. Therefore, wafer-cleaning steps after CMP processing can be simplified and scratches on a work surface caused by peeling-off of the diamond grit from the dressing face 2a can be prevented.
  • the sintered body 12 is constructed by arranging each particle of the diamond grit 13 on the surface of the bonding material 14 so as to have two-dimensional regularity, the distance between the adjacent pieces of grit on the smallest lattice constructed by the arrangement is within a range between 10 ⁇ m and 3, 000 ⁇ m, and each piece of grit is arranged so as to form a substantially uniform distribution.
  • diamond separately classified in some range is used as the diamond grit 13, and the particle size thereof is not limited. However, generally speaking, it is preferable to select a grit included within the range mentioned-above. Also, silicon and/or a silicon alloy is used as the above-mentioned bonding material 14.
  • each particle of the grit 13 is arranged to be fixed on the surface of the bonding material with two-dimensional regularity, the distance between the adjacent pieces of grit on the smallest lattice constructed by the arrangement is within a range between 10 ⁇ m and 3,000 ⁇ m, more preferably, the grit 13 has a grain size of #100 to #60 and a distance between the pieces of grit of 100 ⁇ m to 2,000 ⁇ m, and each piece of grit is arranged so as to form a substantially uniform distribution.
  • the larger the distance of between the grit particles becomes the more the polishing speed increases and the larger the roughness of the polishing cloth becomes.
  • the smaller the distance between the grit particles becomes the more the polishing speed decreases, the smaller the roughness of the surface of the polishing cloth becomes and the more the polishing speed decreases.
  • the distance between the pieces of grit 13 is 10 ⁇ m or less, since clogging occurs in the dresser due to a grinding layer of the polishing cloth or polishing particles, the polishing cloth cannot be uniformly ground. Also, the distance between the pieces of grit 13 is 3,000 ⁇ m or more, a satisfactory grinding operation cannot be obtained. Therefore, it is preferable to select the distance between the pieces of grit according to the type of object to be ground or cost, as required, and the roughness of the polishing cloth or the polishing speed can be arbitrarily adjusted by adjusting the distance.
  • the arrangement of the grit 13 will be described more specifically.
  • the smallest lattice produced by the particles of grit 13 which are adjacent in a circumferential and radial direction on a pedestal 1 is, in general, a square or a parallelogram (this may be called a triangle formed by connecting opposing angles). In this case, it is enough for the distance to the closest adjacent particle of grit in this smallest lattice to be within the range from 10 ⁇ m to 3,000 ⁇ m.
  • the shape of the lattice is not limited to the above-mentioned shape, each of the pieces of grit must be arranged with two-dimensional regularity.
  • the above-mentioned dresser for a polishing cloth will be easily manufactured by a method described below.
  • the adhesive part may be formed by a non-masking part in the adhesive sheet which is masked.
  • masking is performed by forming the non-masking part by making many holes having the same size as that of the particle size of the grit, and the adhesive part is formed by the non-masking part.
  • the adhesive part may be formed by partial application of the adhesive using printing techniques. The size of the adhesive part must be almost the same as the that of the grit in order to adhere and fix each piece of grit 13, and they must be arranged at regular intervals two-dimensionally according to the holding position of each piece grit 13.
  • the grit 13 is sintered and fixed on the surface of the bonding material 14.
  • the diamond grit 13 is pressed into the bonding material 14 and sintered.
  • a carbide film 15 is generated on the surface of the diamond grit 13 by reactive sintering of the diamond and the silicon in the bonding material, and thus, the diamond grit 13 is firmly bonded to the bonding material 14 by the carbide film 15.
  • grit coated in advance with a carbide film of a metal in group IV, V or VI in the periodic table is used as the above-mentioned diamond grit, and the grit is pressed into the bonding material and sintered. In this way, the diamond grit may be firmly bonded to the bonding material by the carbide film.
  • the following method may be used. Holes whose dimension is equal to the maximum dimension of the grit distribution are made on a metal plate with the required arrangement by etching, this metal plate is placed on the surface of a molded body or a sheet, the grit having a particle size distribution corresponding to the holes is fitted into the holes while being observed with an microscope, the grit is pushed into the molded body via a plate placed on the grit after the unnecessary grit is brushed off with a brush, and then, the metal plate is removed and the object is sintered under prescribed temperature, pressure, and time conditions.
  • the bonding material 14 holding the grit 13 with a prescribed arrangement is bonded to a dresser pedestal 1 with an adhesive 6 such as epoxy resin, and then, the dresser surface is subjected to planarizing and dressing by shot blasting using unbound grit such as alumina, wrapping or etching to form a final prescribed dimension, and the grit 13 protrudes at a prescribe height. In this way, a dresser for a polishing cloth is manufactured.
  • Diamond grit having a grain size of #100/#200 is mixed with titanium-silicon alloy powder at 1:1 by weight so as to yield a mixture of volume ratio of 1:3. Then, an obtained mixed powder is filled in a graphite frame, and then it is sintered at a sintering temperature of 1,200 degrees Celsius and under a pressure of 50 Mpa for an hour by hot-pressing. After an obtained sintered product is adhered on a pedestal (refer to FIG.
  • the dressing face of the product is planarized and dressing-processed by using a GC grinding wheel having a grain size of #240 so that the thickness of the product and the height of protrusion of the diamond grit from the matrix may be 2 millimeters and 50 micrometers respectively. This forms a dresser.
  • FIG. 3 shows the rate of change in weight (vertical axis) to dipping hours (horizontal axis) . The figure shows that there was no weight decrease and that the product had superior acid-resistance.
  • the dresser In the durability test of peeling-off, the dresser is pressed on the surface of a CMP polishing cloth made of urethane foam with a face pressure of 20 kPa, then the dresser was subjected to continuous dressing for 100 hours while slurry containing 2 weight percent of alumina abrasive grains having a grain size of #4000 is sprayed at 12 milliliters per minute.
  • the surface of the dresser was observed with a optical microscope at four points to inspect peeling-off of the diamond grit and changes in height.
  • FIGs.4 and 5 respectively show the results of the observation before and after dressing. According to these figures (photographs), no peeling-off of the diamond is observed. Furthermore, no change in protrusion of the diamond grit is observed, and the product is confirmed to have durability and excellent grain retention.
  • Diamond grit, coated with titanium carbide of about 2 micrometers by a CVD method, having a grain size of #100/#120 is mixed with titanium-silicon alloy powder at 1:1 by weight so as to make a mixture having a volume ratio of 1:3. Then, an obtained mixed powder is filled in a graphite frame, then it is sintered at a sintering temperature of 1,200 degrees Celsius and a pressure of 50 Mpa for an hour by hot-pressing.
  • the dressing face of the product is planarized and dressing-processed by using a GC grinding wheel size of #240 so that the thickness of the product and the height of protrusion of the diamond grit from matrix may be 2 millimeters and 50 micrometers, respectively.
  • the following acid-resistance test is a durability test for grid-peeling-off carried out for the dresser under the same conditions as in Example 1.
  • FIG. 6 The result of the acid-resistance test is shown in FIG. 6.
  • the figure shows that no increase in weight of the product is seen and the product has superior acid-resistance.
  • peeling-off of the diamond grit and change in the height of protrusion are observed at four points on the dresser before and after dressing. Neither peeling-off of the diamond grit nor change in the height of the protrusion of the diamond grit is observed before and after dressing.
  • the product is therefor confirmed to exhibit superior durability in holding grit.
  • Tungsten powder and silicon powder are mixed in a ball mill at a ratio of 1:4 by weight, 20% by volume of paraffin is added to the obtained mixed powder and mixed, and the obtained mixed powder is filled in a die to fabricate a planar molded body under a pressure of 50 MPa.
  • An adhesive sheet having an adhesive applied is masked by a sheet having a non-masking part formed by making many holes equivalent to the grit size at two-dimensional regular intervals.
  • the adhesive parts formed by the non-masking part is 270 ⁇ m in size, and they are arranged so that the smallest lattice formed by the adjacent pieces of grit in the circumferential and radial directions is a parallelogram and the grit distance in one side thereof is at regular intervals of 0.8 mm.
  • classified diamond grit of 150 ⁇ m to 250 ⁇ m is adhered and fixed on the non-masking part of the adhesive sheet, the sheet is placed on the molded body made of the tungsten-silicon mixed powder, the grit is pressed into the molded body via a plate, and then, the body is hot-press sintered under a sintering temperature of 1, 200°C and a pressure of 50 MPa for one hour. In this way, a sintered body comprising grit fixed on the molded body is formed.
  • the obtained sintered body is bonded with epoxy resin on a cup-shaped pedestal which is made of stainless steel (SUS 316) and has a diameter of 100 mm so as to form a ring shape with 10 mm intervals, shot blasting is performed on the dressing surface of the sintered body by using unbound alumina with #240 particle size, and then, the body is planarized and dressed so that the protrusion height may be 60 ⁇ m to 80 ⁇ m. In this way, a dresser for a polishing cloth is fabricated.
  • the electron micrograph in Fig. 8 shows the arrangement of the grit on the dressing surface in the above-mentioned dresser for a polishing cloth.
  • the fabricated dresser is pressed on a polishing cloth made of polyurethane foam, which is rotated at 50 rpm, under a pressure of 19.6 kPa to be ground, while slurry (made by Cabot) containing 2% by volume of fumed silica is flows at about 15 ml per minute.
  • a planar sintered body is fabricated by using mixed powder of tungsten and silicon at a ratio of 1:4 by weight.
  • an adhesive sheet is masked by a sheet having a non-masking part, holes having a diameter of about 270 ⁇ m forming the non-masking part are arranged so that the smallest lattice formed by adjacent pieces of grit in the circumferential and radial direction is a parallelogram and a grit distance in one side thereof is at regular intervals of 1.5 mm, classified diamond grit of 150 ⁇ m to 250 ⁇ m is adhered and fixed on the non-masking part of the adhesive sheet, the sheet is placed on the molded body made of the tungsten-silicon mixed powder, and the sheet is hot-press sintered. In this way, a sintered body comprising grit fixed on the molded body is obtained.
  • the obtained sintered body is bonded with epoxy resin on the same pedestal as that used in EXAMPLE 1, shot blasting is performed on the operational surface using unbound alumina with #240 particle size, and then, the protruding height for a matrix of the diamond grit is adjusted to be 60 ⁇ m to 80 ⁇ m. In this way, a dresser for a polishing cloth is fabricated.
  • the electron micrograph in Fig. 9 shows the arrangement of the grit on the dressing surface of the dresser for a polishing cloth.
  • the fabricated dresser is pressed on a polishing cloth made of polyurethane foam, which is rotating at 100 rpm, under a pressure of 19.6 kPa to be ground, while slurry (made by Cabot) containing 2% by volume of fumed silica flows at about 15 ml per minute.
  • the polishing speed and surface roughness (Ra and RZ) of ten dressers are measured every 1, 2, 3, 5, 10, 15, 25 and 30 hours, and the results are also shown in Table 1.
  • a polishing cloth made of polyurethane foam is ground under the same conditions as those in the case of EXAMPLES 3 AND 4 by using the same diamond grit as that in the case of EXAMPLES 3 and 4.
  • the electron micrograph in Fig. 10 shows the arrangement of the grit on the dressing surface in the above-mentioned dresser for a polishing cloth. The results after grinding are shown in Table 1 together with the results of EXAMPLES 3 and 4.
  • Table 1 shows that, in the dresser for a polishing cloth in which the diamond grit is regularly arranged at equal intervals in the examples mentioned above, the surface roughness on the surface of the polishing cloth is more uniform than that on the surface of a conventional dresser on which grit is randomly arranged, and the polishing speed of the polishing cloth is very stable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Claims (9)

  1. Ebarbeur pour un tampon de polissage chimique et mécanique ayant une face d'ébarbage comprenant un produit fritté, dans lequel le produit fritté est fixé sur la surface d'un socle, caractérisé en ce que le produit fritté est obtenu en mélangeant un matériau liant comprenant du silicium et/ou un alliage de silicium à des particules abrasives de diamant et en façonnant et en frittant le mélange de manière à obtenir, sur la surface desdites particules abrasives de diamant, un film de carbure généré en frittant le silicium du matériau liant dans le diamant de sorte que les particules abrasives de diamant soient solidement liées au matériau liant, que le produit soit fini dans la taille spécifiée en planarisant et en ébarbant sa surface d'ébarbage et que les particules abrasives de diamant soient exposées.
  2. Ebarbeur pour un tampon de polissage chimique et mécanique ayant une face d'ébarbage comprenant un produit fritté, dans lequel le produit fritté est fixé sur la surface d'un socle, caractérisé en ce que le produit fritté est obtenu en mélangeant un matériau liant comprenant du silicium et/ou un alliage de silicium à des particules abrasives de diamant revêtues d'un film de carbure d'un métal choisi parmi les groupes IV, V ou VI du tableau périodique et en façonnant et en frittant le mélange de sorte que les particules abrasives de diamant soient solidement liées au matériau liant ayant ledit film de carbure, que le produit soit fini dans sa taille spécifiée en planarisant et en ébarbant sa surface d'ébarbage et que les particules abrasives de diamant soient exposées.
  3. Ebarbeur pour un tampon de polissage chimique et mécanique selon la revendication 1 ou 2, dans lequel le produit fritté est façonné en mélangeant le matériau liant aux particules abrasives de diamant, en moulant le mélange pour former un corps planaire et en frittant le mélange moulé.
  4. Ebarbeux pour un tampon de polissage chimique et mécanique selon la revendication 1 ou 2, dans lequel le produit fritté est façonné en aménageant chaque fragment de particules abrasives sur la surface du matériau liant avec une régularité bidimensionnelle, la distance entre les fragments adjacents de particules abrasives sur le plus petit réseau construit par l'aménagement se situe dans une plage de 10 µm à 3 000 µm et chaque fragment de particules abrasives est aménagé pour assurer une distribution sensiblement uniforme.
  5. Procédé de fabrication d'un ébarbeur pour un tampon de polissage chimique et mécanique, comprenant un produit fritté, dans lequel le produit fritté est fixé sur la surface d'un socle, caractérisé par le mélange d'un matériau liant comprenant du silicium et/ou un alliage de silicium à des particules abrasives de diamant et le frittage du mélange de sorte qu'un film de carbure sur la surface des particules abrasives de diamant soit généré en frittant le silicium dans le matériau liant, que le diamant soit solidement lié aux matériaux liants par le film de carbure, que le produit soit fini dans sa taille spécifiée en planarisant et en ébarbant sa surface d'ébarbage et que les particules abrasives de diamant soient exposées.
  6. Procédé de fabrication d'un ébarbeur pour un tampon de polissage chimique et mécanique selon la revendication 5, dans lequel l'étape de mélange comprend la fourniture de régions adhésives dont la taille est pratiquement la même que celle des particules abrasives sur une surface plane d'un élément façonné à partir du matériau liant de manière à permettre la fixation des particules abrasives en distribution uniforme avec une régularité bidimensionnelle, une particule abrasive est collée sur chaque région adhésive et les particules sont pressées dans le matériau liant.
  7. Procédé de fabrication d'un ébarbeur pour un tampon de polissage chimique et mécanique comprenant un produit fritté, dans lequel le produit fritté est fixé sur la surface d'un socle, dans lequel un matériau liant comprenant du silicium et/ou un alliage de silicium est mélangé à des particules abrasives de diamant revêtues d'un film de carbure d'un métal des groupes IV, V ou VI du tableau périodique et le mélange est fritté de sorte que les particules abrasives de diamant soient solidement liées au matériau liant par le film de carbure, que le produit soit fini dans sa taille spécifiée en planarisant et en ébarbant sa surface d'ébarbage et que les particules abrasives de diamant soient exposées.
  8. Procédé de fabrication d'un ébarbeur pour un tampon de polissage chimique et mécanique selon la revendication 7, dans lequel l'étape de mélange comprend la fourniture de régions adhésives dont la taille est pratiquement la même que celle des particules abrasives et qui sont fournies sur une surface plane d'un élément formé à partir du matériau liant de manière à permettre la fixation des particules abrasives en distribution uniforme avec une régularité bidimensionnelle, que les particules abrasives soient collées sur les régions adhésives et soient ensuite pressées dans l'élément de matériau liant.
  9. Procédé de fabrication d'un ébarbeur pour le tampon de polissage selon l'une ou l'autre revendication 6 ou 8, dans lequel les régions adhésives comprennent des parties non masquées d'une feuille adhésive masquée.
EP20010305243 2000-10-26 2001-06-15 Appareil ébarbeur pour tampon de polissage et son procédé de fabrication Expired - Lifetime EP1201367B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000327146A JP3759399B2 (ja) 2000-10-26 2000-10-26 研磨布用ドレッサーおよびその製造方法
JP2000327146 2000-10-26

Publications (2)

Publication Number Publication Date
EP1201367A1 EP1201367A1 (fr) 2002-05-02
EP1201367B1 true EP1201367B1 (fr) 2007-08-01

Family

ID=18804227

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20010305243 Expired - Lifetime EP1201367B1 (fr) 2000-10-26 2001-06-15 Appareil ébarbeur pour tampon de polissage et son procédé de fabrication

Country Status (3)

Country Link
EP (1) EP1201367B1 (fr)
JP (1) JP3759399B2 (fr)
DE (1) DE60129650T2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10156661A1 (de) * 2001-11-17 2003-06-05 Saint Gobain Winter Diamantwer Diamant-Formabrichtrolle und Verfahren zur Herstellung
JP4234991B2 (ja) * 2002-12-26 2009-03-04 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法及びその製造方法によって製造される情報記録媒体用ガラス基板
TWI286963B (en) * 2004-03-10 2007-09-21 Read Co Ltd Dresser for polishing cloth and method for manufacturing thereof
JP2005288685A (ja) * 2004-03-10 2005-10-20 Read Co Ltd 研磨布用ドレッサー及びその製造方法
US7258708B2 (en) * 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
KR102012786B1 (ko) * 2017-05-17 2019-08-21 모던세라믹스(주) 드레싱 블록의 교체가 가능한 포지셔너 및 그 제조방법
KR20210137580A (ko) * 2019-04-09 2021-11-17 엔테그리스, 아이엔씨. 디스크를 위한 세그먼트 설계

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2044146B (en) * 1978-05-30 1982-10-13 Henderson Diamond Tool Co Ltd Manufacture of diamond and like tools
AT386558B (de) * 1984-03-30 1988-09-12 De Beers Ind Diamond Verwendung eines schleifwerkzeuges
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
JP3368312B2 (ja) * 1996-06-26 2003-01-20 新日本製鐵株式会社 半導体基板用研磨布のドレッサーおよびその製造方法
EP1017540B1 (fr) * 1997-08-15 2002-06-12 Struers A/S Produit abrasif et procede de meulage
JP3057250U (ja) * 1998-09-03 1999-04-09 株式会社東京ダイヤモンド工具製作所 Ｃｍｐ用電着ドレッサ
JP2000141204A (ja) * 1998-09-08 2000-05-23 Sumitomo Metal Ind Ltd ドレッシング装置並びにこれを用いた研磨装置及びｃｍｐ装置

Also Published As

Publication number Publication date
JP2002127017A (ja) 2002-05-08
EP1201367A1 (fr) 2002-05-02
DE60129650T2 (de) 2008-05-21
JP3759399B2 (ja) 2006-03-22
DE60129650D1 (de) 2007-09-13

Similar Documents

Publication Publication Date Title
US6293854B1 (en) Dresser for polishing cloth and manufacturing method therefor
KR100686605B1 (ko) 연마포용 드레서 및 그 제조방법
CN101511542B (zh) 延长寿命的磨料制品及方法
JP4216025B2 (ja) 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法
US6540597B1 (en) Polishing pad conditioner
JP2003511255A (ja) 研磨パッド用コンディショナーおよびその製造方法
EP1927434A1 (fr) Conditionneur CMP
TWI380878B (zh) Combined Dressing Machine and Its Making Method
EP1201367B1 (fr) Appareil ébarbeur pour tampon de polissage et son procédé de fabrication
CN110914016A (zh) 包括可适形涂层的磨料制品和由其制成的抛光系统
JP5957317B2 (ja) 研磨布用ドレッサーおよびその製造方法
JP3456979B2 (ja) シリコンウエハ外周部加工用ベベリングホイール
JP2006218577A (ja) 研磨布用ドレッサー
JP3575540B2 (ja) 数値制御研磨加工方法
JP3434801B2 (ja) シリコンウエハ外周部加工用ベベリングホイールの製造方法
JP2007229865A (ja) 研磨パッド用ドレッサ
JPH03208560A (ja) 人工砥石
JP2005288685A (ja) 研磨布用ドレッサー及びその製造方法
JP3942394B2 (ja) シリコンウエハ外周部加工用ベベリングホイール
JP2001079768A (ja) メタルボンド薄刃ブレードの製造方法
JP2002283218A (ja) 研磨布用ドレッサ
CN113172553A (zh) 一种化学机械研磨抛光垫整修器及其制备方法
US20060046624A1 (en) Method for manufacturing grindstone corrector and grindstone, and grindstone corrector, and grindstone
JP2000117641A (ja) 研削砥石の製造方法および研削砥石
JPH04294978A (ja) 研削砥石

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

Kind code of ref document: A1

Designated state(s): DE FR GB NL

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20020809

AKX Designation fees paid

Free format text: DE FR GB NL

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB NL

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 60129650

Country of ref document: DE

Date of ref document: 20070913

Kind code of ref document: P

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20080506

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20080603

Year of fee payment: 8

Ref country code: DE

Payment date: 20080619

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20080617

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20080618

Year of fee payment: 8

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20090615

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 20100101

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20100226

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20090615

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100101