EP1188990A2 - Built-in cooking hob - Google Patents

Built-in cooking hob Download PDF

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Publication number
EP1188990A2
EP1188990A2 EP01116506A EP01116506A EP1188990A2 EP 1188990 A2 EP1188990 A2 EP 1188990A2 EP 01116506 A EP01116506 A EP 01116506A EP 01116506 A EP01116506 A EP 01116506A EP 1188990 A2 EP1188990 A2 EP 1188990A2
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EP
European Patent Office
Prior art keywords
hob
electronics
built
controls
glass ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01116506A
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German (de)
French (fr)
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EP1188990B1 (en
EP1188990A3 (en
Inventor
Kersten Kaiser
Thomas Weidner
Alwin Neukamm
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AEG Hausgeraete GmbH
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AEG Hausgeraete GmbH
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Publication of EP1188990A2 publication Critical patent/EP1188990A2/en
Publication of EP1188990A3 publication Critical patent/EP1188990A3/en
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Publication of EP1188990B1 publication Critical patent/EP1188990B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00Stoves or ranges heated by electric energy
    • F24C7/08Arrangement or mounting of control or safety devices
    • F24C7/082Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates

Definitions

  • the invention relates to a built-in hob, which is provided for installation in a kitchen base cabinet.
  • troughs consist of a trough pan, a glass ceramic plate or plate covering the trough pan made of a similar material, one or more heating elements for heating hotplates on the hob formed by the glass ceramic plate, and operating elements and electronics for controlling the hob.
  • the heating elements are also assigned means for temperature detection or the cooking zones are also assigned different sensors, for example for detecting the position of a saucepan standing on the cooking zone.
  • the electronics for controlling the troughs are accommodated within the trough pan.
  • the control panels with the controls are located in the hot area of the ceramic surface when cooking.
  • control elements especially when it comes to capacitive sensor fields formed on the surface, are often uncomfortably warm for the operator.
  • the proximity to the hot cooking zones also poses a problem for the control electronics in that particularly expensive components with a low temperature coefficient have to be used and / or special measures have to be taken to cool or insulate the components against the effects of heat.
  • the invention has for its object a built-in hob in such a way that on the one hand for the operator when operating the controls when operating the device the resulting heat is not perceived as unpleasant and that on the other hand no great effort to protect the Control electronics must be operated.
  • the inventive Arrangement have a simple structure.
  • the problem is solved by a built-in hob with the features of the main claim.
  • Advantageous refinements or developments of the built-in hob according to the invention are given by the subclaims.
  • the built-in hob according to the invention comprises, in a manner known per se, a hob, a glass ceramic plate which covers the hob and forms a hob with one or more hotplates, heating elements for heating the hob provided on the hob, and control elements and electronics for controlling the hob.
  • the operating elements and the electronics are arranged on at least one of the side edges of the hob outside the trough pan.
  • the heating elements of the hotplates as well as the means for temperature detection or sensors assigned to them, if necessary, are electrically conductively connected to the control elements and the electronics via conductor tracks of the hob or / and lines laid inside the trough pan.
  • the operating elements and the electronics form one or more modular units (electronics modules) which are coupled to the hob pan on one or more sides of the hob.
  • the coupling of these electronic modules to the trough trough can be detachable or non-detachable.
  • a detachable coupling of the modular units is particularly advantageous.
  • the electronic modules are accommodated in a housing which additionally has a heat-insulating effect. In this way, thermal decoupling is achieved in two ways.
  • a possible embodiment of the invention provides that the operating elements and the electronics of the built-in hob according to the invention are arranged above the side walls of a base cabinet provided for installing the hob. In order to avoid additional cutting out of the side walls of the base cabinet, the electronics are advantageously designed such that their overall height does not exceed the thickness of the thinnest worktops for kitchen furniture available on the market.
  • connection of the control elements and the electronics to the heating elements and, if appropriate, associated means for temperature detection or sensors is realized by conductor tracks which are applied on or below the glass ceramic plate forming the hob.
  • the electrically conductive connection is realized by conductor tracks which are applied on or below the glass ceramic plate forming the hob.
  • Another possibility is to integrate corresponding conductive connections into the volume of the glass ceramic plate.
  • the integration of the conductor tracks into the glass ceramic or ceramic plate can also be carried out using multi-layer technology.
  • a conventional wiring technology is also conceivable, in which the connecting lines are routed below the hob in the trough pan.
  • plug contacts are expediently provided on the lines laid in the trough pan, for their contacting with the electronics or the operating elements.
  • the required electrical connections can also be made by combining two or more of the connection variants mentioned above.
  • FIG. 1 shows the built-in hob according to the invention in the installed state with the kitchen base cabinet 10 receiving it and the worktop 12 associated with the base cabinet 10 in an axonometric view.
  • the representation of the glass ceramic plate 3 has been omitted in FIG. 1.
  • the trough pan 1 can be seen and the modular units (electronic modules) 8 arranged on three of its sides at the edge 7 each with parts of the control electronics 5 and operating elements 4.
  • the entire cooking hob like the electronic modules (8) coupled to it, is shown in FIG known manner fitted into the worktop 12 of the base cabinet 10. However, it is striking, and this can already be seen very clearly in the illustration in FIG.
  • FIG. 2 shows the hob 2, which is not shown in FIG. 1 and is designed as a glass ceramic plate 3.
  • FIG. 3 shows a section of the right side of the hob shown in FIG. 1.
  • the module-like structure of the units 8 accommodating the electronics 5 and the operating elements 4 can also be seen particularly well here.
  • the electronics modules 8 comprise, for example, a number of printed circuit boards (power boards) for the electronics 5 and 4 display and handling elements in the area of the control panel. The operation can, as is known for example from the prior art, take place via touch-sensitive control elements 4 (touch control).
  • An electronic module 8 with power boards and operating elements 4 is connected to the units at the hotplates 6 (heating elements, means for temperature detection, possibly further sensors) by conductor tracks of the glass ceramic plate 3 or via lines laid in the trough pan 1. In the example shown in FIG.
  • connection takes place in accordance with the last-mentioned variant, that is to say via lines in the trough trough 1, for the connection of which an opening 13 is provided in the side wall of the trough trough 1, through which the lines serving for the connection are guided and connected Plug contacts of the electronic module can be contacted.
  • the plug contacts of the module are arranged in a common contact strip 14.
  • FIG. 4 shows part of the detail according to FIG. 3 again laterally in a sectional view.
  • the separate design of the modules 8 accommodating the electronics 5 and the operating elements 4 becomes particularly clear.
  • the figure also shows that in the example explained here, the electronics 5 and the control elements 4, which are formed on the left and right of the hob 2, are arranged above the side wall 11 of the base cabinet 10 provided for installing the hob, and the hob at least in this respect is wider than the interior distance of the base cabinet.
  • the electronics 5 assigned to the operating elements 4 are designed such that their overall height does not exceed the thickness of the worktop 12 of the kitchen cabinet 10 which has to be cut out for installing the hob ,
  • the module 8 with the electronics 5 and the operating elements 4 is surrounded by a plastic housing 9. A certain thermal decoupling is already achieved by shifting the electronics 5 and operating elements 4 into the edge region 7 of the hob 2.

Abstract

A glass ceramic hob forms a cooking area and covers a cooking tray (1). Heating elements detect temperature and heat up one or more cooking points on the cooking area. Electronic components (5) and operating elements (4) fitted on side edge of the cooking tray (1) control it. Sensors can connect to the electronic components and operating elements via conductor strips in the cooking area and/or wires set inside the cooking tray.

Description

Beschreibungdescription

Die Erfindung betrifft eine Einbaukochmulde, welche für den Einbau in einem Küchenunterschrank vorgesehen ist. Derartige Mulden bestehen aus einer Muldenwanne, einer die Muldenwanne bedeckenden Glaskeramikplatte bzw. Platte aus einem ähnlichen Material, einem oder mehreren Heizelementen zur Erwärmung von Kochstellen auf dem durch die Glaskeramikplatte ausgebildeten Kochfeld sowie Bedienelementen und Elektronik zur Steuerung der Kochmulde. Je nach Ausführung sind den Heizelementen außerdem Mittel zu Temperaturerfassung oder den Kochstellen noch unterschiedliche Sensoren, beispielsweise zur Erfassung der Lage eines auf der Kochstelle stehenden Kochtopfs, zugeordnet.
Bei den heute bekannten Einbaukochmulden ist die Elektronik zur Steuerung der Mulden innerhalb der Muldenwanne untergebracht. Ebenso befinden sich die Bedienfelder mit den Bedienelementen in dem beim Kochen heißen Bereich der Ceranoberfläche. Dadurch ist der Nachteil gegeben, dass die Bedienelemente, insbesondere wenn es sich um auf der Oberfläche ausgebildete kapazitive Sensorfelder handelt, für den Bediener oftmals unangenehm warm sind. Auch für die Steuerelektronik stellt die Nähe zu den heißen Kochzonen insoweit ein Problem dar, dass besonders teure Bauelemente mit einem geringen Temperaturkoeffizienten eingesetzt und/oder besondere Maßnahmen zum Kühlen bzw. Isolieren der Bauteile gegen die Wärmeeinwirkung ergriffen werden müssen.
The invention relates to a built-in hob, which is provided for installation in a kitchen base cabinet. Such troughs consist of a trough pan, a glass ceramic plate or plate covering the trough pan made of a similar material, one or more heating elements for heating hotplates on the hob formed by the glass ceramic plate, and operating elements and electronics for controlling the hob. Depending on the version, the heating elements are also assigned means for temperature detection or the cooking zones are also assigned different sensors, for example for detecting the position of a saucepan standing on the cooking zone.
In the built-in cooking hobs known today, the electronics for controlling the troughs are accommodated within the trough pan. Likewise, the control panels with the controls are located in the hot area of the ceramic surface when cooking. This has the disadvantage that the control elements, especially when it comes to capacitive sensor fields formed on the surface, are often uncomfortably warm for the operator. The proximity to the hot cooking zones also poses a problem for the control electronics in that particularly expensive components with a low temperature coefficient have to be used and / or special measures have to be taken to cool or insulate the components against the effects of heat.

Der Erfindung liegt die Aufgabe zugrunde, eine Einbaukochmulde so auszubilden, dass einerseits für den Bediener beim Betätigen der Bedienelemente die beim Betrieb des Gerätes entstehende Wärme nicht als unangenehm empfunden wird und dass andererseits kein hoher Aufwand zum Schutz der Steuerelektronik betrieben werden muss. Dabei soll die erfindungsgemäße Anordnung einen einfachen Aufbau besitzen.The invention has for its object a built-in hob in such a way that on the one hand for the operator when operating the controls when operating the device the resulting heat is not perceived as unpleasant and that on the other hand no great effort to protect the Control electronics must be operated. The inventive Arrangement have a simple structure.

Die Aufgabe wird gelöst, durch eine Einbaukochmulde mit den Merkmalen des Hauptanspruchs. Vorteilhafte Ausgestaltungen bzw. Weiterbildungen der erfindungsgemäßen Einbaukochmulde sind durch die Unteransprüche gegeben.
Die erfindungsgemäße Einbaukochmulde umfasst in an sich bekannter Weise eine Muldenwanne, eine die Muldenwanne bedekkende und ein Kochfeld mit einer oder mehreren Kochstellen ausbildende Glaskeramikplatte, Heizelemente zur Erwärmung der auf dem Kochfeld vorgesehenen Kochstellen sowie Bedienelemente und eine Elektronik zur Steuerung der Kochmulde. In erfindungswesentlicher Weise sind die Bedienelemente und die Elektronik an zumindest einem der seitlichen Ränder des Kochfeldes außerhalb der Muldenwanne angeordnet. Dabei sind die Heizelemente der Kochstellen sowie die ihnen gegebenenfalls zugeordneten Mittel zur Temperaturerfassung oder Sensoren mit den Bedienelementen und der Elektronik über Leiterbahnen des Kochfeldes oder/und im Innern der Muldenwanne verlegte Leitungen elektrisch leitend verbunden. Zwar beziehen sich die vorstehenden Ausführungen ebenfalls wie der die Erfindung charakterisierende Hauptanspruch auf eine Kochmulde mit einer Glaskeramikplatte, jedoch liegt es für den Fachmann auf der Hand, dass die dargestellte Lösung in gleicher Weise für Kochmulden mit einem Kochfeld aus einem mit Glaskeramik vergleichbaren Material anwendbar ist.
The problem is solved by a built-in hob with the features of the main claim. Advantageous refinements or developments of the built-in hob according to the invention are given by the subclaims.
The built-in hob according to the invention comprises, in a manner known per se, a hob, a glass ceramic plate which covers the hob and forms a hob with one or more hotplates, heating elements for heating the hob provided on the hob, and control elements and electronics for controlling the hob. In a manner essential to the invention, the operating elements and the electronics are arranged on at least one of the side edges of the hob outside the trough pan. The heating elements of the hotplates as well as the means for temperature detection or sensors assigned to them, if necessary, are electrically conductively connected to the control elements and the electronics via conductor tracks of the hob or / and lines laid inside the trough pan. Although the above explanations also relate, like the main claim characterizing the invention, to a hob with a glass ceramic plate, but it is obvious to the person skilled in the art that the solution shown can be used in the same way for hob with a hob made of a material comparable to glass ceramic ,

Entsprechend einer besonders vorteilhaften Ausgestaltung der erfindungsgemäßen Einbaukochmulde bilden die Bedienelemente und die Elektronik eine oder mehrere modulare Einheiten (Elektronikmodule) aus, welche an einer oder mehreren Seiten des Kochfeldes an die Muldenwanne angekoppelt sind. Die Ankopplung dieser Elektronikmodule an die Muldenwanne kann dabei lösbar oder unlösbar erfolgen. Von besonderem Vorteil ist aber eine lösbare Ankopplung der modularen Einheiten. Die Elektronikmodule sind dabei gemäß einer zweckmäßigen Weiterbildung der Erfindung in einem Gehäuse untergebracht, welches zusätzlich wärmeisolierend wirkt. Auf diese Weise wird eine thermische Entkopplung auf zweifachem Wege erreicht. Wirkt bereits der Abstand von Elektronik und Bedienfeldern zu den Kochstellen thermisch entkoppelnd, so wird dies durch die Tatsache, dass die Module mit der Elektronik und den Bedienelementen separat außerhalb der Kochmulde angebracht sind, begünstigt und schließlich durch einen entsprechenden wärmeisolierenden Werkstoff für das Gehäuse der Elektronikmodule noch weiter verbessert. Als günstiger Werkstoff für das Gehäuse der Elektronikmodule haben sich temperaturbeständige Kunststoffe erwiesen.
Eine mögliche Ausgestaltung der Erfindung sieht vor, dass die Bedienelemente und die Elektronik der erfindungsgemäßen Einbaukochmulde oberhalb der Seitenwände eines zum Einbau der Mulde vorgesehenen Unterschrankes angeordnet sind. Um ein zusätzliches Ausschneiden der Seitenwände des Unterschranks zu vermeiden, ist dabei die Elektronik vorteilhafterweise so ausgestaltet, dass ihre Bauhöhe die Stärke der dünnsten im Handel erhältlichen Arbeitsplatten für Küchenmöbel nicht übersteigt. Hierdurch wird zusätzlicher Aufwand beim Einbau und der Installation der erfindungsgemäßen Einbaukochmulde vermieden.
Für die Verbindung der Bedienelemente und der Elektronik mit den Heizelementen und diesen gegebenenfalls zugeordneten Mitteln zur Temperaturerfassung oder Sensoren sind unterschiedliche Möglichkeiten denkbar. Eine Möglichkeit besteht darin, dass die elektrisch leitende Verbindung durch Leiterbahnen, welche auf oder unterhalb der das Kochfeld ausbildenden Glaskeramikplatte aufgebracht sind, realisiert wird. Eine andere Möglichkeit ist durch eine Integration entsprechender leitender Verbindungen in das Volumen der Glaskeramikplatte gegeben. Je nach dem erforderlichen Schaltungsaufwand kann im letztgenannten Fall die Integration der Leiterbahnen in die Glaskeramik- bzw. Ceranplatte auch unter Einsatz der Multi-Layer-Technik. Selbstverständlich ist aber auch eine konventionelle Verdrahtungstechnik denkbar, bei welcher die Verbindungsleitungen unterhalb des Kochfeldes in der Muldenwanne geführt sind. Bei dieser Ausgestaltungsvariante sind zweckmäßigerweise an den in der Muldenwanne verlegten Leitungen Steckkontakte, zu deren Kontaktierung mit der Elektronik bzw. den Bedienelementen vorgesehen. Schließlich kann auch die Herstellung der erforderlichen elektrischen Verbindungen durch Kombination zweier oder mehrerer der zuvor genannten Verbindungsvarianten erfolgen.
According to a particularly advantageous embodiment of the built-in hob according to the invention, the operating elements and the electronics form one or more modular units (electronics modules) which are coupled to the hob pan on one or more sides of the hob. The coupling of these electronic modules to the trough trough can be detachable or non-detachable. However, a detachable coupling of the modular units is particularly advantageous. According to an expedient development of the invention, the electronic modules are accommodated in a housing which additionally has a heat-insulating effect. In this way, thermal decoupling is achieved in two ways. If the distance between the electronics and control panels and the hotplates already has a thermal decoupling, this is favored by the fact that the modules with the electronics and the control elements are located separately outside the hob, and finally by a suitable heat-insulating material for the housing of the electronic modules improved even further. Temperature-resistant plastics have proven to be a cheap material for the housing of the electronic modules.
A possible embodiment of the invention provides that the operating elements and the electronics of the built-in hob according to the invention are arranged above the side walls of a base cabinet provided for installing the hob. In order to avoid additional cutting out of the side walls of the base cabinet, the electronics are advantageously designed such that their overall height does not exceed the thickness of the thinnest worktops for kitchen furniture available on the market. This avoids additional effort in the installation and installation of the built-in hob according to the invention.
Different possibilities are conceivable for the connection of the control elements and the electronics to the heating elements and, if appropriate, associated means for temperature detection or sensors. One possibility is that the electrically conductive connection is realized by conductor tracks which are applied on or below the glass ceramic plate forming the hob. Another possibility is to integrate corresponding conductive connections into the volume of the glass ceramic plate. Depending on the circuitry required, the integration of the conductor tracks into the glass ceramic or ceramic plate can also be carried out using multi-layer technology. Of course, a conventional wiring technology is also conceivable, in which the connecting lines are routed below the hob in the trough pan. In this embodiment variant, plug contacts are expediently provided on the lines laid in the trough pan, for their contacting with the electronics or the operating elements. Finally, the required electrical connections can also be made by combining two or more of the connection variants mentioned above.

Die Erfindung soll nachfolgend anhand eines Ausführungsbeispieles näher erläutert werden. In den zugehörigen Zeichnungen zeigen:

  • Fig. 1: Einen Küchenunterschrank mit eingebauter Einbaukochmulde,
  • Fig. 2: Eine Draufsicht auf das in der Fig. 1 nicht dargestellte Kochfeld der Kochmulde,
  • Fig. 3: Einen Ausschnitt der Anordnung gemäß Fig. 1,
  • Fig. 4: Eine Seitenansicht eines Teilbereichs des in Fig. 3 dargestellten Ausschnitts in geschnittener Darstellung.
  • The invention will be explained in more detail below using an exemplary embodiment. In the accompanying drawings:
  • Fig. 1: a kitchen base cabinet with built-in hob,
  • 2: a plan view of the hob of the hob, not shown in FIG. 1,
  • 3: a detail of the arrangement according to FIG. 1,
  • Fig. 4: A side view of a portion of the detail shown in Fig. 3 in a sectional view.
  • Die Fig. 1 zeigt die erfindungsgemäße Einbaukochmulde im eingebauten Zustand mit dem sie aufnehmenden Küchenunterschrank 10 und der zum Unterschrank 10 zugehörigen Arbeitsplatte 12 in einer axonometrischen Darstellung. Zur besseren Veranschaulichung der erfindungsgemäßen Lösung wurde in der Fig. 1 auf die Darstellung der Glaskeramikplatte 3 verzichtet. In der Figur ist die Muldenwanne 1 zu erkennen und die an drei ihrer Seiten am Rand 7 angeordneten modularen Einheiten (Elektronikmodule) 8 jeweils mit Teilen der Steuerelektronik 5 und Bedienelementen 4. Die gesamte Kochmulde ist ebenso wie die an sie angekoppelten Elektronikmodule (8) in bekannter Weise in die Arbeitsplatte 12 des Unterschranks 10 eingepasst. Auffällig ist jedoch, und dies ist bereits in der Darstellung der Fig. 1 sehr gut zu erkennen, dass die links und rechts vorgesehenen Elektronikmodule 8 oberhalb der Seitenwände 11, 11' des Unterschranks 10 angeordnet sind, mit diesen also in einer gemeinsamen vertikalen Ebene liegen.
    In der Fig. 2 ist das in der Fig. 1 nicht gezeigte als Glaskeramikplatte 3 ausgebildete Kochfeld 2 dargestellt. Beispielhaft ist dabei eine mögliche Anordnung mehrerer beheizbarer Kochstellen 6 gezeigt. Links und rechts an den Rändern 7 des Kochfeldes 2 befinden sich Bedienelemente 4 und diesen zugeordnete, im Sinne der Erfindung als Bestandteil der Bedienelemente 4 zu betrachtende optische Anzeigen.
    Dies wird nochmals durch die Fig. 3 verdeutlicht, welche einen Ausschnitt der rechten Seite der in der Fig. 1 dargestellten Kochmulde zeigt. Hier ist auch nochmals besonders gut der modulartige Aufbau der die Elektronik 5 und die Bedienelemente 4 aufnehmenden Einheiten 8 zu erkennen. Diese sind untergebracht in einem gesonderten Gehäuse 9, unmittelbar an die Muldenwanne 1 angekoppelt. Die Elektronikmodule 8 umfassen beispielsweise mehrere Leiterplatten (Leistungsplatinen) der Elektronik 5 und im Bereich des Bedienfeldes 4 Anzeige- und Handhabungselemente. Die Bedienung kann dabei, wie beispielsweise aus dem Stand der Technik bekannt, über berührungsempfindliche Bedienelemente 4 (touch-control) erfolgen. Ein Elektronikmodul 8 mit Leistungsplatinen und Bedienelementen 4 wird durch Leiterbahnen der Glaskeramikplatte 3 oder über in der Muldenwanne 1 verlegte Leitungen mit den Einheiten an den Kochstellen 6 (Heizelemente, Mittel zur Temperaturerfassung, gegebenenfalls weitere Sensoren) verbunden.
    Bei dem in der Fig. 3 dargestellten Beispiel erfolgt die Verbindung entsprechend der letztgenannten Variante, also über Leitungen in der Muldenwanne 1, für deren Anschluss in der Seitenwand der Muldenwanne 1 ein Durchbruch 13 vorgesehen ist, durch welchen die zur Verbindung dienenden Leitungen geführt und an Steckkontakten des Elektronikmoduls kontaktiert werden können. Die Steckkontakte des Moduls sind gemäß dem Beispiel in einer gemeinsamen Kontaktleiste 14 angeordnet.
    Die Fig. 4 stellt einen Teil des Ausschnitts nach der Fig. 3 nochmals seitlich in einer Schnittdarstellung dar. Hier wird nochmals besonders gut die separate Ausbildung der die Elektronik 5 und die Bedienelemente 4 aufnehmenden Module 8 deutlich.
    In der Figur ist außerdem erkennbar, dass in dem hier erläuterten Beispiel die Elektronik 5 und die Bedienelemente 4, welche links und rechts des Kochfeldes 2 ausgebildet sind, oberhalb der Seitenwand 11 des zum Einbau der Kochmulde vorgesehenen Unterschranks 10 angeordnet sind und die Kochmulde insoweit zumindest breiter als der Innenabstand des Unterschranks ist.. Um dabei zusätzliche Arbeiten beim Einpassen der erfindungsgemäßen Kochmulde zu vermeiden, ist die den Bedienelementen 4 zugeordnete Elektronik 5 so ausgebildet, dass ihre Bauhöhe die Stärke der zum Einbau der Kochmulde auszuschneidenden Arbeitsplatte 12 des Küchenschranks 10 nicht übersteigt. Vorliegend ist das Modul 8 mit der Elektronik 5 und den Bedienelementen 4 von einem Kunststoffgehäuse 9 umgeben. Bereits durch die Verlagerung von Elektronik 5 und Bedienelementen 4 in den Randbereich 7 des Kochfeldes 2 wird eine gewisse thermische Entkopplung erreicht. Diese wird aber durch die modulare Bauweise von Elektronik 5 und Bedienelementen 4 und die räumliche Trennung der Elektronikmodule 8 von der Kochmulde sowie deren Unterbringung in einem separaten Gehäuse 9 noch entscheidend verbessert.. Eine aufwendige Isolation der Elektronik 5, wie sie beim Stand der Technik unumgänglich ist, ist gemäß der Erfindung nicht erforderlich. Dennoch kann es vorteilhaft sein, wenn das Gehäuse 9 des Elektronikmoduls 8 zusätzliche thermisch isolierende Eigenschaften besitzt.
    1 shows the built-in hob according to the invention in the installed state with the kitchen base cabinet 10 receiving it and the worktop 12 associated with the base cabinet 10 in an axonometric view. For a better illustration of the solution according to the invention, the representation of the glass ceramic plate 3 has been omitted in FIG. 1. In the figure, the trough pan 1 can be seen and the modular units (electronic modules) 8 arranged on three of its sides at the edge 7 each with parts of the control electronics 5 and operating elements 4. The entire cooking hob, like the electronic modules (8) coupled to it, is shown in FIG known manner fitted into the worktop 12 of the base cabinet 10. However, it is striking, and this can already be seen very clearly in the illustration in FIG. 1, that the electronics modules 8 provided on the left and right are arranged above the side walls 11, 11 'of the base cabinet 10, that is to say they lie in a common vertical plane with them ,
    FIG. 2 shows the hob 2, which is not shown in FIG. 1 and is designed as a glass ceramic plate 3. A possible arrangement of several heatable hotplates 6 is shown as an example. On the left and right on the edges 7 of the cooktop 2 there are operating elements 4 and associated optical displays, which are to be regarded as part of the operating elements 4 in the sense of the invention.
    This is illustrated again by FIG. 3, which shows a section of the right side of the hob shown in FIG. 1. The module-like structure of the units 8 accommodating the electronics 5 and the operating elements 4 can also be seen particularly well here. These are housed in a separate housing 9, directly coupled to the trough 1. The electronics modules 8 comprise, for example, a number of printed circuit boards (power boards) for the electronics 5 and 4 display and handling elements in the area of the control panel. The operation can, as is known for example from the prior art, take place via touch-sensitive control elements 4 (touch control). An electronic module 8 with power boards and operating elements 4 is connected to the units at the hotplates 6 (heating elements, means for temperature detection, possibly further sensors) by conductor tracks of the glass ceramic plate 3 or via lines laid in the trough pan 1.
    In the example shown in FIG. 3, the connection takes place in accordance with the last-mentioned variant, that is to say via lines in the trough trough 1, for the connection of which an opening 13 is provided in the side wall of the trough trough 1, through which the lines serving for the connection are guided and connected Plug contacts of the electronic module can be contacted. According to the example, the plug contacts of the module are arranged in a common contact strip 14.
    FIG. 4 shows part of the detail according to FIG. 3 again laterally in a sectional view. Here again the separate design of the modules 8 accommodating the electronics 5 and the operating elements 4 becomes particularly clear.
    The figure also shows that in the example explained here, the electronics 5 and the control elements 4, which are formed on the left and right of the hob 2, are arranged above the side wall 11 of the base cabinet 10 provided for installing the hob, and the hob at least in this respect is wider than the interior distance of the base cabinet. In order to avoid additional work when fitting the hob according to the invention, the electronics 5 assigned to the operating elements 4 are designed such that their overall height does not exceed the thickness of the worktop 12 of the kitchen cabinet 10 which has to be cut out for installing the hob , In the present case, the module 8 with the electronics 5 and the operating elements 4 is surrounded by a plastic housing 9. A certain thermal decoupling is already achieved by shifting the electronics 5 and operating elements 4 into the edge region 7 of the hob 2. However, this is still significantly improved by the modular design of electronics 5 and operating elements 4 and the spatial separation of electronics modules 8 from the hob and their accommodation in a separate housing 9. A complex insulation of electronics 5, as is essential in the prior art is not required according to the invention. Nevertheless, it can be advantageous if the housing 9 of the electronic module 8 has additional thermally insulating properties.

    Liste der verwendeten BezugszeichenList of the reference symbols used

  • Muldenwannehob trough
  • Kochfeldhob
  • GlaskeramikplatteGlass ceramic plate
  • Bedienelemente (-einheit)Control elements (unit)
  • Elektronikelectronics
  • Kochstellecooking
  • Rand, RandbereichBorder, border area
  • modulare Einheit (Elektronikmodul)modular unit (electronic module)
  • Gehäusecasing
  • Unterschrankcabinet
  • 11, 11' Seitenwände11, 11 'side walls
  • Arbeitsplattecountertop
  • Durchbruchbreakthrough
  • Kontaktleistecontact strip
  • Claims (11)

    Einbaukochmulde mit einer Muldenwanne (1), einer die Muldenwanne (1) bedeckenden und ein Kochfeld (2) mit einer oder mehreren Kochstellen (6) ausbildenden Glaskeramikplatte (3), Heizelementen zur Erwärmung der Kochstellen (6) sowie Bedienelementen (4) und einer Elektronik (5) zur Steuerung der Kochmulde, wobei die Bedienelemente (4) und die Elektronik (5) an zumindest einem der seitlichen Ränder (7) des Kochfeldes (2) außerhalb der Muldenwanne (1) angeordnet und die Heizelemente der Kochstellen (6) sowie ihnen gegebenenfalls zugeordnete Mittel zur Temperaturerfassung oder Sensoren mit den Bedienelementen (4) und der Elektronik (5) über Leiterbahnen des Kochfeldes (2) oder/und im Innern der Muldenwanne (1) verlegte Leitungen elektrisch leitend verbunden sind.Built-in hob with a trough pan (1), one the trough pan (1) covering and a hob (2) with a or several cooking plates (6) forming glass ceramic plate (3), heating elements for heating the hotplates (6) and controls (4) and electronics (5) to control the hob, the controls (4) and the electronics (5) on at least one of the lateral edges (7) of the hob (2) outside the Trough tray (1) arranged and the heating elements of the hotplates (6) and any funds allocated to them for temperature detection or sensors with the controls (4) and the electronics (5) via conductor tracks of the Hob (2) and / or inside the trough pan (1) laid cables are electrically connected. Einbaukochmulde nach Anspruch 1, bei welcher die Bedienelemente (4) und die Elektronik (5) eine oder mehre modulare Einheiten (Elektronikmodule) (8) ausbilden, welche an einer oder mehreren Seiten (7) des Kochfeldes (2) an die Muldenwanne (1) angekoppelt sind.Built-in hob according to claim 1, wherein the controls (4) and the electronics (5) one or more form modular units (electronic modules) (8) which on one or more sides (7) of the hob (2) are coupled to the trough pan (1). Einbaukochmulde nach Anspruch 2, bei welcher die Elektronikmodule (8) mit den Bedienelementen (4) und der Elektronik (5) lösbar an die Muldenwanne (1) angekoppelt sind.Built-in hob according to Claim 2, in which the electronic modules (8) with the controls (4) and the electronics (5) detachably coupled to the trough pan (1) are. Einbaukochmulde nach Anspruch 2 oder 3, bei welcher die Elektronikmodule (8) zur Aufnahme der Bedienelemente (4) und der Elektronik (5) ein zusätzlich wärmeisolierend wirkendes Gehäuse (9) aufweisen. Built-in hob according to claim 2 or 3, wherein the Electronic modules (8) for receiving the controls (4) and the electronics (5) an additional heat insulating have acting housing (9). Einbaukochmulde nach einem der Ansprüche 1 bis 4, bei welcher die Bedienelemente (4) und die Elektronik (5) oberhalb der Seitenwände (11, 11') eines zum Einbau der Kochmulde vorgesehenen Unterschranks (10) angeordnet sind.Built-in hob according to one of claims 1 to 4, which controls (4) and electronics (5) Above the side walls (11, 11 ') one for installing the Cooking hob provided base cabinet (10) arranged are. Einbaukochmulde nach Anspruch 5, bei der die im-Randbereich (7) oberhalb der Seitenwände (11, 11') des Unterschranks (10) eingeordnete Elektronik (5) eine Bauhöhe aufweist, welche die Stärke einer Küchenarbeitsplatte nicht übersteigt.Built-in hob according to claim 5, wherein the in the edge area (7) above the side walls (11, 11 ') of the base cabinet (10) classified electronics (5) a height which has the strength of a kitchen worktop does not exceed. Einbaukochmulde nach Anspruch 5 oder 6, bei dem sich die Glaskeramikplatte (2) über die Elektronikmodule (8) mit den Bedienelementen (4) und der Elektronik. (5) hinweg mindestens zwischen den Außenflächen der Seitenwände (11, 11') des zum Einbau der Kochmulde vorgesehenen Unterschranks (10) erstreckt.Built-in hob according to claim 5 or 6, in which the Glass ceramic plate (2) with the electronic modules (8) the controls (4) and the electronics. (5) away at least between the outer surfaces of the side walls (11, 11 ') of the intended for installing the hob Base cabinets (10) extends. Einbaukochmulde nach einem der Ansprüche 1 bis 7, bei welcher zur elektrisch leitenden Verbindung der Heizelemente sowie der den Kochstellen (5) gegebenenfalls zugeordneten Mittel zur Temperaturerfassung oder Sensoren mit den Bedienelementen (4) und der Elektronik (5) Leiterbahnen auf oder unter der das Kochfeld (2) ausbildenden Glaskeramikplatte (3) aufgebracht sind.Built-in hob according to one of claims 1 to 7, which for the electrically conductive connection of the heating elements as well as any assigned to the hotplates (5) Means for temperature detection or sensors with the controls (4) and the electronics (5) conductor tracks on or under that of the hob (2) Glass ceramic plate (3) are applied. Einbaukochmulde nach einem der Ansprüche 1 bis 8, bei welcher zur elektrisch leitenden Verbindung der Heizelemente sowie der den Kochstellen (6) gegebenenfalls zugeordneten Mittel zur Temperaturerfassung oder Sensoren mit den Bedienelementen (4) und der Elektronik (5) in die Glaskeramikplatte (3) integrierte Leiterbahnen vorgesehen sind. Built-in hob according to one of claims 1 to 8, which for the electrically conductive connection of the heating elements as well as any assigned to the hotplates (6) Means for temperature detection or sensors with the controls (4) and electronics (5) in the Glass ceramic plate (3) integrated conductor tracks are provided are. Einbaukochmulde nach Anspruch 9, bei welcher die Glaskeramikplatte (3) mit den integrierten Leiterbahnen in Multi-Layer-Technik ausgebildet ist.Built-in hob according to claim 9, in which the glass ceramic plate (3) with the integrated conductor tracks in Multi-layer technology is formed. Einbaukochmulde nach einem der Ansprüche 1 bis 10, bei welcher zur elektrisch leitenden Verbindung der Heizelemente sowie der den Kochstellen (6) gegebenenfalls zugeordneten Mittel zur Temperaturerfassung oder Sensoren mit den Bedienelementen (4) und der Elektronik (5) im Innern der Muldenwanne (1) verlegte Leitungen vorgesehen und vermittels Steckkontakten an der Elektronik (5) und den Bedienelementen (4) kontaktiert sind.Built-in hob according to one of claims 1 to 10, which for the electrically conductive connection of the heating elements and the hotplates (6) if necessary assigned means for temperature detection or sensors with the controls (4) and the electronics (5) cables laid inside the trough pan (1) provided and by means of plug contacts on the Electronics (5) and the controls (4) contacted are.
    EP20010116506 2000-09-15 2001-07-07 Built-in cooking hob Expired - Lifetime EP1188990B1 (en)

    Applications Claiming Priority (2)

    Application Number Priority Date Filing Date Title
    DE2000145655 DE10045655A1 (en) 2000-09-15 2000-09-15 Fitted hob
    DE10045655 2000-09-15

    Publications (3)

    Publication Number Publication Date
    EP1188990A2 true EP1188990A2 (en) 2002-03-20
    EP1188990A3 EP1188990A3 (en) 2004-08-11
    EP1188990B1 EP1188990B1 (en) 2006-05-10

    Family

    ID=7656312

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP20010116506 Expired - Lifetime EP1188990B1 (en) 2000-09-15 2001-07-07 Built-in cooking hob

    Country Status (3)

    Country Link
    EP (1) EP1188990B1 (en)
    DE (2) DE10045655A1 (en)
    ES (1) ES2264954T3 (en)

    Cited By (7)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    WO2004042283A1 (en) * 2002-11-02 2004-05-21 BSH Bosch und Siemens Hausgeräte GmbH Method for operating a cooking hob, and cooking hob
    FR2921465A1 (en) * 2007-09-21 2009-03-27 Fagorbrandt Sas Soc Par Action COOKING APPARATUS, AND IN PARTICULAR COOKTOP
    CN103857963A (en) * 2011-11-09 2014-06-11 伊莱克斯家用产品股份有限公司 Cooking hob, household appliance and method of operating an cooking hob
    WO2015068093A1 (en) * 2013-11-06 2015-05-14 BSH Hausgeräte GmbH Hob device
    EP2905541A1 (en) * 2014-02-11 2015-08-12 Electrolux Appliances Aktiebolag Housing for a kitchen hob, flush-mounted kitchen hob, method for manufacturing a housing of a kitchen hob and method for flush-mounting a kitchen hob
    WO2016086963A1 (en) * 2014-12-02 2016-06-09 Arcelik Anonim Sirketi Auxiliary control plate for use with a cooking appliance
    EP1890084A3 (en) * 2006-08-17 2017-01-11 BSH Hausgeräte GmbH Hotplate

    Families Citing this family (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    DE102004033449A1 (en) * 2004-07-06 2006-01-26 E.G.O. Elektro-Gerätebau GmbH Hob with multiple heaters
    DE102005027192A1 (en) * 2005-06-06 2006-12-07 E.G.O. Elektro-Gerätebau GmbH Sensor device for operating device of stove top, has laminar flat material provided as carrier, and sensor units provided on rear side of carrier and including contacting for electrically contacting at operating device
    DE102005053928B4 (en) * 2005-11-11 2018-11-15 BSH Hausgeräte GmbH Operating element for household appliance

    Citations (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    EP0593891A1 (en) * 1992-10-20 1994-04-27 Schott Glaswerke Cooking plate
    DE19526093A1 (en) * 1995-07-18 1997-01-23 Kueppersbusch Electric cooker hob with control sensor
    DE19527824A1 (en) * 1995-07-29 1997-01-30 Ego Elektro Blanc & Fischer Electric cooker hob - has several cooking points contg. electrical heating elements in heating zone and thermal insulation

    Family Cites Families (1)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    GB9414640D0 (en) * 1994-07-20 1994-09-07 Bentley Cristopher M Indicators

    Patent Citations (3)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    EP0593891A1 (en) * 1992-10-20 1994-04-27 Schott Glaswerke Cooking plate
    DE19526093A1 (en) * 1995-07-18 1997-01-23 Kueppersbusch Electric cooker hob with control sensor
    DE19527824A1 (en) * 1995-07-29 1997-01-30 Ego Elektro Blanc & Fischer Electric cooker hob - has several cooking points contg. electrical heating elements in heating zone and thermal insulation

    Cited By (10)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    WO2004042283A1 (en) * 2002-11-02 2004-05-21 BSH Bosch und Siemens Hausgeräte GmbH Method for operating a cooking hob, and cooking hob
    US7150626B2 (en) 2002-11-02 2006-12-19 Bsh Bosch Und Siemens Hausgeraete Gmbh Method for operating a cooking hob, and cooking hob
    EP1890084A3 (en) * 2006-08-17 2017-01-11 BSH Hausgeräte GmbH Hotplate
    FR2921465A1 (en) * 2007-09-21 2009-03-27 Fagorbrandt Sas Soc Par Action COOKING APPARATUS, AND IN PARTICULAR COOKTOP
    EP2040004A3 (en) * 2007-09-21 2010-03-24 FagorBrandt SAS Cooking apparatus, in particular a cooktop
    CN103857963A (en) * 2011-11-09 2014-06-11 伊莱克斯家用产品股份有限公司 Cooking hob, household appliance and method of operating an cooking hob
    CN103857963B (en) * 2011-11-09 2016-08-17 伊莱克斯家用产品股份有限公司 Culinary art stone or metal plate for standing a stove on as a precaution against fire, home appliances and the method running culinary art stone or metal plate for standing a stove on as a precaution against fire
    WO2015068093A1 (en) * 2013-11-06 2015-05-14 BSH Hausgeräte GmbH Hob device
    EP2905541A1 (en) * 2014-02-11 2015-08-12 Electrolux Appliances Aktiebolag Housing for a kitchen hob, flush-mounted kitchen hob, method for manufacturing a housing of a kitchen hob and method for flush-mounting a kitchen hob
    WO2016086963A1 (en) * 2014-12-02 2016-06-09 Arcelik Anonim Sirketi Auxiliary control plate for use with a cooking appliance

    Also Published As

    Publication number Publication date
    DE10045655A1 (en) 2002-04-18
    EP1188990B1 (en) 2006-05-10
    DE50109740D1 (en) 2006-06-14
    EP1188990A3 (en) 2004-08-11
    ES2264954T3 (en) 2007-02-01

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