EP2659195B1 - Kitchen hob - Google Patents

Kitchen hob Download PDF

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Publication number
EP2659195B1
EP2659195B1 EP11802364.7A EP11802364A EP2659195B1 EP 2659195 B1 EP2659195 B1 EP 2659195B1 EP 11802364 A EP11802364 A EP 11802364A EP 2659195 B1 EP2659195 B1 EP 2659195B1
Authority
EP
European Patent Office
Prior art keywords
hob
circuit board
housing
board housing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP11802364.7A
Other languages
German (de)
French (fr)
Other versions
EP2659195A2 (en
Inventor
Johann Huber
Roman Schemmerer
Ernst Wurnitsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Publication of EP2659195A2 publication Critical patent/EP2659195A2/en
Application granted granted Critical
Publication of EP2659195B1 publication Critical patent/EP2659195B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00Stoves or ranges heated by electric energy
    • F24C7/08Arrangement or mounting of control or safety devices
    • F24C7/082Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/086Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination touch control
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/10Tops, e.g. hot plates; Rings
    • F24C15/102Tops, e.g. hot plates; Rings electrically heated

Definitions

  • the present invention relates to a hob according to the preamble of claim 1.
  • Domestic appliances such as a hob or oven, may have an operating status indicator and be operated by touch-sensitive touch panel elements.
  • an air gap may occur due to manufacturing tolerances between the glass ceramic and the display / touch panel electronics.
  • cooktop covers which have on the bottom of a profiled surface with knobs, this has the consequence that are illuminated by the dimpled profile of such a glass ceramic bottom LEDs of the power indicator not sharp and additionally IR sensors of touch panel elements only insufficiently.
  • a silicone layer is attached to the underside of the hob cover to press the display elements against this silicone layer and to avoid such blurry appearing display.
  • the sensor function of the touch panel elements is additionally hindered by such a silicone layer.
  • the EP 2024685 A1 discloses a household appliance, in particular a household oven having at least one control and / or display board, which is arranged in a receiving area provided for this purpose, wherein the control and / or display board in the assembled state another component, in particular a bottom of a glass ceramic hob or a Panel faces.
  • the control and / or display board is positioned in a receptacle arranged in the receptacle.
  • the receptacle has a certain number of spring elements which act on a rear side of the control and / or display board.
  • the FR 2 895 047 A1 shows a leaf spring in particular for an electric appliance of the type of hob.
  • the DE 91 12 371 U1 describes at touch switches of electrical appliances, an attachment of two boards together, with spaced from a base plate fixed in a holder having, for example, a relay, a sensor board is arranged, which is pressed by means of springs against the underside of a glass ceramic.
  • the DE 10 2008 043 457 A1 discloses a board carrier assembly for holding a printed circuit board with touch sensors.
  • the EP 0 687 131 A2 shows a control arrangement for an electric heater.
  • the DE 10 2007 055 310 A1 describes a hob with an arranged under the cooking surface electronic circuit board.
  • the present invention provides a cooktop with an electronic board having a display and / or operating element and is attached to at least one holding element in a circuit board housing. Furthermore, the holding element is approximately L-shaped and designed as a spring element, to press a surface of the display and / or control element to an inner surface of a cooktop cover.
  • the board housing and the at least one retaining element is formed as a one-piece component.
  • the present invention is based on the finding that it is possible by a newly developed holding element for an electronic board to secure the electronic board both against falling out of the board housing as well as display and / or operating elements of the electronic board to press directly to the inner surface of the hob cover ,
  • spring element and fixing element are realized in a combined holding element. In this way, a saving of to be manufactured elements of the board housing can be achieved, which can reduce the manufacturing cost of such a circuit board housing.
  • the electronic circuit board In the installed state in the hob, the electronic circuit board is pressed by the spring function of the holding elements so against the hob cover that a readability and / or operability of the display and / or operating element is secured to the electronic board.
  • the board housing and the at least one retaining element are further formed as a one-piece component.
  • the board housing and the at least one retaining element may consist of a same material and be manufactured in one operation. This offers the advantage that the manufacturing cost of the circuit board housing with the retaining element is also reduced due to the one-piece production.
  • the at least one holding element further comprises a fixing surface and a support surface, which are in particular facing each other and spaced from each other, and the electronic circuit board is mounted between the fixing surface and the support surface.
  • a fixing surface and a support surface which are in particular facing each other and spaced from each other, and the electronic circuit board is mounted between the fixing surface and the support surface.
  • the fixing surface and the bearing surface can at least relative to a support of the holding element be aligned partially inclined, in particular be aligned parallel to each other in relation to the carrier inclined aligned areas of the fixing surface and the support surface.
  • each of the fixing surface and the support surface may have a first portion inclined to a second portion.
  • the respective areas of the fixation surface and the support surface can be achieved for example by an angled design of the fixation surface and the support surface.
  • the at least one holding element may have a spring arm, on which the at least one holding element is connected to the sinker housing.
  • a spring arm on which the at least one holding element is connected to the sinker housing.
  • the circuit board housing may also have at least one stop element for limiting a movement possibility of the electronic circuit board.
  • the present invention offers the advantage that the stop element limits a direction of movement beyond a certain deflection of the holding element, so that a break of the holding elements can be avoided in case of accidental excessive pressure when placing the hob cover on the board housing.
  • the board housing may further comprise at least one resilient support member for the electronic board, which is designed to exert pressure on the electronic board and thereby to press the surface of the at least one display and / or operating element to the inner surface of the hob cover.
  • at least one resilient support member for the electronic board which is designed to exert pressure on the electronic board and thereby to press the surface of the at least one display and / or operating element to the inner surface of the hob cover.
  • the board housing may further comprise at least one centering projection for aligning the electronic board in the board housing.
  • the board housing may be cup-shaped, and projecting a housing edge of the cup-shaped board housing in the direction of the cooking field cover.
  • the shell shape of the board housing enables improved protection of the electronic board. Since the edge of the housing according to a particular embodiment of the invention rests on the hob cover or is pressed against this, the electronics board and / or the holding elements in case of accidental, too strong pressing the hob cover to the board housing can not be damaged, since the edge of the housing acts as a stop.
  • the housing edge may have a sealing element which is arranged between the edge of the housing and the hob cover.
  • the printed circuit board housing may also have a plurality of holding elements along a first side edge, and a plurality of holding elements along a second side edge opposite the first side edge.
  • Such an embodiment of the present invention offers the advantage that the electronic board can be kept particularly secure by two groups of holding elements, which are arranged along the two (long) side edges of the electronic board on the board housing.
  • a contact pressure on the electronic board can be distributed as evenly as possible over the electronics board by a uniform distribution holding elements.
  • the holding elements along the first side edge with respect to the number and the exact geometry of holding elements may differ, which are arranged along the second side edge.
  • Fig. 1A shows a perspective view of an exemplary household appliance 100.
  • the household appliance 100 has a hob 110 and an oven 120.
  • the hob 110 includes four cooking zones 115, of the four cooking zones for clarity only one is provided with a reference numeral.
  • the cooking zones are arranged on a hob cover 117 and controllable by means of controls described in more detail below, which are arranged in a hob control area 118 on or below the hob cover 117.
  • These controls are, for example, touch panel elements that include a sensor that registers a touch of the control element on the top of the cooktop cover 117 and generates a control signal for a heating element for one of the cooking zones 115.
  • the oven 120 has a oven door 125, a door handle or handle 130, a viewing window 135, a blow-out gap or ventilation gap 140 and a front panel 145.
  • the oven door 125 closes a cooking space inside the oven 120 and may be formed as a hinged door or a pull-out door.
  • the viewing window 135 forms part of the oven door 125 and may be composed of one or more panes of glass.
  • the handle 130 is disposed in an upper portion of the oven door 125 and extends parallel to an upper door panel.
  • the ventilation gap 140 is located between the upper door panel and the front panel 145.
  • the front panel 145 has an oven panel 150 that includes controls 155. The controls 155 are operable by a user of the home appliance to control functions of the oven 120.
  • FIG. 1B Under the in Fig. 1A shown operating area 118 of the hob cover 117 is shown in the schematic representation Fig. 1B arranged a board housing 200, in which an electronic circuit board described in more detail below with the display and / or controls is arranged.
  • FIG. 1B is a perspective view of a portion of the household appliance 100 with raised hob cover 117 and schematically illustrated board housing 200 can be seen.
  • the board housing 200 When placing the reasonably transparent cooktop cover 117 on the household appliance 100 thus the board housing 200 is pressed with an electronic board held therein to an inner surface 160 of the cooktop cover 117 and thereby a direct concern of a control and / or display element on the cooktop cover 117 better readability of the display elements and / or a better function of the controls ensured.
  • FIGS. 2A and 2 B 12 show perspective views of a board housing 200 for use in an embodiment of the present invention. Shown are the board housing 200 with a base plate 205, holding elements 210, stop elements 220, resilient support members 230, a housing edge 240, and a centering projection 250. Further, for ease of description, a Cartesian coordinate system having three axes x, y, and z in the lower left portion of FIG Fig. 2A or in the upper left area of Fig. 2B located.
  • the board housing 200 is shown as an elongated body, with a straight long side edge in the foreground. This long side edge runs along the y-axis of the coordinate system. An opposite long side edge is not continuous straight in the y direction, but has a bulge in the middle section of its course. Both narrow side edges run in a straight line in the x direction. These side edges (ie, the long side edges and the narrow side edges) define the course of the housing edge 240.
  • the housing edge 240 encloses an xy plane base plate 205 of the board housing 200 on which the elements 210, 220, 230, and 250 are disposed.
  • the board housing 200 has an overall height in the z-direction.
  • the housing edge 240 protrudes by an amount from the ground plane of the board housing 200 that is less than the overall height.
  • the space extending from the ground plane to the upper case edge 240 is provided for receiving an electronic board.
  • the board housing 200 is, for example, a shaped body, which is produced in one piece from a suitable material, for example from a plastic material, by a suitable method, for example by an injection molding method.
  • the holding elements 210 are arranged on the base plate 205 of the board housing 200 so that they are placed in the region of a peripheral edge of a male electronic board.
  • Fig. 2A is arranged along the rear long side edge 260 at a certain distance from the same and from each other a first group of four holding elements 210.
  • a second group of two retaining elements 210 is also arranged at a certain distance from the same and from each other.
  • Each retaining element 210 is approximately L-shaped. A longer portion of the holding members 210 extends as shown in FIG Fig. 2A in the y direction.
  • the longer section is a spring arm of the holding element 210 connected on one side to the base plate 205 of the board housing 200, which will be described in more detail below.
  • the spring arm runs in a corresponding cutout in the Base plate 205 of the board housing 200, so that a deflection of the spring arm is possible.
  • end of the spring arm is followed by a shorter portion of the holding member 210 at.
  • the shorter portion of the holding member 210 extends in the z-direction up to a certain height above the base plate 205.
  • the shorter portion of the spring arm can therefore also be referred to as a support for the support surface and the fixing surface.
  • the spring arms of the left two retaining elements 210 are connected at their right ends to the base plate 205.
  • the spring arms of the right two holding elements 210 in the region of the rear long side edge 260 and the spring arm of the right holding element 210 in the region of the front long side edge 270 are at their left Ends connected to the base plate 205.
  • the shape of the holding elements of the second group of holding elements 210 differs from the shape of the holding elements of the first group of holding elements 210.
  • the bearing surfaces in the x direction with respect to the bearing surfaces of the remaining four holding elements 210th increased. In practice, this does not necessarily apply and all holding elements can have the same shape. On the exact shape and design of the holding elements 210 is in the FIGS. 3A to 3E discussed in more detail.
  • the stop elements 220 are spatially assigned to the first group of the four holding elements 210 in the base plate 205 of the board housing 200.
  • Each of the stopper members 220 is disposed adjacent each one of the holding members 210, more specifically, adjacent to the z-direction extending portion thereof.
  • the stop elements 220 are formed as narrow, web-shaped projections which extend from the base plate 205 in the z-direction upwards.
  • a height of the stop elements 220 above the base plate 205 is less than the height of the holding elements 210 above the base plate 205, but is sized so that the stop members 220 serve as stops in the x direction for an attached to the support members 210 electronic board in the mounted state on the hob.
  • the resilient support elements 230 are arranged in the region of the front long side edge 270 of the board housing 200.
  • the two holding elements 210 of the second group of holding elements are placed between the resilient supporting elements 230.
  • the resilient support elements 230 are contact areas which are prestressed in the z direction and extend obliquely in the x direction, and are inclined upwards and are connected on one side to the base surface of the board housing 200 for an electronic circuit board.
  • the resilient support members 230 are provided in corresponding cutouts of the base of the circuit board housing 200, so that a resilient deflection is possible.
  • the upper casing edge 240 comes in the installed state of the board housing 200 in a household appliance in contact with the inner surface 160 of the hob cover 117.
  • the housing edge 240 is provided with a sealing member 280 which, after the installation between the inner surface 160 of the hob cover 117 and the housing edge 240 arranged is.
  • the sealing element 280 may be, for example, a sealing lip made of silicone, rubber or the like.
  • the centering projection 250 is arranged in the area of the front long side edge at the base or ground plane of the board housing 200.
  • the centering projection 250 extends in a web shape in the z and x directions and is dimensioned and arranged to cooperate with a recess of the electronic board to achieve a centering or alignment of the electronic board in the board housing 200.
  • Fig. 2B shows the board housing 200 from Fig. 2A rotated by approximately 180 degrees about the z-axis.
  • the formerly long front side edge 270 is off Fig. 2A now the rear long side edge 260 in Fig. 2B
  • At the base of the circuit board housing 200 are in Fig. 2B in the region of the rear long side edge 260 of the centering projection 250, the resilient support members 230 and the two holding elements 210 arranged.
  • FIGS. 3A to 3E show schematic representations of a holding element 210 from the FIGS. 2A and 2 B , Shown are of the holding member 210 in the FIGS. 3A to 3D in each case a spring arm 312 and a carrier 313 on which a fixing surface 314 and a bearing surface 316 are formed. In Fig. 3E only the carrier 313 with the fixing surface 314 and the bearing surface 316 are shown by the holding element 210.
  • FIG. 12 shows the retaining element 210 obliquely from the front approximately in alignment, as one of the four rear retaining elements 210 in FIG Fig. 2A is oriented.
  • Fig. 3A On the top right is a Cartesian coordinate system with three axes x, y and z.
  • Bottom right in the illustration of Fig. 3A represents a black filled area a junction of the spring arm 312 of the holding member 210 on a board housing. From this junction of the spring arm 312 extends in Fig. 3A in the y direction diagonally to the top left.
  • the spring arm 312 has a rectangular profile in cross-section.
  • the holding member 210 has a in the z-direction upwardly extending portion, the carrier 313 on.
  • the fixing surface 314 and the support surface 316 are arranged.
  • the fixing surface 314 is closer to the upper end of the holding member 210 than the support surface 316.
  • the fixing surface 314 and the support surface 316 are facing each other or aligned at least parallel or anti-parallel.
  • the fixing surface 314 and the bearing surface 316 are at least partially aligned relative to the carrier 313.
  • the surfaces 314 and 316 each have a smaller first area which extends parallel to the xy plane.
  • the surfaces 314 and 316 each have a larger second area which is inclined downwardly toward the spring arm 312 in the y-direction.
  • the surfaces 314 and 316 extend in a profile in the y-direction parallel to each other. The function of the partially tapered surfaces 314 and 316 will be described in more detail below Fig. 4 seen.
  • FIG. 12 shows the retaining element 210 obliquely from the front approximately in alignment, as one of the two rear retaining elements 210 in FIG Fig. 2B is oriented.
  • Fig. 3C shows the holding element 210 frontally from the front in the x direction.
  • Fig. 3D shows the holding element 210 from below in the z-direction.
  • Fig. 3E shows the holding member 210 from the spring arm 312 opposite side in the y direction.
  • FIGS. 2A and 2 B a fixing process for mounting an electronic board in the board housing 200 from the FIGS. 2A and 2 B briefly outlined.
  • An electronic board is first placed on the resilient support members 230 and the two support members 210 between the resilient support members 230 during assembly, aligned with the centering projection 250, and then latched to the four support members 210 on the opposite side.
  • the holding elements 210 thereby form combined Rastund spring elements.
  • the two holding elements 210 between the resilient support elements 230 and the four holding elements 210 on the opposite side engage around the electronic circuit board to secure them in the z-direction.
  • the position in the x direction is defined by the stop elements 220.
  • each retaining element 210 in this case generates the desired spring force during a deflection in the z-direction. In this deflection, the entire holding member 210 moves in the z direction down. This has the advantage that an upper fixing surface 314 never protrudes beyond elements of the electronic board and thus large spring travel can be realized. During compression, the holding elements 210 rotate. For this reason, the holding elements 210 are provided in the region of the support surface 316 and the fixing surface 314 with bevels so as not to overload the electronic board by a pressure of edges of the holding element. Also, for example, in the housing, as it is designed, two different types of boards are installed.
  • a first of the types of boards may be elongate, which engages only on the two outer opposite holding elements.
  • a second of the types of boards can have a smaller board, which engages only on the two inner opposite holding elements. This is for example not on the support elements.
  • the front retaining elements are conveniently used always.
  • Fig. 4 shows schematic cross-sectional views of a first deflection state 400 of a holding member 210 of the FIGS. 2A to 3E before placing or pressing the hob cover 117 on the board housing with the holding element 210 (left illustration Fig. 4 ) and a second deflection state 410 after placing the hob cover 117 on the board housing (right illustration Fig. 4 ).
  • an electronic circuit board 420 is respectively mounted between the bearing surface 316 and the fixing surface 314 of the retaining element 210.
  • the electronics board 420 further comprises at least one display and / or operating element 425, which may be a display element, by means of which a status display, for example, about a current power supply to a heating element of a cooking zone or a temperature of a cooking zone is output, which then recognize a user through the transparent cooktop cover can.
  • the display and / or operating element 425 may comprise a sensor which is designed to detect a touch of a region of the cooktop cover by means of the sensor according to the touch panel touch detection and from this a control signal for the control of the power supply to a heating element for one of To generate cooking zones of the hob. Further, between dashed lines extending horizontally and in parallel across the left and the right half of FIG Fig.
  • a spring travel 430 indicated by an arrow around which the electronics board 420 together with the display and / or operating element 425 is pressed down when the inner surface 160 of the cooktop cover is brought from the left illustrated state when placing the cooktop cover in a rebounded position is the one in the right representation Fig. 4 is apparent.
  • the electronic board 420 is hooked to the support member 210 and the support member 210 is not deflected by a deflection of the spring arm.
  • the smaller, edge-like first regions 435 of the fixing surface 314 and the bearing surface 316 abut against opposite or opposite main surfaces of the electronic circuit board 420.
  • the holding element 210 with the electronics board 420 suspended therein is deflected counter to by the bending of the holding element 210 or the spring arm 312 of the holding element 210.
  • the larger, second portions 440 of the fixing surface 314 and the bearing surface 316 are in contact with the main surfaces of the electronic board 420 remote from each other.
  • the holding element 210 has been moved downwardly by the deflection about the spring travel 430 bending of the spring arm 312 results so that the second portions 440 of the surfaces 314 and 316 press against the electronics board 420.
  • the display and / or operating element 425 is always pressed against the inner surface 160 of the hob cover 117 when the hob cover is placed on the sinker housing and, furthermore, can be ensured by such an embodiment of the holding element 210 that the electronics board 420 is not damaged when placing the hob cover 117 by a high pressure of the edges 435 on the main surfaces of the electronic board 420.
  • a maximum length of the carrier 313 from the first region 435 of the fixing surface 314 to one end of the carrier 313 may be less than a height of the display and / or operating element 425. It can also be seen that the oblique second regions 440 the fixing surface 314 and the bearing surface 316, a horizontal orientation of the board 420 with respect to the inner surface 160 of the hob cover 117 can be kept constant regardless of the deflection state of the holding member 210.

Description

Die vorliegende Erfindung bezieht sich auf ein Kochfeld gemäß dem Oberbegriff des Anspruchs 1.The present invention relates to a hob according to the preamble of claim 1.

Haushaltsgeräte, wie zum Beispiel ein Kochfeld oder ein Backofen, können eine Betriebszustandsanzeige aufweisen und mittels berührungsempfindlicher Touchfeld-Elementen bedient werden. Bei Glaskeramikkochfeldern kann es beispielsweise aufgrund von Fertigungstoleranzen zwischen Glaskeramik und Anzeige-/Touchfeldelektronik zu einem Luftspalt kommen. Insbesondere bei Kochfeldabdeckungen, die auf der Unterseite eine mit Noppen profilierte Oberfläche haben, hat dies zur Folge, dass durch das Noppenprofil einer solchen Glaskeramikunterseite Leuchtanzeigen der Betriebsanzeige nicht mehr scharf zu sehen sind und zusätzlich IR-Sensoren von Touchfeldelementen nur ungenügend funktionieren. Oftmals wird in einem solchen Fall eine Silikonschicht an der Unterseite der Kochfeldabdeckung angebracht, um die Anzeigeelemente an diese Silikonschicht zu drücken und eine solche unscharf erscheinende Anzeige zu vermieden. Ein solcher Ansatz erfordert jedoch ein zusätzliches Element bei der Herstellung des Kochfeldes und ist somit kostenintensiv. Die Sensorfunktion der Touchfeldelemente wird durch eine solche Silikonschicht zusätzlich behindert.Domestic appliances, such as a hob or oven, may have an operating status indicator and be operated by touch-sensitive touch panel elements. In the case of glass-ceramic cooktops, for example, an air gap may occur due to manufacturing tolerances between the glass ceramic and the display / touch panel electronics. Especially with cooktop covers, which have on the bottom of a profiled surface with knobs, this has the consequence that are illuminated by the dimpled profile of such a glass ceramic bottom LEDs of the power indicator not sharp and additionally IR sensors of touch panel elements only insufficiently. Often, in such a case, a silicone layer is attached to the underside of the hob cover to press the display elements against this silicone layer and to avoid such blurry appearing display. However, such an approach requires an additional element in the production of the hob and is thus costly. The sensor function of the touch panel elements is additionally hindered by such a silicone layer.

Die EP 2024685 A1 offenbart ein Haushaltsgerät, insbesondere einen Haushaltsofen, das mindestens eine Bedien- und/oder Anzeigeplatine aufweist, die in einem hierfür vorgesehenen Aufnahmebereich angeordnet ist, wobei die Bedien- und/oder Anzeigeplatine im montierten Zustand einem weiteren Bauteil, insbesondere einer Unterseite eines Glaskeramikkochfeldes oder eines Bedienfeldes zugewandt ist. Dabei ist die Bedien- und/oder Anzeigeplatine in einer im Aufnahmebereich angeordneten Aufnahme positioniert. Die Aufnahme weist eine bestimmte Anzahl von Federelementen auf, die auf einer Rückseite der Bedien- und/oder Anzeigeplatine einwirken.The EP 2024685 A1 discloses a household appliance, in particular a household oven having at least one control and / or display board, which is arranged in a receiving area provided for this purpose, wherein the control and / or display board in the assembled state another component, in particular a bottom of a glass ceramic hob or a Panel faces. In this case, the control and / or display board is positioned in a receptacle arranged in the receptacle. The receptacle has a certain number of spring elements which act on a rear side of the control and / or display board.

Die FR 2 895 047 A1 zeigt eine Blattfeder insbesondere für ein Elektrogerät vom Typ eines Kochfeldes.The FR 2 895 047 A1 shows a leaf spring in particular for an electric appliance of the type of hob.

Die DE 91 12 371 U1 beschreibt bei Berührungsschaltern von Elektrogeräten eine Befestigung zweier Platinen aneinander, wobei mit Abstand von einer in einer Halterung festgelegten Grundplatine, die beispielsweise ein Relais aufweist, eine Sensorplatine angeordnet ist, die mit Hilfe von Federn gegen die Unterseite einer Glaskeramik angedrückt wird.The DE 91 12 371 U1 describes at touch switches of electrical appliances, an attachment of two boards together, with spaced from a base plate fixed in a holder having, for example, a relay, a sensor board is arranged, which is pressed by means of springs against the underside of a glass ceramic.

Die DE 10 2008 043 457 A1 offenbart eine Platinenträgeranordnung zum Halten einer Schaltplatine mit Berührungssensoren.The DE 10 2008 043 457 A1 discloses a board carrier assembly for holding a printed circuit board with touch sensors.

Die EP 0 687 131 A2 zeigt eine Steuerungsanordnung für ein Elektrowärmegerät.The EP 0 687 131 A2 shows a control arrangement for an electric heater.

Die DE 10 2007 055 310 A1 beschreibt ein Kochfeld mit einem unter der Kochfläche angeordneten elektronischen Schaltungsträger.The DE 10 2007 055 310 A1 describes a hob with an arranged under the cooking surface electronic circuit board.

Es ist die Aufgabe der vorliegenden Erfindung, ein verbessertes Kochfeld zu schaffen.It is the object of the present invention to provide an improved cooktop.

Diese Aufgabe wird durch ein Kochfeld gemäß Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen ergeben sich aus den jeweiligen Unteransprüchen und der nachfolgenden Beschreibung.This object is achieved by a hob according to claim 1. Advantageous embodiments emerge from the respective subclaims and the following description.

Die vorliegende Erfindung schafft ein Kochfeld mit einer Elektronikplatine, die ein Anzeige- und/oder Bedienelements aufweist und an zumindest einem Halteelement in einem Platinengehäuse befestigt ist. Ferner ist das Halteelement näherungsweise L-förmig und als Federelement ausgebildet,
um eine Oberfläche des Anzeige- und/oder Bedienelements an eine Innenoberfläche einer Kochfeldabdeckung zu drücken.
The present invention provides a cooktop with an electronic board having a display and / or operating element and is attached to at least one holding element in a circuit board housing. Furthermore, the holding element is approximately L-shaped and designed as a spring element,
to press a surface of the display and / or control element to an inner surface of a cooktop cover.

Ferner ist das Platinengehäuse und das zumindest eine Halteelement als ein einstückiges Bauteil ausgebildet.Furthermore, the board housing and the at least one retaining element is formed as a one-piece component.

Der vorliegenden Erfindung liegt die Erkenntnis zugrunde, dass es durch ein neu entwickeltes Halteelement für eine Elektronikplatine möglich ist, die Elektronikplatine sowohl gegen ein Herausfallen aus dem Platinengehäuse zu sichern als auch Anzeige- und/oder Bedienelemente der Elektronikplatine direkt an die Innenoberfläche der Kochfeldabdeckung zu drücken. In dem Platinengehäuse sind hierzu Federelement und Fixierungselement in einem kombinierten Halteelement realisiert. Hierdurch kann eine Einsparung von zu fertigenden Elementen des Platinengehäuses erreicht werden, wodurch sich die Herstellungskosten für ein solches Platinengehäuse reduzieren lassen. Im verbauten Zustand in dem Kochfeld wird die Elektronikplatine durch die Federfunktion der Halteelemente so gegen die Kochfeldabdeckung gedrückt, dass eine Ablesbarkeit und/oder Bedienbarkeit des Anzeige- und/oder Bedienelements an der Elektronikplatine sichergestellt ist.The present invention is based on the finding that it is possible by a newly developed holding element for an electronic board to secure the electronic board both against falling out of the board housing as well as display and / or operating elements of the electronic board to press directly to the inner surface of the hob cover , In the circuit board housing spring element and fixing element are realized in a combined holding element. In this way, a saving of to be manufactured elements of the board housing can be achieved, which can reduce the manufacturing cost of such a circuit board housing. In the installed state in the hob, the electronic circuit board is pressed by the spring function of the holding elements so against the hob cover that a readability and / or operability of the display and / or operating element is secured to the electronic board.

Das Platinengehäuse und das zumindest eine Halteelement sind weiterhin als ein einstückiges Bauteil ausgebildet. Insbesondere können das Platinengehäuse und das zumindest eine Halteelement aus einem gleichen Material bestehen und in einem Arbeitsgang gefertigt werden. Dies bietet den Vorteil, dass der Herstellungsaufwand des Platinengehäuses mit dem Halteelement aufgrund der einstückigen Fertigung ebenfalls verringert wird.The board housing and the at least one retaining element are further formed as a one-piece component. In particular, the board housing and the at least one retaining element may consist of a same material and be manufactured in one operation. This offers the advantage that the manufacturing cost of the circuit board housing with the retaining element is also reduced due to the one-piece production.

Günstig ist es, wenn das zumindest eine Halteelement ferner eine Fixierungsfläche und eine Auflagefläche aufweist, die insbesondere einander zugewandt und voneinander beabstandet angeordnet sind, und die Elektronikplatine zwischen der Fixierungsfläche und der Auflagefläche gelagert ist. Eine derartige Ausführungsform der vorliegenden Erfindung bietet den Vorteil einer stabilen Halterung der Elektronikplatine, so dass beim Einbau der Elektronikplatine ein Herausfallen derselben vermieden werden kann.
Gemäß einer weiteren Ausführungsform der vorliegenden Erfindung können die Fixierungsfläche und die Auflagefläche gegenüber einem Träger des Halteelementes zumindest teilweise geneigt ausgerichtet sein, insbesondere die in Bezug zum Träger geneigt ausgerichteten Bereiche der Fixierungsfläche und der Auflagefläche zueinander parallel ausgerichtet sein. Eine derartige Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass bei einem Einspannen des Platinengehäuses oder des Halteelementes an die Innenoberfläche der Kochfeldabdeckung größere flächige Bereiche der Auflagefläche und der Fixierungsfläche auf die Elektronikplatine gepresst werden können und somit eine punktuelle Belastung der Elektronikplatine durch einen Druck einer oder mehrerer Kanten des Halteelementes auf die Oberflächen der Elektronikplatine vermieden werden kann. Ferner kann gemäß einer weiteren Ausführungsform der vorliegenden Erfindung jede der Fixierungsfläche und der Auflagefläche einen ersten Bereich aufweisen, der zu einem zweiten Bereich geneigt angeordnet ist. Die jeweiligen Bereiche der Fixierungsfläche sowie der Auflagefläche kann beispielsweise durch eine gewinkelte Ausführung der Fixierungsfläche und der Auflagefläche erreicht werden. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass die Elektronikplatine in einer Position vor dem Verbau in das Kochfeld sowie nach dem Verbau in das Kochfeld sicher und verspannungsfrei durch das Halteelement gehalten wird.
It is advantageous if the at least one holding element further comprises a fixing surface and a support surface, which are in particular facing each other and spaced from each other, and the electronic circuit board is mounted between the fixing surface and the support surface. Such an embodiment of the present invention offers the advantage of a stable mounting of the electronic board, so that when installing the electronic board falling out of the same can be avoided.
According to a further embodiment of the present invention, the fixing surface and the bearing surface can at least relative to a support of the holding element be aligned partially inclined, in particular be aligned parallel to each other in relation to the carrier inclined aligned areas of the fixing surface and the support surface. Such an embodiment of the present invention provides the Advantage that when clamping the circuit board housing or the holding element to the inner surface of the hob cover larger areas of the bearing surface and the fixing surface can be pressed onto the electronic board and thus a punctual loading of the electronic board by pressing one or more edges of the holding element on the surfaces of Electronics board can be avoided. Further, according to another embodiment of the present invention, each of the fixing surface and the support surface may have a first portion inclined to a second portion. The respective areas of the fixation surface and the support surface can be achieved for example by an angled design of the fixation surface and the support surface. Such an embodiment of the present invention has the advantage that the electronic circuit board is held in a safe and tension-free by the holding element in a position before installation in the hob and after installation in the hob.

Gemäß einer besonderen Ausführungsform kann das zumindest eine Halteelement einen Federarm aufweisen, an dem das zumindest eine Halteelement mit dem Platinengehäuse verbunden ist. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass die an dem Halteelement fixiert und federnd gelagerte Elektronikplatine mit einer durch die Ausgestaltung des Federarms vorbestimmten Kraft gegen die Kochfeldabdeckung gedrückt werden kann, dass einerseits die Bedienbarkeit und Ablesbarkeit des zumindest einen Anzeige- und/oder Bedienelement verbessert bzw. optimiert wird und andererseits keine Beschädigung des Halteelementes oder der Kochfeldabdeckung zu befürchten ist.
Auch kann das Platinengehäuse ferner zumindest ein Anschlagelement zur Begrenzung einer Bewegungsmöglilchkeit der Elektronikplatine aufweisen. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass das Anschlagelement eine Bewegungsrichtung ab einer bestimmten Auslenkung des Haltelementes begrenzt, so dass ein Abbrechen der Halteelemente bei einem versehentlich zu starken Druck beim Aufsetzen der Kochfeldabdeckung auf das Platinengehäuse vermieden werden kann.
According to a particular embodiment, the at least one holding element may have a spring arm, on which the at least one holding element is connected to the sinker housing. Such an embodiment of the present invention has the advantage that the fixed to the support member and resiliently mounted electronic board can be pressed with a predetermined by the design of the spring arm force against the cooktop cover, on the one hand the operability and readability of at least one display and / or Operating element is improved or optimized and on the other hand no damage to the holding element or the hob cover is to be feared.
The circuit board housing may also have at least one stop element for limiting a movement possibility of the electronic circuit board. Such an embodiment The present invention offers the advantage that the stop element limits a direction of movement beyond a certain deflection of the holding element, so that a break of the holding elements can be avoided in case of accidental excessive pressure when placing the hob cover on the board housing.

Zudem kann das Platinengehäuse ferner zumindest ein federndes Auflageelement für die Elektronikplatine aufweisen, das ausgebildet ist, um Druck auf die Elektronikplatine auszuüben und hierdurch die Oberfläche des zumindest einen Anzeige- und/oder Bedienelements an die Innenoberfläche der Kochfeldabdeckung zu drücken. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass auf einfache Weise eine erhöhte und/oder über eine größere Fläche gleichmäßigere Andrückkraft der Elektronikplatine gegen die Kochfeldabdeckung realisiert werden kann, falls die durch die Halteelemente auszuübende Andrückkraft nicht ausreichen sollte.In addition, the board housing may further comprise at least one resilient support member for the electronic board, which is designed to exert pressure on the electronic board and thereby to press the surface of the at least one display and / or operating element to the inner surface of the hob cover. Such an embodiment of the present invention has the advantage that in a simple manner an increased and / or over a larger area more uniform pressure force of the electronic board against the hob cover can be realized if the pressure exerted by the holding elements pressing force should not be sufficient.

Auch kann das Platinengehäuse ferner zumindest einen Zentriervorsprung zur Ausrichtung der Elektronikplatine in dem Platinengehäuse aufweisen. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass ein positionsgenaues Einsetzen der Elektronikplatine in das Platinengehäuse erleichtert wird.Also, the board housing may further comprise at least one centering projection for aligning the electronic board in the board housing. Such an embodiment of the present invention has the advantage that a positionally accurate insertion of the electronic board is facilitated in the board housing.

Gemäß einer besonderen Ausführungsform kann das Platinengehäuse schalenförmig ausgebildet sein, und ein Gehäuserand des schalenförmigen Platinengehäuses in Richtung der Kochnfeldabdeckung ragen. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass die Schalenform des Platinengehäuses einen verbesserten Schutz der Elektronikplatine ermöglicht. Da der Gehäuserand gemäß einer besonderen Ausführungsform der Erfindung an der Kochfeldabdeckung anliegt oder an diese angedrückt wird, können die Elektronikplatine und/oder die Halteelemente bei versehentlichem, zu festem Andrücken der Kochfeldabdeckung an das Platinengehäuse nicht beschädigt werden, da der Gehäuserand als Anschlag wirkt.According to a particular embodiment, the board housing may be cup-shaped, and projecting a housing edge of the cup-shaped board housing in the direction of the cooking field cover. Such an embodiment of the present invention offers the advantage that the shell shape of the board housing enables improved protection of the electronic board. Since the edge of the housing according to a particular embodiment of the invention rests on the hob cover or is pressed against this, the electronics board and / or the holding elements in case of accidental, too strong pressing the hob cover to the board housing can not be damaged, since the edge of the housing acts as a stop.

Hierbei kann der Gehäuserand ein Dichtelement aufweisen, das zwischen dem Gehäuserand und der Kochfeldabdeckung angeordnet ist. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass im verbauten Zustand in dem Kochfeld das Platinengehäuse mit der darin befindlichen Elektronikplatine vor dem Eindringen von Feuchtigkeit und sonstigen Dämpfen geschützt werden kann.In this case, the housing edge may have a sealing element which is arranged between the edge of the housing and the hob cover. Such an embodiment of the present invention has the advantage that in the installed state in the hob, the board housing with the electronic board therein can be protected from the ingress of moisture and other vapors.

Auch kann das Platinengehäuse entlang einer ersten Seitenkante mehrere Haltelemente aufweisen, und entlang einer der ersten Seitenkante gegenüberliegenden zweiten Seitenkante mehrere Haltelemente aufweisen. Eine solche Ausführungsform der vorliegenden Erfindung bietet den Vorteil, dass die Elektronikplatine durch zwei Gruppen von Halteelementen, die entlang der beiden (Lang-) Seitenkanten der Elektronikplatine an dem Platinengehäuse angeordnet sind, besonders sicher gehalten werden kann. Ein Anpressdruck auf die Elektronikplatine kann dabei durch eine gleichmäßige Verteilung Haltelemente möglichst gleichmäßig über die Elektronikplatine verteilt werden. Hierbei können sich die Halteelemente entlang der ersten Seitenkante hinsichtlich der Anzahl sowie der genauen Geometrie von Halteelementen unterscheiden, die entlang der zweiten Seitenkante angeordnet sind.The printed circuit board housing may also have a plurality of holding elements along a first side edge, and a plurality of holding elements along a second side edge opposite the first side edge. Such an embodiment of the present invention offers the advantage that the electronic board can be kept particularly secure by two groups of holding elements, which are arranged along the two (long) side edges of the electronic board on the board housing. A contact pressure on the electronic board can be distributed as evenly as possible over the electronics board by a uniform distribution holding elements. Here, the holding elements along the first side edge with respect to the number and the exact geometry of holding elements may differ, which are arranged along the second side edge.

Die Erfindung wird anhand der beigefügten Zeichnungen an einem Ausführungsbeispiel näher erläutert. Es zeigen:

Fig. 1A
eine perspektivische Darstellung eines Haushaltsgeräts, das ein Ausführungsbeispiel der vorliegenden Erfindung aufweist;
Fig. 1B
eine perspektivische Ansicht eines Teilbereiches eines Haushaltsgerätes, bei dem die Kochfeldabdeckung angehoben dargestellt ist;
Fig. 2A und 2B
perspektivische Darstellungen eines Platinengehäuses zur Verwendung in einem Ausführungsbeispiel der vorliegenden Erfindung;
Fig. 3A bis 3E
schematische Darstellungen des Halteelements aus Fig. 2A und 2B in unterschiedlichen Perspektiven; und
Fig. 4
eine schematische Darstellung eines Vergleiches von zwei Auslenkungszuständen des Halteelements aus Fig. 2A bis 3E.
The invention will be explained in more detail with reference to the accompanying drawings of an embodiment. Show it:
Fig. 1A
a perspective view of a household appliance, which has an embodiment of the present invention;
Fig. 1B
a perspective view of a portion of a household appliance, in which the hob cover is shown raised;
FIGS. 2A and 2B
perspective views of a board housing for use in an embodiment of the present invention;
FIGS. 3A to 3E
schematic representations of the retaining element Fig. 2A and 2 B in different perspectives; and
Fig. 4
a schematic representation of a comparison of two Auslenkungszuständen of the holding element Fig. 2A to 3E ,

Gleiche oder ähnliche Elemente können in den folgenden Figuren durch gleiche oder ähnliche Bezugszeichen versehen sein, wobei auf eine wiederholte Beschreibung dieser Elemente verzichtet wird.The same or similar elements may be given the same or similar reference numerals in the following figures, with a repeated description of these elements being omitted.

Fig. 1A zeigt eine perspektivische Darstellung eines beispielhaften Haushaltsgerätes 100. Das Haushaltsgerät 100 weist ein Kochfeld 110 und einen Backofen 120 auf. Das Kochfeld 110 umfasst vier Kochzonen 115, wobei von den vier Kochzonen der Übersichtlichkeit halber lediglich eine mit einem Bezugszeichen versehen ist. Die Kochzonen sind auf einer Kochfeldabdeckung 117 angeordnet und mittels nachfolgend noch näher beschriebenen Bedienelementen steuerbar, die in einem Kochfeldbedienbereich 118 auf oder unter der der Kochfeldabdeckung 117 angeordnet sind. Diese Bedienelemente sind beispielsweise Touchfeldelemente, die einen Sensor umfassen, der eine Berührung des Bedienelementes auf der Oberseite der Kochfeldabdeckung 117 registriert und hieraus ein Steuersignal für ein Heizelement für eines der Kochzonen 115 generiert. Der Backofen 120 weist eine Backofentür 125, einen Türgriff bzw. Griff 130, ein Sichtfenster 135, einen Ausblasspalt bzw. Lüftungsspalt 140 und eine Frontblende 145 auf. Die Backofentür 125 verschließt einen Garraum im Inneren des Backofens 120 und kann als eine Klapptür oder eine Ausziehtür ausgebildet sein. Das Sichtfenster 135 bildet einen Teil der Backofentür 125 und kann aus einer oder mehreren Glasscheiben zusammengesetzt sein. Der Griff 130 ist in einem oberen Bereich der Backofentür 125 angeordnet und erstreckt sich parallel zu einem oberen Türabschluss. Der Lüftungsspalt 140 befindet sich zwischen dem oberen Türabschluss und der Frontblende 145. Die Frontblende 145 weist ein Backofenbedienfeld 150 auf, das Bedienelemente 155 umfasst. Die Bedienelemente 155 sind durch einen Benutzer des Haushaltsgeräts bedienbar, um Funktionen des Backofens 120 zu steuern. Fig. 1A shows a perspective view of an exemplary household appliance 100. The household appliance 100 has a hob 110 and an oven 120. The hob 110 includes four cooking zones 115, of the four cooking zones for clarity only one is provided with a reference numeral. The cooking zones are arranged on a hob cover 117 and controllable by means of controls described in more detail below, which are arranged in a hob control area 118 on or below the hob cover 117. These controls are, for example, touch panel elements that include a sensor that registers a touch of the control element on the top of the cooktop cover 117 and generates a control signal for a heating element for one of the cooking zones 115. The oven 120 has a oven door 125, a door handle or handle 130, a viewing window 135, a blow-out gap or ventilation gap 140 and a front panel 145. The oven door 125 closes a cooking space inside the oven 120 and may be formed as a hinged door or a pull-out door. The viewing window 135 forms part of the oven door 125 and may be composed of one or more panes of glass. The handle 130 is disposed in an upper portion of the oven door 125 and extends parallel to an upper door panel. The ventilation gap 140 is located between the upper door panel and the front panel 145. The front panel 145 has an oven panel 150 that includes controls 155. The controls 155 are operable by a user of the home appliance to control functions of the oven 120.

Unter dem in Fig. 1A dargestellten Bedienbereich 118 der Kochfeldabdeckung 117 ist entsprechend der schematischen Darstellung aus Fig. 1B ein Platinengehäuse 200 angeordnet, in welchem eine nachfolgend noch näher beschriebene Elektronikplatine mit den Anzeige- und/oder Bedienelementen angeordnet ist. In der Fig. 1B ist eine perspektivische Ansicht eines Teilbereiches des Haushaltsgeräts 100 mit angehobener Kochfeldabdeckung 117 und schematisch dargestelltem Platinengehäuse 200 zu erkennen. Beim Aufsetzen der günstigerweise transparenten Kochfeldabdeckung 117 auf das Haushaltsgerät 100 wird somit das Platinengehäuse 200 mit einer darin gehaltenen Elektronikplatine an eine Innenoberfläche 160 der Kochfeldabdeckung 117 gedrückt und hierdurch ein direktes Anliegen eines Bedien- und/oder Anzeigeelementes an der Kochfeldabdeckung 117 eine bessere Lesbarkeit der Anzeigeelemente und/oder eine bessere Funktion der Bedienelemente sichergestellt.Under the in Fig. 1A shown operating area 118 of the hob cover 117 is shown in the schematic representation Fig. 1B arranged a board housing 200, in which an electronic circuit board described in more detail below with the display and / or controls is arranged. In the Fig. 1B is a perspective view of a portion of the household appliance 100 with raised hob cover 117 and schematically illustrated board housing 200 can be seen. When placing the reasonably transparent cooktop cover 117 on the household appliance 100 thus the board housing 200 is pressed with an electronic board held therein to an inner surface 160 of the cooktop cover 117 and thereby a direct concern of a control and / or display element on the cooktop cover 117 better readability of the display elements and / or a better function of the controls ensured.

Die Figuren 2A und 2B zeigen perspektivische Darstellungen eines Platinengehäuses 200 zur Verwendung in einem Ausführungsbeispiel der vorliegenden Erfindung. Gezeigt sind das Platinengehäuse 200 mit einer Grundplatte 205, Halteelemente 210, Anschlagelemente 220, federnde Auflageelemente 230, ein Gehäuserand 240 und ein Zentriervorsprung 250. Ferner ist der einfacheren Beschreibung halber ein kartesisches Koordinatensystem mit drei Achsen x, y und z im linken unteren Bereich von Fig. 2A bzw. im linken oberen Bereich von Fig. 2B eingezeichnet.The FIGS. 2A and 2 B 12 show perspective views of a board housing 200 for use in an embodiment of the present invention. Shown are the board housing 200 with a base plate 205, holding elements 210, stop elements 220, resilient support members 230, a housing edge 240, and a centering projection 250. Further, for ease of description, a Cartesian coordinate system having three axes x, y, and z in the lower left portion of FIG Fig. 2A or in the upper left area of Fig. 2B located.

In der perspektivischen Darstellung von Fig. 2A ist das Platinengehäuse 200 als ein länglicher Körper dargestellt, wobei sich eine gerade Langseitenkante im Vordergrund befindet. Diese Langseitenkante verläuft entlang der y-Achse des Koordinatensystems. Eine gegenüberliegende Langseitenkante verläuft nicht durchgehend geradlinig in y-Richtung, sondern weist eine Ausbuchtung im mittleren Abschnitt ihres Verlaufs auf. Beide Schmalseitenkanten verlaufen geradlinig in x-Richtung. Diese Seitenkanten (d.h. die Langseitenkanten und die Schmalseitenkanten) definieren den Verlauf des Gehäuserandes 240. Der Gehäuserand 240 umschließt eine in der x-y-Ebene liegende Grundplatte 205des Platinengehäuses 200, an der die Elemente 210, 220, 230 und 250 angeordnet sind. Das Platinengehäuse 200 weist eine Gesamthöhe in z-Richtung auf. Der Gehäuserand 240 steht um einen Betrag von der Grundebene des Platinengehäuses 200 vor, die geringer als die Gesamthöhe ist. Der Raum, der sich von der Grundebene bis zu dem oberen Gehäuserand 240 erstreckt, ist zur Aufnahme einer Elektronikplatine vorgesehen. Das Platinengehäuse 200 ist beispielsweise ein Formkörper, der durch ein geeignetes Verfahren, beispielsweise durch ein Spritzgussverfahren, einstückig aus einem geeigneten Material, beispielsweise aus einem Kunststoffmaterial, hergestellt ist.In the perspective view of Fig. 2A the board housing 200 is shown as an elongated body, with a straight long side edge in the foreground. This long side edge runs along the y-axis of the coordinate system. An opposite long side edge is not continuous straight in the y direction, but has a bulge in the middle section of its course. Both narrow side edges run in a straight line in the x direction. These side edges (ie, the long side edges and the narrow side edges) define the course of the housing edge 240. The housing edge 240 encloses an xy plane base plate 205 of the board housing 200 on which the elements 210, 220, 230, and 250 are disposed. The board housing 200 has an overall height in the z-direction. The housing edge 240 protrudes by an amount from the ground plane of the board housing 200 that is less than the overall height. The space extending from the ground plane to the upper case edge 240 is provided for receiving an electronic board. The board housing 200 is, for example, a shaped body, which is produced in one piece from a suitable material, for example from a plastic material, by a suitable method, for example by an injection molding method.

Die Halteelemente 210 sind an der Grundplatte 205 des Platinengehäuses 200 so angeordnet, dass sie im Bereich einer Umfangskante einer aufzunehmenden Elektronikplatine platziert sind. In Fig. 2A ist entlang der hinteren langen Seitenkante 260 in einem bestimmten Abstand von derselben und voneinander eine erste Gruppe von vier Halteelementen 210 angeordnet. Entlang der vorderen, geradlinig verlaufenden, langen Seitenkante 270 des Platinengehäuses 200 ist ebenfalls in einem bestimmten Abstand von derselben und voneinander eine zweite Gruppe von zwei Halteelementen 210 angeordnet. Jedes Halteelement 210 ist näherungsweise L-förmig ausgebildet. Ein längerer Abschnitt der Halteelemente 210 verläuft gemäß der Darstellung in Fig. 2A in y-Richtung. Bei dem längeren Abschnitt handelt es sich um einen einseitig mit der Grundplatte 205 des Platinengehäuses 200 verbundenen Federarm des Halteelements 210, der nachfolgend noch näher beschrieben wird. Der Federarm verläuft in einem entsprechenden Ausschnitt in der Grundplatte 205 des Platinengehäuses 200, so dass eine Auslenkung des Federarms möglich ist. An dem nicht mit der Grundplatte 205 des Platinengehäuses 200 verbundenen Ende des Federarms schließt sich ein kürzerer Abschnitt des Halteelements 210 an. Der kürzere Abschnitt des Halteelements 210 verläuft in z-Richtung nach oben bis zu einer bestimmten Höhe über der Grundplatte 205. Von dem in z-Richtung verlaufenden Abschnitt des Halteelements 210 erstrecken sich - von der Grundplatte 205 aus in dieser Reihenfolge - eine Auflagefläche und eine Fixierungsfläche, zwischen denen im am Kochfeld montierten Zustand des Platinengehäuses 200 eine Elektronikplatine angeordnet ist. Der kürzere Abschnitt des Federarmes kann daher auch als Träger für die Auflagefläche und die Fixierungsfläche bezeichnet werden.The holding elements 210 are arranged on the base plate 205 of the board housing 200 so that they are placed in the region of a peripheral edge of a male electronic board. In Fig. 2A is arranged along the rear long side edge 260 at a certain distance from the same and from each other a first group of four holding elements 210. Along the front, rectilinear, long side edge 270 of the board housing 200, a second group of two retaining elements 210 is also arranged at a certain distance from the same and from each other. Each retaining element 210 is approximately L-shaped. A longer portion of the holding members 210 extends as shown in FIG Fig. 2A in the y direction. The longer section is a spring arm of the holding element 210 connected on one side to the base plate 205 of the board housing 200, which will be described in more detail below. The spring arm runs in a corresponding cutout in the Base plate 205 of the board housing 200, so that a deflection of the spring arm is possible. At the not connected to the base plate 205 of the board housing 200 end of the spring arm is followed by a shorter portion of the holding member 210 at. The shorter portion of the holding member 210 extends in the z-direction up to a certain height above the base plate 205. From the extending in the z-direction portion of the holding member 210 extend - from the base plate 205 in this order - a support surface and a Fixing surface, between which mounted in the hob state of the circuit board housing 200, an electronic circuit board is arranged. The shorter portion of the spring arm can therefore also be referred to as a support for the support surface and the fixing surface.

Von den vier Halteelementen 210 im Bereich der hinteren langen Seitenkante 260 des Platinengehäuses 200 sind die Federarme der linken beiden Halteelemente 210 an ihren rechten Enden mit der Grundplatte 205 verbunden. Das gleiche gilt für das linke der zwei Halteelemente 210 im Bereich der vorderen langen Seitenkante 270. Die Federarme der rechten beiden Halteelemente 210 im Bereich der hinteren langen Seitenkante 260 und der Federarm des rechten Halteelements 210 im Bereich der vorderen langen Seitenkante 270 sind an ihren linken Enden mit der Grundplatte 205 verbunden. Die Form der Halteelemente aus der zweiten Gruppe von Halteelementen 210 unterscheidet sich von der Form der Halteelemente aus der ersten Gruppe von Halteelementen 210. So sind bei der zweiten Gruppe der zwei Halteelemente 210 die Auflageflächen in x-Richtung bezüglich der Auflageflächen der übrigen vier Halteelemente 210 vergrößert. In der Praxis muss dies nicht zwangsläufig gelten und alle Halteelemente können die gleiche Form aufweisen. Auf die genaue Form und Ausgestaltung der Halteelemente 210 wird in den Figuren 3A bis 3E noch detaillierter eingegangen.Of the four retaining elements 210 in the region of the rear long side edge 260 of the board housing 200, the spring arms of the left two retaining elements 210 are connected at their right ends to the base plate 205. The same applies to the left of the two holding elements 210 in the region of the front long side edge 270. The spring arms of the right two holding elements 210 in the region of the rear long side edge 260 and the spring arm of the right holding element 210 in the region of the front long side edge 270 are at their left Ends connected to the base plate 205. The shape of the holding elements of the second group of holding elements 210 differs from the shape of the holding elements of the first group of holding elements 210. Thus, in the second group of two holding elements 210, the bearing surfaces in the x direction with respect to the bearing surfaces of the remaining four holding elements 210th increased. In practice, this does not necessarily apply and all holding elements can have the same shape. On the exact shape and design of the holding elements 210 is in the FIGS. 3A to 3E discussed in more detail.

Es sind ferner vier Anschlagelemente 220 gezeigt. Die Anschlagelemente 220 sind der ersten Gruppe der vier Halteelemente 210 räumlich zugeordnet in der Grundplatte 205 des Platinengehäuses 200 platziert. Jedes der Anschlagelemente 220 ist benachbart zu jeweils einem der Halteelemente 210, genauer gesagt benachbart zu dem sich in z-Richtung erstreckenden Abschnitt desselben, angeordnet. Die Anschlagelemente 220 sind als schmale, stegförmige Vorsprünge ausgebildet, die sich von der Grundplatte 205 in z-Richtung nach oben erstrecken. Eine Höhe der Anschlagelemente 220 über der Grundplatte 205 ist geringer als die Höhe der Halteelemente 210 über der Grundplatte 205, aber ist so bemessen, dass die Anschlagelemente 220 als Anschläge in x-Richtung für eine an den Halteelemente 210 angebrachte Elektronikplatine im am Kochfeld befestigten Zustand dienen.There are also shown four stop elements 220. The stop elements 220 are spatially assigned to the first group of the four holding elements 210 in the base plate 205 of the board housing 200. Each of the stopper members 220 is disposed adjacent each one of the holding members 210, more specifically, adjacent to the z-direction extending portion thereof. The stop elements 220 are formed as narrow, web-shaped projections which extend from the base plate 205 in the z-direction upwards. A height of the stop elements 220 above the base plate 205 is less than the height of the holding elements 210 above the base plate 205, but is sized so that the stop members 220 serve as stops in the x direction for an attached to the support members 210 electronic board in the mounted state on the hob.

Die federnden Auflageelemente 230 sind im Bereich der vorderen langen Seitenkante 270 des Platinengehäuses 200 angeordnet. Die zwei Halteelemente 210 der zweiten Gruppe von Halteelementen sind zwischen den federnden Auflageelementen 230 platziert. Bei den federnden Auflageelementen 230 handelt es sich um in z-Richtung vorgespannte, sich länglich in x-Richtung erstreckende, nach oben geneigte, einseitig mit der Grundfläche des Platinengehäuses 200 verbundene Auflagebereiche für eine Elektronikplatine. Auch die federnden Auflageelemente 230 sind in entsprechenden Ausschnitten der Grundfläche des Platinengehäuses 200 vorgesehen, damit eine federnde Auslenkung möglich ist.The resilient support elements 230 are arranged in the region of the front long side edge 270 of the board housing 200. The two holding elements 210 of the second group of holding elements are placed between the resilient supporting elements 230. The resilient support elements 230 are contact areas which are prestressed in the z direction and extend obliquely in the x direction, and are inclined upwards and are connected on one side to the base surface of the board housing 200 for an electronic circuit board. Also, the resilient support members 230 are provided in corresponding cutouts of the base of the circuit board housing 200, so that a resilient deflection is possible.

Der obere Gehäuserand 240 kommt im eingebauten Zustand des Platinengehäuses 200 in ein Haushaltsgerät in Kontakt mit der Innenoberfläche 160 der Kochfeldabdeckung 117. Der Gehäuserand 240 ist mit einem Dichtelement 280 versehen, welches nach dem Verbau zwischen der Innenoberfläche 160 der Kochfeldabdeckung 117 und dem Gehäuserand 240 angeordnet ist. Bei dem Dichtelement 280 kann es sich beispielsweise um eine Dichtlippe aus Silikon, Gummi oder dergleichen handeln.The upper casing edge 240 comes in the installed state of the board housing 200 in a household appliance in contact with the inner surface 160 of the hob cover 117. The housing edge 240 is provided with a sealing member 280 which, after the installation between the inner surface 160 of the hob cover 117 and the housing edge 240 arranged is. The sealing element 280 may be, for example, a sealing lip made of silicone, rubber or the like.

Der Zentriervorsprung 250 ist im Bereich der vorderen Langseitenkante an der Grundfläche oder Grundebene des Platinengehäuses 200 angeordnet. Der Zentriervorsprung 250 erstreckt sich stegförmig in z- und x-Richtung und ist es so dimensioniert und angeordnet, dass er mit einer Ausnehmung der Elektronikplatine zusammenwirkt, um eine Zentrierung bzw. Ausrichtung der Elektronikplatine in dem Platinengehäuse 200 zu erreichen.The centering projection 250 is arranged in the area of the front long side edge at the base or ground plane of the board housing 200. The centering projection 250 extends in a web shape in the z and x directions and is dimensioned and arranged to cooperate with a recess of the electronic board to achieve a centering or alignment of the electronic board in the board housing 200.

Fig. 2B zeigt das Platinengehäuse 200 aus Fig. 2A um näherungsweise 180 Grad um die z-Achse gedreht. Somit ist die vormals vordere lange Seitenkante 270 aus Fig. 2A nun die hintere lange Seitenkante 260 in Fig. 2B. An der Grundfläche des Platinengehäuses 200 sind in Fig. 2B im Bereich der hinteren langen Seitenkante 260 der Zentriervorsprung 250, die federnden Auflageelemente 230 und die zwei Halteelemente 210 angeordnet. Fig. 2B shows the board housing 200 from Fig. 2A rotated by approximately 180 degrees about the z-axis. Thus, the formerly long front side edge 270 is off Fig. 2A now the rear long side edge 260 in Fig. 2B , At the base of the circuit board housing 200 are in Fig. 2B in the region of the rear long side edge 260 of the centering projection 250, the resilient support members 230 and the two holding elements 210 arranged.

Die Figuren 3A bis 3E zeigen schematische Darstellungen eines Halteelements 210 aus den Figuren 2A und 2B. Gezeigt sind von dem Halteelement 210 in den Figuren 3A bis 3D jeweils ein Federarm 312 und ein Träger 313, an dem eine Fixierungsfläche 314 und eine Auflagefläche 316 ausgebildet sind. In Fig. 3E sind von dem Halteelement 210 nur der Träger 313 mit der Fixierungsfläche 314 und der Auflagefläche 316 dargestellt.The FIGS. 3A to 3E show schematic representations of a holding element 210 from the FIGS. 2A and 2 B , Shown are of the holding member 210 in the FIGS. 3A to 3D in each case a spring arm 312 and a carrier 313 on which a fixing surface 314 and a bearing surface 316 are formed. In Fig. 3E only the carrier 313 with the fixing surface 314 and the bearing surface 316 are shown by the holding element 210.

Fig. 3A zeigt das Halteelement 210 schräg von vorne ungefähr in der Ausrichtung, wie eines der vier hinteren Halteelemente 210 in Fig. 2A orientiert ist. Zur besseren Veranschaulichung ist für Fig. 3A rechts oben ein kartesisches Koordinatensystem mit drei Achsen x, y und z eingezeichnet. Rechts unten in der Darstellung von Fig. 3A stellt eine schwarz ausgefüllte Fläche eine Verbindungsstelle des Federarms 312 des Halteelements 210 an einem Platinengehäuse dar. Von dieser Verbindungsstelle aus erstreckt sich der Federarm 312 in Fig. 3A in y-Richtung schräg nach links oben. Der Federarm 312 weist im Querschnitt ein rechteckiges Profil auf. An dem nicht mit einem Platinengehäuse verbundenen Ende des Federarms 312 weist das Halteelement 210 einen sich in z-Richtung nach oben erstreckenden Abschnitt, den Träger 313, auf. An jeweils einem Vorsprung dieses Trägers 313 sind die Fixierungsfläche 314 und die Auflagefläche 316 angeordnet. Dabei befindet sich die Fixierungsfläche 314 näher an dem oberen Ende des Halteelements 210 als die Auflagefläche 316. Die Fixierungsfläche 314 und die Auflagefläche 316 sind einander zugewandt oder zumindest parallel bzw. antiparallel ausgerichtet. Die Fixierungsfläche 314 sowie die Auflagefläche 316 sind zumindest teilweise gegenüber dem Träger 313 geneigt ausgerichtet. Die Flächen 314 und 316 weisen hierbei jeweils einen kleineren ersten Bereich auf, der parallel zu der x-y-Ebene erstreckt. Ferner weisen die Flächen 314 und 316 jeweils einen größeren zweiten Bereich auf, der zu dem Federarm 312 hin in y-Richtung nach unten geneigt ist. Dabei verlaufen die Flächen 314 und 316 in einem Profil in y-Richtung parallel zueinander. Die Funktion der teilweise angeschrägten Flächen 314 und 316 wird in nachfolgend noch näher beschriebenen Fig. 4 ersichtlich. Fig. 3A FIG. 12 shows the retaining element 210 obliquely from the front approximately in alignment, as one of the four rear retaining elements 210 in FIG Fig. 2A is oriented. For better illustration is for Fig. 3A On the top right is a Cartesian coordinate system with three axes x, y and z. Bottom right in the illustration of Fig. 3A represents a black filled area a junction of the spring arm 312 of the holding member 210 on a board housing. From this junction of the spring arm 312 extends in Fig. 3A in the y direction diagonally to the top left. The spring arm 312 has a rectangular profile in cross-section. At the not connected to a circuit board housing end of the spring arm 312, the holding member 210 has a in the z-direction upwardly extending portion, the carrier 313 on. At each one projection of this support 313, the fixing surface 314 and the support surface 316 are arranged. In this case, the fixing surface 314 is closer to the upper end of the holding member 210 than the support surface 316. The fixing surface 314 and the support surface 316 are facing each other or aligned at least parallel or anti-parallel. The fixing surface 314 and the bearing surface 316 are at least partially aligned relative to the carrier 313. The surfaces 314 and 316 each have a smaller first area which extends parallel to the xy plane. Further, the surfaces 314 and 316 each have a larger second area which is inclined downwardly toward the spring arm 312 in the y-direction. In this case, the surfaces 314 and 316 extend in a profile in the y-direction parallel to each other. The function of the partially tapered surfaces 314 and 316 will be described in more detail below Fig. 4 seen.

Fig. 3B zeigt das Halteelement 210 schräg von vorne ungefähr in der Ausrichtung, wie eines der zwei hinteren Halteelemente 210 in Fig. 2B orientiert ist. Fig. 3C zeigt das Halteelement 210 frontal von vorne in x-Richtung. Fig. 3D zeigt das Halteelement 210 von unten in z-Richtung. Fig. 3E zeigt das Halteelement 210 von der dem Federarm 312 abgewandten Seite in y-Richtung. Fig. 3B FIG. 12 shows the retaining element 210 obliquely from the front approximately in alignment, as one of the two rear retaining elements 210 in FIG Fig. 2B is oriented. Fig. 3C shows the holding element 210 frontally from the front in the x direction. Fig. 3D shows the holding element 210 from below in the z-direction. Fig. 3E shows the holding member 210 from the spring arm 312 opposite side in the y direction.

Im Folgenden wird ein Befestigungsvorgang zur Montage einer Elektronikplatine in dem Platinengehäuse 200 aus den Figuren 2A und 2B kurz umrissen. Eine Elektronikplatine wird bei der Montage zuerst auf die federnden Auflageelemente 230 sowie die zwei Halteelemente 210 zwischen den federnden Auflageelementen 230 gelegt, an dem Zentriervorsprung 250 ausgerichtet, und dann an den vier Halteelementen 210 auf der gegenüberliegenden Seite eingerastet. Die Halteelemente 210 bilden hierdurch kombinierte Rastund Federelemente. Die beiden Halteelemente 210 zwischen den federnden Auflageelementen 230 sowie die vier Halteelemente 210 auf der gegenüberliegenden Seite umgreifen die Elektronikplatine, um diese in z-Richtung zu sichern. Die Lage in x-Richtung wird durch die Anschlagelemente 220 definiert. Der Federarm 312 jedes Halteelements 210 erzeugt hierbei bei einer Auslenkung in z-Richtung die gewünschte Federkraft. Bei dieser Auslenkung bewegt sich das gesamte Halteelement 210 in z-Richtung nach unten. Dies hat den Vorteil, dass eine obere Fixierungsfläche 314 nie über Elemente der Elektronikplatine hinausragt und somit große Federwege realisiert werden können. Beim Einfedern verdrehen sich die Halteelemente 210. Aus diesem Grund sind die Haltelemente 210 im Bereich der Auflagefläche 316 und der Fixierungsfläche 314 mit Schrägen versehen, um die Elektronikplatine nicht zu stark durch einen Druck von Kanten des Halteelementes zu belasten. Auch können beispielsweise in das Gehäuse, so wie es gestaltet ist, zwei unterschiedliche Platinentypen eingebaut werden. Ein erster der Platinentypen kann länglich sein, wobei diese nur an den beiden äußeren gegenüberliegenden Halteelementen einrastet. Ein zweiter der Platinentypen kann eine kleinere Platine aufweisen, die nur an den beiden inneren gegenüberliegenden Halteelementen einrastet. Diese liegt beispielsweise auch nicht auf den Auflageelementen auf. Die vorderen Halteelemente werden günstigerweise immer eingesetzt.Hereinafter, a fixing process for mounting an electronic board in the board housing 200 from the FIGS. 2A and 2 B briefly outlined. An electronic board is first placed on the resilient support members 230 and the two support members 210 between the resilient support members 230 during assembly, aligned with the centering projection 250, and then latched to the four support members 210 on the opposite side. The holding elements 210 thereby form combined Rastund spring elements. The two holding elements 210 between the resilient support elements 230 and the four holding elements 210 on the opposite side engage around the electronic circuit board to secure them in the z-direction. The position in the x direction is defined by the stop elements 220. The spring arm 312 of each retaining element 210 in this case generates the desired spring force during a deflection in the z-direction. In this deflection, the entire holding member 210 moves in the z direction down. This has the advantage that an upper fixing surface 314 never protrudes beyond elements of the electronic board and thus large spring travel can be realized. During compression, the holding elements 210 rotate. For this reason, the holding elements 210 are provided in the region of the support surface 316 and the fixing surface 314 with bevels so as not to overload the electronic board by a pressure of edges of the holding element. Also, for example, in the housing, as it is designed, two different types of boards are installed. A first of the types of boards may be elongate, which engages only on the two outer opposite holding elements. A second of the types of boards can have a smaller board, which engages only on the two inner opposite holding elements. This is for example not on the support elements. The front retaining elements are conveniently used always.

Fig. 4 zeigt schematische Querschnittsdarstellungen von einem ersten Auslenkungszustand 400 eines Halteelements 210 aus den Figuren 2A bis 3E vor dem Aufsetzen bzw. Andrücken der Kochfeldabdeckung 117 auf das Platinengehäuse mit dem Halteelement 210 (linke Darstellung aus Fig. 4) und einem zweiten Auslenkungszustand 410 nach dem Aufsetzen der Kochfeldabdeckung 117 auf das Platinengehäuse (rechte Darstellung aus Fig. 4). Sowohl in dem ersten Auslenkungszustand 400 als auch dem zweiten Auslenkungszustand 410 ist jeweils eine Elektronikplatine 420 zwischen die Auflagefläche 316 und der Fixierungsfläche 314 des Halteelements 210 gelagert. Die Elektronikplatine 420 umfasst ferner zumindest ein Anzeige- und/oder Bedienelement 425, das ein Displayelement sein kann, mittels welchem eine Statusanzeige, beispielsweise über eine aktuelle Leistungszufuhr an ein Heizelement einer Kochzone oder eine Temperatur einer Kochzone ausgegeben wird, die ein Benutzer dann durch die transparente Kochfeldabdeckung erkennen kann. Auch kann das Anzeige- und/oder Bedienelement 425 einen Sensor umfassen, der ausgebildet ist, um entsprechend der Touchfeld-Berührungserkennung eine Berührung eines Bereiches der Kochfeldabdeckung mittels des Sensors zu erfassen und hieraus ein Steuersignal für die Ansteuerung der Leistungszufuhr an ein Heizelement für eine der Kochzonen des Kochfeldes zur generieren. Ferner ist zwischen gestrichelten Linien, die sich horizontal und parallel über die linke und die rechte Bildhälfte von Fig. 4 hinweg erstrecken, ein Federweg 430 durch einen Pfeil angedeutet, um den die Elektronikplatine 420 mitsamt dem Anzeige- und/oder Bedienelement 425 nach unten gedrückt wird, wenn die Innenoberfläche 160 der Kochfeldabdeckung von dem links darstellten Zustand beim Aufsetzen der Kochfeldabdeckung in eine eingefederte Position gebracht wird, die in der rechten Darstellung aus Fig. 4 ersichtlich ist. Fig. 4 shows schematic cross-sectional views of a first deflection state 400 of a holding member 210 of the FIGS. 2A to 3E before placing or pressing the hob cover 117 on the board housing with the holding element 210 (left illustration Fig. 4 ) and a second deflection state 410 after placing the hob cover 117 on the board housing (right illustration Fig. 4 ). In both the first deflection state 400 and the second deflection state 410, an electronic circuit board 420 is respectively mounted between the bearing surface 316 and the fixing surface 314 of the retaining element 210. The electronics board 420 further comprises at least one display and / or operating element 425, which may be a display element, by means of which a status display, for example, about a current power supply to a heating element of a cooking zone or a temperature of a cooking zone is output, which then recognize a user through the transparent cooktop cover can. Also, the display and / or operating element 425 may comprise a sensor which is designed to detect a touch of a region of the cooktop cover by means of the sensor according to the touch panel touch detection and from this a control signal for the control of the power supply to a heating element for one of To generate cooking zones of the hob. Further, between dashed lines extending horizontally and in parallel across the left and the right half of FIG Fig. 4 A spring travel 430 indicated by an arrow around which the electronics board 420 together with the display and / or operating element 425 is pressed down when the inner surface 160 of the cooktop cover is brought from the left illustrated state when placing the cooktop cover in a rebounded position is the one in the right representation Fig. 4 is apparent.

In dem ersten Auslenkungszustand 400, dem unverbauten Zustand oder der Montageposition, ist die Elektronikplatine 420 an dem Halteelement 210 eingehängt und das Halteelement 210 ist nicht durch eine Verbiegung des Federarmes ausgelenkt. Die kleineren, kantenartigen ersten Bereiche 435 der Fixierungsfläche 314 und der Auflagefläche 316 liegen an voneinander abgewandten oder gegenüberliegenden Hauptoberflächen der Elektronikplatine 420 an. Dabei ist noch ein gewisses Spiel zwischen einer durch diese ersten Bereiche 435 gebildeten Kanten und der Elektronikplatine 420 vorhanden, so dass die Elektronikplatine 420 an dem ersten Bereich 435 der Auflagefläche 316 direkt anliegt, aber ein kleiner Spalt zwischen dem ersten Bereich 435 der Fixierungsfläche 314 und der Elektronikplatine 420 vorliegt.In the first deflection state 400, the unassembled state or the mounting position, the electronic board 420 is hooked to the support member 210 and the support member 210 is not deflected by a deflection of the spring arm. The smaller, edge-like first regions 435 of the fixing surface 314 and the bearing surface 316 abut against opposite or opposite main surfaces of the electronic circuit board 420. In this case, there is still a certain clearance between an edge formed by these first regions 435 and the electronic circuit board 420, so that the electronic circuit board 420 directly adjoins the first region 435 of the support surface 316, but a small gap exists between the first region 435 of the fixing surface 314 and the electronic board 420 is present.

In dem zweiten Auslenkungszustand 410, dem eingefederten Zustand oder der Gebrauchsposition, ist das Halteelement 210 mit der darin eingehängten Elektronikplatine 420 entgegen durch die Verbiegung des Halteelements 210 bzw. des Federarmes 312 des Halteelementes 210 ausgelenkt. In diesem Zustand befinden sich die größeren, zweiten Bereiche 440 der Fixierungsfläche 314 und der Auflagefläche 316 in Kontakt mit den voneinander abgewandten Hauptoberflächen der Elektronikplatine 420. Das Halteelement 210 hat wurde durch die Auslenkung um den Federweg 430 nach unten bewegt, wodurch eine Verbiegung des Federarmes 312 resultiert, so dass die zweiten Bereiche 440 der Flächen 314 und 316 an die Elektronikplatine 420 drücken. Auf diese Weise kann einerseits sichergestellt werden, dass das Anzeige- und/oder Bedienelement 425 immer an die Innenoberfläche 160 der Kochfeldabdeckung 117 gedrückt wird, wenn die Kochfeldabdeckung auf das Platinengehäuse aufgesetzt ist und weiterhin kann durch eine solche Ausführung des Halteelementes 210 sichergestellt werden, dass die Elektronikplatine 420 nicht beim Aufsetzen der Kochfeldabdeckung 117 durch einen hohen Druck der Kanten 435 auf die Hauptoberflächen der Elektronikplatine 420 beschädigt wird. Zugleich kann durch eine vorbestimmte Abmessung der Länge des Federarmes 312 in Verbindung mit einer Verwendung eines bestimmten Materials für den Federarm 312 sichergestellt werden, dass das Anzeige- und/oder Bedienelement 425 mit einer vorbestimmten Kraft an die Innenoberfläche 160 der Kochfeldabdeckung 117 gedrückt wird, so dass sich ein Bruch der Kochfeldabdeckung 117 durch eine zu hohe Kraft, mit der das Anzeige-und/oder Bedienelement 425 an die Kochfeldabdeckung 117 anderenfalls gedrückt werden könnte, vermeiden lässt. Obwohl es in Fig. 4 lediglich schematisch angedeutet ist, ist zu erkennen, dass sich das obere Ende des Halteelements 210 nicht nach oben über das Anzeige- und/oder Bedienelement 425 an der Elektronikplatine 420 hinaus erstreckt. Hierzu kann eine maximale Länge des Trägers 313 von dem ersten Bereich 435 der Fixierungsfläche 314 bis zu einem Ende des Trägers 313 geringer sein, als eine Höhe des Anzeige- und/oder Bedienelementes 425. Ferner ist zu erkennen, dass durch die schrägen zweiten Bereiche 440 der Fixierungsfläche 314 und der Auflagefläche 316 eine horizontale Ausrichtung der Platine 420 in Bezug zur Innenoberfläche 160 der Kochfeldabdeckung 117 unabhängig von dem Auslenkungszustand des Halteelements 210 konstant gehalten werden kann.In the second deflection state 410, the compressed state or the use position, the holding element 210 with the electronics board 420 suspended therein is deflected counter to by the bending of the holding element 210 or the spring arm 312 of the holding element 210. In this state, the larger, second portions 440 of the fixing surface 314 and the bearing surface 316 are in contact with the main surfaces of the electronic board 420 remote from each other. The holding element 210 has been moved downwardly by the deflection about the spring travel 430 bending of the spring arm 312 results so that the second portions 440 of the surfaces 314 and 316 press against the electronics board 420. In this way, on the one hand, it can be ensured that the display and / or operating element 425 is always pressed against the inner surface 160 of the hob cover 117 when the hob cover is placed on the sinker housing and, furthermore, can be ensured by such an embodiment of the holding element 210 that the electronics board 420 is not damaged when placing the hob cover 117 by a high pressure of the edges 435 on the main surfaces of the electronic board 420. At the same time, by a predetermined dimension of the length of the spring arm 312 in conjunction with a use of a particular material for the spring arm 312, it can be ensured that the display and / or operating element 425 is pressed against the inner surface 160 of the cooktop cover 117 with a predetermined force that a break of the cooktop cover 117 by a too high force, with the display and / or operating element 425 could be pressed against the cooktop cover 117, otherwise avoided. Although it is in Fig. 4 is merely indicated schematically, it can be seen that the upper end of the holding member 210 does not extend upward beyond the display and / or control element 425 on the electronic circuit board 420 addition. For this purpose, a maximum length of the carrier 313 from the first region 435 of the fixing surface 314 to one end of the carrier 313 may be less than a height of the display and / or operating element 425. It can also be seen that the oblique second regions 440 the fixing surface 314 and the bearing surface 316, a horizontal orientation of the board 420 with respect to the inner surface 160 of the hob cover 117 can be kept constant regardless of the deflection state of the holding member 210.

Bezugszeichenreference numeral

100100
Haushaltsgeräthousehold appliance
110110
Kochfeldhob
115115
Kochzonecooking zone
117117
KochfeldabdeckungHob cover
118118
KochfeldbedienbereichHob operating area
120120
Backofenoven
125125
Backofentüroven door
130130
GriffHandle
135135
Sichtfensterwindow
140140
Lüftungsspaltventilation gap
145145
Frontblendefront panel
150150
Backofenbedienfeldoven control panel
155155
Bedienelementoperating element
160160
Innenoberfläche der KochfeldabdeckungInner surface of the hob cover
200200
Platinengehäuseplatinum case
205205
Grundplattebaseplate
210210
Halteelementretaining element
220220
Anschlagelementstop element
230230
federndes Auflageelementresilient support element
240240
Gehäuserandhousing edge
250250
Zentriervorsprungcentering
260260
erste Seitenkante des Platinengehäusesfirst side edge of the board housing
270270
zweite Seitenkante des Platinengehäusessecond side edge of the board housing
280280
Dichtelementsealing element
312312
Federarmspring arm
313313
Trägercarrier
314314
Fixierungsflächefixation surface
316316
Auflageflächebearing surface
400400
erster Auslenkungszustandfirst deflection state
410410
zweiter Auslenkungszustandsecond deflection state
420420
Elektronikplatineelectronic board
425425
Anzeige- und/oder BedienelementDisplay and / or operating element
430430
Federwegtravel
435435
erste Bereiche der Auflagefläche und der Fixierungsflächefirst areas of the support surface and the fixation surface
440440
zweite Bereiche der Auflagefläche und der Fixierungsflächesecond areas of the support surface and the fixation surface

Claims (10)

  1. Hob (110) with an electronic circuit board (420) which has a display and/or operating element (425) and is fastened to at least one retaining element (210) in a circuit board housing (200), wherein the retaining element (210) is embodied as a spring element for pressing a surface of the display and/or operating element (425) onto an inner surface (160) of a hob cover (117), characterised in that the retaining element (210) is embodied in an approximately L-shaped manner and the circuit board housing (200) and the at least one retaining element (210) are embodied as an integrated component.
  2. Hob (110) according to claim 1, characterised in that the at least one retaining element (210) additionally has a fixing surface (314) and a supporting surface (316), which are in particular arranged such that they are facing towards one another and are spaced at a distance from one another, and the electronic circuit board (420) is mounted between the fixing surface (314) and the supporting surface (316).
  3. Hob (110) according to claim 2, characterised in that the fixing surface (314) and the supporting surface (316) are aligned at least partially at an angle with respect to a mount (313) of the retaining element (210), in particular the regions (440) of the fixing surface (314) and supporting surface (316) aligned at an angle in relation to the mount (313) are aligned in parallel to one another.
  4. Hob (110) according to one of the preceding claims, characterised in that the at least one retaining element (210) has a spring arm (312), on which the at least one retaining element (210) is connected to the circuit board housing (200)
  5. Hob (110) according to one of the preceding claims, characterised in that the circuit board housing (200) also has at least one stop element (220) for delimiting a possibility for movement of the electronic circuit board (420).
  6. Hob (110) according to one of the preceding claims, characterised in that the circuit board housing (200) also has at least one sprung support element (230) for the electronic circuit board (420), which is embodied to exert pressure onto the electronic circuit board (420) and as a result to press the surface of the at least one display and/or operating element (425) onto the inner surface of the hob cover (117).
  7. Hob (110) according to one of the preceding claims, characterised in that the circuit board housing (200) also has at least one centring projection (250) for aligning the electronic circuit board (420) in the circuit board housing (200).
  8. Hob (110) according to one of the preceding claims, characterised in that the circuit board housing (200) is embodied in the shape of a shell, and a housing edge (240) of the shell-shaped circuit board housing (200) protrudes in the direction of the hob cover (117).
  9. Hob (110) according to claim 8, characterised in that the housing edge (240) has a sealing element (280) which is arranged at least partially between the housing edge (240) and the hob cover (117).
  10. Hob (110) according to one of the preceding claims, characterised in that the circuit board housing (200) has a plurality of retaining elements (210) along a first side edge (260), and a plurality of retaining elements (210) along a second side edge (270) opposing the first side edge.
EP11802364.7A 2010-12-28 2011-12-19 Kitchen hob Active EP2659195B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201010064236 DE102010064236A1 (en) 2010-12-28 2010-12-28 hob
PCT/EP2011/073182 WO2012089543A2 (en) 2010-12-28 2011-12-19 Hob

Publications (2)

Publication Number Publication Date
EP2659195A2 EP2659195A2 (en) 2013-11-06
EP2659195B1 true EP2659195B1 (en) 2016-10-05

Family

ID=45420625

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11802364.7A Active EP2659195B1 (en) 2010-12-28 2011-12-19 Kitchen hob

Country Status (5)

Country Link
EP (1) EP2659195B1 (en)
DE (1) DE102010064236A1 (en)
ES (1) ES2599651T3 (en)
PL (1) PL2659195T3 (en)
WO (1) WO2012089543A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2703724B1 (en) * 2012-09-03 2017-04-19 BSH Hausgeräte GmbH Device for a cooking hob and method for assembling a device for a cooking hob
FR2998041B1 (en) * 2012-11-09 2018-04-20 Groupe Brandt COOKTOP COMPRISING A CONTROL KEYBOARD
DE102013211299A1 (en) * 2013-06-17 2014-12-18 E.G.O. Elektro-Gerätebau GmbH Holding device for a controller and electrical appliance
DE102013211296A1 (en) * 2013-06-17 2014-12-18 E.G.O. Elektro-Gerätebau GmbH Holding device for an assembly and electrical appliance
ES2528061B1 (en) * 2013-07-31 2015-12-09 Bsh Electrodomésticos España, S.A. System for the composition of at least one household appliance device, and household appliance device
ES2537928B1 (en) * 2013-12-05 2016-04-20 Bsh Electrodomésticos España, S.A. Cooking Field Device
DE102015214882B4 (en) * 2015-08-04 2018-11-08 E.G.O. Elektro-Gerätebau GmbH Control unit and hob
DE102016213004A1 (en) 2016-07-15 2018-01-18 BSH Hausgeräte GmbH Operating module for a hob
DE102016212995A1 (en) 2016-07-15 2018-01-18 BSH Hausgeräte GmbH Operating module for a household appliance
FR3099548B1 (en) * 2019-07-31 2021-08-27 Groupe Brandt Support box intended to receive a user interface of a household appliance and household appliance
DE102020104843A1 (en) 2020-02-25 2021-08-26 Miele & Cie. Kg Glass ceramic device for a hob, hob with a glass ceramic device and method for producing a glass ceramic device
CN113986025A (en) * 2020-07-27 2022-01-28 博西华电器(江苏)有限公司 Household appliance and control panel assembly and touch module thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9112371U1 (en) * 1991-10-04 1993-02-11 E.G.O. Elektro-Geraete Blanc U. Fischer, 7519 Oberderdingen, De
DE4419866A1 (en) * 1994-06-07 1995-12-14 Ego Elektro Blanc & Fischer Control arrangement for an electric heating device
DE10348979B4 (en) * 2003-07-09 2007-11-22 Hirschmann Electronics Gmbh & Co. Kg Attaching a printed circuit board to a housing
FR2895047B1 (en) * 2005-12-19 2012-03-09 Brandt Ind SPRING BLADE IN PARTICULAR FOR HOUSEHOLD APPLIANCE OF THE COOKTOP TYPE
ES2389255T3 (en) * 2005-12-30 2012-10-24 Arçelik Anonim Sirketi Kitchen device
DE102006024739B4 (en) 2006-05-26 2012-04-12 Electrolux Home Products Corporation N.V. Household appliance, in particular household oven
DE102007055310A1 (en) * 2007-11-20 2009-05-28 BSH Bosch und Siemens Hausgeräte GmbH hob
ES2333634B1 (en) * 2007-11-28 2011-01-17 Bsh Electrodomesticos España, S.A. PLATINUM SUPPORT PROVISION FOR THE HOLDING OF A CONNECTION PLATE WITH CONTACT SENSORS.

Also Published As

Publication number Publication date
EP2659195A2 (en) 2013-11-06
WO2012089543A3 (en) 2012-08-23
WO2012089543A2 (en) 2012-07-05
ES2599651T3 (en) 2017-02-02
DE102010064236A1 (en) 2012-06-28
PL2659195T3 (en) 2017-03-31

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