EP2427032B1 - Hotplate device - Google Patents

Hotplate device Download PDF

Info

Publication number
EP2427032B1
EP2427032B1 EP11178379.1A EP11178379A EP2427032B1 EP 2427032 B1 EP2427032 B1 EP 2427032B1 EP 11178379 A EP11178379 A EP 11178379A EP 2427032 B1 EP2427032 B1 EP 2427032B1
Authority
EP
European Patent Office
Prior art keywords
unit
heating element
electronics
support unit
carrier unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP11178379.1A
Other languages
German (de)
French (fr)
Other versions
EP2427032A3 (en
EP2427032A2 (en
Inventor
Daniel Anton Falcon
Damaso Martin Gomez
David Ortiz Sainz
Carmelo Pina Gadea
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Publication of EP2427032A2 publication Critical patent/EP2427032A2/en
Publication of EP2427032A3 publication Critical patent/EP2427032A3/en
Application granted granted Critical
Publication of EP2427032B1 publication Critical patent/EP2427032B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/10Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12Cooking devices
    • H05B6/1209Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1281Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements with flat coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/10Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12Cooking devices
    • H05B6/1209Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1263Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02Induction heating
    • H05B2206/022Special supports for the induction coils

Definitions

  • the invention relates to a hob device according to the preamble of claim 1.
  • the publication DE 101 63 839 B4 discloses a cooktop device with a Bankelementabotician for holding at least one heating element and an electronics carrier unit, which is provided for holding at least one electronic unit and simultaneously forms a lower cover unit of a hob.
  • the Schuschmiktician and the entire electronics unit are arranged on the same side of the electronics carrier unit.
  • the publication EP 1 122 983 A2 discloses a hob apparatus according to the preamble of claim 1.
  • the object of the invention is in particular to provide a generic hob device with a lower installation cost.
  • the object is achieved by the features of claim 1, while advantageous embodiments and modifications of the invention can be taken from the dependent claims.
  • the invention is based on a hob device with a Schublementmikhimiser for holding at least one heating element and an electronics carrier unit for supporting at least one electronic unit.
  • a “heating element carrier unit” is to be understood as a unit to which, in an assembled state, at least one heating element is fixed by fastening means, in particular by a screw connection and / or a latching connection.
  • the heating element carrier unit preferably has a main extension plane and is advantageously at least substantially flat Plate formed.
  • An "at least substantially flat plate” should be understood in particular to mean a plate which is flat over a total surface area of at least 50%, advantageously at least 70% and particularly advantageously at least 90%.
  • the Schuelementzihim may have recesses.
  • a heating element is meant an element intended to convert electrical energy into heat.
  • the heating element is a resistance heater or a radiant heater or preferably an induction heater, which is intended to convert electrical energy indirectly via induced eddy currents into heat.
  • An “electronics carrier unit” is to be understood as a carrier differing from an electronic circuit board and the heating element carrier unit for at least one electronic unit.
  • the electronics carrier unit consists at least partially and particularly advantageously at least to a large extent of plastic and in particular has fastening means for fixing at least one electronic unit.
  • a “fastening means” is to be understood in particular a means which is provided for attachment of a component.
  • the fastening means are integrally formed on the electronics carrier unit.
  • An "electronic unit” is to be understood in particular as meaning a control and / or regulating unit and / or microprocessor unit and / or power electronics unit.
  • a "power electronic unit” is to be understood in particular as an electronic unit which is intended to operate an electrical load having a peak power of at least 500 W, in particular of at least 1000 W, advantageously of at least 1500 W and particularly advantageously of at least 2000 W, and the preferably comprises a power converter, in particular a rectifier and / or an inverter and / or a DC-DC converter and / or a frequency converter.
  • a hob device can be provided with a low installation cost, which costs can be reduced. Furthermore, a hob device is provided, which allows a high flexibility in a positioning of the heating elements and thus many different configurations of a hob.
  • a cooling unit which in particular comprises a heat sink and / or a fan unit, is additionally fastened on the electronics carrier unit.
  • the heating element carrier unit is formed entirely from a metal sheet and particularly advantageously from a non-magnetic metal sheet, in particular an aluminum sheet.
  • non-magnetic material is to be understood as meaning, in particular, a material having a permeability number of at most 1.1, and advantageously of at most 1.0001. In this way, a temperature-resistant and stable Schuelementlinihim maybe achieved, which advantageously excludes an influence on magnetic alternating fields of an induction heater when used in an induction hob.
  • the electronics carrier unit at least partially surrounds a receiving region for the electronic unit. Including that the electronics carrier unit at least "partially surrounds" a receiving region for the electronics unit, should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the electronics carrier unit, which enclose an angle between 0 ° and 180 °, on the same side of the electronics carrier unit like the receiving area for the electronics unit. Under a "surface normal" of a surface is in particular a Just to understand that is perpendicular to the surface. By such a configuration, an advantageous protection of the electronic unit against mechanical stress can be achieved.
  • the electronics carrier unit advantageously has a trough-shaped design, in particular in the form of a flat trough.
  • a "trough-shaped" structural unit is to be understood in particular as a structural unit comprising a base and four side walls.
  • the floor forms an at least substantially closed surface, wherein recesses and / or elevations of the area make up at most 30%, in particular at most 20%, advantageously at most 10% and particularly advantageously at most 5% of the area.
  • the trough-shaped electronics carrier unit forms a receiving region for the electronic unit and preferably for the electronic unit and the cooling unit and particularly advantageously has corresponding fastening means.
  • the electronics carrier unit has at least one base with fastening means for fastening the electronics carrier unit.
  • a "bottom" of the electronics carrier unit is to be understood, in particular, as that region of the electronics carrier unit whose contour line includes a maximum surface area in one plane.
  • the fastening means for fastening the electronics carrier unit to an underside of the bottom of the electronics carrier unit are arranged, which is opposite a provided for receiving the electronic unit top of the bottom and are preferably designed as locking lugs.
  • the fastening means are provided to attach the electronics carrier unit to the Schuelementziiser.
  • the Schuelementziiser corresponding to the attachment means of the electronics carrier unit Fastener on.
  • the fastening means are provided for fastening the electronics carrier unit to the underside of the bottom of the electronics carrier unit on the heating element carrier unit.
  • the heating element carrier unit has at least one cable feedthrough in an outer region for the passage of power supply lines of at least one heating element.
  • An "outside area" of the heating element carrier unit is to be understood in particular to mean a surface area of the heating element carrier unit which is located outside a surface area provided for the electronics carrier unit.
  • the cable feedthrough has a smallest distance from an edge of the Schuelementmikiser which is at most 30%, in particular at most 20%, advantageously at most 10% and more preferably at most 6% of a total extension of the Schuelementlinitician in a direction of this smallest distance.
  • a "cable feedthrough” is to be understood in particular a unit which is provided for guiding a cable from the first side of the Schuelementriadiser to the second side of the Schuelementziiser.
  • the cable bushing is formed by a recess, in particular an at least substantially rectangular recess in the Schuelementziiser.
  • Such a configuration makes it possible to guide the cables in an advantageously cool region of the heating element carrier unit.
  • a wiring of the electronic unit can be easily and quickly performed due to the advantageously arranged cable penetrations.
  • shorter cables can be used, which can save costs.
  • the hob device has a cover unit which is provided to cover the electronics unit.
  • a "cover unit” is to be understood in particular a unit that covers the electronics unit and preferably the electronics unit and the cooling unit, so that both are inaccessible to an operator from the outside.
  • the cover unit for cooling in particular the electronic unit via at least one air inlet opening and / or at least one air outlet opening. In this way, an advantageous cooling, in particular the electronic unit, can be achieved.
  • the cover unit at least partially surrounds the electronics carrier unit.
  • the cover unit at least “partially surrounds” the electronics carrier unit, it should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the cover unit, which enclose an angle between 0 ° and 180 °, in a projection parallel to both surface normals Level on the same side of the cover unit is like the electronics carrier unit. In this way, an attachment of the cover unit to the Schuelementizitician and / or advantageously to a further, different from the Schuelementzihimiser component can be achieved.
  • the cover unit is designed in the form of a hood, which is open on one side and concave from at least one heating element, and in particular is contacted on an open side with the metallic heating element carrier unit.
  • a Faraday cage can be achieved around the electronics unit, which allows advantageously improved electromagnetic shielding. Costs may be reduced due to subsequent weakened requirements for an EMC filter unit.
  • the cover unit at least partially surrounds the heating element carrier unit.
  • the cover unit at least "partially surrounds" the electronics carrier unit, it should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the cover unit, which enclose an angle between 0 ° and 180 °, when projecting onto a plane parallel to both surface normals lie on the same side of the cover unit as the heating element carrier unit. In this way, an attachment of the cover unit to a different from the Schuelementmikhimiser component can be achieved.
  • the hob device comprises a carrier unit which is connected to a hob plate and which has an overlap region with the cover unit.
  • a “carrier unit” is to be understood here in particular as an assembly which comprises at least one carrier strip and preferably two, in particular opposite, carrier strips.
  • the carrier unit preferably comprises fastening means for fastening the cover unit and / or the hob plate.
  • the fact that the carrier unit is connected to the cooktop panel is to be understood in particular to mean that the carrier unit is connected directly and / or indirectly via spacer elements to the cooktop panel, in particular by a material fit.
  • the carrier unit is glued to the hob plate.
  • a “distance element” is to be understood in particular as a passive component which is intended to bridge a spatial area.
  • the spacer element has fastening means and / or splices, in particular on two opposite sides.
  • An "overlapping area" of the carrier unit with the cover unit is to be understood in particular as a surface area of the carrier unit facing the cover unit, wherein a surface normal of any area of the surface area that intersects the geometrical center of gravity of the area intersects at least one surface of the cover unit and preferably intersects perpendicularly.
  • at most air and / or the carrier unit and the cover unit are contacted directly in the overlapping area between the carrier unit and the cover unit in a mounted state.
  • the carrier unit preferably comprises four carrier strips, which are combined to form a frame-like structural unit with a closed, preferably rectangular, contour line.
  • the support unit is advantageously at least partially, and preferably to a large extent made of metal and particularly advantageously made of a non-magnetic metal, in particular aluminum. In this way, a temperature-resistant and stable carrier unit can be achieved which, when used in an induction hob, advantageously precludes interference from alternating magnetic fields of an induction heater.
  • the heating element carrier unit and the cover unit have corresponding plug-in elements, via which the heating element carrier unit and the cover unit are connected to one another.
  • “Corresponding plug-in elements” is to be understood, in particular, as combinations of fastening means which are releasable relative to one another by one or more translational movements of the fastening means and, in particular, differ from a screw-threaded hole combination. In this way, a hob device can be provided with a particularly low installation costs.
  • a method for mounting a hob in particular an induction hob with a hob according to the invention is proposed.
  • the heating elements be mounted on a first side of the Schuelementriadiser and the electronics carrier unit is mounted on a first side opposite the second side of the Schuelement advantageousiser.
  • a control electronics carrier unit is mounted.
  • the power supply lines of the heating elements are routed through the cable feedthroughs from the first side to the second side of the heating element carrier unit.
  • the carrier unit is connected to the hob plate and in particular glued to this.
  • the cover unit is placed over the electronics carrier unit and connected to the Schuelementmikiser via the corresponding plug-in elements.
  • the cover unit is connected to the overlay region of the carrier unit with the cover unit with the carrier unit, in particular screwed.
  • Fig. 1 shows a portion of a cooktop apparatus of an induction cooktop with a Walkerelementriadiser 10 in the form of a flat aluminum plate for holding four heating elements 12a-d and an operating device 42 on a first side 38 of the Schuelementriadappel 10.
  • the heating elements 12a-d are induction heaters, the are bolted to the Schuelementziappel 10 by means of molded on the heating elements 12a-d wings 48a-d.
  • the operating device 42 comprises an operating electronics carrier unit 44, which is fastened to the heating element carrier unit 10 by means of a latching connection.
  • a control electronics unit 46 is screwed, which has display units and touch-sensitive sensors.
  • the heating element carrier unit 10 has, in an outer region 22, two cable bushings 24, 25 for passing through the power supply lines 26a-d of the heating elements 12a-d to a second side 40 of the heating element carrier unit 10 opposite the first side 38.
  • the power supply lines 26a-d of the two respectively adjacent heating elements 12a-d are guided through each of the cable bushings 24, 25.
  • the heating element carrier unit 10 has a further cable feedthrough 50 for carrying out power supply lines and signal lines for the operating electronics unit 46.
  • On the first side 38 of the Schuelementlie 10 is an in Fig. 1 not shown, bonded to a cooktop plate 32 made of glass ceramic carrier unit 30 of the cooktop device, which is designed as a support frame.
  • Fig. 2 shows a portion of the hob device in a plan view of the second side 40 of the Schub99 10.
  • an electronics support unit 14 of the hob device is attached on the second side 40 of the Schub device.
  • the electronics carrier unit 14 has a trough shape and surrounds a receiving area for an electronics unit 16 at least partially.
  • the electronics carrier unit 14 has a bottom 18 and a side wall 52.
  • the base 18 On a side facing the heating element carrier unit 10, the base 18 has fastening means 20 for fastening the electronics carrier unit 14 to the heating element carrier unit 10 (cf. Fig. 5 ).
  • the fastening means 20 are elastic latching hooks, which are intended to be pushed through latching openings 54 of the Schuelementziussi 10 and to secure the electronics carrier unit 14 in a rear grip on the Schuelementziappel 10.
  • the cable bushings 24, 25 in the heating element carrier unit 10 are arranged such that they lie outside a surface area of the heating element carrier unit 10 provided for the electronics carrier unit 14.
  • the cable gland 50 is covered by this after assembly of the electronics carrier unit 14.
  • the electronics carrier unit 14 is provided for holding the electronic unit 16 and a cooling unit 56.
  • Fig. 3 shows a portion of the cooktop device with the electronics carrier unit 14 and the electronics unit 16 mounted on the electronics carrier unit 14 and the cooling unit 56 mounted on the electronics carrier unit 14. Both are fastened to the electronics carrier unit 14 by means of a screw connection.
  • the heating element carrier unit 10 and the electronics unit 16 are arranged on different sides of the electronics carrier unit 14.
  • the electronics unit 16 includes power electronics components 62 that generate high frequency alternating currents for the heating elements 12a-d during operation of the induction hob. For cooling, the power electronics components 62 are in direct contact with an aluminum heat sink 60 of the cooling unit 56.
  • the cooling unit 56 includes a cooling fan 58, which draws cooling air perpendicular to the electronics carrier unit 14 and ejects parallel to the electronics carrier unit 14 through channels of the aluminum heat sink 60. Since the cable lead-throughs 24, 25 are located outside the surface area of the heating element carrier unit 10 provided for the electronics carrier unit 14, a simple contacting of the power supply lines 26a-d to the electronic unit 16 is possible.
  • Fig. 4 shows the fully assembled hob device in a perspective view from below.
  • the cooktop apparatus has a cover unit 28 made of aluminum, which is intended to cover the electronics unit 16.
  • the cover unit 28 is embodied at least substantially in the form of a rectangular tub with side walls 66, 67, 68, 70 that are perpendicular to a bottom wall 64.
  • the bottom wall 64 has, above the cooling fan 58, air inlet openings 72, through which the cooling fan 58 sucks in cooling air in at least one operating state.
  • the side wall 66 of the cover unit 28 has air outlet openings 74 through which the heated cooling air is expelled from the aluminum heat sink 60 in at least one operating state.
  • the cover unit 28 comprises integrally formed and protruding tabs 76, 78 which, in an assembled state, are perpendicular to the heating element carrier unit 10.
  • the cover unit 28 surrounds the electronics carrier unit 14 with the side walls 66, 67, 68, 70.
  • the cover unit 28 surrounds the heating element carrier unit 10 on two opposite side edges of the heating element carrier unit 10 with the integrally formed tabs 76, 78.
  • the carrier unit 30 has an overlap region 34 with the Tabs 76, 78 of the cover unit 28 (see. Fig. 5 ). In the overlapping area 34, the carrier unit 30 and the cover unit 28 touch directly and their surfaces run parallel to each other.
  • the carrier unit 30 and the cover unit 28 are screwed together in the overlapping area 34.
  • the carrier unit 30 has threaded holes and the tabs 76, 78 of the cover unit 28 via corresponding recesses (see. Fig. 5 ).
  • the heating element carrier unit 10 and the cover unit 28 have corresponding plug-in elements 36, 37, via which the heating element carrier unit 10 and the cover unit 28 are connected to one another.
  • the cover unit 28 has on the side wall 66 with the air outlet openings 74 on one edge of the side wall 66 integrally formed on tabs 80, 82, which fit into plug-in recesses 84, 86 of the Schuelementzihim 10.
  • the heating element carrier unit 10 and the cover unit 28 are fixed relative to a relative movement parallel to the Bankelementlinitician 10 by the plug-in elements 36, 37.
  • a fixation relative to a relative movement perpendicular to the Edelelementzitician 10 takes place by the screwing of the cover unit 28 with the carrier unit 30.
  • the heating element carrier unit 10 is fixed between the carrier unit 30 and the cover unit 28 (cf. Fig. 5 ).
  • the carrier unit 30 is glued to the hob plate 32.
  • the heating elements 12a-d and the control electronics carrier unit 44 are fastened on the first side 38 of the heating element carrier unit 10.
  • the operating electronics unit 46 is mounted on the control electronics carrier unit 44.
  • the power supply lines 26a-d of the heating elements 12a-d are led through the cable feedthroughs 24, 25 to the second side 40 of the heating element carrier unit 10. Further, the power supply lines and signal lines of the operating electronics unit 46 are guided through the grommet 50 to the second side 40 of the Schuelementriadappel 10.
  • the carrier unit 30 is placed together with the glued cooking field plate 32 on the first side 38 of the Schuelementlinitician 10. Afterwards the complete arrangement is turned over.
  • the heater support unit 10 may be turned over and placed on the support unit 30 adhered to the cooktop panel 32.
  • the electronics carrier unit 14 is attached to the second side 40 of the Schuelementmikaku 10. Thereafter, the electronics unit 16 and the cooling unit 56 are mounted on the electronics carrier unit 14.
  • the power supply lines 26a-d of the heating elements 12a-d and the power supply lines and the signal lines of the operating electronics unit 46 are connected to the electronic unit 16.
  • the cover unit 28 is slipped over the electronics carrier unit 14, the plug-in tabs 80, 82 being inserted on the side wall 66 of the cover unit 28 into the plug-in recesses 84, 86 of the heating element carrier unit 10.
  • the cover unit 28 bolted to the tabs 76, 78 of the side walls 68, 70 with the support unit 30.
  • the operating electronics unit 46 can also be preassembled on the control electronics carrier unit 44.
  • the control electronics carrier unit 44 is fastened together with the preassembled operating electronics unit 46 on the first side 38 of the heating element carrier unit 10.
  • the electronics unit 16 and the cooling unit 56 can also be preassembled on the electronics carrier unit 14.
  • the electronics carrier unit 14 is mounted on the second side 40 of the heater support unit 10 together with the preassembled electronics unit 16 and the preassembled cooling unit 56.
  • FIG. 6 shows the same cut as in FIG. 5 with the difference that the tabs 76, 78 of the cover unit 28 are not bent by not forming an overlap region 34 until the support unit 30 is reached. That is, the cover unit 28 rests on the support unit of heating elements 10, and the support unit 30 and the cover unit 28 are screwed together with the support unit held by heating elements 10 therebetween.
  • the support unit 30 has screw holes, and the tabs 76, 78 of the cover unit 28 and the support unit of heating elements 10 via corresponding recesses. This is advantageous in the last step of the assembly process of the cooktop, as when mounting all the components on the cooktop panel 32, the screwing direction will be perpendicular to it and thus more ergonomic to the operator of the assembly line.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Baking, Grill, Roasting (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Electric Stoves And Ranges (AREA)

Description

Die Erfindung geht aus von einer Kochfeldvorrichtung nach dem Oberbegriff des Anspruchs 1.The invention relates to a hob device according to the preamble of claim 1.

Die Druckschrift DE 101 63 839 B4 offenbart eine Kochfeldvorrichtung mit einer Heizelementträgereinheit zur Halterung zumindest eines Heizelements und einer Elektronikträgereinheit, die zur Halterung zumindest einer Elektronikeinheit vorgesehen ist und die gleichzeitig eine untere Abdeckeinheit eines Kochfelds bildet. Die Heizmittelträgereinheit und die gesamte Elektronikeinheit sind auf derselben Seite der Elektronikträgereinheit angeordnet. Die Druckschrift EP 1 122 983 A2 offenbart eine Kochfeldvorrichtung gemäß dem Oberbegriff des Anspruchs 1.The publication DE 101 63 839 B4 discloses a cooktop device with a Heizelementträgereinheit for holding at least one heating element and an electronics carrier unit, which is provided for holding at least one electronic unit and simultaneously forms a lower cover unit of a hob. The Heizmittelträgereinheit and the entire electronics unit are arranged on the same side of the electronics carrier unit. The publication EP 1 122 983 A2 discloses a hob apparatus according to the preamble of claim 1.

Die Aufgabe der Erfindung besteht insbesondere darin, eine gattungsgemäße Kochfeldvorrichtung mit einem geringeren Montageaufwand bereitzustellen. Die Aufgabe wird erfindungsgemäß durch die Merkmale des Patentanspruchs 1 gelöst, während vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung den Unteransprüchen entnommen werden können.The object of the invention is in particular to provide a generic hob device with a lower installation cost. The object is achieved by the features of claim 1, while advantageous embodiments and modifications of the invention can be taken from the dependent claims.

Die Erfindung geht aus von einer Kochfeldvorrichtung mit einer Heizelementträgereinheit zur Halterung zumindest eines Heizelements und einer Elektronikträgereinheit zur Halterung zumindest einer Elektronikeinheit.The invention is based on a hob device with a Heizelementträgereinheit for holding at least one heating element and an electronics carrier unit for supporting at least one electronic unit.

Es wird vorgeschlagen, dass die Heizelementträgereinheit und zumindest ein Teil der Elektronikeinheit auf unterschiedlichen Seiten der Elektronikträgereinheit angeordnet sind. Unter einer "Heizelementträgereinheit" soll eine Einheit verstanden werden, an der in einem montierten Zustand zumindest ein Heizelement mit Befestigungsmitteln fixiert ist, insbesondere durch eine Schraubverbindung und/oder eine Rastverbindung. Unter "vorgesehen" soll insbesondere speziell ausgelegt und/oder ausgestattet und/oder programmiert verstanden werden. Die Heizelementträgereinheit weist vorzugsweise eine Haupterstreckungsebene auf und ist vorteilhaft von einer wenigstens weitgehend ebenen Platte gebildet. Unter einer "wenigstens weitgehend ebenen Platte" soll insbesondere eine Platte verstanden werden, die auf einem Gesamtoberflächenbereich von mindestens 50%, vorteilhaft mindestens 70% und besonders vorteilhaft wenigstens 90% eben ist. Des Weiteren kann die Heizelementträgereinheit Ausnehmungen aufweisen. Unter einem "Heizelement" soll ein Element verstanden werden, das dazu vorgesehen ist, elektrische Energie in Wärme umzuwandeln. Insbesondere ist das Heizelement ein Widerstandsheizkörper oder ein Strahlungsheizkörper oder vorzugsweise ein Induktionsheizkörper, der dazu vorgesehen ist, elektrische Energie indirekt über induzierte Wirbelströme in Wärme umzuwandeln. Unter einer "Elektronikträgereinheit" soll ein von einer Elektronikplatine und der Heizelementträgereinheit differierender Träger für zumindest eine Elektronikeinheit verstanden werden. Vorzugsweise besteht die Elektronikträgereinheit zumindest teilweise und besonders vorteilhaft zumindest zu einem Großteil aus Kunststoff und weist insbesondere Befestigungsmittel zur Fixierung zumindest einer Elektronikeinheit auf. Unter einem "Befestigungsmittel" soll insbesondere ein Mittel verstanden werden, das zu einer Befestigung eines Bauteils vorgesehen ist. Hierbei kann es sich um Ausnehmungen, insbesondere Gewindelöcher, und/oder Erhebungen, insbesondere Sperrbolzen, und/oder Rastelemente und/oder jegliche Art von Befestigungsmitteln handeln, die einem Fachmann als sinnvoll erscheint. Vorzugsweise sind die Befestigungsmittel einstückig an der Elektronikträgereinheit angeformt. Unter einer "Elektronikeinheit" soll insbesondere eine Steuer- und/oder Regeleinheit und/oder Mikroprozessoreinheit und/oder Leistungselektronikeinheit verstanden werden. Unter einer "Leistungselektronikeinheit" ist insbesondere eine Elektronikeinheit zu verstehen, die dazu vorgesehen ist, einen elektrischen Verbraucher mit einer Spitzenleistung von zumindest 500 W, insbesondere von wenigstens 1000 W, vorteilhaft von mindestens 1500 W und besonders vorteilhaft von zumindest 2000 W zu betreiben und die vorzugsweise einen Stromrichter, insbesondere einen Gleichrichter und/oder einen Wechselrichter und/oder einen Gleichstromsteller und/oder einen Frequenzumrichter umfasst. Darunter, dass die Heizelementträgereinheit und "zumindest ein Teil der Elektronikeinheit auf unterschiedlichen Seiten" der Elektronikträgereinheit angeordnet sind, soll insbesondere verstanden werden, dass in einem montierten Zustand wenigstens eine gedachte Verbindungslinie zwischen einem Punkt der Heizelementträgereinheit und einem Punkt zumindest eines von einem Kabel differierenden Teils der Elektronikeinheit existiert, welche die Elektronikträgereinheit durchstößt.It is proposed that the Heizelementträgereinheit and at least a portion of the electronics unit are arranged on different sides of the electronics carrier unit. A "heating element carrier unit" is to be understood as a unit to which, in an assembled state, at least one heating element is fixed by fastening means, in particular by a screw connection and / or a latching connection. By "provided" is intended to be understood in particular specifically designed and / or equipped and / or programmed. The heating element carrier unit preferably has a main extension plane and is advantageously at least substantially flat Plate formed. An "at least substantially flat plate" should be understood in particular to mean a plate which is flat over a total surface area of at least 50%, advantageously at least 70% and particularly advantageously at least 90%. Furthermore, the Heizelementträgereinheit may have recesses. By a "heating element" is meant an element intended to convert electrical energy into heat. In particular, the heating element is a resistance heater or a radiant heater or preferably an induction heater, which is intended to convert electrical energy indirectly via induced eddy currents into heat. An "electronics carrier unit" is to be understood as a carrier differing from an electronic circuit board and the heating element carrier unit for at least one electronic unit. Preferably, the electronics carrier unit consists at least partially and particularly advantageously at least to a large extent of plastic and in particular has fastening means for fixing at least one electronic unit. A "fastening means" is to be understood in particular a means which is provided for attachment of a component. These may be recesses, in particular threaded holes, and / or elevations, in particular locking pins, and / or latching elements and / or any type of fastening means that appears to be appropriate to a person skilled in the art. Preferably, the fastening means are integrally formed on the electronics carrier unit. An "electronic unit" is to be understood in particular as meaning a control and / or regulating unit and / or microprocessor unit and / or power electronics unit. A "power electronic unit" is to be understood in particular as an electronic unit which is intended to operate an electrical load having a peak power of at least 500 W, in particular of at least 1000 W, advantageously of at least 1500 W and particularly advantageously of at least 2000 W, and the preferably comprises a power converter, in particular a rectifier and / or an inverter and / or a DC-DC converter and / or a frequency converter. The fact that the Heizelementträgereinheit and "at least a portion of the electronics unit on different sides" of the electronics carrier unit are arranged, in particular be understood that in an assembled state, at least one imaginary connecting line exists between a point of the Heizelementträgereinheit and a point of at least one of a cable differentiating part of the electronic unit, which pierces the electronics carrier unit.

Durch eine solche Ausgestaltung kann eine Kochfeldvorrichtung mit einem geringen Montageaufwand bereitgestellt werden, wodurch Kosten gesenkt werden können. Des Weiteren wird eine Kochfeldvorrichtung bereitgestellt, die eine hohe Flexibilität bei einer Positionierung der Heizelemente und damit viele verschiedene Ausgestaltungen eines Kochfelds ermöglicht. Vorzugsweise ist in einem montierten Zustand zusätzlich eine Kühleinheit, die insbesondere einen Kühlkörper und/oder eine Lüftereinheit umfasst, auf der Elektronikträgereinheit befestigt. Hierdurch kann eine kompakte Bauweise erzielt werden. Ferner kann eine Vormontage der Elektronikeinheit und der Kühleinheit auf der Elektronikträgereinheit ermöglicht werden. Die Heizelementträgereinheit ist gemäß der Erfindung vollständig aus einem Metallblech und besonders vorteilhaft aus einem unmagnetischen Metallblech, insbesondere einem Aluminiumblech, gebildet. Unter einem "unmagnetischen" Material soll insbesondere ein Material mit einer Permeabilitätszahl von höchstens 1,1 und vorteilhaft von höchstens 1,0001 verstanden werden. Hierdurch kann eine temperaturbeständige und stabile Heizelementträgereinheit erreicht werden, die vorteilhaft bei einem Einsatz in einem Induktionskochfeld eine Beeinflussung von magnetischen Wechselfeldern eines Induktionsheizkörpers ausschließt.By such a configuration, a hob device can be provided with a low installation cost, which costs can be reduced. Furthermore, a hob device is provided, which allows a high flexibility in a positioning of the heating elements and thus many different configurations of a hob. Preferably, in a mounted state, a cooling unit, which in particular comprises a heat sink and / or a fan unit, is additionally fastened on the electronics carrier unit. As a result, a compact design can be achieved. Furthermore, a pre-assembly of the electronics unit and the cooling unit on the electronics carrier unit can be made possible. According to the invention, the heating element carrier unit is formed entirely from a metal sheet and particularly advantageously from a non-magnetic metal sheet, in particular an aluminum sheet. A "non-magnetic" material is to be understood as meaning, in particular, a material having a permeability number of at most 1.1, and advantageously of at most 1.0001. In this way, a temperature-resistant and stable Heizelementträgereinheit be achieved, which advantageously excludes an influence on magnetic alternating fields of an induction heater when used in an induction hob.

Ferner wird vorgeschlagen, dass die Elektronikträgereinheit einen Aufnahmebereich für die Elektronikeinheit zumindest teilweise umgreift. Darunter, dass die Elektronikträgereinheit einen Aufnahmebereich für die Elektronikeinheit zumindest "teilweise umgreift", soll insbesondere verstanden werden, dass ein Schnittpunkt von zumindest zwei Flächennormalen zweier Wandflächen der Elektronikträgereinheit, die einen Winkel zwischen 0° und 180° einschließen, auf derselben Seite der Elektronikträgereinheit liegt wie der Aufnahmebereich für die Elektronikeinheit. Unter einer "Flächennormalen" einer Fläche ist insbesondere eine Gerade zu verstehen, die auf der Fläche senkrecht steht. Durch eine solche Ausgestaltung kann ein vorteilhafter Schutz der Elektronikeinheit gegen eine mechanische Beanspruchung erreicht werden. Vorteilhaft ist die Elektronikträgereinheit wannenförmig ausgestaltet, insbesondere in Form einer flachen Wanne. Unter einer "wannenförmigen" Baueinheit ist insbesondere eine Baueinheit zu verstehen, die einen Boden und vier Seitenwände umfasst. Vorteilhaft bildet der Boden eine zumindest weitgehend geschlossene Fläche, wobei Ausnehmungen und/oder Erhebungen der Fläche höchstens 30%, insbesondere höchstens 20%, vorteilhaft höchstens 10% und besonders vorteilhaft höchstens 5% der Fläche ausmachen. Vorzugsweise bildet die wannenförmige Elektronikträgereinheit einen Aufnahmebereich für die Elektronikeinheit und vorzugsweise für die Elektronikeinheit und die Kühleinheit und verfügt besonders vorteilhaft über dementsprechende Befestigungsmittel. Durch eine wannenförmige Ausgestaltung der Elektronikträgereinheit kann ein besonders vorteilhafter Schutz der Elektronikeinheit gegen eine mechanische Beanspruchung erreicht werden.It is also proposed that the electronics carrier unit at least partially surrounds a receiving region for the electronic unit. Including that the electronics carrier unit at least "partially surrounds" a receiving region for the electronics unit, should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the electronics carrier unit, which enclose an angle between 0 ° and 180 °, on the same side of the electronics carrier unit like the receiving area for the electronics unit. Under a "surface normal" of a surface is in particular a Just to understand that is perpendicular to the surface. By such a configuration, an advantageous protection of the electronic unit against mechanical stress can be achieved. The electronics carrier unit advantageously has a trough-shaped design, in particular in the form of a flat trough. A "trough-shaped" structural unit is to be understood in particular as a structural unit comprising a base and four side walls. Advantageously, the floor forms an at least substantially closed surface, wherein recesses and / or elevations of the area make up at most 30%, in particular at most 20%, advantageously at most 10% and particularly advantageously at most 5% of the area. Preferably, the trough-shaped electronics carrier unit forms a receiving region for the electronic unit and preferably for the electronic unit and the cooling unit and particularly advantageously has corresponding fastening means. By a trough-shaped design of the electronics carrier unit, a particularly advantageous protection of the electronic unit against mechanical stress can be achieved.

In einer bevorzugten Ausgestaltung wird vorgeschlagen, dass die Elektronikträgereinheit zumindest einen Boden mit Befestigungsmitteln zur Befestigung der Elektronikträgereinheit aufweist. Unter einem "Boden" der Elektronikträgereinheit soll insbesondere derjenige Bereich der Elektronikträgereinheit verstanden werden, dessen Konturlinie in einer Ebene einen maximalen Flächeninhalt einschließt. Insbesondere sind die Befestigungsmittel zur Befestigung der Elektronikträgereinheit an einer Unterseite des Bodens der Elektronikträgereinheit angeordnet, die einer für eine Aufnahme der Elektronikeinheit vorgesehenen Oberseite des Bodens gegenüber liegt und sind vorzugsweise als Rastnasen ausgeführt. Durch eine solche Ausgestaltung kann konstruktiv einfach eine Befestigung der Elektronikträgereinheit erzielt werden, die einen vorteilhaften Zugang zur Elektronikeinheit ermöglicht.In a preferred embodiment, it is proposed that the electronics carrier unit has at least one base with fastening means for fastening the electronics carrier unit. A "bottom" of the electronics carrier unit is to be understood, in particular, as that region of the electronics carrier unit whose contour line includes a maximum surface area in one plane. In particular, the fastening means for fastening the electronics carrier unit to an underside of the bottom of the electronics carrier unit are arranged, which is opposite a provided for receiving the electronic unit top of the bottom and are preferably designed as locking lugs. By such a configuration can be structurally easy attachment of the electronics carrier unit can be achieved, which allows an advantageous access to the electronic unit.

Vorteilhaft sind die Befestigungsmittel dazu vorgesehen, die Elektronikträgereinheit an der Heizelementträgereinheit zu befestigen. Insbesondere weist die Heizelementträgereinheit zu den Befestigungsmitteln der Elektronikträgereinheit korrespondierende Befestigungsmittel auf. Insbesondere sind die Befestigungsmittel dazu vorgesehen, die Elektronikträgereinheit mit der Unterseite des Bodens der Elektronikträgereinheit an der Heizelementträgereinheit zu befestigen. Durch diese Ausgestaltung kann eine Kochfeldvorrichtung mit einem geringeren Montageaufwand bereitgestellt werden, da eine Kabelverbindung zwischen den Heizelementen auf einer ersten Seite der Heizelementträgereinheit und der Elektronikeinheit auf einer der ersten Seite gegenüber liegenden zweiten Seite der Heizelementträgereinheit leicht möglich ist.Advantageously, the fastening means are provided to attach the electronics carrier unit to the Heizelementträgereinheit. In particular, the Heizelementträgereinheit corresponding to the attachment means of the electronics carrier unit Fastener on. In particular, the fastening means are provided for fastening the electronics carrier unit to the underside of the bottom of the electronics carrier unit on the heating element carrier unit. By this configuration, a cooktop device can be provided with less installation effort, since a cable connection between the heating elements on a first side of the Heizelementträgereinheit and the electronic unit on a first side opposite the second side of the Heizelementträgereinheit is easily possible.

In einer weiteren Ausgestaltung der Erfindung wird vorgeschlagen, dass die Heizelementträgereinheit in einem Außenbereich zumindest eine Kabeldurchführung zur Durchführung von Stromversorgungsleitungen zumindest eines Heizelements aufweist. Unter einem "Außenbereich" der Heizelementträgereinheit soll insbesondere ein Flächenbereich der Heizelementträgereinheit verstanden werden, der sich außerhalb eines für die Elektronikträgereinheit vorgesehenen Flächenbereichs befindet. Vorzugsweise weist die Kabeldurchführung einen kleinsten Abstand von einem Rand der Heizelementträgereinheit auf, der maximal 30%, insbesondere maximal 20%, vorteilhaft maximal 10% und besonders vorteilhaft maximal 6% einer Gesamterstreckung der Heizelementträgereinheit in einer Richtung dieses kleinsten Abstands beträgt. Unter einer "Kabeldurchführung" soll insbesondere eine Einheit verstanden werden, die zur Führung eines Kabels von der ersten Seite der Heizelementträgereinheit zur zweiten Seite der Heizelementträgereinheit vorgesehen ist. Vorteilhaft ist die Kabeldurchführung von einer Ausnehmung, insbesondere einer zumindest weitgehend rechteckigen Ausnehmung in der Heizelementträgereinheit gebildet. Durch eine solche Ausgestaltung kann eine Führung der Kabel in einem vorteilhaft kühlen Bereich der Heizelementträgereinheit erreicht werden. Des Weiteren kann eine Verkabelung der Elektronikeinheit einfach und schnell aufgrund der vorteilhaft angeordneten Kabeldurchführungen durchgeführt werden. Ferner können kürzere Kabel verwendet werden, wodurch Kosten eingespart werden können.In a further embodiment of the invention, it is proposed that the heating element carrier unit has at least one cable feedthrough in an outer region for the passage of power supply lines of at least one heating element. An "outside area" of the heating element carrier unit is to be understood in particular to mean a surface area of the heating element carrier unit which is located outside a surface area provided for the electronics carrier unit. Preferably, the cable feedthrough has a smallest distance from an edge of the Heizelementträgereinheit which is at most 30%, in particular at most 20%, advantageously at most 10% and more preferably at most 6% of a total extension of the Heizelementträgereinheit in a direction of this smallest distance. A "cable feedthrough" is to be understood in particular a unit which is provided for guiding a cable from the first side of the Heizelementträgereinheit to the second side of the Heizelementträgereinheit. Advantageously, the cable bushing is formed by a recess, in particular an at least substantially rectangular recess in the Heizelementträgereinheit. Such a configuration makes it possible to guide the cables in an advantageously cool region of the heating element carrier unit. Furthermore, a wiring of the electronic unit can be easily and quickly performed due to the advantageously arranged cable penetrations. Furthermore, shorter cables can be used, which can save costs.

Ferner wird vorgeschlagen, dass die Kochfeldvorrichtung eine Abdeckeinheit aufweist, die zur Abdeckung der Elektronikeinheit vorgesehen ist. Unter einer "Abdeckeinheit" soll insbesondere eine Einheit verstanden werden, die die Elektronikeinheit und vorzugsweise die Elektronikeinheit und die Kühleinheit abdeckt, so dass beide für einen Bediener von außen unzugänglich sind. Durch eine solche Ausgestaltung kann ein vorteilhafter Schutz der Elektronikeinheit und/oder eines Bedieners erreicht werden. Vorzugsweise verfügt die Abdeckeinheit zur Kühlung insbesondere der Elektronikeinheit über zumindest eine Lufteintrittsöffnung und/oder zumindest eine Luftaustrittsöffnung. Hierdurch kann eine vorteilhafte Kühlung, insbesondere der Elektronikeinheit, erreicht werden.It is also proposed that the hob device has a cover unit which is provided to cover the electronics unit. A "cover unit" is to be understood in particular a unit that covers the electronics unit and preferably the electronics unit and the cooling unit, so that both are inaccessible to an operator from the outside. By such a configuration, an advantageous protection of the electronics unit and / or an operator can be achieved. Preferably, the cover unit for cooling in particular the electronic unit via at least one air inlet opening and / or at least one air outlet opening. In this way, an advantageous cooling, in particular the electronic unit, can be achieved.

Vorteilhaft umgreift die Abdeckeinheit die Elektronikträgereinheit zumindest teilweise. Darunter, dass die Abdeckeinheit die Elektronikträgereinheit zumindest "teilweise umgreift", soll insbesondere verstanden werden, dass ein Schnittpunkt von zumindest zwei Flächennormalen zweier Wandflächen der Abdeckeinheit, die einen Winkel zwischen 0° und 180° einschließen, bei einer Projektion auf eine zu beiden Flächennormalen parallele Ebene auf derselben Seite der Abdeckeinheit liegt wie die Elektronikträgereinheit. Hierdurch kann eine Befestigung der Abdeckeinheit an der Heizelementträgereinheit und/oder vorteilhaft an einem weiteren, von der Heizelementträgereinheit differierenden Bauteil erreicht werden. Vorzugsweise ist die Abdeckeinheit in Form einer einseitig offenen, von zumindest einem Heizelement aus betrachtet konkaven Haube ausgeführt und insbesondere an einer offenen Seite mit der metallischen Heizelementträgereinheit kontaktiert. Hierdurch kann ein Faradayscher Käfig um die Elektronikeinheit erreicht werden, der eine vorteilhaft verbesserte elektromagnetische Abschirmung ermöglicht. Aufgrund von hieraus folgenden abgeschwächten Anforderungen an eine EMV-Filtereinheit können Kosten gesenkt werden.Advantageously, the cover unit at least partially surrounds the electronics carrier unit. By the fact that the cover unit at least "partially surrounds" the electronics carrier unit, it should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the cover unit, which enclose an angle between 0 ° and 180 °, in a projection parallel to both surface normals Level on the same side of the cover unit is like the electronics carrier unit. In this way, an attachment of the cover unit to the Heizelementträgereinheit and / or advantageously to a further, different from the Heizelementträgereinheit component can be achieved. Preferably, the cover unit is designed in the form of a hood, which is open on one side and concave from at least one heating element, and in particular is contacted on an open side with the metallic heating element carrier unit. As a result, a Faraday cage can be achieved around the electronics unit, which allows advantageously improved electromagnetic shielding. Costs may be reduced due to subsequent weakened requirements for an EMC filter unit.

In einer bevorzugten Ausgestaltung der Erfindung wird vorgeschlagen, dass die Abdeckeinheit die Heizelementträgereinheit zumindest teilweise umgreift. Darunter, dass die Abdeckeinheit die Elektronikträgereinheit zumindest "teilweise umgreift", soll insbesondere verstanden werden, dass ein Schnittpunkt von zumindest zwei Flächennormalen zweier Wandflächen der Abdeckeinheit, die einen Winkel zwischen 0° und 180° einschließen, bei einer Projektion auf eine zu beiden Flächennormalen parallele Ebene auf derselben Seite der Abdeckeinheit liegt wie die Heizelementträgereinheit. Hierdurch kann eine Befestigung der Abdeckeinheit an einem von der Heizelementträgereinheit differierenden Bauteil erreicht werden.In a preferred embodiment of the invention, it is proposed that the cover unit at least partially surrounds the heating element carrier unit. By the fact that the cover unit at least "partially surrounds" the electronics carrier unit, it should be understood in particular that an intersection of at least two surface normals of two wall surfaces of the cover unit, which enclose an angle between 0 ° and 180 °, when projecting onto a plane parallel to both surface normals lie on the same side of the cover unit as the heating element carrier unit. In this way, an attachment of the cover unit to a different from the Heizelementträgereinheit component can be achieved.

Ferner wird vorgeschlagen, dass die Kochfeldvorrichtung eine Trägereinheit umfasst, die mit einer Kochfeldplatte verbunden ist und die einen Überlappungsbereich mit der Abdeckeinheit aufweist. Unter einem "Trägereinheit" soll hierbei insbesondere eine Baueinheit verstanden werden, die zumindest eine Trägerleiste und vorzugsweise zwei, insbesondere gegenüberliegende, Trägerleisten umfasst. Des Weiteren umfasst die Trägereinheit vorzugsweise Befestigungsmittel zur Befestigung der Abdeckeinheit und/oder der Kochfeldplatte. Darunter, dass die Trägereinheit mit der Kochfeldplatte verbunden ist, soll insbesondere verstanden werden, dass die Trägereinheit unmittelbar und/oder indirekt über Abstandselemente mit der Kochfeldplatte, insbesondere stoffschlüssig, verbunden ist. Vorzugsweise ist die Trägereinheit auf die Kochfeldplatte aufgeklebt. Unter einem "Abstandselement" soll insbesondere ein passives Bauelement verstanden werden, welches dazu vorgesehen ist, einen räumlichen Bereich zu überbrücken. Bei einer indirekten Verbindung der Kochfeldplatte mit der Trägereinheit über ein Abstandselement weist das Abstandselement insbesondere auf zwei gegenüber liegenden Seiten Befestigungsmittel und/oder Klebestellen auf. Unter einem "Überlappungsbereich" der Trägereinheit mit der Abdeckeinheit soll insbesondere ein der Abdeckeinheit zugewandter Oberflächenbereich der Trägereinheit verstanden werden, wobei eine Flächennormale eines beliebigen Flächenstücks des Oberflächenbereichs, die den geometrischen Schwerpunkt des Flächenstücks schneidet, zumindest eine Oberfläche der Abdeckeinheit schneidet und vorzugsweise senkrecht schneidet. Vorzugsweise befindet sich zwischen der Trägereinheit und der Abdeckeinheit in einem montierten Zustand höchstens Luft und/oder die Trägereinheit und die Abdeckeinheit sind im Überlappungsbereich direkt kontaktiert. Durch eine solche Ausgestaltung kann eine Befestigung der Abdeckeinheit an der Trägereinheit, insbesondere durch eine Schraubverbindung, erreicht werden. Die Trägereinheit umfasst vorzugsweise vier Trägerleisten, die zu einer rahmenartigen Baueinheit mit einer geschlossenen, vorzugsweise rechteckigen, Konturlinie zusammengefasst sind. Hierdurch kann ein nach außen geschlossenes Kochfeld erreicht werden. Die Trägereinheit ist vorteilhaft zumindest teilweise und vorzugsweise zu einem Großteil aus Metall und besonders vorteilhaft aus einem unmagnetischen Metall, insbesondere Aluminium, gefertigt. Hierdurch kann eine temperaturbeständige und stabile Trägereinheit erreicht werden, die vorteilhaft bei einem Einsatz in einem Induktionskochfeld eine Beeinflussung von magnetischen Wechselfeldern eines Induktionsheizkörpers ausschließt.It is also proposed that the hob device comprises a carrier unit which is connected to a hob plate and which has an overlap region with the cover unit. A "carrier unit" is to be understood here in particular as an assembly which comprises at least one carrier strip and preferably two, in particular opposite, carrier strips. Furthermore, the carrier unit preferably comprises fastening means for fastening the cover unit and / or the hob plate. The fact that the carrier unit is connected to the cooktop panel is to be understood in particular to mean that the carrier unit is connected directly and / or indirectly via spacer elements to the cooktop panel, in particular by a material fit. Preferably, the carrier unit is glued to the hob plate. A "distance element" is to be understood in particular as a passive component which is intended to bridge a spatial area. In the case of an indirect connection of the cooktop panel to the carrier unit via a spacing element, the spacer element has fastening means and / or splices, in particular on two opposite sides. An "overlapping area" of the carrier unit with the cover unit is to be understood in particular as a surface area of the carrier unit facing the cover unit, wherein a surface normal of any area of the surface area that intersects the geometrical center of gravity of the area intersects at least one surface of the cover unit and preferably intersects perpendicularly. Preferably, at most air and / or the carrier unit and the cover unit are contacted directly in the overlapping area between the carrier unit and the cover unit in a mounted state. By such a configuration, an attachment of the cover unit be achieved on the support unit, in particular by a screw connection. The carrier unit preferably comprises four carrier strips, which are combined to form a frame-like structural unit with a closed, preferably rectangular, contour line. As a result, an outwardly closed hob can be achieved. The support unit is advantageously at least partially, and preferably to a large extent made of metal and particularly advantageously made of a non-magnetic metal, in particular aluminum. In this way, a temperature-resistant and stable carrier unit can be achieved which, when used in an induction hob, advantageously precludes interference from alternating magnetic fields of an induction heater.

In einer besonders bevorzugten Ausgestaltung der Erfindung wird vorgeschlagen, dass die Heizelementträgereinheit und die Abdeckeinheit korrespondierende Steckelemente aufweisen, über die die Heizelementträgereinheit und die Abdeckeinheit miteinander verbunden sind. Unter "korrespondierenden Steckelementen" sollen insbesondere Kombinationen von Befestigungsmitteln verstanden werden, die durch eine oder mehrere translatorische Bewegungen der Befestigungsmittel relativ zueinander lösbar sind und insbesondere von einer Schraube-Gewindeloch-Kombination verschieden sind. Hierdurch kann eine Kochfeldvorrichtung mit einem besonders geringeren Montageaufwand bereitgestellt werden.In a particularly preferred embodiment of the invention, it is proposed that the heating element carrier unit and the cover unit have corresponding plug-in elements, via which the heating element carrier unit and the cover unit are connected to one another. "Corresponding plug-in elements" is to be understood, in particular, as combinations of fastening means which are releasable relative to one another by one or more translational movements of the fastening means and, in particular, differ from a screw-threaded hole combination. In this way, a hob device can be provided with a particularly low installation costs.

Des Weiteren wird ein Verfahren zur Montage eines Kochfelds, insbesondere eines Induktionskochfelds mit einer erfindungsgemäßen Kochfeldvorrichtung vorgeschlagen. Es wird vorgeschlagen, dass die Heizelemente auf einer ersten Seite der Heizelementträgereinheit befestigt werden und die Elektronikträgereinheit auf einer der ersten Seite gegenüber liegenden zweiten Seite der Heizelementträgereinheit befestigt wird. Vorzugsweise wird bei einer Montage der Heizelemente auf der ersten Seite der Heizelementträgereinheit zusätzlich eine Bedienelektronikträgereinheit montiert. Insbesondere werden die Stromversorgungsleitungen der Heizelemente durch die Kabeldurchführungen von der ersten Seite auf die zweite Seite der Heizelementträgereinheit geführt. Vorzugsweise wird die Trägereinheit mit der Kochfeldplatte verbunden und insbesondere auf diese aufgeklebt. Vorzugsweise wird die Abdeckeinheit über die Elektronikträgereinheit gestülpt und mit der Heizelementträgereinheit über die korrespondierenden Steckelemente verbunden. Vorzugsweise wird die Abdeckeinheit am Überlappungsbereich der Trägereinheit mit der Abdeckeinheit mit der Trägereinheit verbunden, insbesondere verschraubt. Mit diesem Verfahren kann ein Kochfeld mit einem geringeren Montageaufwand montiert werden. Insbesondere ermöglicht das Verfahren eine bequeme und einfache Verkabelung der Heizelemente mit der Elektronikeinheit.Furthermore, a method for mounting a hob, in particular an induction hob with a hob according to the invention is proposed. It is proposed that the heating elements be mounted on a first side of the Heizelementträgereinheit and the electronics carrier unit is mounted on a first side opposite the second side of the Heizelementträgereinheit. Preferably, when mounting the heating elements on the first side of the Heizelementträgereinheit additionally a control electronics carrier unit is mounted. In particular, the power supply lines of the heating elements are routed through the cable feedthroughs from the first side to the second side of the heating element carrier unit. Preferably, the carrier unit is connected to the hob plate and in particular glued to this. Preferably, the cover unit is placed over the electronics carrier unit and connected to the Heizelementträgereinheit via the corresponding plug-in elements. Preferably, the cover unit is connected to the overlay region of the carrier unit with the cover unit with the carrier unit, in particular screwed. With this method, a hob can be mounted with less installation effort. In particular, the method allows a convenient and easy wiring of the heating elements with the electronic unit.

Weitere Vorteile ergeben sich aus den folgenden Zeichnungsbeschreibungen. In den Zeichnungen ist ein Ausführungsbeispiel der Erfindung dargestellt.Further advantages can be found in the following drawing descriptions. In the drawings, an embodiment of the invention is shown.

Es zeigen:

Fig. 1
einen Teil einer Kochfeldvorrichtung mit einer Heizelementträgereinheit und einer Bedienvorrichtung sowie vier Heizelemente in einer Draufsicht auf eine erste Seite der Heizelementträgereinheit,
Fig. 2
einen Teil der Kochfeldvorrichtung mit der Heizelementträgereinheit und einer Elektronikträgereinheit in einer Draufsicht auf eine zweite Seite der Heizelementträgereinheit,
Fig. 3
einen Teil der Kochfeldvorrichtung mit der Heizelementträgereinheit und der Elektronikträgereinheit sowie eine an der Elektronikträgereinheit befestigte Elektronikeinheit in einer Draufsicht auf die zweite Seite der Heizelementträgereinheit,
Fig. 4
die Kochfeldvorrichtung mit der Heizelementträgereinheit, einer Trägereinheit und einer Abdeckeinheit sowie eine Kochfeldplatte in einer perspektivischen Ansicht auf die zweite Seite der Heizelementträgereinheit,
Fig. 5
die Kochfeldvorrichtung in einer um 180° gedrehten Schnittdarstellung entlang einer Linie V-V aus Fig. 4, und
Fig. 6
die Kochfeldvorrichtung in einer weiteren um 180° gedrehten Schnittdarstellung entlang einer Linie V-V aus Fig. 4.
Show it:
Fig. 1
a part of a hob device with a Heizelementträgereinheit and an operating device and four heating elements in a plan view of a first side of the Heizelementträgereinheit,
Fig. 2
a part of the cooktop device with the Heizelementträgereinheit and an electronics carrier unit in a plan view of a second side of the Heizelementträgereinheit,
Fig. 3
a part of the cooktop device with the Heizelementträgereinheit and the electronics carrier unit and an electronics unit attached to the electronics carrier unit in a plan view of the second side of the Heizelementträgereinheit,
Fig. 4
the hob device with the Heizelementträgereinheit, a carrier unit and a cover unit and a cooking plate in a perspective view of the second side of the Heizelementträgereinheit,
Fig. 5
the hob device in a rotated by 180 ° sectional view along a line VV Fig. 4 , and
Fig. 6
the hob device in a further rotated by 180 ° sectional view along a line VV Fig. 4 ,

Fig. 1 zeigt einen Teil einer Kochfeldvorrichtung eines Induktionskochfelds mit einer Heizelementträgereinheit 10 in Form einer ebenen Aluminiumplatte zur Halterung von vier Heizelementen 12a-d und einer Bedienvorrichtung 42 auf einer ersten Seite 38 der Heizelementträgereinheit 10. Bei den Heizelementen 12a-d handelt es sich um Induktionsheizkörper, die mittels an den Heizelementen 12a-d angeformter Flügel 48a-d an der Heizelementträgereinheit 10 festgeschraubt sind. Die Bedienvorrichtung 42 umfasst eine Bedienelektronikträgereinheit 44, die an der Heizelementträgereinheit 10 mittels einer Rastverbindung befestigt ist. Auf der Bedienelektronikträgereinheit 44 ist eine Bedienelektronikeinheit 46 aufgeschraubt, die Anzeigeeinheiten und berührungsempfindliche Sensoren aufweist. Die Heizelementträgereinheit 10 weist in einem Außenbereich 22 zwei Kabeldurchführungen 24, 25 zur Durchführung von Stromversorgungsleitungen 26a-d der Heizelemente 12a-d auf eine der ersten Seite 38 gegenüberliegende zweite Seite 40 der Heizelementträgereinheit 10 auf. Durch jede der Kabeldurchführungen 24, 25 werden jeweils die Stromversorgungsleitungen 26a-d der beiden jeweils angrenzenden Heizelemente 12a-d geführt. Des Weiteren weist die Heizelementträgereinheit 10 eine weitere Kabeldurchführung 50 zur Durchführung von Stromversorgungsleitungen und Signalleitungen für die Bedienelektronikeinheit 46 auf. Auf die erste Seite 38 der Heizelementträgereinheit 10 ist eine in Fig. 1 nicht dargestellte, mit einer Kochfeldplatte 32 aus Glaskeramik verklebte Trägereinheit 30 der Kochfeldvorrichtung aufgelegt, die als ein Trägerrahmen ausgeführt ist. Fig. 1 shows a portion of a cooktop apparatus of an induction cooktop with a Heizelementträgereinheit 10 in the form of a flat aluminum plate for holding four heating elements 12a-d and an operating device 42 on a first side 38 of the Heizelementträgereinheit 10. The heating elements 12a-d are induction heaters, the are bolted to the Heizelementträgereinheit 10 by means of molded on the heating elements 12a-d wings 48a-d. The operating device 42 comprises an operating electronics carrier unit 44, which is fastened to the heating element carrier unit 10 by means of a latching connection. On the control electronics carrier unit 44, a control electronics unit 46 is screwed, which has display units and touch-sensitive sensors. The heating element carrier unit 10 has, in an outer region 22, two cable bushings 24, 25 for passing through the power supply lines 26a-d of the heating elements 12a-d to a second side 40 of the heating element carrier unit 10 opposite the first side 38. The power supply lines 26a-d of the two respectively adjacent heating elements 12a-d are guided through each of the cable bushings 24, 25. Furthermore, the heating element carrier unit 10 has a further cable feedthrough 50 for carrying out power supply lines and signal lines for the operating electronics unit 46. On the first side 38 of the Heizelementträgereinheit 10 is an in Fig. 1 not shown, bonded to a cooktop plate 32 made of glass ceramic carrier unit 30 of the cooktop device, which is designed as a support frame.

Fig. 2 zeigt einen Teil der Kochfeldvorrichtung in einer Draufsicht auf die zweite Seite 40 der Heizelementträgereinheit 10. Auf der zweiten Seite 40 der Heizelementträgereinheit 10 ist eine Elektronikträgereinheit 14 der Kochfeldvorrichtung befestigt. Die Elektronikträgereinheit 14 ist wannenförmig ausgeführt und umgreift einen Aufnahmebereich für eine Elektronikeinheit 16 zumindest teilweise. Die Elektronikträgereinheit 14 weist einen Boden 18 und eine Seitenwand 52 auf. Der Boden 18 weist auf einer der Heizelementträgereinheit 10 zugewandten Seite Befestigungsmittel 20 zur Befestigung der Elektronikträgereinheit 14 an der Heizelementträgereinheit 10 auf (vgl. Fig. 5). Bei den Befestigungsmitteln 20 handelt es sich um elastische Rasthaken, die dazu vorgesehen sind, durch Rastöffnungen 54 der Heizelementträgereinheit 10 geschoben zu werden und die Elektronikträgereinheit 14 in einem Hintergriff an der Heizelementträgereinheit 10 zu befestigen. Die Kabeldurchführungen 24, 25 in der Heizelementträgereinheit 10 sind so angeordnet, dass sie außerhalb eines für die Elektronikträgereinheit 14 vorgesehenen Flächenbereichs der Heizelementträgereinheit 10 liegen. Die Kabeldurchführung 50 wird nach einer Montage der Elektronikträgereinheit 14 von dieser bedeckt. Fig. 2 shows a portion of the hob device in a plan view of the second side 40 of the Heizelementträgereinheit 10. On the second side 40 of the Heizelementträgereinheit 10 an electronics support unit 14 of the hob device is attached. The electronics carrier unit 14 has a trough shape and surrounds a receiving area for an electronics unit 16 at least partially. The electronics carrier unit 14 has a bottom 18 and a side wall 52. On a side facing the heating element carrier unit 10, the base 18 has fastening means 20 for fastening the electronics carrier unit 14 to the heating element carrier unit 10 (cf. Fig. 5 ). The fastening means 20 are elastic latching hooks, which are intended to be pushed through latching openings 54 of the Heizelementträgereinheit 10 and to secure the electronics carrier unit 14 in a rear grip on the Heizelementträgereinheit 10. The cable bushings 24, 25 in the heating element carrier unit 10 are arranged such that they lie outside a surface area of the heating element carrier unit 10 provided for the electronics carrier unit 14. The cable gland 50 is covered by this after assembly of the electronics carrier unit 14.

Die Elektronikträgereinheit 14 ist zur Halterung der Elektronikeinheit 16 und einer Kühleinheit 56 vorgesehen. Fig. 3 zeigt einen Teil der Kochfeldvorrichtung mit der Elektronikträgereinheit 14 und der an der Elektronikträgereinheit 14 montierten Elektronikeinheit 16 und der an der Elektronikträgereinheit 14 montierten Kühleinheit 56. Beide sind mittels einer Schraubverbindung an der Elektronikträgereinheit 14 befestigt. Die Heizelementträgereinheit 10 und die Elektronikeinheit 16 sind auf unterschiedlichen Seiten der Elektronikträgereinheit 14 angeordnet. Die Elektronikeinheit 16 umfasst Leistungselektronikbauteile 62, die im Betrieb des Induktionskochfelds hochfrequente Wechselströme für die Heizelemente 12a-d erzeugen. Zur Kühlung sind die Leistungselektronikbauteile 62 direkt mit einem Aluminiumkühlkörper 60 der Kühleinheit 56 in Kontakt. Zusätzlich umfasst die Kühleinheit 56 einen Kühllüfter 58, der Kühlluft senkrecht zur Elektronikträgereinheit 14 ansaugt und parallel zur Elektronikträgereinheit 14 durch Kanäle des Aluminiumkühlkörpers 60 ausstößt. Da die Kabeldurchführungen 24, 25 außerhalb des für die Elektronikträgereinheit 14 vorgesehenen Flächenbereichs der Heizelementträgereinheit 10 liegen, ist eine einfache Kontaktierung der Stromversorgungsleitungen 26a-d mit der Elektronikeinheit 16 möglich.The electronics carrier unit 14 is provided for holding the electronic unit 16 and a cooling unit 56. Fig. 3 shows a portion of the cooktop device with the electronics carrier unit 14 and the electronics unit 16 mounted on the electronics carrier unit 14 and the cooling unit 56 mounted on the electronics carrier unit 14. Both are fastened to the electronics carrier unit 14 by means of a screw connection. The heating element carrier unit 10 and the electronics unit 16 are arranged on different sides of the electronics carrier unit 14. The electronics unit 16 includes power electronics components 62 that generate high frequency alternating currents for the heating elements 12a-d during operation of the induction hob. For cooling, the power electronics components 62 are in direct contact with an aluminum heat sink 60 of the cooling unit 56. In addition, the cooling unit 56 includes a cooling fan 58, which draws cooling air perpendicular to the electronics carrier unit 14 and ejects parallel to the electronics carrier unit 14 through channels of the aluminum heat sink 60. Since the cable lead-throughs 24, 25 are located outside the surface area of the heating element carrier unit 10 provided for the electronics carrier unit 14, a simple contacting of the power supply lines 26a-d to the electronic unit 16 is possible.

Fig. 4 zeigt die vollständig montierte Kochfeldvorrichtung in einer perspektivischen Ansicht von unten. Die Kochfeldvorrichtung weist eine Abdeckeinheit 28 aus Aluminium auf, die dazu vorgesehen ist, die Elektronikeinheit 16 abzudecken. Die Abdeckeinheit 28 ist zumindest im Wesentlichen in Form einer rechteckigen Wanne mit zu einer Bodenwand 64 senkrechten Seitenwänden 66, 67, 68, 70 ausgeführt. Die Bodenwand 64 weist oberhalb des Kühllüfters 58 Lufteintrittsöffnungen 72 auf, durch die der Kühllüfter 58 in zumindest einem Betriebszustand Kühlluft ansaugt. Die Seitenwand 66 der Abdeckeinheit 28 weist Luftaustrittsöffnungen 74 auf, durch die in zumindest einem Betriebszustand die erwärmte Kühlluft aus dem Aluminiumkühlkörper 60 ausgestoßen wird. An zwei gegenüberliegenden Seitenwänden 68, 70 umfasst die Abdeckeinheit 28 angeformte und überstehende Laschen 76, 78, die in einem montierten Zustand senkrecht zur Heizelementträgereinheit 10 stehen. Die Abdeckeinheit 28 umgreift die Elektronikträgereinheit 14 mit den Seitenwänden 66, 67, 68, 70. Die Abdeckeinheit 28 umgreift die Heizelementträgereinheit 10 auf zwei gegenüberliegenden Seitenkanten der Heizelementträgereinheit 10 mit den angeformten Laschen 76, 78. Die Trägereinheit 30 verfügt über einen Überlappungsbereich 34 mit den Laschen 76, 78 der Abdeckeinheit 28 (vgl. Fig. 5). Im Überlappungsbereich 34 berühren sich die Trägereinheit 30 und die Abdeckeinheit 28 unmittelbar und ihre Oberflächen verlaufen parallel zueinander. Die Trägereinheit 30 und die Abdeckeinheit 28 sind im Überlappungsbereich 34 miteinander verschraubt. Die Trägereinheit 30 verfügt über Gewindebohrungen und die Laschen 76, 78 der Abdeckeinheit 28 über korrespondierende Ausnehmungen (vgl. Fig. 5). Die Heizelementträgereinheit 10 und die Abdeckeinheit 28 weisen korrespondierende Steckelemente 36, 37 auf, über die die Heizelementträgereinheit 10 und die Abdeckeinheit 28 miteinander verbunden sind. Die Abdeckeinheit 28 weist an der Seitenwand 66 mit den Luftaustrittsöffnungen 74 an einem Rand der Seitenwand 66 angeformte Stecklaschen 80, 82 auf, die in Steckausnehmungen 84, 86 der Heizelementträgereinheit 10 passen. Die Heizelementträgereinheit 10 und die Abdeckeinheit 28 sind gegenüber einer Relativbewegung parallel zur Heizelementträgereinheit 10 durch die Steckelemente 36, 37 fixiert. Eine Fixierung gegenüber einer Relativbewegung senkrecht zur Heizelementträgereinheit 10 erfolgt durch die Verschraubung der Abdeckeinheit 28 mit der Trägereinheit 30. Die Heizelementträgereinheit 10 ist zwischen der Trägereinheit 30 und der Abdeckeinheit 28 fixiert (vgl. Fig. 5). Fig. 4 shows the fully assembled hob device in a perspective view from below. The cooktop apparatus has a cover unit 28 made of aluminum, which is intended to cover the electronics unit 16. The cover unit 28 is embodied at least substantially in the form of a rectangular tub with side walls 66, 67, 68, 70 that are perpendicular to a bottom wall 64. The bottom wall 64 has, above the cooling fan 58, air inlet openings 72, through which the cooling fan 58 sucks in cooling air in at least one operating state. The side wall 66 of the cover unit 28 has air outlet openings 74 through which the heated cooling air is expelled from the aluminum heat sink 60 in at least one operating state. On two opposite side walls 68, 70, the cover unit 28 comprises integrally formed and protruding tabs 76, 78 which, in an assembled state, are perpendicular to the heating element carrier unit 10. The cover unit 28 surrounds the electronics carrier unit 14 with the side walls 66, 67, 68, 70. The cover unit 28 surrounds the heating element carrier unit 10 on two opposite side edges of the heating element carrier unit 10 with the integrally formed tabs 76, 78. The carrier unit 30 has an overlap region 34 with the Tabs 76, 78 of the cover unit 28 (see. Fig. 5 ). In the overlapping area 34, the carrier unit 30 and the cover unit 28 touch directly and their surfaces run parallel to each other. The carrier unit 30 and the cover unit 28 are screwed together in the overlapping area 34. The carrier unit 30 has threaded holes and the tabs 76, 78 of the cover unit 28 via corresponding recesses (see. Fig. 5 ). The heating element carrier unit 10 and the cover unit 28 have corresponding plug-in elements 36, 37, via which the heating element carrier unit 10 and the cover unit 28 are connected to one another. The cover unit 28 has on the side wall 66 with the air outlet openings 74 on one edge of the side wall 66 integrally formed on tabs 80, 82, which fit into plug-in recesses 84, 86 of the Heizelementträgereinheit 10. The heating element carrier unit 10 and the cover unit 28 are fixed relative to a relative movement parallel to the Heizelementträgereinheit 10 by the plug-in elements 36, 37. A fixation relative to a relative movement perpendicular to the Heizelementträgereinheit 10 takes place by the screwing of the cover unit 28 with the carrier unit 30. The heating element carrier unit 10 is fixed between the carrier unit 30 and the cover unit 28 (cf. Fig. 5 ).

Alternativ oder zusätzlich zu den hier erwähnten Befestigungsarten kann auch jede andere, einem Fachmann als sinnvoll erscheinende Befestigungsart, insbesondere eine Schraub- und/oder eine Kleb- und/oder eine Rastverbindung, zum Einsatz kommen.As an alternative or in addition to the types of attachment mentioned here, it is also possible to use any other type of fastening which appears appropriate to a person skilled in the art, in particular a screw connection and / or an adhesive connection and / or a latching connection.

Bei einer Montage des Kochfelds wird wie folgt vorgegangen. In einem Schritt wird die Trägereinheit 30 auf die Kochfeldplatte 32 aufgeklebt. In einem Schritt werden die Heizelemente 12a-d und die Bedienelektronikträgereinheit 44 auf der ersten Seite 38 der Heizelementträgereinheit 10 befestigt. Die Bedienelektronikeinheit 46 wird an der Bedienelektronikträgereinheit 44 montiert. Die Stromversorgungsleitungen 26a-d der Heizelemente 12a-d werden durch die Kabeldurchführungen 24, 25 auf die zweite Seite 40 der Heizelementträgereinheit 10 geführt. Ferner werden die Stromversorgungsleitungen und Signalleitungen der Bedienelektronikeinheit 46 durch die Kabeldurchführung 50 auf die zweite Seite 40 der Heizelementträgereinheit 10 geführt. In einem Schritt wird die Trägereinheit 30 zusammen mit der angeklebten Kochfeldplatte 32 auf die erste Seite 38 der Heizelementträgereinheit 10 aufgelegt. Danach wird die komplette Anordnung umgedreht. Alternativ kann die Heizelementträgereinheit 10 umgedreht und auf die an die Kochfeldplatte 32 angeklebte Trägereinheit 30 gelegt werden. In einem Schritt wird die Elektronikträgereinheit 14 an der zweiten Seite 40 der Heizelementträgereinheit 10 befestigt. Danach werden die Elektronikeinheit 16 und die Kühleinheit 56 an der Elektronikträgereinheit 14 montiert. In einem Schritt werden die Stromversorgungsleitungen 26a-d der Heizelemente 12a-d und die Stromversorgungsleitungen und die Signalleitungen der Bedienelektronikeinheit 46 mit der Elektronikeinheit 16 verbunden. In einem Schritt wird die Abdeckeinheit 28 über die Elektronikträgereinheit 14 gestülpt, wobei die Stecklaschen 80, 82 an der Seitenwand 66 der Abdeckeinheit 28 in die Steckausnehmungen 84, 86 der Heizelementträgereinheit 10 gesteckt werden. In einem Schritt wird die Abdeckeinheit 28 an den Laschen 76, 78 der Seitenwände 68, 70 mit der Trägereinheit 30 verschraubt.When installing the hob, proceed as follows. In one step, the carrier unit 30 is glued to the hob plate 32. In one step, the heating elements 12a-d and the control electronics carrier unit 44 are fastened on the first side 38 of the heating element carrier unit 10. The operating electronics unit 46 is mounted on the control electronics carrier unit 44. The power supply lines 26a-d of the heating elements 12a-d are led through the cable feedthroughs 24, 25 to the second side 40 of the heating element carrier unit 10. Further, the power supply lines and signal lines of the operating electronics unit 46 are guided through the grommet 50 to the second side 40 of the Heizelementträgereinheit 10. In one step, the carrier unit 30 is placed together with the glued cooking field plate 32 on the first side 38 of the Heizelementträgereinheit 10. Afterwards the complete arrangement is turned over. Alternatively, the heater support unit 10 may be turned over and placed on the support unit 30 adhered to the cooktop panel 32. In one step, the electronics carrier unit 14 is attached to the second side 40 of the Heizelementträgereinheit 10. Thereafter, the electronics unit 16 and the cooling unit 56 are mounted on the electronics carrier unit 14. In one step, the power supply lines 26a-d of the heating elements 12a-d and the power supply lines and the signal lines of the operating electronics unit 46 are connected to the electronic unit 16. In one step, the cover unit 28 is slipped over the electronics carrier unit 14, the plug-in tabs 80, 82 being inserted on the side wall 66 of the cover unit 28 into the plug-in recesses 84, 86 of the heating element carrier unit 10. In one step, the cover unit 28 bolted to the tabs 76, 78 of the side walls 68, 70 with the support unit 30.

Alternativ kann die Bedienelektronikeinheit 46 auch auf der Bedienelektronikträgereinheit 44 vormontiert werden. In diesem Fall wird die Bedienelektronikträgereinheit 44 zusammen mit der vormontierten Bedienelektronikeinheit 46 auf der ersten Seite 38 der Heizelementträgereinheit 10 befestigt. Des Weiteren können die Elektronikeinheit 16 und die Kühleinheit 56 auch auf der Elektronikträgereinheit 14 vormontiert werden. In diesem Fall wird die Elektronikträgereinheit 14 zusammen mit der vormontierten Elektronikeinheit 16 und der vormontierten Kühleinheit 56 auf der zweiten Seite 40 der Heizelementträgereinheit 10 befestigt.Alternatively, the operating electronics unit 46 can also be preassembled on the control electronics carrier unit 44. In this case, the control electronics carrier unit 44 is fastened together with the preassembled operating electronics unit 46 on the first side 38 of the heating element carrier unit 10. Furthermore, the electronics unit 16 and the cooling unit 56 can also be preassembled on the electronics carrier unit 14. In this case, the electronics carrier unit 14 is mounted on the second side 40 of the heater support unit 10 together with the preassembled electronics unit 16 and the preassembled cooling unit 56.

Figur 6 zeigt den gleichen Schnitt wie in Figur 5 mit dem Unterschied, dass die Laschen 76, 78 der Abdeckeinheit 28 nicht gebogen werden, indem sie keinen Überlappungsbereich 34 bilden, bis die Trägereinheit 30 erreicht wird. Das heißt, die Abdeckeinheit 28 liegt auf der Trägereinheit von Heizelementen 10 auf, und die Trägereinheit 30 und die Abdeckeinheit 28 sind miteinander verschraubt, wobei die Trägereinheit von Heizelementen 10 dazwischen gehalten wird. Die Trägereinheit 30 verfügt über Schraubenbohrungen, und die Laschen 76, 78 der Abdeckeinheit 28 und die Trägereinheit von Heizelementen 10 über korrespondierende Ausnehmungen. Dies ist im letzten Schritt des Montageprozesses des Kochfeldes vorteilhaft, da beim Montieren aller Komponenten auf der Kochfeldplatte 32 die Schraubrichtung senkrecht zu dieser, und somit ergonomischer für den Bediener der Montagestraße sein wird. Bezugszeichen 10 Heizelementträgereinheit 48a Flügel 12a Heizelement 48b Flügel 12b Heizelement 48c Flügel 12c Heizelement 48d Flügel 12d Heizelement 50 Kabeldurchführung 14 Elektronikträgereinheit 52 Seitenwand 16 Elektronikeinheit 54 Rastöffnung 18 Boden 56 Kühleinheit 20 Befestigungsmittel 58 Kühllüfter 22 Außenbereich 60 Aluminiumkühlkörper 24 Kabeldurchführung 62 Leistungselektronikbauteil 25 Kabeldurchführung 64 Bodenwand 26a Stromversorgungsleitungen 66 Seitenwand 26b Stromversorgungsleitungen 67 Seitenwand 26c Stromversorgungsleitungen 68 Seitenwand 26d Stromversorgungsleitungen 70 Seitenwand 28 Abdeckeinheit 72 Lufteintrittsöffnungen 30 Trägereinheit 74 Luftaustrittsöffnungen 32 Kochfeldplatte 76 Lasche 34 Überlappungsbereich 78 Lasche 36 Steckelement 80 Stecklasche 37 Steckelement 82 Stecklasche 38 Erste Seite 84 Steckausnehmungen 40 Zweite Seite 86 Steckausnehmungen 42 Bedienvorrichtung 44 Bedienelektronikträgereinheit 46 Bedienelektronikeinheit FIG. 6 shows the same cut as in FIG. 5 with the difference that the tabs 76, 78 of the cover unit 28 are not bent by not forming an overlap region 34 until the support unit 30 is reached. That is, the cover unit 28 rests on the support unit of heating elements 10, and the support unit 30 and the cover unit 28 are screwed together with the support unit held by heating elements 10 therebetween. The support unit 30 has screw holes, and the tabs 76, 78 of the cover unit 28 and the support unit of heating elements 10 via corresponding recesses. This is advantageous in the last step of the assembly process of the cooktop, as when mounting all the components on the cooktop panel 32, the screwing direction will be perpendicular to it and thus more ergonomic to the operator of the assembly line. reference numeral 10 Heizelementträgereinheit 48a wing 12a heating element 48b wing 12b heating element 48c wing 12c heating element 48d wing 12d heating element 50 Grommet 14 Electronic support unit 52 Side wall 16 electronics unit 54 latching opening 18 ground 56 cooling unit 20 fastener 58 cooling fan 22 outdoors 60 Aluminum heat sink 24 Grommet 62 Power electronics component 25 Grommet 64 bottom wall 26a Power lines 66 Side wall 26b Power lines 67 Side wall 26c Power lines 68 Side wall 26d Power lines 70 Side wall 28 capping 72 Air inlet openings 30 support unit 74 Air outlet openings 32 Hotplate 76 flap 34 overlap area 78 flap 36 plug-in element 80 insertion flap 37 plug-in element 82 insertion flap 38 First page 84 plug recesses 40 Second page 86 plug recesses 42 operating device 44 Operating electronics support unit 46 Control electronics unit

Claims (12)

  1. Hotplate device having a heating element support unit (10) for supporting at least one heating element (12a-d) and an electronic support unit (14) which differs from an electronic circuit board and the heating element support unit (10) for supporting at least one electronic unit (16), wherein the heating element support unit (10) and at least one part of the electronic unit (16) are arranged on different sides of the electronic support unit (14), characterised in that the heating element support unit (10) is formed entirely from sheet metal.
  2. Hotplate device according to claim 1, characterised in that the electronic support unit (14) at least partially encompasses a receiving region for the electronic unit (16).
  3. Hotplate device according to one of the preceding claims, characterised in that the electronic support unit (14) has at least one base (18) with fastening means (20) for fastening the electronic support unit (14).
  4. Hotplate device according to claim 3, characterised in that the fastening means (20) are provided to fasten the electronic support unit (14) to the heating element support unit (10).
  5. Hotplate device according to one of the preceding claims, characterised in that in an outer region (22) the heating element support unit (10) has at least one cable feedthrough (24, 25) for feeding through power supply lines (26a-d) of at least one heating element (12a-d).
  6. Hotplate device according to one of the preceding claims, characterised by a cover unit (28), which is provided to cover the electronic unit (16).
  7. Hotplate device according to claim 6, characterised in that the cover unit (28) at least partially encompasses the electronic support unit (14).
  8. Hotplate device according to claim 7, characterised in that the cover unit (28) at least partially encompasses the heating element support unit (10).
  9. Hotplate device according to one of claims 6 to 8, characterised by a support unit (30), which is connected to a hotplate (32) and which has an overlap region (34) with the cover unit (28).
  10. Hotplate device according to one of claims 6 to 9, characterised in that the heating element support unit (10) and the cover unit (28) have corresponding plug-in elements (36, 37), by way of which the heating element support unit (10) and the cover unit (28) are connected to one another.
  11. Hob, in particular induction hob, having a hotplate device according to one of the preceding claims.
  12. Method for assembling a hob, having a hotplate device according to one of claims 1 to 10, wherein the heating elements (12a-d) are fastened on one side (38) of the heating element support unit (10) and the electronic support unit (14) is fastened on a second side (40) of the heating element support unit (10) which faces the first side (38).
EP11178379.1A 2010-09-06 2011-08-23 Hotplate device Active EP2427032B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201031328 2010-09-06

Publications (3)

Publication Number Publication Date
EP2427032A2 EP2427032A2 (en) 2012-03-07
EP2427032A3 EP2427032A3 (en) 2013-01-16
EP2427032B1 true EP2427032B1 (en) 2016-12-21

Family

ID=44651157

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11178379.1A Active EP2427032B1 (en) 2010-09-06 2011-08-23 Hotplate device

Country Status (2)

Country Link
EP (1) EP2427032B1 (en)
ES (1) ES2614406T3 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10605464B2 (en) 2012-10-15 2020-03-31 Whirlpool Corporation Induction cooktop
US10893579B2 (en) 2017-07-18 2021-01-12 Whirlpool Corporation Method for operating an induction cooking hob and cooking hob using such method
US10993292B2 (en) 2017-10-23 2021-04-27 Whirlpool Corporation System and method for tuning an induction circuit
US11140751B2 (en) 2018-04-23 2021-10-05 Whirlpool Corporation System and method for controlling quasi-resonant induction heating devices
US11212880B2 (en) 2012-10-15 2021-12-28 Whirlpool Emea S.P.A. Induction cooking top

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2394996B1 (en) * 2011-01-10 2014-01-17 BSH Electrodomésticos España S.A. Cooking Field Device
DE102012219265A1 (en) * 2011-11-16 2013-05-16 BSH Bosch und Siemens Hausgeräte GmbH Home appliance device
EP2629586B1 (en) * 2012-02-20 2020-04-08 Electrolux Home Products Corporation N.V. An induction cooking hob
EP2703725B1 (en) * 2012-09-03 2016-04-27 BSH Hausgeräte GmbH Hotplate device
ES2485565B1 (en) * 2013-02-11 2015-05-22 Bsh Electrodomésticos España, S.A. Cooking field shielding element support device
US9730278B2 (en) 2013-03-28 2017-08-08 Panasonic Intellectual Property Management Co., Ltd. Induction heating cooking device
ES2883593T3 (en) * 2013-06-21 2021-12-09 Bsh Hausgeraete Gmbh Cooking field device
DE102013107089B4 (en) 2013-07-05 2023-02-09 Miele & Cie. Kg induction hob
WO2015040865A1 (en) * 2013-09-19 2015-03-26 パナソニックIpマネジメント株式会社 Inductive heating cooker
ES2537928B1 (en) * 2013-12-05 2016-04-20 Bsh Electrodomésticos España, S.A. Cooking Field Device
ES2537503B1 (en) * 2013-12-05 2016-03-23 Bsh Electrodomésticos España, S.A. Cooking Field Device
EP3030042B1 (en) * 2014-12-03 2017-08-23 Electrolux Appliances Aktiebolag Induction hob
EP3267766B1 (en) * 2015-03-05 2020-11-25 Panasonic Intellectual Property Management Co., Ltd. Induction heating cooker
ES2684128B1 (en) * 2017-03-30 2019-07-29 Bsh Electrodomesticos Espana Sa Home appliance device and procedure for manufacturing a home appliance device
ES2928849T3 (en) * 2019-01-31 2022-11-23 Miele & Cie cooktop module
DE102019206476A1 (en) * 2019-05-06 2020-11-12 E.G.O. Elektro-Gerätebau GmbH Hob with a flat support plate for heating devices and a method for producing such a support plate
DE102022128987A1 (en) 2022-11-02 2024-05-02 Miele & Cie. Kg Induction hob

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE50113954D1 (en) * 2000-02-04 2008-06-26 Aeg Hausgeraete Gmbh Induction cooking means
US6410892B1 (en) * 2001-06-19 2002-06-25 Bsh Home Appliances Corporation Cooktop having a flat glass ceramic cooking surface
DE10163839B4 (en) 2001-12-22 2005-01-05 AEG Hausgeräte GmbH Cooker, in particular induction cooker
DE102005005527A1 (en) * 2005-01-31 2006-08-03 E.G.O. Elektro-Gerätebau GmbH Induction heating device for cooking area of hob tray, has supply part converting applied voltage into power control for induction coil, where device is formed as installation-finished and/or connection-finished component
US8884197B2 (en) * 2007-02-03 2014-11-11 Western Industries, Inc. Induction cook top with heat management system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10605464B2 (en) 2012-10-15 2020-03-31 Whirlpool Corporation Induction cooktop
US11212880B2 (en) 2012-10-15 2021-12-28 Whirlpool Emea S.P.A. Induction cooking top
US11655984B2 (en) 2012-10-15 2023-05-23 Whirlpool Corporation Induction cooktop
US10893579B2 (en) 2017-07-18 2021-01-12 Whirlpool Corporation Method for operating an induction cooking hob and cooking hob using such method
US10993292B2 (en) 2017-10-23 2021-04-27 Whirlpool Corporation System and method for tuning an induction circuit
US11140751B2 (en) 2018-04-23 2021-10-05 Whirlpool Corporation System and method for controlling quasi-resonant induction heating devices

Also Published As

Publication number Publication date
ES2614406T3 (en) 2017-05-31
EP2427032A3 (en) 2013-01-16
EP2427032A2 (en) 2012-03-07

Similar Documents

Publication Publication Date Title
EP2427032B1 (en) Hotplate device
EP1844630B1 (en) Induction heating device and ceramic hob cavity comprising said type of induction heating device
EP2703724B1 (en) Device for a cooking hob and method for assembling a device for a cooking hob
EP2659195B1 (en) Kitchen hob
DE19700065C2 (en) Filter fan or outlet filter
DE112015003987T5 (en) Circuit assembly, electrical distributor and circuit assembly manufacturing method
EP2595450A2 (en) Hotplate device
DE102013218714A1 (en) Cooking field device i.e. induction cooking field device, has spring elements pressing heating units against cooking field plate and in detent connection with assembly strips, which connect cooking field housing unit with field plate
EP2475220A1 (en) Hotplate device
DE102013107089B4 (en) induction hob
DE102012219264A1 (en) Home appliance device
EP0818133A1 (en) Control unit for a motor vehicle
EP2816869A1 (en) Hotplate device
EP2256416B1 (en) Support assembly
EP2156706B1 (en) Stove top
EP2703725B1 (en) Hotplate device
DE102013207787A1 (en) Cooking hob device e.g. induction cooking device has holding unit having extension plane that partially receives heating units and separator that partially divides recess portion of holding unit into two sections
EP2703726B1 (en) Hotplate device
DE102013106849A1 (en) Cooking appliance
EP2645833B1 (en) Domestic appliance
EP3691412B1 (en) Cooking field module
DE102012101829A1 (en) Induction hob used in kitchen, has control and power electronic unit that is provided with contact device whose contact region is arranged within aperture above supporting metal sheet
DE202004008514U1 (en) Induction cool top platform for a domestic cooker hob has a cool top platform plate and an inductor fitted underneath in a housing with a base and raised side panels linked to the plate
EP1771686A1 (en) Cooking hob with several heating devices
DE102020206865A1 (en) Hob, arrangement of a hob in a worktop and method for arranging a hob in a worktop

Legal Events

Date Code Title Description
AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: H05B 6/12 20060101AFI20121207BHEP

17P Request for examination filed

Effective date: 20130716

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

17Q First examination report despatched

Effective date: 20130923

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: BSH HAUSGERAETE GMBH

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20160722

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 856474

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170115

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502011011372

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170322

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170321

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2614406

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20170531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170421

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170421

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170321

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502011011372

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20170922

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20170823

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170831

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170831

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20170831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170823

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170823

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170823

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 856474

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170823

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170823

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20110823

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161221

REG Reference to a national code

Ref country code: DE

Ref legal event code: R084

Ref document number: 502011011372

Country of ref document: DE

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230504

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20230918

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20230821

Year of fee payment: 13

Ref country code: DE

Payment date: 20230831

Year of fee payment: 13