EP1089108A2 - Optische Schalter, basierend auf Mikrospiegeln in Nuten und integrierten Lichtwellenleitern - Google Patents

Optische Schalter, basierend auf Mikrospiegeln in Nuten und integrierten Lichtwellenleitern Download PDF

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Publication number
EP1089108A2
EP1089108A2 EP00114440A EP00114440A EP1089108A2 EP 1089108 A2 EP1089108 A2 EP 1089108A2 EP 00114440 A EP00114440 A EP 00114440A EP 00114440 A EP00114440 A EP 00114440A EP 1089108 A2 EP1089108 A2 EP 1089108A2
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EP
European Patent Office
Prior art keywords
trench
waveguides
waveguide
switching element
micromirror
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Granted
Application number
EP00114440A
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English (en)
French (fr)
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EP1089108A3 (de
EP1089108B1 (de
Inventor
Julie E. Fouquet
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Avago Technologies International Sales Pte Ltd
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Agilent Technologies Inc
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/351Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3514Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element moving along a line so as to translate into and out of the beam path, i.e. across the beam path
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3538Optical coupling means having switching means based on displacement or deformation of a liquid
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • G02B6/305Optical coupling means for use between fibre and thin-film device and having an integrated mode-size expanding section, e.g. tapered waveguide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/354Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/35442D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3546NxM switch, i.e. a regular array of switches elements of matrix type constellation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3564Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3566Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details involving bending a beam, e.g. with cantilever
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3564Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3564Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357Electrostatic force
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/35Optical coupling means having switching means
    • G02B6/3596With planar waveguide arrangement, i.e. in a substrate, regardless if actuating mechanism is outside the substrate
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers

Definitions

  • the invention relates generally to optical switching elements and more particularly to methods and mechanisms for manipulating optical signals within a switch.
  • the switching element is shown as including first and second input waveguides 14 and 16 and first and second output waveguides 18 and 20.
  • the core material is primarily silicon dioxide, but with other materials that affect the refractive index of the core.
  • the cladding layers are formed of a material having a refractive index that is substantially lower than that of the core material, so that optical signals are guided along the core material.
  • a trench 22 is etched through the core material to the silicon substrate in which the cladding layers and core material are formed.
  • the waveguides intersect the trench at an angle of incidence greater than the critical angle of total internal reflection (TIR) when the trench is filled with a vapor or gas.
  • TIR critical angle of total internal reflection
  • One wall of the trench 22 intersects the crosspoints of the waveguides 14-20.
  • TIR diverts light from the first input waveguide 14 to the second output waveguide 20, unless an index-matching fluid is located within the gap between the first input waveguide 14 and the first output waveguide 18.
  • the fluid within the trench has a refractive index that substantially matches the refractive index of the core material.
  • An acceptable liquid is a combination of isopropyl alcohol and glycerol. Another acceptable liquid is M-pyrol.
  • two microheaters 24 and 26 control the position of a bubble 28 within the fluid-containing trench 22.
  • one of the microheaters is brought to a temperature sufficiently high to form the gas bubble. Once formed, the bubble can be maintained in position with a reduced current to the microheater.
  • the bubble In Fig. 1, the bubble is located at the intersection of the core waveguides 14-20. Consequently, an input signal along the first input waveguide 14 will encounter a refractive index mismatch upon reaching the wall of the trench 22. TIR causes the input signals to be diverted to the second output waveguide 20.
  • the switching element is shown in a reflecting state in Fig. 1.
  • the activation of the microheater 24 pins the bubble at the intersection, so that the reflecting state is maintained as long as the microheater is activated.
  • the microheater 24 at the intersection of the waveguides 14-20 has been deactivated and the second microheater 26 has been activated.
  • the bubble 28 is strongly attracted to the activated microheater. This allows index-matching fluid to fill the gap at the intersection of the waveguides.
  • the switching element is in a transmitting state, since the first input waveguide 14 is optically coupled to the collinear first output waveguide 18. Moreover, the second input waveguide 16 is optically coupled to the collinear second output waveguide 20.
  • Figs. 1 and 2 represent only one available approach to manipulating fluid within a trench of a switching element.
  • Other approaches are described in the Fouquet et al. patent.
  • a single heater may be used to vaporize index-matching fluid at the intersections of waveguides in order to toggle a switching element from a reflective state to a transmissive state.
  • What is needed is an optical switching element and a method for fabricating switching matrices that enable optical switching with low insertion loss, low crosstalk, and high scalability, with long-term reliability.
  • a switching element for a planar lightwave circuit includes a waveguide substrate in which at least two light-transmitting waveguides are formed of a core layer to extend along the substrate to a trench, so that optical coupling between the waveguides is dependent upon optical characteristics exhibited at the trench.
  • a displaceable member is moved relative to the trench, such that a selected pair of waveguides is optically coupled when the displaceable member is in the first position and the same pair of waveguides is optically isolated when the displaceable member is in the second position.
  • the displaceable member is the micromirror that is manipulated between the second position (i.e., a non-reflecting position) in which a first input waveguide is optically coupled to a first output waveguide and the first position (i.e., a reflecting position) in which the first input waveguide is optically coupled to a second output waveguide.
  • the switching element there is no liquid within the trench. It follows that the angle of incidence of a waveguide at the wall of the trench must be less than the critical angle required for total internal reflection (TIR). Consequently, an optical signal can enter the trench to be reflected by the micromirror when the micromirror is in the reflecting state. As a result of the ray bending (i.e., refraction) that will occur at the interfaces of the air in the trench and the input and output waveguides, the waveguides that are on opposite sides of the trench should be parallel, with an offset that is calculated using Snell's Law.
  • Unidirectional reflection can be reduced by depositing an anti-reflection coating on the sidewalls of the air-filled trench, so that the resulting switching element is less susceptible to loss and crosstalk. If using two cross-connect switching arrays, one for each polarization component, then the angle of incidence of the waveguides to the trench can be chosen to be Brewster's angle, which in this case would be approximately 34°. This substantially eliminates reflections from the waveguide/air interfaces at trenches which do not contain liquid for one of the two polarizations.
  • the trenches are normally filled with liquid.
  • the angle of incidence of the waveguides to the trenches can assume a large range of values.
  • Movement of the mirror between the reflecting and non-reflecting positions may be in the direction perpendicular to the major surfaces of the waveguide substrate.
  • a modified multi-pin dot matrix printer engine may be used.
  • MEMS micro-electromechanical system
  • More conventional MEMS actuators may be used to manipulate the mirror in the direction parallel to the axis of the trench.
  • Such actuators can function in the presence of a non-conducting liquid, such as the refractive index-matching fluids used in optical switching elements of the type described with reference to Figs. 1 and 2.
  • electrostatic actuator technology is limited to approximately a 25 ⁇ m range of motion, which may not be adequate to remove a small mirror from a 32 ⁇ m-long intersection length along the trench for crossing 16 ⁇ m-wide waveguides.
  • the approach of using electrostatic actuators requires selection of a new kind of actuator having a larger "throw” or requires application of a mirror and actuator combination to fit within a trench intersected by waveguides that are 12.5 ⁇ m wide or less, so that the mirror need not move more than 25 ⁇ m.
  • the waveguides expand as they approach the trench.
  • the expansion is ideally adiabatic. That is, the cross sectional area of the tapering waveguide should change slowly over distance, so that the lowest order local normal mode of the waveguide propagates through the tapering region without a cumulative transfer of power to higher order local normal modes.
  • the size of the waveguides is one factor in determining the required throw of the actuator and is one factor in determining the minimal dimensions of the micromirror.
  • Another factor is the angle of incidence of the waveguides to the trench walls, so that fluid-free switching elements may require less translation and smaller micromirrors (since fluid-free elements may have smaller angles of incidence).
  • a planar lightwave circuit 30 is shown as including a waveguide substrate 32.
  • the waveguide substrate is preferably a silicon chip, but other materials, such as silica, may be used.
  • planar lightwave circuit 30 At one end of the planar lightwave circuit 30 are four input wave-guides 34, 35, 36 and 37.
  • the same side of the circuit includes three output waveguides 38, 39 and 40.
  • the number of output waveguides will match the number of input waveguides, but Fig. 3 is intended to illustrate the principles of the invention, rather than to illustrate a working model.
  • the planar lightwave circuit 30 At the opposite end of the planar lightwave circuit 30 are three add waveguides 42, 43 and 44 and three drop waveguides 46, 47 and 48.
  • the number of drop waveguides 46-48 at the far end of the circuit will match the number of input waveguides 34-37 at the near end of the circuit.
  • the number of far-end add waveguides 42-44 will typically equal the number of near-end output waveguides 38-40.
  • the number of components in the drawing has been reduced in order to facilitate explanation of the circuit.
  • Each of the waveguides is formed of a core material, such as SiO 2 that is doped with Ge or TiO 2 (and possibly B 2 O 3 and/or P 2 O 5 ) to define a first refractive index. While not shown separately in Fig. 3, conventionally there are upper and lower cladding layers that retard the escape of light energy from the waveguides. Cladding material may also be primarily SiO 2 , possibly with a dopant, such as B 2 O 3 and/or P 2 O 5 , to define a second refractive index different than the first refractive index. Because of the difference in refractive indices, optical signals are guided along the waveguide cores.
  • the waveguides of Fig. 3 may be formed using conventional integrated circuit fabrication techniques or flame hydrolysis deposition.
  • the core material is patterned using photolithography or other known approaches.
  • a pair of trenches 58 and 60 are formed at the crosspoints of the intermediate waveguides 50-56 with near-end and far-end waveguides 34-48.
  • the optical coupling among the waveguides is dependent upon the localized optical characteristics at the crosspoints. For example, an input signal along input waveguide 34 will enter the intermediate waveguide 50 if the localized region between the waveguides 34 and 50 is in a transmissive state.
  • an input signal propagating along the input waveguide 34 will be reflected to the output waveguide 38 if the region at the crosspoint of these waveguides is in a reflecting state. If the localized regions aligned with the input waveguide 34 and the output waveguide 39 are both in transmissive states, but the crosspoint of the intermediate waveguides 50 and 54 is in a reflecting state, a signal that is received via the input waveguide 34 will propagate into the intermediate waveguide 50, be reflected into the intermediate waveguide 54, and exit through the output waveguide 39.
  • the signal that is received via the input waveguide 34 can be directed to any one of the three output waveguides 38, 39 and 40.
  • Increased flexibility in signal manipulation can be achieved by using the add ports 42-44 and the drop ports 46-48 as secondary input ports and output ports, respectively, during times in which the primary input and output ports 34-40 are optically coupled to each other.
  • the micromirror that is controlled to determine the transmissive/reflective state at the junctions of waveguides 50 and 54 and waveguides 42 and 46 has a non-zero thickness, so if one side of the micromirror is at the crosspoint of the four waveguides, the other side will be offset from that crosspoint. Since multimode applications are more tolerant of alignment impreciseness, this approach to increasing flexibility is likely to have better results in multimode applications than in single mode applications.
  • Figs. 4 and 5 illustrate one embodiment of the invention.
  • a displaceable micromirror 62 is shown in a reflecting position, while the same displaceable micromirror is shown in a transmitting position in Fig. 5.
  • the micromirror slides along the trench 58.
  • preferred embodiments will be described below.
  • an input signal along the input waveguide 35 will enter the trench 58 and be reflected at the surface of the micromirror 62.
  • the reflected optical signal will enter the output waveguide 39.
  • the micromirror in the transmitting position of Fig. 5 the input signal propagates into the trench 58 and exits via the intermediate waveguide 51. Consequently, by manipulating the micromirror, the direction of the optical signal can be switched.
  • each trenches are free of fluid-matching liquid.
  • each trench is filled with a fluid having a refractive index similar to the refractive index of the core material used to form the waveguides 35, 39, 51 and 54.
  • An acceptable liquid is a combination of isopropyl alcohol and glycerol.
  • Another acceptable liquid is M-pyrol.
  • the angle of incidence of the waveguides 35, 39, 51 and 54 on the walls of the trench 58 must be less than the critical angle required for total internal reflection (TIR). With an incidence angle less than that required for TIR, an input optical signal will enter into the trench 58 to be reflected by the mirror 62 or will pass through the opposite walls of the trench, if the micromirror is in the transmitting state of Fig. 5. As a result of ray bending (i.e., refraction), at the interfaces of the air in the trench and the waveguides, the waveguides that are on opposite sides of the trench should be slightly misaligned, as shown in Figs. 4 and 5.
  • TIR total internal reflection
  • Undesired reflections can be reduced by depositing an anti-reflection coating on the sidewalls of the air-filled trench, so that the resulting switching element is less susceptible to loss and crosstalk.
  • anti-reflection coatings provide a controlled transition between the refractive characteristics of the waveguide material and the refractive characteristics of the atmosphere within the trench. If using two cross-connected switching arrays, one for each polarization component, and the initial polarization component is rotated, then the angle of incidence of the waveguides to the trench can be chosen to be Brewster's angle, which in this case would be approximately 34°. This substantially eliminates reflection from the waveguide/air interfaces at trenches which do not contain index-matching liquid, and no anti-reflection coating is needed.
  • the angle of incidence of the waveguides to the trenches can assume a large range of values.
  • the micromirror 62 moves parallel to the major surface of the substrate 32 on which the waveguides 35, 39, 51 and 54 are fabricated.
  • the sliding motion may be achieved using MEMS actuators.
  • Such actuators can function in the presence of non-conducting liquid, such as the refractive index-matching liquids identified above.
  • many currently available electrostatic actuators are limited to a range of motion of approximately 25 ⁇ m, which may not be adequate to remove the mirror from a ⁇ 32 ⁇ m-long intersection length along the trench for crossing waveguides having a width of 16 ⁇ m.
  • the sliding-motion approach of using electrostatic actuators may require selection of an actuator having an improved "throw” or requires application of a micromirror-and-actuator combination to fit in a trench in which the waveguides are 12.5 ⁇ m wide or less, so that the micromirror does not need to move more than 25 ⁇ m.
  • an embodiment of Figs. 6 and 7 utilizes micromirror motion perpendicular to the major surfaces of the substrate on which the waveguides are fabricated.
  • a possible implementation is to utilize a modified multi-pin dot matrix printer engine.
  • three micromirrors 64, 66 and 68 have positions that are determined by independent manipulation of the pins 70, 72 and 74.
  • the first and third micromirrors 64 and 68 are shown in the lowered, transmitting position.
  • the center micromirror 66 has been raised to the reflecting position. In the reflecting position, the micromirror 66 extends into a trench 76 along the lower surface of a waveguide substrate 78.
  • micromirror 66 is at the same level as input and output waveguides, an optical signal propagating along an input waveguide will be reflected at the surface of the micromirror. The reflected energy will enter a properly aligned output waveguide that is on the same side as the input waveguide.
  • the lowered micromirror 64 is out of alignment with the crosspoint of an input waveguide 82 and an output waveguide 84.
  • an optical signal that is propagating along the input waveguide will enter the trench 76 and will exit the trench via a drop waveguide 86.
  • an optical signal is propagating along an add waveguide 88, the signal will enter the output waveguide 84.
  • the pin 70 is moved upwardly to place the micromirror 64 into the trench 76, the input signal along the input waveguide 82 will be reflected at the surface of the micromirror 64 and will enter the output waveguide 84.
  • the opposite end micromirror 68 are waveguides 90 and 92.
  • the waveguide 90 is the functional equivalent of the add waveguide 88 of Figs. 6 and 7, while the waveguide 92 is the functional equivalent of the drop waveguide 86.
  • the pin spacing for conventional multi-pin dot matrix printer engines is typically greater than the preferred spacing between the switching elements of Fig. 6.
  • a pitch of 250 ⁇ m may be the preferred spacing between adjacent waveguides.
  • a specially designed multi-pin engine may be utilized, or the pitch of the switching elements may be expanded.
  • an actuator substrate is connected to a waveguide substrate using conventional techniques.
  • the coupling of the two substrates provides a means for enclosing the trenches when an index-matching liquid is to be captured within the trenches.
  • the actuators 94 and 96 employ the bending technology that employs stress-induced curling and electrostatic actuation.
  • the actuators are formed on an actuator substrate 98.
  • An acceptable mechanism of the stress-induced curling and electrostatic actuation embodiment is the one recently disclosed by Ming Wu et al. in "Optical Fiber Communications Conference," February, 1999.
  • the resulting switches have adequate throw (i.e., move a sufficiently large distance between the reflecting position and the transmitting position) to move fully into and out of the optical signal traveling through a planar lightwave circuit.
  • the Wu et al. actuators are described with reference to free-space applications.
  • the switch array can be seven or eight units in each direction, leading to a maximum size of 8 ⁇ 8, if low optical losses are required. While larger switches can be fabricated with higher loss (and higher crosstalk due to beams spilling over mirrors), high optical performance is required for the majority of applications (telecommunications and test/measurement) under consideration. Even if larger mirrors are constructed, the larger beams that will be used will require extremely tight angular control in order to keep losses low. However, by using planar lightwave circuits as described herein, the optical path lengths over which divergence occurs will be much shorter per crosspoint (e.g., 10 ⁇ m, as opposed to 1 mm), and thus much larger switches can be constructed.
  • the first actuator 94 is shown in the relaxed state in which a micromirror 100 is outside of a trench 102 of a waveguide substrate 104. With the micromirror 100 outside of the trench 102, optical signals are free to propagate through the trench, as indicated by the exposed waveguides 106 and 108.
  • the second actuator 96 has been actuated and the stress-induced curling results in a micromirror 110 being moved into the trench 102. While not shown, the micromirror 110 is in a position to reflect optical signals from a first input waveguide into an output waveguide.
  • the second actuator 96 is relaxed, the micromirror 110 will move out of the trench and propagation through the trench will be enabled.
  • the waveguide substrate 104 and the actuator substrate 98 must be precisely aligned and positioned.
  • Optical fiber and/or ball lenses can be placed in grooves and/or holes wet-etched in silicon. Complementary slots can be etched in the waveguide substrate during the etching step for forming the trench 102. These features can then be used as registration elements.
  • the micromirrors 100 and 110 are configured such that the upper mirror surfaces may contact the surface of the waveguide substrate 104 when the actuators place the mirrors in the reflecting position, as shown by the micromirror 110.
  • the version of the planar waveguide circuit illustrated in Fig. 8 includes index-matching liquid within the trench 102 and within the region between the two substrates 98 and 104.
  • the actuators 94 and 96 may be used in applications in which there is no index-matching liquid.
  • the actuators 94 and 96 are too large to accommodate the desired pitch (e.g., a desired 250 ⁇ m actuator pitch to match the fiber pitch of a fiber ribbon cable), it is possible to tilt the actuator layout relative to the trenches, as indicated in Fig. 9.
  • Two actuators 112 and 114 control the position of micromirrors 116 and 118 relative to a trench 120.
  • the micromirrors move into and out of the trench 120 as the actuators are curled and straightened.
  • the micromirrors are positioned at crosspoints of input waveguides 122 and 124 with output waveguides 126 and 128.
  • On the opposite side of the trench 120 are add waveguides 130 and 132 and drop waveguides 134 and 136.
  • the input waveguide 122 is optically coupled to the drop waveguide 134.
  • the add waveguide 130 is optically coupled to the output waveguide 126.
  • the micromirror 116 is displaced to its reflecting position at the crosspoint of the waveguides 122 and 126.
  • An input signal propagating along the input waveguide 122 will be reflected at the surface of the micromirror 116 and will exit via the output waveguide 126.
  • Fig. 10 illustrates a waveguide substrate 152 that is attached to four fiber array substrates 154, 156, 158 and 160. While not shown in the top view of Fig. 10, the interfaces between the waveguide substrate and each fiber array substrate can be intentionally tilted at an angle that is intended to decrease the magnitude of reflection between the waveguides on the substrate 152 and the optical fibers on the substrates 154, 156, 158 and 160.
  • the actuator substrate that includes the micromirrors is not illustrated in Fig. 10.
  • the waveguide substrate 152 includes four input waveguides 162, 164, 166 and 168, four add waveguides 170, 172, 174 and 176, four drop waveguides 178, 180, 182 and 184, and four output waveguides 186, 188, 190 and 192. Additionally, there are twenty-four intermediate waveguides to increase the flexibility of the switching arrangement.
  • an optical signal In order to optically couple the input waveguide 162 to the drop waveguide 184, an optical signal must pass through three intermediate waveguides and four trenches that are between adjacent waveguides.
  • the trenches are represented by lines 194 at the waveguide intersections and may be implementations of any of the embodiments described above.
  • any input signals from the waveguide 162 will be diverted by total internal reflection to the output waveguide 192.
  • the micromirror for the lowermost trench is in its transmitting position, the optical signal from waveguide 162 will propagate through the trench to the next trench.
  • the input signal from waveguide 162 may be diverted into any one of four output waveguides 186, 188, 190 and 192. This versatility applies to the other three input waveguides 164, 166 and 168 that are adjacent to waveguide 162.
  • Each of the four fiber array substrates 154, 156, 158 and 160 includes four optical fibers 196, 198, 200 and 202.
  • An acceptable pitch is approximately 250 ⁇ m, but other center-to-center distances may be utilized, such as 500 ⁇ m.
  • the waveguides 162-192 are adiabatically tapered from a relatively large cross sectional area at the interfaces with the trenches 194 to a relatively small cross sectional area at the interfaces with the optical fibers 196-202.
  • the cross sectional geometry of the waveguides at the trenches is selected to achieve efficient optical coupling across the trenches.
  • the cross sectional geometry at the interfaces with the optical fibers is selected to achieve high coupling efficiency to the optical fibers.
  • the adiabatic tapering is from a 16 ⁇ m wide ⁇ 8 ⁇ m high waveguide core cross sectional geometry to an 8 ⁇ m square cross sectional geometry.
  • the adiabatic tapering is shown in Fig. 11.
  • Each of the four waveguide cores 162-168 includes a tapering region 210 in which the sidewalls of the waveguide core diverge with distance from an edge 212 of the waveguide substrate 152.
  • Each waveguide core also includes an interior region 214 in which the sidewalls are parallel.
  • the region of each waveguide core proximate to the edge 212 also has parallel sidewalls, so that the tapering region 210 is an intermediate region between the two constant-width regions.
  • An advantage of the adiabatically expanding waveguide cores of the planar lightwave circuit is that transmission losses across the trenches are reduced.
  • the angular alignment requirements involved in forming the planar lightwave circuit are tightened. If in practice it is determined that it is more difficult to achieve desired angular alignment (probably within 1°) than positional alignment (probably roughly within 1 ⁇ m in the direction perpendicular to the trench sidewall), it may be preferential to use non-expanding cores.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
EP00114440A 1999-09-28 2000-07-05 Optische Schalter, basierend auf Mikrospiegeln in Nuten und integrierten Lichtwellenleitern Expired - Lifetime EP1089108B1 (de)

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US407542 1999-09-28
US09/407,542 US6195478B1 (en) 1998-02-04 1999-09-28 Planar lightwave circuit-based optical switches using micromirrors in trenches

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002059668A2 (en) * 2001-01-24 2002-08-01 Adc Telecommunications, Inc. Mems optical switch on a single chip and method
US6445841B1 (en) 1999-05-28 2002-09-03 Omm, Inc. Optomechanical matrix switches including collimator arrays
US6445840B1 (en) 1999-05-28 2002-09-03 Omm, Inc. Micromachined optical switching devices
US6449406B1 (en) 1999-05-28 2002-09-10 Omm, Inc. Micromachined optomechanical switching devices
US6453083B1 (en) 1999-05-28 2002-09-17 Anis Husain Micromachined optomechanical switching cell with parallel plate actuator and on-chip power monitoring
GB2388918A (en) * 2002-05-25 2003-11-26 Alcatel Optronics Netherlands Optical waveguide switch with movable reflector in trench
WO2007005796A1 (en) * 2005-06-30 2007-01-11 Intel Corporation Planar waveguides with air thin films used as antireflective layers, beam splitters and mirrors
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Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6389189B1 (en) * 1998-10-23 2002-05-14 Corning Incorporated Fluid-encapsulated MEMS optical switch
US6404942B1 (en) * 1998-10-23 2002-06-11 Corning Incorporated Fluid-encapsulated MEMS optical switch
CN1423757A (zh) * 1999-11-23 2003-06-11 L3光学公司 具有平面波导和快门致动器的光学开关
TW451093B (en) 1999-11-23 2001-08-21 Nanovation Tech Inc Analog optical switches using an integrated machzehnder interferometer having a movable phase shifter
TW521166B (en) * 1999-11-23 2003-02-21 L3 Optics Inc An optical phase shifter having an integrated planar optical waveguide and phase shifter element
US6363183B1 (en) * 2000-01-04 2002-03-26 Seungug Koh Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof
US6360036B1 (en) * 2000-01-14 2002-03-19 Corning Incorporated MEMS optical switch and method of manufacture
EP1264206B1 (de) * 2000-01-31 2003-12-17 Sercalo Microtechnology Ltd. Schalteranordnung für strahlungsleiter
WO2001059492A2 (en) * 2000-02-04 2001-08-16 L3 Optics, Inc. Optical waveguide and shutter
US6396972B1 (en) * 2000-02-09 2002-05-28 Agilent Technologies, Inc. Thermally actuated optical add/drop switch
US6477290B1 (en) * 2000-02-15 2002-11-05 Optic Net, Inc. Fiber optic switch using MEMS
US6470108B1 (en) * 2000-04-26 2002-10-22 Tini Alloy Company Optical switching device and method
US6490382B1 (en) * 2000-05-05 2002-12-03 Jds Uniphase Corporation MicroElectroMechanical optical cross-connect switches having reduced numbers of reflectors therein and methods of operating same
US7085445B2 (en) * 2000-08-04 2006-08-01 Seungug Koh Micro-opto-electro-mechanical waveguide switches
US7003187B2 (en) * 2000-08-07 2006-02-21 Rosemount Inc. Optical switch with moveable holographic optical element
US6504968B1 (en) * 2000-08-30 2003-01-07 Jds Uniphase Inc. Optical switches including reflectors having associated actuators and latches located adjacent to a surface thereof and methods of operating same
JP3766953B2 (ja) * 2000-09-13 2006-04-19 日本電信電話株式会社 光回路
US6532319B2 (en) * 2000-12-18 2003-03-11 Agilent Technologies, Inc. Ceramic substrate for photonic switching system
US20020086456A1 (en) * 2000-12-19 2002-07-04 Cunningham Shawn Jay Bulk micromachining process for fabricating an optical MEMS device with integrated optical aperture
TW456523U (en) * 2000-12-28 2001-09-21 Hon Hai Prec Ind Co Ltd Optical switch
US6731833B2 (en) 2001-01-16 2004-05-04 T-Rex Enterprises Corp. Optical cross connect switch
WO2002068821A2 (en) * 2001-02-28 2002-09-06 Lightwave Microsystems Corporation Microfluidic control using dieletric pumping
US7016560B2 (en) * 2001-02-28 2006-03-21 Lightwave Microsystems Corporation Microfluidic control for waveguide optical switches, variable attenuators, and other optical devices
US6818559B2 (en) * 2001-03-21 2004-11-16 Intel Corporation Method of fabrication to sharpen corners of Y-branches in integrated optical components and other micro-devices
EP1245976A1 (de) * 2001-03-30 2002-10-02 Corning O.T.I. S.p.A. Optische Schalteranordnung
US6760503B1 (en) 2001-04-12 2004-07-06 Eric F. Hermann Scalable optical router/switch and method of constructing thereof
US6477222B1 (en) * 2001-04-30 2002-11-05 Agilent Technologies, Inc. Getter for atmospheric gases in optical switch working fluid
US6647165B2 (en) * 2001-05-31 2003-11-11 Agilent Technologies, Inc. Total internal reflection optical switch utilizing a moving droplet
JP2003057569A (ja) * 2001-06-07 2003-02-26 Sumitomo Electric Ind Ltd 光スイッチ及び光スイッチアレイ
JP3810768B2 (ja) * 2001-07-13 2006-08-16 エヌティティエレクトロニクス株式会社 光導波路型マトリクス・スイッチおよびその製造方法
US6618519B2 (en) * 2001-07-16 2003-09-09 Chromux Technologies, Inc. Switch and variable optical attenuator for single or arrayed optical channels
AU2002326454A1 (en) * 2001-07-24 2003-02-17 Onix Microsystems Mems element having perpendicular portion formed from substrate
US6813412B2 (en) * 2001-07-24 2004-11-02 Michael J. Daneman Mems element having perpendicular portion formed from substrate
KR20040044965A (ko) * 2001-09-21 2004-05-31 스미토모 덴키 고교 가부시키가이샤 광 스위치 및 광 스위치 어레이
KR100393193B1 (ko) * 2001-09-29 2003-07-31 삼성전자주식회사 광 도파로와 mems 액추에이터를 구비한 가변 광 감쇠기
US6890619B2 (en) * 2001-11-13 2005-05-10 Agilent Technologies, Inc. Optical systems and refractive index-matching compositions
US6801679B2 (en) * 2001-11-23 2004-10-05 Seungug Koh Multifunctional intelligent optical modules based on planar lightwave circuits
US6807356B2 (en) * 2001-12-10 2004-10-19 Jds Uniphase Corporation Fiber-coupled optical attenuator
US6760529B2 (en) 2001-12-11 2004-07-06 Intel Corporation Three-dimensional tapered optical waveguides and methods of manufacture thereof
US7010200B2 (en) * 2001-12-26 2006-03-07 Nikon Corporation Light-beam switching/adjusting apparatus and manufacturing method thereof
US7177065B2 (en) * 2002-01-09 2007-02-13 Nikon Corporation Optical element, thin film structure, optical switch, and method of manufacturing optical element
JP3986840B2 (ja) * 2002-02-01 2007-10-03 三菱電機株式会社 光スイッチの製造方法
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US6728449B2 (en) 2002-02-14 2004-04-27 Agilent Technologies, Inc. Fiber assembly alignment using fiducials
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US6710350B2 (en) 2002-03-05 2004-03-23 Ge Medical Systems Information Technologies, Inc. Radiation detector with microphotonic optical switches to route light in an imaging system
US6798939B2 (en) * 2002-03-14 2004-09-28 Agilent Technologies, Inc. Bubble stability in an optical switch
JP2004126503A (ja) * 2002-03-28 2004-04-22 Nikon Corp マイクロアクチュエータ及びこれを用いた光スイッチ
US6732905B2 (en) 2002-04-16 2004-05-11 Agilent Technologies, Inc. Vented cavity, hermetic solder seal
US6958446B2 (en) * 2002-04-17 2005-10-25 Agilent Technologies, Inc. Compliant and hermetic solder seal
US20030202264A1 (en) * 2002-04-30 2003-10-30 Weber Timothy L. Micro-mirror device
US7023603B2 (en) * 2002-04-30 2006-04-04 Hewlett-Packard Development Company, L.P. Micro-mirror device including dielectrophoretic microemulsion
US6954297B2 (en) * 2002-04-30 2005-10-11 Hewlett-Packard Development Company, L.P. Micro-mirror device including dielectrophoretic liquid
US6972882B2 (en) * 2002-04-30 2005-12-06 Hewlett-Packard Development Company, L.P. Micro-mirror device with light angle amplification
US6816648B2 (en) 2002-05-01 2004-11-09 Intel Corporation Integrated waveguide gratings by ion implantation
US6670210B2 (en) * 2002-05-01 2003-12-30 Intel Corporation Optical waveguide with layered core and methods of manufacture thereof
US20030210865A1 (en) * 2002-05-08 2003-11-13 Kjetil Johannessen Method and apparatus for coupling of optically active devices to a planar lightwave circuit
KR100443670B1 (ko) * 2002-06-19 2004-08-11 (주)엠투엔 마이크로 광 스위치 및 그 제조 방법
US6782185B2 (en) * 2002-07-03 2004-08-24 Sumitomo Electric Industries, Ltd. Optical variable attenuator and optical module
US6807333B2 (en) * 2002-07-15 2004-10-19 Agilent Technologies, Inc. Optical switch using an annular array of optical ports
EP1382984A1 (de) * 2002-07-19 2004-01-21 Avanex Corporation Planarer optischer Schalter und Schaltermatrix
US7221819B2 (en) 2002-08-01 2007-05-22 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Operating an optical switch at a negative pressure differential
US7040323B1 (en) * 2002-08-08 2006-05-09 Tini Alloy Company Thin film intrauterine device
CA2434625A1 (en) * 2002-09-10 2004-03-10 Sumitomo Electric Industries, Ltd. Optical switch
US6876788B2 (en) * 2002-09-11 2005-04-05 Agilent Technologies, Inc. Preventing hydrodynamic crosstalk in an optical switch
US20040091202A1 (en) * 2002-10-24 2004-05-13 Lg Electronics Inc. Optical switch
KR20040047327A (ko) * 2002-11-29 2004-06-05 엘지전자 주식회사 광스위치
US6903487B2 (en) * 2003-02-14 2005-06-07 Hewlett-Packard Development Company, L.P. Micro-mirror device with increased mirror tilt
US6844953B2 (en) * 2003-03-12 2005-01-18 Hewlett-Packard Development Company, L.P. Micro-mirror device including dielectrophoretic liquid
JP2004294890A (ja) * 2003-03-27 2004-10-21 Ntt Electornics Corp 可変光減衰器
US7095913B2 (en) * 2003-04-02 2006-08-22 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Non-active waveguides on planar lightwave circuits
US6897469B2 (en) * 2003-05-02 2005-05-24 Athanasios J. Syllaios Sub-wavelength structures for reduction of reflective properties
US7359523B2 (en) * 2003-06-17 2008-04-15 Avago Technologies Fiber Ip Pte Ltd Fluidic acoustic transducer
US7274840B2 (en) * 2003-07-23 2007-09-25 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Clean and test for fluid within a reflection optical switch system
US7492992B1 (en) * 2003-08-08 2009-02-17 Neophotonics Corporation Bi-directional PLC transceiver device
US7039273B2 (en) * 2003-08-12 2006-05-02 Tyler Sims Solder seals within a switching system
US7422403B1 (en) 2003-10-23 2008-09-09 Tini Alloy Company Non-explosive releasable coupling device
US7031564B2 (en) * 2003-11-05 2006-04-18 Tyler Sims Heat transfer structures
US7465903B2 (en) * 2003-11-05 2008-12-16 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Use of mesa structures for supporting heaters on an integrated circuit
US7172269B2 (en) * 2003-11-13 2007-02-06 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Resistor shapes for heating devices on an integrated circuit
US7024062B2 (en) * 2004-02-25 2006-04-04 John Julian Uebbing Optical switch with low pressure bubble
US7632361B2 (en) * 2004-05-06 2009-12-15 Tini Alloy Company Single crystal shape memory alloy devices and methods
US20060118210A1 (en) * 2004-10-04 2006-06-08 Johnson A D Portable energy storage devices and methods
US7763342B2 (en) * 2005-03-31 2010-07-27 Tini Alloy Company Tear-resistant thin film methods of fabrication
US20080044130A1 (en) * 2006-08-16 2008-02-21 Xyratex Technology Limited Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide
US20080213062A1 (en) * 2006-09-22 2008-09-04 Tini Alloy Company Constant load fastener
US20080075557A1 (en) * 2006-09-22 2008-03-27 Johnson A David Constant load bolt
US8349099B1 (en) 2006-12-01 2013-01-08 Ormco Corporation Method of alloying reactive components
WO2008092028A1 (en) * 2007-01-25 2008-07-31 Tini Alloy Company Frangible shape memory alloy fire sprinkler valve actuator
US8584767B2 (en) * 2007-01-25 2013-11-19 Tini Alloy Company Sprinkler valve with active actuation
US7862056B2 (en) 2007-02-02 2011-01-04 Ford Global Technologies, Llc Steering gear inertia damper
US8007674B2 (en) 2007-07-30 2011-08-30 Tini Alloy Company Method and devices for preventing restenosis in cardiovascular stents
WO2009073609A1 (en) 2007-11-30 2009-06-11 Tini Alloy Company Biocompatible copper-based single-crystal shape memory alloys
US7842143B2 (en) * 2007-12-03 2010-11-30 Tini Alloy Company Hyperelastic shape setting devices and fabrication methods
US8382917B2 (en) * 2007-12-03 2013-02-26 Ormco Corporation Hyperelastic shape setting devices and fabrication methods
US8731343B2 (en) 2011-02-24 2014-05-20 Xyratex Technology Limited Optical printed circuit board, a method of making an optical printed circuit board and an optical waveguide
US20130287336A1 (en) * 2012-04-26 2013-10-31 Shih-Yuan Wang Optical switch
US11040230B2 (en) 2012-08-31 2021-06-22 Tini Alloy Company Fire sprinkler valve actuator
US10124197B2 (en) 2012-08-31 2018-11-13 TiNi Allot Company Fire sprinkler valve actuator
CN107678097B (zh) 2016-08-01 2019-11-12 华为技术有限公司 光开关和光交换系统
DE102019210747B4 (de) * 2019-07-19 2023-11-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
US11125941B1 (en) * 2019-10-29 2021-09-21 Waymo Llc LIDAR signal system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131210A (ja) * 1988-11-11 1990-05-21 Nippon Telegr & Teleph Corp <Ntt> 光導波路スイッチ
JPH03215812A (ja) * 1990-01-22 1991-09-20 Nippon Telegr & Teleph Corp <Ntt> マトリクス光スイッチ
JPH0452616A (ja) * 1990-06-21 1992-02-20 Furukawa Electric Co Ltd:The 導波路型光スイッチ
JPH04255804A (ja) * 1991-02-08 1992-09-10 Nippon Telegr & Teleph Corp <Ntt> マトリクス光導波路スイッチ
JPH06308400A (ja) * 1993-04-20 1994-11-04 Nippon Telegr & Teleph Corp <Ntt> 光導波路スイッチ
JPH08201857A (ja) * 1995-01-24 1996-08-09 Hitachi Cable Ltd 磁気駆動導波路型光スイッチとその製造方法
EP0902538A2 (de) * 1997-09-10 1999-03-17 Lucent Technologies Inc. Gegenstand mit einer durch Licht ausgelösten mikromechanischen photonischen Schaltereinrichtung
EP0935149A2 (de) * 1998-02-04 1999-08-11 Hewlett-Packard Company Elément de commutation avec guide d'onde à coeur élargi
WO2000025160A1 (en) * 1998-10-23 2000-05-04 Corning Incorporated Fluid-encapsulated mems optical switch

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988157A (en) 1990-03-08 1991-01-29 Bell Communications Research, Inc. Optical switch using bubbles
US5699462A (en) 1996-06-14 1997-12-16 Hewlett-Packard Company Total internal reflection optical switches employing thermal activation

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131210A (ja) * 1988-11-11 1990-05-21 Nippon Telegr & Teleph Corp <Ntt> 光導波路スイッチ
JPH03215812A (ja) * 1990-01-22 1991-09-20 Nippon Telegr & Teleph Corp <Ntt> マトリクス光スイッチ
JPH0452616A (ja) * 1990-06-21 1992-02-20 Furukawa Electric Co Ltd:The 導波路型光スイッチ
JPH04255804A (ja) * 1991-02-08 1992-09-10 Nippon Telegr & Teleph Corp <Ntt> マトリクス光導波路スイッチ
JPH06308400A (ja) * 1993-04-20 1994-11-04 Nippon Telegr & Teleph Corp <Ntt> 光導波路スイッチ
JPH08201857A (ja) * 1995-01-24 1996-08-09 Hitachi Cable Ltd 磁気駆動導波路型光スイッチとその製造方法
EP0902538A2 (de) * 1997-09-10 1999-03-17 Lucent Technologies Inc. Gegenstand mit einer durch Licht ausgelösten mikromechanischen photonischen Schaltereinrichtung
EP0935149A2 (de) * 1998-02-04 1999-08-11 Hewlett-Packard Company Elément de commutation avec guide d'onde à coeur élargi
WO2000025160A1 (en) * 1998-10-23 2000-05-04 Corning Incorporated Fluid-encapsulated mems optical switch

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
CHEN R ET AL.: "A high-Speed Low-Voltage Stress-Induced Micromachined 2 x 2 Optical Switch" IEEE PHOTONICS TECHNOLOGY LETTERS, vol. 11, no. 11, November 1999 (1999-11), pages 1396-1398, XP000893775 *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 358 (P-1087), 2 August 1990 (1990-08-02) & JP 02 131210 A (NIPPON TELEGR & TELEPH CORP), 21 May 1990 (1990-05-21) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 499 (P-1289), 17 December 1991 (1991-12-17) & JP 03 215812 A (NIPPON TELEGR & TELEPH CORP), 20 September 1991 (1991-09-20) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 241 (P-1363), 3 June 1992 (1992-06-03) & JP 04 052616 A (FURUKAWA ELECTRIC CO LTD:THE), 20 February 1992 (1992-02-20) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 036 (P-1474), 22 January 1993 (1993-01-22) & JP 04 255804 A (NIPPON TELEGR & TELEPH CORP), 10 September 1992 (1992-09-10) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02, 31 March 1995 (1995-03-31) & JP 06 308400 A (NIPPON TELEGR & TELEPH CORP), 4 November 1994 (1994-11-04) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12, 26 December 1996 (1996-12-26) & JP 08 201857 A (HITACHI CABLE LTD;NIPPON TELEGR & TELEPH CORP <NTT>), 9 August 1996 (1996-08-09) *
TOSHIYOSHI H ET AL: "ELECTROSTATIC MICRO TORSION MIRRORS FOR AN OPTICAL SWITCH MATRIX" JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE INC. NEW YORK, US, vol. 5, no. 4, 1 December 1996 (1996-12-01), pages 231-237, XP000678676 ISSN: 1057-7157 *
WU M ET AL.: "A low voltage micromachined optical switch by stress-induced bending" PROC. MEMS '99, TWELFTH INTERNATIONAL CONFERENCE ON MICROELECTROMECHANICAL SYSTEMS, ORLANDO, FLORIDA, USA, 17 January 2009 (2009-01-17), - 21 January 2009 (2009-01-21) XP010321766 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445841B1 (en) 1999-05-28 2002-09-03 Omm, Inc. Optomechanical matrix switches including collimator arrays
US6445840B1 (en) 1999-05-28 2002-09-03 Omm, Inc. Micromachined optical switching devices
US6449406B1 (en) 1999-05-28 2002-09-10 Omm, Inc. Micromachined optomechanical switching devices
US6453083B1 (en) 1999-05-28 2002-09-17 Anis Husain Micromachined optomechanical switching cell with parallel plate actuator and on-chip power monitoring
US6901180B2 (en) 2001-01-24 2005-05-31 Adc Telecommunications, Inc. MEMS optical switch on a single chip and method
WO2002059668A3 (en) * 2001-01-24 2003-05-30 Adc Telecommunications Inc Mems optical switch on a single chip and method
WO2002059668A2 (en) * 2001-01-24 2002-08-01 Adc Telecommunications, Inc. Mems optical switch on a single chip and method
GB2388918A (en) * 2002-05-25 2003-11-26 Alcatel Optronics Netherlands Optical waveguide switch with movable reflector in trench
EP1813974A3 (de) * 2003-03-31 2007-10-31 Nippon Telegraph and Telephone Corporation Optische Halbleitervorrichtung und integrierte optische Halbleiterschaltung
US7471864B2 (en) 2003-03-31 2008-12-30 Nippon Telegraph And Telephone Corporation Optical semiconductor device and optical semiconductor integrated circuit
US7474817B2 (en) 2003-03-31 2009-01-06 Nippon Telegraph And Telephone Corporation. Optical semiconductor device and optical semiconductor integrated circuit
US7738520B2 (en) 2003-03-31 2010-06-15 Nippon Telegraph And Telephone Corporation Optical semiconductor device and optical semiconductor integrated circuit
WO2007005796A1 (en) * 2005-06-30 2007-01-11 Intel Corporation Planar waveguides with air thin films used as antireflective layers, beam splitters and mirrors

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JP2001142008A (ja) 2001-05-25
DE60040584D1 (de) 2008-12-04
US6195478B1 (en) 2001-02-27
EP1089108B1 (de) 2008-10-22

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