EP1040923A2 - Tintenstrahlaufzeichnungskopf, piezoelektrische Vibratorelementeinheit und Verfahren zur Herstellung der piezoelektrischen Vibratorelementeinheit - Google Patents

Tintenstrahlaufzeichnungskopf, piezoelektrische Vibratorelementeinheit und Verfahren zur Herstellung der piezoelektrischen Vibratorelementeinheit Download PDF

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Publication number
EP1040923A2
EP1040923A2 EP00106070A EP00106070A EP1040923A2 EP 1040923 A2 EP1040923 A2 EP 1040923A2 EP 00106070 A EP00106070 A EP 00106070A EP 00106070 A EP00106070 A EP 00106070A EP 1040923 A2 EP1040923 A2 EP 1040923A2
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EP
European Patent Office
Prior art keywords
piezoelectric
piezoelectric vibration
accordance
dummy
internal electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00106070A
Other languages
English (en)
French (fr)
Other versions
EP1040923A3 (de
EP1040923B1 (de
Inventor
Tsuyoshi Kitahara
Hiroshi Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of EP1040923A2 publication Critical patent/EP1040923A2/de
Publication of EP1040923A3 publication Critical patent/EP1040923A3/de
Application granted granted Critical
Publication of EP1040923B1 publication Critical patent/EP1040923B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1612—Production of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Definitions

  • the present invention relates to an inkjet recording head which uses, as a pressure generating source, piezoelectric vibration elements of the longitudinal vibration type, which are each constructed such that a plurality of internal electrodes are alternately layered in a state that piezoelectric material is interposed therebetween.
  • the inkjet recording head which uses the piezoelectric vibration elements each vibrating in the longitudinal vibration mode, includes a plurality of linear arrays each consisting of pressure generating chambers, each chamber communicating with a nozzle orifice and a part of each chamber being sealingly closed with an elastically deformable plate member.
  • Each pressure generating chamber is expanded and contracted by its associated piezoelectric vibration element which axially deflects in accordance with a drive signal applied thereto.
  • the piezoelectric vibration elements are constructed as a unit form as shown in Fig. 15. That is, a piezoelectric vibrating plate, which is wide enough to cover a plurality of piezoelectric vibration elements, is fastened to a fixing plate 60, and is cut into a plurality of piezoelectric vibration elements 61 with a wire saw or the like to be arranged at a constant pitch.
  • Dummy piezoelectric vibration elements 62 and 63 which are not associated with the ink drop ejecting operation, are provided at both ends of a linear array of piezoelectric vibration elements in order to improve the workability in positioning the piezoelectric vibration elements in the stage of assembling.
  • the outer side surfaces 62' and 63' of the dummy piezoelectric vibration elements 62 and 63 are used as a reference in setting the piezoelectric vibration element unit to a case, whereby the piezoelectric vibration elements 61 are positioned with respect to the fluid channel unit within a predetermined tolerance.
  • the piezoelectric vibrating plate is formed such that internal electrode material layers including metal and piezoelectric material layers are layered, and the resultant layered structure is sintered.
  • the cutting of the thus formed piezoelectric vibrating plate with a wire saw into a plurality of piezoelectric vibration elements will minutely shift the actual cutting lines from the correct cutting lines since the internal electrodes are hard.
  • the shift of the cutting lines greatly affects an accuracy of the relative positioning of the piezoelectric vibration element unit when the distal ends of the piezoelectric vibration elements are reduced in area for the purpose of increasing a print density.
  • an object of the present invention is to provide an inkjet recording head in which piezoelectric vibration elements are positioned at predetermined positions with high accuracy.
  • Another object of the invention is to provide a piezoelectric vibration element unit which is configured with high accuracy.
  • a third object of the invention is to provide a method of manufacturing the piezoelectric vibration element unit.
  • a dummy piezoelectric element is disposed at least at one of the ends of a linear array of piezoelectric vibration elements.
  • a region not including an internal electrode is provided in the vicinity of the outer side surface of said dummy piezoelectric vibration element.
  • An inkjet recording head preferably includes a piezoelectric vibration element unit in which a plurality of piezoelectric vibration elements, each of which is axially expandable, and is made up of piezoelectric material layers and internal electrodes which are alternately layered, are linearly arrayed on a substrate.
  • the volumes of pressure generating chambers are increased and decreased by said piezoelectric vibration elements associated respectively with said pressure generating chambers.
  • a dummy piezoelectric vibration element is provided at least one end of a linear array of piezoelectric vibration elements, and a region not including the internal electrodes is provided in the vicinity of the outer side surface of said dummy piezoelectric vibration element.
  • the internal electrodes are not contained in a region in the vicinity of the outer side surface of said dummy piezoelectric vibration element. Therefore, the cutting of the piezoelectric vibrating plate along the outer side surface of the dummy piezoelectric vibration element does not cause a shift of an actual cutting line from the correct cutting line due to the high hardness of the internal electrodes. Therefore, the piezoelectric vibrating plate can be highly accurately cut.
  • Fig. 1 shows an embodiment of the present invention.
  • piezoelectric vibration elements 5 as shown in Fig. 4, are disposed at fixed pitches along a fixing plate 6.
  • internal electrodes 3 and 4 having different poles are arranged parallel to one another, and extend in the axial or longitudinal direction of the element 5.
  • Those internal electrodes 3 and 4 are exposed to outside at respective ends, that is, in this embodiment the internal electrodes 3 are exposed at the proximal ends of the piezoelectric vibration elements 5, whereas the other internal electrodes 4 are exposed at the distal ends of the piezoelectric elements 5.
  • each of the piezoelectric vibration element 5 has a layered construction in which electrically conductive layers and piezoelectric material layers are stacked one on another alternately.
  • Dummy piezoelectric elements 7 are located at both ends of an array of the piezoelectric vibration elements 5. The remains 7' of the dummy piezoelectric elements 7, which are produced as a consequence of the formation of the dummy piezoelectric elements 7 are present on the outer side of the dummy piezoelectric elements 7.
  • the outer side surfaces of the dummy piezoelectric elements 7 are formed of only piezoelectric material P, not including electrodes.
  • External electrodes 9 and 10 which form connection parts to a flexible cable 8 for supplying a drive signal are formed, by sputtering or vapor deposition, over regions ranging from the distal and proximal end faces of each piezoelectric vibration element 5 where the internal electrodes 3 and 4 are exposed, to a surface of the fixing plate (6) side.
  • the internal electrodes 3 are common (grounded) electrodes
  • the internal electrodes 4 are segment electrodes.
  • a fluid channel forming unit 11 is formed by liquid-tightly laminating a fluid channel forming substrate 15 defining a reservoir 12, ink supplying ports 13 and pressure generating chambers 14, an elastic plate 16 which is brought into contact with the distal end of piezoelectric vibration elements 5 to increase and reduce the volumes of the associated pressure generating chambers 14, and a nozzle plate 18 which sealingly closes the opposite surface of the fluid channel forming substrate 15 and has nozzle orifices 17 for ejecting ink, which is supplied from the pressure generating chambers 14, in the form of ink drops.
  • the fluid channel forming unit 11 is fixed to an opened surface 19a of a head holder 19.
  • the distal ends of the piezoelectric vibration elements 5 are coated with adhesive and brought into contact with islands 16a of the elastic plate 16.
  • the fixing plate 6 is fixed to the head holder 19 by adhesive. In this manner, the inkjet recording head is formed.
  • each dummy piezoelectric element 7 is used as a positioning member, and the outer side surface of each dummy piezoelectric element 7 is used as a reference surface for positioning the piezoelectric vibration element unit 1 with respect to the head holder 19.
  • a drive signal is applied to a piezoelectric vibration element 5, which is associated with a pressure generating chamber 14 communicating with a nozzle orifice 17 through which ink is to be ejected.
  • the piezoelectric vibration element 5 is shrunk and expanded to increase and decrease the volume of the pressure generating chamber 14.
  • ink flows into the pressure generating chamber 14 through the ink supplying ports 13, and the ink within the pressure generating chamber 14 is pressurized and forcibly discharged in the form of an ink drop through the nozzle orifice 17.
  • Figs. 5 through 7 exemplarily show a method of manufacturing piezoelectric vibration elements 5 thus structured.
  • a green sheet 21 made of piezoelectric material is placed on a base plate 20 having a flat surface (Fig. 5(I)).
  • the green sheet 21 is preliminarily prepared so as to have the width W2 which is somewhat longer than the width W1 (see Fig. 3) of a portion of the piezoelectric vibration element unit 1 where the piezoelectric vibration elements 5 and dummy piezoelectric elements 7 are formed (the width W1 being defined between the outer side surface of the one dummy piezoelectric element 7 and the outer side surface of the other dummy piezoelectric element 7), and to have a thickness equal to the piezoelectric material layer.
  • a conductive layer 22 which serves as the internal electrode 3 which is one of the coupled internal electrodes is formed on a surface of the green sheet 21 by use of a mask with a pattern having such a width W3 that the conductive layer 22 is located on the inner side with respect to the outer side surfaces of the dummy piezoelectric elements 7 but on the outer side with respect to the piezoelectric vibration elements 5 adjacent to the dummy piezoelectric elements 7 (Fig. 5(II)). Then, another green sheet 21, which is made of piezoelectric material and has the same size as of the former green sheet already stated, is layered on the conductive layer thus formed (Fig. 5(III)).
  • a conductive layer 23 which serves as the other internal electrode 4 is formed on a surface of the green sheet 21 by use of a mask with a pattern having such a width W3' that the conductive layer is located on the inner side with respect to the outer side surfaces of the dummy piezoelectric elements 7 but on the outer side with respect to the piezoelectric vibration elements 5 adjacent to the piezoelectric elements 7 (Fig. 6(I)). Then, another green sheet 21, which is made of piezoelectric material and has the same size as of the green sheet already stated, is layered on the conductive layer 23 thus formed (Fig. 6(II)).
  • a sequence of manufacturing steps mentioned above is repeated to form the required number of layers (Fig. 6(III).
  • the green sheets are dried, and then the resultant structure is sintered.
  • External electrodes 24 and 25, which serve as electrodes used for the connection to a flexible cable 8, are formed on a surface of the structure by sputtering or vapor deposition process.
  • a given dielectric polarization process is carried out by applying voltage to those electrodes 24 and 25.
  • a piezoelectric vibrating plate 27 is manufactured.
  • a non-vibration region, i.e. an inactive region, of the piezoelectric vibrating plate 27 is positioned to a fixing plate 28 and secured thereto by adhesive (Fig. 7(I)).
  • the piezoelectric vibrating plate is cut into a teeth shape or a comb shape with a cutting tool, for example, a wire saw, such that the cutting lines on both ends of the piezoelectric vibrating plate (i.e., the outermost cutting lines C in this embodiment) are located outside the conductive layers 22 and 23, and the width of the dummy piezoelectric elements 7 and the width of the piezoelectric vibration elements 5 are exactly secured.
  • the outermost cutting lines C are positioned in the regions which are made of only piezoelectric material, not including the conductive layers 22 and 23 (Fig. 8). Therefore, the cutting operation is smoothly performed while being free from a slip caused by the presence of the metallic material.
  • the piezoelectric vibrating plate 27 can be cut to have cut surfaces coincident in position with the intended cutting lines.
  • the remains 29 located at the outermost positions are removed, and here the piezoelectric vibration element unit 1 is completed (Fig. 7(III)). Since the conductive layers 22 and 23 are not present in the remains, those remains are relatively low in strength, and accordingly, may be bent and removed easily.
  • the electrodes 24 and 25 for the external connections are formed extending over the full width of the piezoelectric vibrating plate 27.
  • the adverse effect by the hardness of the electrodes 24 and 25 is eliminated in the cutting process of the piezoelectric vibrating plate 27, so that a more smooth cutting operation is ensured.
  • the remains 29 (7') have been completely removed.
  • the piezoelectric vibrating plate 27 has such a size as to allow one piezoelectric vibration element unit to be formed.
  • the region not including the internal electrodes maybe located in each boundary region at which one of the piezoelectric vibration units is separated from another adjacent one of the piezoelectric vibration units.
  • Fig. 10 shows another embodiment of a piezoelectric vibration element unit of the piezoelectric constant d33 which is formed with piezoelectric vibration elements 33 each including internal electrodes 30 and 31 layered in the longitudinal direction of the piezoelectric vibration element 33.
  • the internal electrodes 30 and 31 with different poles are arranged such that those electrodes overlap with each other in the vibrating region with the piezoelectric material 32 being interposed therebetween (Fig. 10B), and that the internal electrodes 30 is exposed on the side face of the top and bottom portions of the piezoelectric element 33, whereas the internal electrodes 31 is exposed on the opposite side face of the top and bottom portions thereof.
  • Those piezoelectric vibration elements 33 are fixed onto a fixing plate 34 while being arrayed at fixed pitches along the fixing plate 34.
  • Dummy piezoelectric elements 35 are located at both the ends of the array of the piezoelectric vibration elements 33, respectively. The remains 35' of the dummy piezoelectric elements 35 are present outside the dummy piezoelectric elements 35.
  • the electrodes are not present but only piezoelectric material 32 is present in the outside surfaces of the dummy piezoelectric elements 35. That is, the piezoelectric vibrating plate to be cut into a teeth or comb shape does not have electrodes in regions, each extending by an amount of a width W5 inwardly from the corresponding outer surface of the plate.
  • the slit S to be formed for the purpose of cutting out the dummy piezoelectric element 35 from the plate is located within the region.
  • the internal electrodes are not formed in the remains 7', 35' of the dummy piezoelectric elements 7, 35.
  • internal electrodes 3' and 4' are not present only in a region D of the dummy piezoelectric element 7 which is bent and cut to form the remain 7'.
  • a part of the dummy piezoelectric element 7 to be removed as a consequence of bending and cutting the element 7, i.e. a part of the dummy piezoelectric element 7 above the region D is reinforced by an internal electrode 4'. Therefore, the dummy piezoelectric element 7 can be bent and cut exactly at an intended position to form the remain 7'.
  • a thickness of the piezoelectric vibrating plate can be uniform over its entire area, so that distortion and warp of the piezoelectric vibrating plate are minimized when it is sintered.
  • the steps explained with reference to Figs. 5(II), 6(I) and 6(III) are modified preferably in the following manner:
  • the laterally protruded conductive layer part 22' corresponds to the internal electrode 3'.
  • the conductive layer 23 is formed on the green sheet 21 to extend across the cutting line C for defining the positioning reference surface and to have a laterally protruded conductive layer part 23'.
  • the laterally protruded conductive layer part 23' corresponds to the internal electrode 4'.
  • the internal electrodes 3 and 4 appear on the outer side surface (i.e. the positioning reference surface) of the positioning dummy piezoelectric element 7.
  • the embodiment shown in Fig. 11 may be modified so that no electrode appear on the outer side surface of the positioning dummy piezoelectric element 7 as shown in Fig. 4.
  • 5(II), 6(I) and 6(III) are modified preferably such that:
  • additional conductive layers 22' are formed on the green sheet 21 adjacent to the conductive layer 22 to form the internal electrodes 3' as shown in Fig. 16
  • the additional conductive layers 23' are formed on the green sheet 21 adjacent to the conductive layer 23 to form the internal electrodes 4' as shown in Fig. 17.
  • the cutting line C for defining the positioning reference surface is located between the additional conductive layer 22' and the conductive layer 22 and between the additional conductive layer 23' and the conductive layer 23.
  • 5(II), 6(I) and 6(III) may be modified such that: In each of the steps shown in Figs.5(I) and 6(III), additional conductive layers 22' for forming the internal electrodes 3' located below the region D and additional conductive layers 23' for forming the internal electrodes 4' located above the region D are formed on the green sheet 21 adjacent to the conductive layer 22 as shown in Fig. 18, and in the step shown in Fig. 6(I), the additional conductive layers 22' for forming the internal electrodes 3' located below the region D and the additional conductive layers 23' for forming the internal electrodes 4' located above the region D are formed on the green sheet 21 adjacent to the conductive layer 23 as shown in Fig. 19.
  • reference numeral R designates another conductive layer formed on the green sheet 21 to make the piezoelectric vibration plate uniform in thickness and reinforce the piezoelectric vibration plate.
  • the conductive layers 22, 23, 22', 23' and R are the same in thickness.
  • the inkjet recording head is of the type in which the fluid channel unit containing ink confined therein is expanded and contracted externally.
  • the present invention may likewise be applied to the inkjet recording head of the zale type in which spaces 41 each between adjacent piezoelectric vibration elements 40 are used as pressure generating chambers as shown in Fig. 12.
  • the outer surface of the outermost piezoelectric vibration element 40' does not have the internal electrodes 42 so that a width of the entire piezoelectric vibrating plate can be secured accurately.
  • Fig. 13 is a set of perspective views showing another method of manufacturing a piezoelectric vibration element unit according to the present invention.
  • dummy piezoelectric elements 7 are each formed by a combination of a piezoelectric vibrating plate and a second member.
  • Blocks 50 made of ceramic, e.g., alumina, or metal, e.g., stainless steel, are bonded to both side end surfaces of a piezoelectric vibrating plate 27, by adhesive layers being interlayered therebetween.
  • external electrodes 24 and 25 serving as electrodes used for connecting to a flexible cable 8 have been formed on the surfaces of the piezoelectric vibrating plate 27.
  • each block 50 is slightly thinner in thickness than the piezoelectric vibrating plate 27 by ⁇ G1, and the distal end of each block 50 is slightly recessed toward a fixing plate 28 from the distal end of the piezoelectric vibration plate 27 by ⁇ G2.
  • the surfaces of the blocks 50, which face the fixing plate 28, are also secured thereto by use of adhesive layers (Fig. 13(I)).
  • the blocks 50 are made of conductive material, it is preferable that the internal electrodes are not exposed in the side end surfaces of the piezoelectric vibrating plate 27, as in the previously mentioned embodiments.
  • a dielectric polarization process is carried out in a manner that in this state, polarizing voltage applying electrodes having areas large enough to cover at least the piezoelectric vibrating plate 27 are brought into contact with the connection electrodes 24 and 25. It is noted here that the polarizing voltage applying electrodes reliably contact the piezoelectric vibrating plate 27 since the blocks 50 are each thinner than the piezoelectric vibrating plate 27.
  • the piezoelectric vibrating plate is cut into a teeth or comb shape with a cutting tool, e.g., a wire saw, such that both outermost cut lines C are set at the respective blocks 50, and the width of the dummy piezoelectric elements 7 and the width of the piezoelectric vibration elements 5 are exactly secured (Fig. 13(II)).
  • the piezoelectric vibrating plate can be cut smoothly to have cut surfaces exactly along the intended cutting lines C since the blocks 50 are made of homogeneous material.
  • a piezoelectric vibration element unit is completed (Fig. 13(III)). Those remains can be removed relatively easily since those are made of homogeneous material.
  • the distal ends of the dummy piezoelectric elements 7 of the piezoelectric vibration element unit thus manufactured are regulated in position with respect to the distal end of the piezoelectric vibrating plate 27 formed highly accurately. Therefore, the dummy piezoelectric elements 7 can be used to position the piezoelectric vibration plate 27 to the fluid channel unit with high accuracy. Further, the dummy piezoelectric elements 7 are reinforced by the blocks 50 having a higher toughness than the piezoelectric material. Therefore, even if the piezoelectric vibration element unit is inserted into a head holder by using the outside surfaces of the blocks 50 as a reference, the piezoelectric element unit can withstand external forces applied during its assembling, whereby it will not be damaged.
  • the blocks are provided on the piezoelectric vibrating plate of the piezoelectric constant d31 in the above-mentioned embodiment, it may likewise be applied to the formation of the dummy piezoelectric elements when a piezoelectric vibrating plate of the piezoelectric constant d33 is cut into piezoelectric vibration elements. That is, the blocks may be attached to the piezoelectric vibration plate after the piezoelectric vibration plate is subjected to the polarizing process and before the piezoelectric vibration plate is cut into piezoelectric vibration elements.
  • a proximal end 7p of the dummy piezoelectric element 7 may be separated from a proximal end 5p of an adjacent piezoelectric element 5 and fixed with respect to the proximal end 5p of the adjacent piezoelectric element 5 through the fixing plate 6.
  • the proximal end 7p of the positioning dummy piezoelectric element 7 may be integral with the proximal end 5p of the adjacent active piezoelectric element 5 as long as the segment electrodes 4 in the positioning dummy piezoelectric element 7 is electrically insulated from the segment electrodes 4 in the adjacent active piezoelectric element 5.
  • the proximal ends 5p of the adjacent piezoelectric elements 5 may be separated one from the other, or integral together.
  • the present invention is applicable to various actuators, such as liquid ejection devices, that employ a piezoelectric vibration element or piezoelectric vibration elements.
EP00106070A 1999-03-29 2000-03-29 Tintenstrahlaufzeichnungskopf, piezoelektrische Vibratorelementeinheit und Verfahren zur Herstellung der piezoelektrischen Vibratorelementeinheit Expired - Lifetime EP1040923B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP8578899 1999-03-29
JP8578899 1999-03-29
JP2000076269 2000-03-17
JP2000076269 2000-03-17

Publications (3)

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EP1040923A2 true EP1040923A2 (de) 2000-10-04
EP1040923A3 EP1040923A3 (de) 2000-11-08
EP1040923B1 EP1040923B1 (de) 2003-12-03

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EP00106070A Expired - Lifetime EP1040923B1 (de) 1999-03-29 2000-03-29 Tintenstrahlaufzeichnungskopf, piezoelektrische Vibratorelementeinheit und Verfahren zur Herstellung der piezoelektrischen Vibratorelementeinheit

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EP (1) EP1040923B1 (de)
AT (1) ATE255505T1 (de)
DE (1) DE60006878T2 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0550030A2 (de) * 1991-12-26 1993-07-07 Seiko Epson Corporation Tintenstrahldruckkopf und sein Herstellungsverfahren
WO1996000151A1 (fr) * 1994-06-23 1996-01-04 Citizen Watch Co., Ltd. Actionneur piezo-electrique pour tete d'impression a jet d'encre et son procede de fabrication
EP0761447A2 (de) * 1995-09-05 1997-03-12 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf und sein Herstellungsverfahren
EP0787589A2 (de) * 1996-02-05 1997-08-06 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf
EP0860279A1 (de) * 1997-02-21 1998-08-26 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf
EP0861725A2 (de) * 1997-01-27 1998-09-02 Seiko Epson Corporation Tintenstrahldruckkopf
DE19745980A1 (de) * 1997-03-19 1998-10-01 Fujitsu Ltd Tintenstrahlkopf zum Vorsehen eines akkuraten Positionierens von Düsen von Segmentchips auf einem Halter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0550030A2 (de) * 1991-12-26 1993-07-07 Seiko Epson Corporation Tintenstrahldruckkopf und sein Herstellungsverfahren
WO1996000151A1 (fr) * 1994-06-23 1996-01-04 Citizen Watch Co., Ltd. Actionneur piezo-electrique pour tete d'impression a jet d'encre et son procede de fabrication
EP0761447A2 (de) * 1995-09-05 1997-03-12 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf und sein Herstellungsverfahren
EP0787589A2 (de) * 1996-02-05 1997-08-06 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf
EP0861725A2 (de) * 1997-01-27 1998-09-02 Seiko Epson Corporation Tintenstrahldruckkopf
EP0860279A1 (de) * 1997-02-21 1998-08-26 Seiko Epson Corporation Tintenstrahlaufzeichnungskopf
DE19745980A1 (de) * 1997-03-19 1998-10-01 Fujitsu Ltd Tintenstrahlkopf zum Vorsehen eines akkuraten Positionierens von Düsen von Segmentchips auf einem Halter

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Publication number Publication date
ATE255505T1 (de) 2003-12-15
EP1040923A3 (de) 2000-11-08
EP1040923B1 (de) 2003-12-03
DE60006878T2 (de) 2004-10-14
DE60006878D1 (de) 2004-01-15

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