EP0985218B1 - Dispositif et procede pour refroidir une bobine d'inductance de type planar - Google Patents

Dispositif et procede pour refroidir une bobine d'inductance de type planar Download PDF

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Publication number
EP0985218B1
EP0985218B1 EP98932086A EP98932086A EP0985218B1 EP 0985218 B1 EP0985218 B1 EP 0985218B1 EP 98932086 A EP98932086 A EP 98932086A EP 98932086 A EP98932086 A EP 98932086A EP 0985218 B1 EP0985218 B1 EP 0985218B1
Authority
EP
European Patent Office
Prior art keywords
support
cooling
core
cooling element
core element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98932086A
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German (de)
English (en)
Other versions
EP0985218A1 (fr
Inventor
Peter Gammenthaler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Power One AG
Original Assignee
Power One AG
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Filing date
Publication date
Priority claimed from DE19808592A external-priority patent/DE19808592C2/de
Application filed by Power One AG filed Critical Power One AG
Publication of EP0985218A1 publication Critical patent/EP0985218A1/fr
Application granted granted Critical
Publication of EP0985218B1 publication Critical patent/EP0985218B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings

Definitions

  • the present invention relates to a device or a method of cooling a planar inductance, in particular a planar transformer, according to the preamble of claim 1, as is known from EP 0 564 315 A1.
  • Multilayer multilayer carrier boards
  • a transformer core which suitably on the multilayer or is placed in openings of the same.
  • planar inductors it is used particularly in power electronics through a number of mechanical and thermal problems difficult.
  • the multi-layer cable carrier without special cooling measures heat up too much so that even with oversizing the use of this new technology encounters performance limits.
  • a transformer arrangement or choke in a multilayer 10 with corresponding as transformer windings trained line layers has a first - in cross-section, E-shaped example - transformer core 12 on, with legs 14 by appropriate slot-shaped openings of the multilayer 10 extends.
  • a second, plate-shaped and I-shaped transformer core in cross section 16 so that in the intermediate multilayer sections 18 running winding layers from the transformer core 12, 16 are enclosed.
  • the core elements 12, 16 are glued to each other or flat and put so the magnetic circuit sure.
  • FIG. 5 Another approach from the prior art is according to 5 of the drawing shows a thermal connection of the transformer core itself to the heat sink 22 intended. This is done using an elastic layer 26 made of heat-conducting material, that shown in FIG Way between transformer core 16 and heat sink 22 lies.
  • the mechanical connection between the heat sink 22 and multilayer 10 is over spacers 28 and screws 30 realized; the naturally occurring dimensional tolerances however, the cores and bolts require the flexibility of the Material 26, which as a large, flexible Thermal pad also referred to as a "gap pad” or "soft pad” becomes.
  • the arrangement according to FIG. 5 is not insignificant Manufacturing and manufacturing expenses. The same applies Disadvantages as in the embodiment according to FIG. 4.
  • FIG. 6 shows the technology in which by means of elastic thermal mats 32 dissipated heat of the multilayer 10 to the heat sink 22 becomes; at the same time the transformer arrangement are held by a resilient bracket element 34.
  • the core is not cooled.
  • planar transformers be used in a so-called matrix arrangement; a plurality of arranged on a multilayer Transformers, each with individual, local heat dissipation need.
  • the object of the present invention is therefore for multilayer carriers of the generic type with used Planar inductors to provide heat dissipation that especially suitable for high power losses and is mechanically stable as well as a simple, inexpensive and potentially automatable production allowed.
  • the invention advantageously enables a planar inductance in a multilayer, in particular a circuit arrangement of power electronics, to create that extremely is easy to manufacture, opting for automatic assembly or implementation and beyond very high level of heat dissipation - both from the heat-generating Section of the multilayer as well as from the transformer core - allowed.
  • the transformer cores not just as magnetic or electrical components, but viewed as mechanical elements that - due to their relatively good heat conduction, for example with ferrite - serve as thermal bridges and the multilayer assembly fix.
  • the cores also implement at the shortest distance the largest possible area for heat dissipation at the point of origin.
  • the adhesive layer according to the invention can be advantageous Tolerance problems between the different cores a matrix arrangement and the plate-shaped cooling element compensate.
  • the thickness of the multilayer printed circuit board then plays and the thickness of the cores for mechanical Attachment no longer a role.
  • brittle material for example Ferrite
  • realized - core elements reliably fixed, which makes the assembly extremely vibration-resistant.
  • a large, continuous metallic cooling plate used as a cooling element is used in a suitable manner as a shield against Interference fields of the inductors.
  • Cooling element in addition to cooling semiconductors or other heat-generating electronic components to be used on the carrier board (multilayer) so that a complete, compact and efficient cooling and mounting system for electrical power modules.
  • the cooling element according to the invention further electronic components to be cooled place that within a single operation or Assembly process both cooling the core element and also of the electronic component to be cooled in addition can be done; this can be done appropriately dimensioned projections or profiled sections of the Cooling element at points of attack and contact for one too cooling power semiconductors. The result arises this makes it particularly suitable for SMD-equipped arrangements a cooling system with no additional effort.
  • FIG. 1 to 3 For the description of the exemplary embodiments in FIG. 1 to 3 apply reference numerals corresponding to FIGS. 4 to 6, if identical components are affected.
  • FIG. 1 shows the top view of a power semiconductor arrangement with a multilayer board 10 and a plate-shaped, flat heat sink 22 made of common heat sink material, such as copper or aluminum.
  • transformers there is a plurality of transformers on the printed circuit board 10 (or chokes) 38 - partly distributed in matrix form - arranged, these transformers (cores and winding) on their assembly side shown in FIG. 1 side facing away from contact with the entire heat sink 22 cooled and kept.
  • FIG. 1 shows a plurality of (SMD-equipped) electronic components 40 on the component side board 10, and it is a plurality of power semiconductor elements 42 recognizable, also be cooled by contact with the heat sink 22.
  • the E-shaped, first transformer element 12 by means of an example electrically conductive, thermally conductive adhesive connection 44 with the downward-facing surface of the multilayer 10 connected between the legs 14 and it is the plane Surface of the transformer core 12 by means of the entire surface a heat and electrically conductive adhesive 46 with the Heatsink plate 22 connected.
  • the one for the adhesive connections Adhesive 44 or 46 used preferably has metal particles or the like. on that is not just electrical conductivity between the components involved, but also for a clearly superior one Ensure thermal conductivity.
  • properties of the cores cooled in this way is the electrical connection between the transformer core and heat sink with practically no disadvantageous consequence.
  • FIG. 3 illustrates the principle of the invention Arrangement of Fig. 2 in an environment of a heat-generating Power module, such as an electronic switching power supply is.
  • the transformer arrangement 12, 16 is adjacent a power semiconductor 42, such as an insulated switching transistor, which in the manner shown also has a Adhesive connection 48 is connected to the heat sink 22 and not only uses the available cooling surface, but also also for further mechanical stabilization of the arrangement worries.
  • the invention enables the additional cooling of SMD power components, for example in housings such as D-Pack, D 2 -Pack, SOT 223 etc. without additional effort.
  • the resulting heat loss is dissipated to the external cooler through the multilayer; this can be seen in FIG. 3 above the projection 50.
  • copper or the like can advantageously be used to improve heat conduction below the power components.
  • Thermally conductive material can be introduced into the multilayer, wherein the layers can be connected to one another with vias.
  • the adhesive generally fits all unevenness so that not only the thermal contact resistance by trapped air between all components involved is reduced; it also finds an effective one Area adjustment instead.
  • the parts can no longer be moved against each other; it not only creates a reliable, lasting one thermal, but also a correspondingly resilient and vibration-proof mechanical connection.
  • the different expansion coefficients of the multilayer and the cooling plate can preferably be matched to one another. Since such a power multilayer contains a lot of copper, the thermal linear expansion of such a plate is approximately equal to that of copper (multilayer FR 4: 10 - 17 10 - 6 / K; copper: 16.5 10 -6 / K; ferrite: 10, 5 10 -6 / K).

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)

Claims (7)

  1. Dispositif pour refroidir une inductance planaire avec un support (10) en forme de plaques, présentant une pluralité de couches conductrices, un élément formant noyau (12, 16) et un élément de refroidissement (22), au moins une couche conductrice du support, en coopération avec l'élément formant noyau réalisé pour le passage d'un flux magnétique, constituant l'inductance planaire,
    l'élément formant noyau, pour assurer la fixation du support et en tant que pont thermique, étant relié sur sa première face, tournée vers une face supérieure du substrat (10), à la face supérieur au moyen d'un adhésif(44) et étant relié sur une deuxième face extérieure, planaire, à l'élément de refroidissement (22), présentant une surface de contact planaire, de l'élément thermique,
    caractérisé en ce que
    l'adhésif est conducteur de la chaleur, l'élément formant noyau est collé à l'élément de refroidissement, l'élément de refroidissement étant réalisé pour assurer un refroidissement supplémentaire d'un semi-conducteur de puissance prévu sur le support et présente, dans une zone de contact (50) avec le semi-conducteur de puissance, une saillie ou un tronçon à profilage approprié.
  2. Dispositif selon la revendication 1, caractérisé en ce que sur le support en forme de plaque est prévue une pluralité d'inductances planaires présentant chacune un élément formant noyau, un élément de refroidissement commun étant collé aux éléments formant noyau.
  3. Dispositif selon la revendication 1 ou 2, caractérisé en ce que l'élément de refroidissement est réalisé en forme de plaques et s'étend sensiblement parallèlement au support (10).
  4. Dispositif selon la revendication 3, caractérisé en ce que l'élément de refroidissement s'étend sensiblement sur la surface totale du support (10) en forme de plaque.
  5. Dispositif selon l'une des revendications 1 à 4, caractérisé en ce que le collage, entre l'élément formant noyau et le support, et/ou le collage, entre l'élément formant noyau et l'élément de refroidissement, est réalisé avec un adhésif d'une épaisseur comprise entre 100 et 200 micromètres.
  6. Dispositif selon l'une des revendications 1 à 4, caractérisé en ce que le collage, entre l'élément formant le noyau et le support, et/ou, entre l'élément formant noyau et l'élément de refroidissement, est réalisé au moyen d'une feuille adhésive double face, conductrice de la chaleur.
  7. Utilisation du dispositif selon l'une des revendications 1 à 6, pour réaliser une partie de réseau de commutation, un convertisseur de tension, ou une partie de réseau.
EP98932086A 1997-05-27 1998-05-27 Dispositif et procede pour refroidir une bobine d'inductance de type planar Expired - Lifetime EP0985218B1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE19722204 1997-05-27
DE19722204 1997-05-27
DE19740283 1997-09-13
DE19740283 1997-09-13
DE19808592 1998-02-28
DE19808592A DE19808592C2 (de) 1997-05-27 1998-02-28 Vorrichtung zum Kühlen einer Planarinduktivität
PCT/EP1998/003104 WO1998054735A1 (fr) 1997-05-27 1998-05-27 Dispositif et procede pour refroidir une bobine d'inductance de type planar

Publications (2)

Publication Number Publication Date
EP0985218A1 EP0985218A1 (fr) 2000-03-15
EP0985218B1 true EP0985218B1 (fr) 2001-10-04

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Family Applications (1)

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EP98932086A Expired - Lifetime EP0985218B1 (fr) 1997-05-27 1998-05-27 Dispositif et procede pour refroidir une bobine d'inductance de type planar

Country Status (3)

Country Link
US (1) US6222733B1 (fr)
EP (1) EP0985218B1 (fr)
WO (1) WO1998054735A1 (fr)

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Also Published As

Publication number Publication date
US6222733B1 (en) 2001-04-24
EP0985218A1 (fr) 2000-03-15
WO1998054735A1 (fr) 1998-12-03

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