WO2014206460A1 - Module d'alimentation électrique en mode commuté et son procédé de fabrication - Google Patents

Module d'alimentation électrique en mode commuté et son procédé de fabrication Download PDF

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Publication number
WO2014206460A1
WO2014206460A1 PCT/EP2013/063382 EP2013063382W WO2014206460A1 WO 2014206460 A1 WO2014206460 A1 WO 2014206460A1 EP 2013063382 W EP2013063382 W EP 2013063382W WO 2014206460 A1 WO2014206460 A1 WO 2014206460A1
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WO
WIPO (PCT)
Prior art keywords
heatsink
circuit board
printed circuit
magnetic core
module
Prior art date
Application number
PCT/EP2013/063382
Other languages
English (en)
Inventor
Oscar Persson
Johan HÖRMAN
Magnus Karlsson
Peter Schurmann
Original Assignee
Telefonaktiebolaget L M Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget L M Ericsson (Publ) filed Critical Telefonaktiebolaget L M Ericsson (Publ)
Priority to PCT/EP2013/063382 priority Critical patent/WO2014206460A1/fr
Publication of WO2014206460A1 publication Critical patent/WO2014206460A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core

Definitions

  • the present invention relates to a switched-mode power supply module and to a method of manufacturing the same, and particularly to a switched-mode power supply module which is able to efficiently dissipate generated heat.
  • Switched-mode power supplies are a type of electronic power supply used for the transfer of electrical power from a source to a load while converting the voltage and/or the current characteristics of the electrical power transferred.
  • such power supply modules can be used to convert from AC power to DC power, and to convert from one voltage to another voltage.
  • a switching-mode supply achieves the conversion by switching between different circuit configurations in which electrical energy is alternatively stored and released. Since the switching elements and the storage elements are usually selected to dissipate little electrical power, switched-mode power supplies are able to achieve much higher power conversion efficiencies than traditional linear power supplies .
  • Examples of the storage elements in a switched-mode power supply include capacitors and inductors, while examples of the switching elements include transistors, such as FETS, especially MOSFETS .
  • an inductor is used as one of the storage components, comprising an inductive coil of a conductive material surrounding a ferro- or ferrimagnetic core.
  • Such a configuration is able to achieve a relatively high inductance within a small inductor volume.
  • field electrode transistors As switching elements, field electrode transistors, or FETs, are often used due to their high degree of isolation between input and output and low dissipation in the on-state.
  • switched-mode power supply is often provided as a switched-mode power supply module.
  • the switched-mode power supply module may be provided as an ancillary printed circuit board (PCB) , or daugherboard, having the components of the switched-mode power supply mounted thereto and which is configured to be mounted directly, for example during product assembly, to a main PCB, or motherboard, which requires the converted power.
  • PCB printed circuit board
  • switched-mode power supply modules can be mass produced for standardized input and output characteristics, and with standardized form factors, for easy integration by electronics manufacturers into end-user products.
  • non-ideal switched-mode power supply modules there is some residual heat generated during the conversion process. As the power supplied by the module increases, the residual heat generated also increases. However, it is difficult to dissipate excess heat while maintaining a relatively small package size.
  • a method of manufacturing a switched-mode power supply module comprises providing a printed circuit board.
  • the board has conductive traces on at least a first side.
  • the conductive traces on at least the first side are electronically connected to at least one inductive winding formed around an aperture connecting the first side and the second side.
  • the method comprises inserting a magnetic core into the aperture from the first side to the second side.
  • the method comprises securing the magnetic core at the first side.
  • the method comprises mounting at least one switching element on the first side so as to be electrically connected to the conductive traces.
  • the method comprises providing a thermally conductive heatsink to the magnetic core on the first side of the printed circuit board.
  • the magnetic core has a head portion having a cross-sectional area larger than the aperture, and securing the magnetic core comprises applying an adhesive between the head portion and the first side.
  • the method further comprises providing pins to the second side of the printed circuit board for mounting the module to a further assembly.
  • providing the heatsink comprises providing the heatsink to the at least one switching element mounted on the first side.
  • the heatsink has a plurality of land surfaces each adapted to face a core or a field-effect transistor module, and the land surfaces have heights from a reference plane of the heatsink selected such that, when the heatsink is provided to the module, substantially the same gap is provided between the heatsink and cores or switching element which the land surfaces are adapted to face.
  • providing the thermally conductive heatsink comprises applying a thermal interface material between the heatsink and each core or switching element to which the heatsink is provided.
  • the heatsink comprises a thermally conductive backplate arranged to face the printed circuit board and a heat dissipator in thermal contact with a side of the backplate opposite to the side arranged to face the printed circuit board.
  • providing the heatsink comprises applying pressure with the heatsink to the magnetic core in a direction towards the first side of the printed circuit board .
  • the method further comprises mounting the heatsink to the printed circuit board.
  • a switched-mode power supply module apparatus comprising a printed circuit board.
  • the board has conductive traces on at least a first side.
  • the conductive traces on at least the first side are electronically connected to at least one inductive winding formed around an aperture connecting the first side and the second side.
  • the board comprises a magnetic core inserted in the aperture passing from the first side to the second side.
  • the magnetic core is secured at the first side.
  • At least one switching element is mounted on the first side so as to be electrically connected to the conductive traces.
  • a thermally conductive heatsink is provided to the magnetic core on the first side of the printed circuit board.
  • the magnetic core has a head portion having a cross-sectional area larger than the aperture, and the magnetic core is secured by means of an adhesive applied between the head portion and the first side.
  • the module further comprises pins provided to the second side of the printed circuit board for mounting the module to a further assembly.
  • the heatsink has a plurality of land surfaces each adapted to face a core or a switching element, and the land surfaces have heights from a reference plane of the heatsink selected such that substantially the same gap is provided between the heatsink and each core or switching element which the land surfaces are adapted to face.
  • the heatsink comprises a thermally conductive backplate arranged to face the printed circuit board and a heat dissipator in thermal contact with a side of the backplate opposite to the side arranged to face the printed circuit board.
  • the heatsink is retained against the magnetic core with pressure applied from the heatsink to the magnetic core in a direction towards the first side of the printed circuit board.
  • FIG.l shows the PCB layout of a switched-mode power supply module according to one reference design
  • FIG.2 shows a cross-section through the switched-mode supply module of FIG. 1;
  • FIG. 3 shows an expanded heat dissipation pathway through the switched-mode power supply module of FIG. 1, showing the internal structure of the printed circuit board;
  • FIG. 4 shows a method of mounting a heatsink to the switched-mode power supply module of FIG. 1;
  • FIG. 5 shows heat transfer paths through the configuration of switched-mode power supply module shown in FIG. 4;
  • FIG. 6 shows a configuration of a switched-mode power supply module in accordance with the present disclosure
  • FIG. 7 shows heat dissipation pathways through the switched-mode power supply module of FIG. 6;
  • FIG. 8 shows one implementation of a process by which the switched-mode power supply module of FIG. 6 may be manufactured .
  • FIG. 1 shows the layout of a known switched-mode power supply module 900 according to a reference design devised by the present inventors.
  • the switched-mode power supply module 900 has a printed circuit board 901, to which the various components forming the switched-mode power supply are mounted.
  • Switched-mode power supply module 900 includes, for example, field effect transistor (FET) modules 920 and 921, which act as the switching elements in the switched-mode power supply, and choke and transformer cores 910 and 911, which act as the cores of the inductive components in the switched-mode power supply.
  • Cores 910 and 911 may be, for example, ferrite cores.
  • Printed circuit board 901 is provided with conductive traces, for example etched copper traces, which provide the inductive windings (902) of the choke and transformer inductors and which also provide interconnections between the switching elements and the conductors.
  • printed circuit board 901 is a multi-layer circuit board having conducted traces on each side and having internal traces laminated between the first side and the second side. Such traces may be accessed using plated vias which pass from one side of the board to the opposite side.
  • the cores 910 and 911 whose size is essentially dependent on the inductance desired and which are difficult to further minimise, come to represent the greatest usage of space on the board.
  • FIG. 1 A cross-section through the module of FIG. 1 is shown in
  • FIG. 2 in which it can be seen how cores 910 and 911 penetrate board 901 through respective apertures 940 and 941, passing from a second (lower) side of the board to a first (upper) side of the board 901.
  • the lower side of the board is conventionally termed the "pin side” while the upper side of the board is conventionally termed the "top side”.
  • Cores 910 and 911 are provided with head portions 910C and 911C, respectively, at one end of the core, which are larger than the respective apertures 940 and 941 so as to prevent the head portion passing through the respective aperture when the remaining body portion of the core is inserted.
  • Adhesive 910B and 911B is applied between head portions 910C and 911C, respectively, and the second (lower) side of board 901 to secure the magnetic core to the board.
  • Suitable adhesives are well-known in the art for fixing cores to printed circuit boards, and may be selected in accordance with local preference and availability.
  • such cores also may include a cap portion of similar dimensions to the head portion but adapted to be engaged, for example by press-fit, adhesive or screwing, to the main body portion of the core at the end opposite to the head portion after the main body portion has been inserted, at the first (upper) side of the board.
  • a cap portion of similar dimensions to the head portion but adapted to be engaged, for example by press-fit, adhesive or screwing, to the main body portion of the core at the end opposite to the head portion after the main body portion has been inserted, at the first (upper) side of the board.
  • an air gap (910A, 911A) exists between the cap portion and the first (upper) side of the board as a consequence of the need to provide tolerances to ensure that the core can be correctly mounted to the board.
  • the air gap is normally small, but normally larger than the thickness of adhesive used to secure the head portion of the core to the second (lower) side of the board.
  • pins 930A and 930B which serve both to transfer electrical power to and from module 900 and to attach module 900 to a further printed circuit board, or motherboard, of the electronic product to which power supply module 900 is intended to supply power.
  • FET modules 920 and 921 are mounted, for example by soldering to conductive traces provided on the upper surface of the board 901.
  • FET modules 920 and 921 may be soldered to the conductive traces on upper surface of board 901 by surface-mount technology, for example by positioning modules 920 and 921 relative to circuit board 901 by pick- and-place and by applying reflow soldering to secure modules 920 and 921 to upper side of printed circuit board 901.
  • pins 930A and 930B are inserted into vias 960A and 960B as push-pins so as to penetrate the full depth of board 901, enabling access to the pins from conductive traces on both sides of board 901.
  • the components on the second (lower) side of the board 901 including cores 910 and 911 and pins 930A and 930B, are first arranged on and then secured to the second side of board 901 while the board is in an inverted configuration with the second side uppermost, for ease of access. Then the module is further inverted to that the first side is uppermost and the components on the first (upper) side of module 901 are first arranged on and then secured to the first (upper) side of board 901.
  • the configuration chosen in FIG. 2 is selected so as to minimize the length of pins 930A and 930B so that module 900 may be mounted closely to the main board to which it is to be provided. Therefore, the overall stand-off height of board 900 is minimized.
  • components having a lower height relative to the surface of the board on which they are mounted are provided on the second (lower) side of the board, being the same side to which pins 930A and 930B are mounted.
  • Such components include the head portions of cores 910 and 911.
  • FIG. 3 shows the heat dissipation pathways as dashed lines from cores, exemplified by core 910, core 911 not being shown for simplicity, or from FET modules 920 and 921.
  • the heat generated in the FET modules 920 and 921 passes along conductive traces 901A and down plated vias 950 and 951 to pass to supply pins 930A and 930B. From supply pins 930A and 930B, the heat is conducted into the supply planes of the PCB to which the module is attached, and from where the heat may be further dissipated.
  • the heat generated in core 910 is transferred through adhesive 910B into the conductive traces 901B formed on the second (lower) side of board 901 from which it is also transferred into supply pins 930A and 930B and dissipated.
  • the transfer of heat through PCB 901 may be assisted by internal conductive traces 950A, 950B, 950C, 950D, 950E and 950F, which may include the inductor windings about core 910.
  • one approach for cooling the module is to provide a heatsink having a thermal dissipator 990 to the components mounted on the first (upper) side of circuit board 901, principally to dissipate the heat generated in FET modules 920 and 921.
  • the thermal dissipator 990 may be, for example, an arrangement of radiator fins or a liquid-cooling block having passages for flowing cooling liquid or refrigerant therein.
  • a thermal interface material 970 and 971 may be placed between FET modules 920 and 921 and the heatsink to provide adequate thermal contact between the FET modules and the heatsink.
  • thermal interface material may fill small gaps, grooves or irregularities in the respective interface surfaces of FET modules 920 and 921 and the heatsink.
  • the thermal interface material may be a thermal pad, a thermal grease, or a thermal adhesive.
  • the FET modules 920 and 921 may not necessarily have the same height above the first surface of the circuit board 901, and other components of varying heights may also be positioned on the first (upper) side of printed circuit board 901.
  • the heatsink is provided with a baseplate 980, for example as shown in Figure 4.
  • Baseplate 980 has a lower surface which faces the first (upper) surface of printed circuit board 901.
  • the lower surface of baseplate 980 is formed to have a number of lands 980A, 980B and 980C, which in practice may be any number of lands, and which are spaced apart from the first (upper) surface of printed circuit board 901 by predetermined respective heights.
  • Land 980A faces FET module 921, and is arranged to be positioned only a small distance above FET module 921 when baseplate 980 is attached to circuit board 901.
  • Land 980C is similarly spaced closely to FET module 920 to accommodate thermal interface material 970 therebetween.
  • 980B is positioned sufficiently far away from first (upper) surface of printed circuit board 901 as to allow space for cores 910 and 911 to protrude without contact between the baseplate 980 and the cores 910 and 911.
  • thermal interface material 970 and 971 Since the heat transfer through thermal interface material 970 and 971 is significantly improved if only a thin layer of thermal interface material 970 and 971 is present, it is conventional for baseplate 980 to be pressed tightly against FET modules 920 and 921, for example by clamping or screwing the baseplate 980 to the first (upper) side of printed circuit board 901.
  • the thickness of thermal interface material is thicker than 0.05mm, to allow for appropriate tolerances in the manufacture of the baseplate.
  • the thickness of the thermal interface material is less than 0.2mm to enable good thermal transfer characteristics. Other values may be achievable with a suitable choice of thermal interface material selected.
  • the thermal transfer pathways in such an arrangement are shown in FIG. 5, again as dashed lines.
  • thermal interface material 970 and 971 is provided between FET modules 920 and 921 and baseplate 980.
  • core 910 is secured by adhesive 910B to the second (lower) side of PCB 901
  • pressure from baseplate 980 onto core 910 will tend to drive core 910 away from the second (lower) surface of printed circuit board 901, weakening the bond provided by adhesive 910B and potentially allowing core 910 to become free.
  • the pressures required between baseplate 980 and core 910 to form adequate thermal conduct between baseplate 980 and core 910 tend to be so high as to break bonds between core 910 and the second (lower) side of PCB 901 using conventional adhesives. Therefore, in the present art, it is not conventionally considered appropriate to directly provide heatsinks to the cores.
  • switched-mode power supply module 100 being an embodiment of the present disclosure, has a similar configuration to the switched-mode power supply shown in FIG. 4.
  • Elements bearing reference numerals of the form 1XX should be taken to be essentially similar to the elements bearing reference numerals of the form 9XX shown in FIGS. 1 to 5, except where otherwise stated or described.
  • magnetic cores 110 and 111 are secured to the same, first (upper) side of PCB 101 by adhesive layers HOB and 111B.
  • thermal interface material 172 and 173 is provided between magnetic cores 110 and 111 and baseplate 180 in a similar manner to the thermal material 170 and 171 provided between FET modules 120 and 121. Since cores 110 and 111 are secured on the same side of circuit board 101 as FET modules 120 and 121, which is the side against which baseplate 180 is retained, pressure can be applied between cores 110 and 111 and baseplate 180 to compress, and thus reduce the thickness of, thermal interface material 172 and 173, without risking the possibility of dislodging cores 110 and 111 from their predetermined position.
  • FIG. 7 it can now be seen that heat can transfer not only from FET modules 120 and 121 through thermal interface material 170 and 171 to baseplate 180 and then into thermal dissipator 190, but heat can also transfer from core 110 through thermal interface material 172 to baseplate 180 and then into thermal dissipator 190. Although there still exists a pathway for heat generated in module 100 to dissipate through supply pins 130A and 130B, the quantity of the heat to be dissipated through these pins is reduced as compared with the configuration shown in FIG. 5.
  • the switched-mode power supply module may comprise a greater or smaller number of cores and/or FET modules.
  • Other components for example control and monitoring logic packages, may be provided to first and second surfaces of printed circuit board 101, and those which are provided on the first (upper) surface of printed circuit board 101 may be provided with thermal interface material for thermal connection to baseplate 180 in a similar manner to the FET modules.
  • pins have been described as the means by which the module is able to be connected to a further circuit board, other arrangements, such as plug-and-socket connectors, header sockets, ZIF sockets, or similar are also possible .
  • the coils forming the inductors may be provided as laminated layers interior to the printed circuit board, or may be provided as a spiral coil on one or other surface of the printed circuit board.
  • Components on the second (lower) side of the PCB may be inserted into through-holes, or may also be attached by surface mount technology, including the pins.
  • FET modules may also be provided to a second (lower) surface of the printed circuit board, and may dissipate heat through conductive traces on the second (lower) surface and via vias formed in the printed circuit board either to the heatsink or to assembly to which the module is mounted.
  • Such optional modules are shown as modules 922, 923, 122, 123 in the Drawings. In some configurations, it is sufficient that thermal dissipation occur from the FET modules into the heatsink through the core alone, and therefore thermal interface material can be omitted between the FET modules and the baseplate.
  • the base plate need not have lands formed at different heights, but may be provided with a uniform flat surface.
  • the thermal interface material may be omitted, and direct contact between the baseplate and the heat-dissipating components may be sufficient.
  • the heatsink may be provided in a two-piece arrangement, having a baseplate connected to a heatsink, or the baseplate and heatsink can be formed in a unitary and integral manner, for example by forming fins on an upper surface of baseplate 180.
  • a set of discrete heatsinks may be provided, one to each component, including the cores.
  • the field-effect transistor module is a surface-mount module
  • mounting the field-effect transistor module comprises using surface-mount technology, optionally pick-and-place and reflow soldering, to mount the module to the conductive traces
  • other mounting technologies are possible for the FET module or modules.
  • the FET module or modules may be inserted into sockets.
  • the second side of the printed circuit board is provided with conductive traces
  • providing the pins comprises surface- mount technology, optionally using pick-and-place and reflow soldering, to mount the pins to the conductive traces
  • other mounting technologies are possible for the pins.
  • the pins may be inserted into through-holes formed in the printed circuit board.
  • the printed circuit board has two surfaces each having conductive traces and FET modules mounted thereon
  • the arrangement in which the second side of the printed circuit board is provided with conductive traces and at least one FET module is mounted on the second side so as to be electrically connected to the conductive traces on the second side is exemplary.
  • Power supply modules having FET modules on one or both sides are also within the scope and teaching of the present disclosure.
  • the module employs FET modules as switching elements
  • the switching elements can use switching technology other than FETs, and may, for example, be applied to other types of transistor without limitation.
  • the switching elements may be discrete, as in individually- packaged transistors, or may be provided as an integrated circuit module.
  • the switching element or components can be provided on a separate substrate, such as a PCB, which is mounted to a surface of the power supply module PCB, for example by means of pins which mate with corresponding receptacles on the power supply module PCB. All such structures may be regarded as being a switching element for the purposes of the present disclosure.
  • the switching elements may be binary switches which operate between two states, may operate between more than two states, or may be operated, for example, in a linear regime, for example as a regulator .
  • the module is for mounting to a motherboard by means of pins, other means of mounting the module to a motherboard are possible.
  • the module may be connected to the motherboard by means of surface mount technologies such as a ball-grid array (BGA) , a quad flat package (QFP) , a land grid array (LGA) , such other mounting technologies which are available in the art.
  • BGA ball-grid array
  • QFP quad flat package
  • LGA land grid array
  • Electrical connection of the module to the motherboard by means of a ribbon cable or a flexible PCB or by means of jumper wiring is also contemplated.
  • the module may be arranged relative to the motherboard by purely mechanical means such as spacers or posts or by retaining elements of a common enclosure.
  • the module comprises at least one further inductor formed around a further aperture; and a further magnetic core is inserted into the further aperture from the first side to the second side and is secured at the first side, and that the heatsink is provided to the further core on the first side of the printed circuit board, such an arrangement is exemplary.
  • One, two, or a plurality of cores are envisioned, some or all of which may be provided with a common heatsink, or with individual heatsinks .
  • the heat dissipator is provided with cooling fins, or that the heat dissipator is provided with passages for coolant flow, other mechanisms of operation of the heat dissipator may be selected.
  • the heat dissipator may comprise a thermoelectric device, such as a Peltier cooler, or may comprise a cooling agent which, for example, evaporates (e.g. liquid nitrogen) or sublimes (e.g. solid carbon dioxide) to dissipate excess heat .
  • the inductor core or cores are ferrite, for example manganese-zinc ferrite or nickel-zinc ferrite, other materials are possible.
  • soft iron, carbonyl iron, or amorphous (vitreous) metal may be suitable for use in the inductor core. While it has been described that components are mounted to the second side of the printed circuit board before components are mounted to the first side of the printed circuit board, in some circumstances the order may be reversed, or some components may be added to one or other side after components have previously been placed on each side. Mounting all, or substantially all, components to one side before the other side has an advantage of simplicity of manufacture .
  • FIG. 8 One implementation of a method of manufacturing the exemplary module of FIG. 6 is shown schematically in FIG. 8.
  • This implementation starts from a previously prepared printed circuit board which has conductive traces on at least a first side.
  • the conductive traces on at least the first side are electronically connected to at least one inductive winding formed around an aperture connecting the first side and the second side.
  • the inductive winding can be formed, for example, as a spiral winding in a plane of the circuit board, optionally on the first side, or as a helical winding involving multiple layers of conductor formed over several planes of the circuit board.
  • pins 130A and 130B are provided to the second (lower) side of PCB 101 either by surface mount technology pick-and-place or by press-fit, corresponding to process S8-2 of FIG. 8.
  • the module is then inverted and FET modules 120 and 121 are positioned on the first (upper) surface of PCB 101, with, for example, solder paste interposed between the contacts of the FET modules and the conductive traces of the printed circuit board 101, corresponding to process S8-4 of FIG. 8.
  • Adhesive is applied to either the surface of the PCB 101 or the board-facing surfaces of the head portions of cores 110 and 111, corresponding to process S8-6 of FIG. 8.
  • the cores are inserted into their respective apertures 142 and 143, corresponding to process S8-8 of Fig. 8.
  • the assembly is heated, for example in a re-flow oven, during which time the solder paste melts to connect FET modules 120 and 121 to the conductor traces on the first (upper) side of PCB 101, corresponding to process S8-10 of FIG. 8.
  • PCB adhesive HOB and 111B cures to secure core modules 110 and 111 to PCB 101, corresponding to process S8-12 of FIG. 8.
  • Thermal interface material is then applied in suitable quantity as to provide adequate coverage to FET modules 120 and 121 and cores 110 and 111, corresponding to process S8-14 of FIG. 8.
  • Baseplate 180 is secured to first (upper) surface PCB 101 to apply pressure to thermal interface material 170, 171, 172 and 173, corresponding to process S8-16 of FIG. 8. This brings FET modules 120 and 121 and cores 110 and 111 into good thermal contact with baseplate 180.
  • Heat dissipator 190 may be then mounted to baseplate 180, for example by applying a layer of thermal interface material, for example thermal adhesive, between heat dissipator 190 and baseplate 180, and then clamping dissipator 190 and baseplate 180 together.
  • a layer of thermal interface material for example thermal adhesive
  • the thermal resistance between the heatsink and the other components of a switched-mode power supply may be reduced by approximately 30% to 40% and the output power for a given configuration of module may be increased by up to 15%.
  • the thermal mass of the cores helps to ensure temperature stability in the event of temporary excess heat production, for example during an overload configuration.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention porte sur un procédé de fabrication d'un module d'alimentation électrique en mode commuté. Le procédé consiste à produire une carte de circuit imprimé. La carte a des traces conductrices sur au moins un premier côté. Les traces conductrices sur au moins le premier côté sont électroniquement connectées à au moins un enroulement inductif formé autour d'un orifice connectant le premier côté et le second côté. Le procédé consiste à insérer un noyau magnétique dans l'orifice depuis le premier côté vers le second côté. Le procédé consiste à fixer le noyau magnétique du premier côté. Le procédé consiste à monter au moins un élément commutateur du premier côté de manière à être électriquement connecté aux traces conductrices. Le procédé consiste à équiper le noyau magnétique d'un dissipateur thermique thermiquement conducteur sur le premier côté de la carte de circuit imprimé. L'invention concerne également un module d'alimentation électrique en mode commuté pouvant être fabriqué par le procédé selon l'invention.
PCT/EP2013/063382 2013-06-26 2013-06-26 Module d'alimentation électrique en mode commuté et son procédé de fabrication WO2014206460A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/063382 WO2014206460A1 (fr) 2013-06-26 2013-06-26 Module d'alimentation électrique en mode commuté et son procédé de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/063382 WO2014206460A1 (fr) 2013-06-26 2013-06-26 Module d'alimentation électrique en mode commuté et son procédé de fabrication

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WO2014206460A1 true WO2014206460A1 (fr) 2014-12-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111786541A (zh) * 2019-03-18 2020-10-16 台达电子工业股份有限公司 电压调节模块
US11114946B2 (en) 2019-03-18 2021-09-07 Delta Electronics, Inc. Voltage regulator module
US11546994B2 (en) 2019-10-28 2023-01-03 Delta Electronics, Inc. Voltage regulator module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters
US6222733B1 (en) * 1997-05-27 2001-04-24 Melcher A.G. Device and method for cooling a planar inductor
US6411507B1 (en) * 1998-02-13 2002-06-25 Micron Technology, Inc. Removing heat from integrated circuit devices mounted on a support structure
US6466454B1 (en) * 1999-05-18 2002-10-15 Ascom Energy Systems Ag Component transformer
US20030174037A1 (en) * 2002-03-11 2003-09-18 Roger Hooey Packaging techniques for a high-density power converter
EP2361005A1 (fr) * 2008-12-12 2011-08-24 Murata Manufacturing Co. Ltd. Module de circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222733B1 (en) * 1997-05-27 2001-04-24 Melcher A.G. Device and method for cooling a planar inductor
US6411507B1 (en) * 1998-02-13 2002-06-25 Micron Technology, Inc. Removing heat from integrated circuit devices mounted on a support structure
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters
US6466454B1 (en) * 1999-05-18 2002-10-15 Ascom Energy Systems Ag Component transformer
US20030174037A1 (en) * 2002-03-11 2003-09-18 Roger Hooey Packaging techniques for a high-density power converter
EP2361005A1 (fr) * 2008-12-12 2011-08-24 Murata Manufacturing Co. Ltd. Module de circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111786541A (zh) * 2019-03-18 2020-10-16 台达电子工业股份有限公司 电压调节模块
US11114946B2 (en) 2019-03-18 2021-09-07 Delta Electronics, Inc. Voltage regulator module
US11212919B2 (en) 2019-03-18 2021-12-28 Delta Electronics, Inc. Voltage regulator module
US11923773B2 (en) 2019-03-18 2024-03-05 Delta Electronics, Inc. Voltage regulator module
US11546994B2 (en) 2019-10-28 2023-01-03 Delta Electronics, Inc. Voltage regulator module

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