EP0951691B1 - Carte a puce - Google Patents

Carte a puce Download PDF

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Publication number
EP0951691B1
EP0951691B1 EP98904010A EP98904010A EP0951691B1 EP 0951691 B1 EP0951691 B1 EP 0951691B1 EP 98904010 A EP98904010 A EP 98904010A EP 98904010 A EP98904010 A EP 98904010A EP 0951691 B1 EP0951691 B1 EP 0951691B1
Authority
EP
European Patent Office
Prior art keywords
module carrier
carrier
smart card
transmission
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98904010A
Other languages
German (de)
English (en)
Other versions
EP0951691A1 (fr
Inventor
Manfred Fries
Frank PÜSCHNER
Josef Mundigl
Jürgen Fischer
Detlef Houdeau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of EP0951691A1 publication Critical patent/EP0951691A1/fr
Application granted granted Critical
Publication of EP0951691B1 publication Critical patent/EP0951691B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the invention relates to a chip card with a card carrier, on which a data processing circuit and a Connection module for contactless transmission of data between the data processing circuit and an external Data processing station are provided.
  • a generic chip card and an external one Data processing station form a data system that for Billing of cashless purchases, to monitor Passenger traffic or for simple fee management at Access to a telephone network is used.
  • receives a User a smart card on which a data processing circuit is provided, which consists of a microprocessor consists.
  • To transfer data between the Data processing circuit and the external data processing station is used in contactless transmission processes one generated by the external data processing station Alternating field modulated by the chip card. Doing so for example one provided in the connection assembly Capacitive chip card coil in a time-varying manner or resistively loaded, so that their electromagnetic Change properties. This affects a station coil back in the external data processing station. From the May affect in the data processing circuit stored data can be closed.
  • the generic chip card is a plastic card trained, which is so large that it for example, can be safely stowed in a wallet can.
  • an integrated circuit on a card carrier applied from plastic After that, along the Outside edges of the chip card a transmitting / receiving coil applied with corresponding connections of the integrated circuit is connected.
  • Such Chip card is known for example from DE 44 10 732 A1.
  • a disadvantage of the generic chip card is that the Manufacturing is complex and expensive. If a chip card not working properly, the faulty chip card destroyed.
  • DE 44 37 721 A1 shows an electronic module for installation in a Data carrier, the electronic module one on a carrier of the module arranged integrated circuit, which is conductive with a coil for the non-contact data exchange is connected.
  • the data processing circuit and the connection assembly provided in the area of at least one module carrier, and the card carrier has an area for receiving the Module carrier or the Mcdulmph.
  • the invention is based on the basic idea that the disadvantages in the case of the generic chip cards, therefore, that can only be checked with a completed chip card whether the integrated circuit properly with the transmit / receive coil works together.
  • the for Function of the chip card essential parts, i.e. a Functional assembly separated from the card carrier on one Module carrier manufactured and only during the final assembly of Card carrier and module carrier connected together.
  • the function module on its Check function. If it is certain that on this the data processing circuit does not work properly with the Connection assembly works together, then the Functional assembly can be destroyed without one in itself usable card carrier should be destroyed with.
  • the module carrier is fixed to the Chip card connectable, the one provided on the card carrier Area for receiving the module carrier also as a recess can be trained. With a suitable training of Module carrier and recess can be ensured that itself when inserting the module carrier into the holder results in a positive connection that only fixes must become.
  • a particularly advantageous chip card according to the invention results when the connector assembly has at least one Transmitting / receiving coil, which with respect to the
  • the main direction of extension of the module carrier is also in two different levels can be arranged. It is in particular provided that an area of the transmitting / receiving coil is arranged on a surface of the module carrier, while another area in a layer inside the Module carrier can be arranged. This can be done particularly well easily achieved by a two-layer metallization, whereby in particular a sandwich-like structure of the module carrier in Question is coming.
  • the areas of the transmitting / receiving coil can be used on a surface of the module carrier and in Inside of the module carrier can be arranged plane-parallel, wherein the individual areas are connected by contacts are.
  • the individual areas of the transmitting / receiving coil are preferably connected in series since there is then a transmit / receive coil results in a high efficiency external alternating field can influence.
  • This results in a particularly high efficiency of the transmitting / receiving coil then, if the transmission facility, often part of the Data processing circuit is designed so that the Areas of the transmission / reception coil to one another in one Resonance phase position are durable. For example by suitably adding capacities and / or Inductors take place, this preferably taking place in such a way that the resonance frequencies of the areas of the transmit / receive coil match each other.
  • Deviating from this or in addition to the aforementioned Embodiment can also do so be formed that the areas of the transmission / reception coil can be operated synchronized with each other. This can advantageously take place in such a way that the alternating field emanating from the transmitting / receiving coil results. This is important for active cards that have a Send out the signal.
  • a phase cut technique can synchronize the flank position on the areas the transmitting / receiving coil can be reached in such a way that there is a gain from the transmit / receive coil generated alternating field results.
  • Passive cards can thereby a particularly high degree of coupling between the chip card and external data processing station can be reached.
  • a further improvement in the transmission quality of data between chip card and external data processing station arises when the module carrier at least one as Coil core for the transmitter / receiver coil trained area having.
  • the module carrier can be made of plastic be trained in the permeable material like for example, ferrite is stored. If the permeable Material is present as a large number of ferrite particles these for the purpose of mutual isolation in one Bound plastic mass provided in the module carrier is.
  • the coil core thus produced is used to achieve a high field gain factor. Through such a dielectric can have relative magnetic permeabilities in the Magnitude of 5,000 and thus high flux densities achieved become.
  • a chip card can be obtained by the method according to the invention be produced particularly easily and inexpensively.
  • Module carrier with double-layer transmission / reception coil can of course also for the production of chip cards and / or module carriers with a single coil layer be applied. Beyond that too Procedural steps possible, the provision of individual or Combinations of characteristics, especially according to the May include claims 1 to 13.
  • FIG. 1 shows a module carrier 1 of the invention Smart card.
  • the module carrier 1 has a plastic manufactured base plate 2 with substantially rectangular Cross section on. The corners of the base plate 2 rounded off, as can be seen particularly clearly in FIG. 1.
  • On the top of the base plate 2 is by means of metallization a transmission / reception coil 3 is provided, whereby the turns of the transmitting / receiving coil 3 starting from one provided in the middle of the base plate 2 first Terminal contact 4 substantially spiral around the first Terminal 4 around to a second terminal 5 extend.
  • the integrated Circuit 7 has a first connecting line 8, which with the first connection contact 4 is connected, and a second Connection line 9, which is connected to the second connection contact 5 connected is.
  • a first connecting line 8 which with the first connection contact 4 is connected
  • a second Connection line 9 which is connected to the second connection contact 5 connected is.
  • the module carrier 1 in the area of the first connection contact 4 and in the area of second connection contact 5 with a cover layer 10 a thermally curable or UV-curable mass.
  • FIG 2 shows a card carrier 11 with substantially rectangular outer shape, which has a rectangular recess 12 for receiving the module carrier 1 from Figure 1.
  • the Card carrier 11 is made of a plastic plate, which has essentially the same strength as that Base plate 2 of the module carrier 1.
  • the recess 12 is there shaped so that the module carrier 1 in a form-fitting manner Recess 12 can be used.
  • FIG 3 shows a chip card 13 according to the invention, which from the Module carrier 1 according to Figures 1 and 4 and from Card carrier 11 is assembled according to Figure 2. How to get in sees this view particularly well, the module carrier 1 is so inserted into the recess 12 that a positive Connection results. In this state, the module carrier is 1 with the card carrier 11 additionally via an adhesive connected.
  • Both the base plate 2 and the card carrier 11 are made of a plastic such as glass fiber reinforced epoxy resin, PVC, PET, PC and / or ABS can be produced.
  • the transmit / receive coil 3 is in etching, winding, laying or Printing technology can be applied to the base plate 2.
  • an endless belt 14 made of a plastic is provided, one on both long sides Has transport perforation 15. Due to the provision of the The continuous belt 14 can be particularly transport hole 15 simply by in the manufacture of the invention Guide the machine carrier 1 used machines.
  • module carriers 1 After completion of the endless belt 14 with it provided module carriers 1, these are checked individually and then by punching from the endless belt 14 detached. In another, not shown here The process step is based on their function checked module carrier 1 in the card carrier 11 used and thereby the chip cards according to the invention completed.
  • the transmitting / receiving coil 3 with a semiconductor chip 7 in a single Module 1 summarized that in a mass production is easy to manufacture. Only in a final one Working step are the module body 1 according to the invention the card carrier 11 used.
  • the semiconductor chip 7 both according to a conventional wire bond technique as well with a flip-chip technology on the invention Module carrier 2 are attached.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Dry Shavers And Clippers (AREA)

Claims (14)

  1. Support de module destiné à être utilisé dans une carte à puce comportant un dispositif de transmission, lequel présente au moins une bobine émettrice/réceptrice (3) qui présente des zones qui sont disposées dans au moins deux plans superposés différents par rapport au sens d'extension principal du support de module, caractérisé en ce que le dispositif de transmission est configuré de telle manière à ce que les zones de la bobine émettrice/réceptrice puissent être maintenues l'une par rapport à l'autre dans une relation de phases de résonance.
  2. Support de module destiné à être utilisé dans une carte à puce comportant un dispositif de transmission, lequel présente au moins une bobine émettrice/réceptrice (3) qui présente des zones qui sont disposées dans au moins deux plans différents par rapport au sens d'extension principal du support de module, caractérisé en ce que le dispositif de transmission est configuré de telle manière à ce que les zones de la bobine émettrice/réceptrice puissent fonctionner de façon synchrone l'une par rapport à l'autre.
  3. Carte à puce avec un support de carte sur laquelle est prévu un circuit de traitement de données ainsi qu'un module de connexion pour la transmission sans contact de données entre le circuit de traitement de données et un poste de traitement de données externe, le circuit de traitement de données (7) et le module de connexion (3) étant prévus dans la zone d'au moins un support de module (1), le support de carte (11) présentant une zone (12) pour recevoir le support de module (1) ou les supports de module, caractérisée en ce que le support de module est prévu conformément à la revendication 1 et/ou la revendication 2.
  4. Carte à puce selon la revendication 3, caractérisée en ce que la carte à puce est configurée de telle manière que le ou les supports de module (1) puissent être ou sont fixés à demeure avec le support de carte (11).
  5. Carte à puce selon la revendication 3 ou la revendication 5, caractérisée en ce que la zone destinée à recevoir le support de module (1) est réalisée sous la forme d'un évidement (12).
  6. Carte à puce selon l'une des revendications 3 à 5, caractérisée en ce que le module de connexion présente au moins une bobine émettrice/réceptrice (3).
  7. Carte à puce selon la revendication 6, caractérisée en ce que la bobine émettrice/réceptrice est disposée dans deux plans différents par rapport au sens d'extension principal du support de module.
  8. Carte à puce selon la revendication 7, caractérisée en ce qu'une zone de la bobine émettrice/réceptrice est disposée sur une surface du support de module.
  9. Carte à puce selon la revendication 7 ou la revendication 8, caractérisée en ce qu'une zone de la bobine émettrice/réceptrice est disposée à l'intérieur du support de module.
  10. Carte à puce selon la revendication 8 et la revendication 9, caractérisée en ce que les zones de la bobine émettrice/réceptrice sont reliées entre elles par des contacts sur une surface du support de module et à l'intérieur du support de module.
  11. Carte à puce selon la revendication 11, caractérisée en ce que les zones de la bobine émettrice/réceptrice sont branchées en série sur une surface du support de module et à l'intérieur du support de module.
  12. Carte à puce selon l'une des revendications précédentes, caractérisée en ce que le support de module présente au moins une zone réalisée sous la forme d'un noyau de bobine.
  13. Carte à puce selon la revendication 12, caractérisée en ce que le support de module est réalisé en matière plastique dans laquelle est incorporé un matériau perméable.
  14. Procédé pour réaliser une carte à puce selon l'une des revendications 3 à 13, comprenant les étapes suivantes :
    dotation d'un support de carte (11) d'un logement pour un support de module (1),
    dotation d'un support de module (1) selon la revendication 1 et/ou la revendication 2 d'un circuit de traitement de données (7) et d'un module de connexion (3),
    mise en place du support de module (1) dans le logement, et
    raccordement du support de module (1) avec le support de carte (11).
EP98904010A 1997-01-15 1998-01-07 Carte a puce Expired - Lifetime EP0951691B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19701167A DE19701167A1 (de) 1997-01-15 1997-01-15 Chipkarte
DE19701167 1997-01-15
PCT/DE1998/000033 WO1998032099A1 (fr) 1997-01-15 1998-01-07 Carte a puce

Publications (2)

Publication Number Publication Date
EP0951691A1 EP0951691A1 (fr) 1999-10-27
EP0951691B1 true EP0951691B1 (fr) 2001-10-10

Family

ID=7817441

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98904010A Expired - Lifetime EP0951691B1 (fr) 1997-01-15 1998-01-07 Carte a puce

Country Status (9)

Country Link
US (1) US6375083B2 (fr)
EP (1) EP0951691B1 (fr)
JP (1) JP2000509538A (fr)
KR (1) KR20000070160A (fr)
CN (1) CN1241145C (fr)
AT (1) ATE206835T1 (fr)
DE (2) DE19701167A1 (fr)
IN (1) IN192329B (fr)
WO (1) WO1998032099A1 (fr)

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PT871474E (pt) * 1994-12-29 2007-02-28 Ferring Int Ct Sa Produção de insulina humana
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
JP3180086B2 (ja) * 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
US8538801B2 (en) 1999-02-19 2013-09-17 Exxonmobile Research & Engineering Company System and method for processing financial transactions
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DE19701167A1 (de) 1998-07-23
ATE206835T1 (de) 2001-10-15
US20010011685A1 (en) 2001-08-09
WO1998032099A1 (fr) 1998-07-23
EP0951691A1 (fr) 1999-10-27
IN192329B (fr) 2004-04-10
JP2000509538A (ja) 2000-07-25
CN1241145C (zh) 2006-02-08
DE59801682D1 (de) 2001-11-15
KR20000070160A (ko) 2000-11-25
CN1243585A (zh) 2000-02-02
US6375083B2 (en) 2002-04-23

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