IN192329B - - Google Patents

Info

Publication number
IN192329B
IN192329B IN64CA1998A IN192329B IN 192329 B IN192329 B IN 192329B IN 64CA1998 A IN64CA1998 A IN 64CA1998A IN 192329 B IN192329 B IN 192329B
Authority
IN
India
Prior art keywords
card
carrier
data processing
prior
smart card
Prior art date
Application number
Other languages
English (en)
Inventor
Manfred Fries
Frank Puesehner
Josef Mendige
Detlef Dr Houdeau
Juergen Fischer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN192329B publication Critical patent/IN192329B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Dry Shavers And Clippers (AREA)
IN64CA1998 1997-01-15 1998-01-14 IN192329B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19701167A DE19701167A1 (de) 1997-01-15 1997-01-15 Chipkarte

Publications (1)

Publication Number Publication Date
IN192329B true IN192329B (fr) 2004-04-10

Family

ID=7817441

Family Applications (1)

Application Number Title Priority Date Filing Date
IN64CA1998 IN192329B (fr) 1997-01-15 1998-01-14

Country Status (9)

Country Link
US (1) US6375083B2 (fr)
EP (1) EP0951691B1 (fr)
JP (1) JP2000509538A (fr)
KR (1) KR20000070160A (fr)
CN (1) CN1241145C (fr)
AT (1) ATE206835T1 (fr)
DE (2) DE19701167A1 (fr)
IN (1) IN192329B (fr)
WO (1) WO1998032099A1 (fr)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9408638A (pt) * 1994-12-29 2004-09-21 Bio Technology General Corp Geração de insulina humana
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
JP3180086B2 (ja) * 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
US8538801B2 (en) 1999-02-19 2013-09-17 Exxonmobile Research & Engineering Company System and method for processing financial transactions
EP1031940A1 (fr) * 1999-02-24 2000-08-30 Sihl GmbH Dispositif contenant plusieurs circuits éléctriques
FR2796183B1 (fr) * 1999-07-07 2001-09-28 A S K Ticket d'acces sans contact et son procede de fabrication
DE19939347C1 (de) * 1999-08-19 2001-02-15 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
DE60037717T2 (de) * 1999-08-31 2009-01-15 Nxp B.V. Datenträger mit integriertem schaltkreis und übertragungsspule
CN1162812C (zh) * 1999-12-05 2004-08-18 穆萨·伊利莎·埃尔爱姆利 银行支票系统以及带有磁条和/或存储芯片的支票
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
DE10017431C2 (de) * 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zum Herstellen von Datenträgern mit integriertem Transponder
KR100746742B1 (ko) * 2001-02-03 2007-08-06 삼성전자주식회사 리더 코일 안테나 및 이를 이용한 비접촉 카드 인증 시스템
DE10122414A1 (de) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Durchkontaktierung von flexiblen Leiterplatten
KR20010099429A (ko) * 2001-09-27 2001-11-09 김경현 신분증위조방지시스템
DE10151941A1 (de) * 2001-10-22 2003-01-02 Infineon Technologies Ag Chipmodul und Chipkarte oder Speicherkarte
US6774470B2 (en) * 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
KR100407451B1 (ko) * 2002-03-04 2003-11-28 주식회사 티오디 알에프 발급기를 갖는 카드 발급기
JP4110380B2 (ja) * 2002-09-05 2008-07-02 富士ゼロックス株式会社 表示記録媒体及び情報書き込み装置
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7926728B2 (en) * 2007-10-31 2011-04-19 Infineon Technologies Ag Integrated circuit device including a contactless integrated circuit inlay
DE102009022136A1 (de) 2009-05-20 2010-11-25 Prüftechnik Dieter Busch AG Vorrichtung und Verfahren für induktive Messungen
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
JP5904356B2 (ja) * 2011-09-12 2016-04-13 日立化成株式会社 Ｒｆｉｄタグ及び自動認識システム
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
DE102015222364A1 (de) * 2015-11-12 2017-05-18 Bundesdruckerei Gmbh Wert- oder Sicherheitsdokument aus einem Faserverbundwerkstoff und Verfahren zum Herstellen des Wert- oder Sicherheitsdokuments

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514709A (en) 1978-07-18 1980-02-01 Toshiba Corp Facsimile device
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
FR2641102B1 (fr) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE4034225C2 (de) * 1990-10-26 1994-01-27 Reinhard Jurisch Datenträger für Identifikationssysteme
FR2674052A1 (fr) 1991-03-15 1992-09-18 Philips Composants Carte a microcircuit.
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
DE4220194C2 (de) * 1992-06-19 1996-02-22 Herbert Stowasser Vorrichtung und Verfahren zur Herstellung eines Transponders, wobei Wickeldraht einer Spule mit den Anschlußflächen eines elektronischen Bauelementes (Chip) verbunden wird
JP2709223B2 (ja) * 1992-01-30 1998-02-04 三菱電機株式会社 非接触形携帯記憶装置
DE69220029T2 (de) * 1992-02-05 1997-09-18 Texas Instruments Inc Verfahren zur Herstellung eines flachen, flexiblen Antennenkerns für einen Chip-Transponder, eingebaut in einer Karte oder ähnlichem Objekt und ein derart hergestellter Antennenkern
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
JPH07146922A (ja) 1993-09-28 1995-06-06 Dainippon Printing Co Ltd 非接触型ｉｃモジュール、非接触型ｉｃカードおよびその製造方法
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
DE4410732C2 (de) 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
DE9406390U1 (de) * 1994-04-16 1994-06-23 Karakas GmbH, 50968 Köln Gyros-Gerät
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
JPH08202844A (ja) * 1995-01-25 1996-08-09 Nippon Retsuku Kk 電子機器及びその製造方法
JPH08216570A (ja) 1995-02-09 1996-08-27 Hitachi Chem Co Ltd Ｉｃカード
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit

Also Published As

Publication number Publication date
EP0951691A1 (fr) 1999-10-27
WO1998032099A1 (fr) 1998-07-23
CN1241145C (zh) 2006-02-08
DE59801682D1 (de) 2001-11-15
JP2000509538A (ja) 2000-07-25
KR20000070160A (ko) 2000-11-25
EP0951691B1 (fr) 2001-10-10
US6375083B2 (en) 2002-04-23
DE19701167A1 (de) 1998-07-23
ATE206835T1 (de) 2001-10-15
CN1243585A (zh) 2000-02-02
US20010011685A1 (en) 2001-08-09

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