EP0949661A3 - Station de nettoyage/séchage et ligne de production pour dispositifs semiconducteurs - Google Patents

Station de nettoyage/séchage et ligne de production pour dispositifs semiconducteurs Download PDF

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Publication number
EP0949661A3
EP0949661A3 EP99106559A EP99106559A EP0949661A3 EP 0949661 A3 EP0949661 A3 EP 0949661A3 EP 99106559 A EP99106559 A EP 99106559A EP 99106559 A EP99106559 A EP 99106559A EP 0949661 A3 EP0949661 A3 EP 0949661A3
Authority
EP
European Patent Office
Prior art keywords
cleaning
production line
drying station
semiconductor devices
drying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99106559A
Other languages
German (de)
English (en)
Other versions
EP0949661A2 (fr
Inventor
Nahomi Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
NEC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Electronics Corp filed Critical NEC Electronics Corp
Priority to EP07022573A priority Critical patent/EP1898447A3/fr
Publication of EP0949661A2 publication Critical patent/EP0949661A2/fr
Publication of EP0949661A3 publication Critical patent/EP0949661A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP99106559A 1998-03-31 1999-03-30 Station de nettoyage/séchage et ligne de production pour dispositifs semiconducteurs Withdrawn EP0949661A3 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07022573A EP1898447A3 (fr) 1998-03-31 1999-03-30 Ligne de production de dispositifs semiconducteurs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10085815A JP3109471B2 (ja) 1998-03-31 1998-03-31 洗浄・乾燥装置及び半導体装置の製造ライン
JP8581598 1998-03-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP07022573A Division EP1898447A3 (fr) 1998-03-31 1999-03-30 Ligne de production de dispositifs semiconducteurs

Publications (2)

Publication Number Publication Date
EP0949661A2 EP0949661A2 (fr) 1999-10-13
EP0949661A3 true EP0949661A3 (fr) 2004-12-29

Family

ID=13869365

Family Applications (2)

Application Number Title Priority Date Filing Date
EP99106559A Withdrawn EP0949661A3 (fr) 1998-03-31 1999-03-30 Station de nettoyage/séchage et ligne de production pour dispositifs semiconducteurs
EP07022573A Withdrawn EP1898447A3 (fr) 1998-03-31 1999-03-30 Ligne de production de dispositifs semiconducteurs

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP07022573A Withdrawn EP1898447A3 (fr) 1998-03-31 1999-03-30 Ligne de production de dispositifs semiconducteurs

Country Status (6)

Country Link
US (1) US6336463B1 (fr)
EP (2) EP0949661A3 (fr)
JP (1) JP3109471B2 (fr)
KR (1) KR19990078433A (fr)
CN (1) CN1132230C (fr)
TW (1) TW416089B (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624086B1 (en) * 1999-09-15 2003-09-23 Texas Instruments Incorporated Effective solution and process to wet-etch metal-alloy films in semiconductor processing
KR100436900B1 (ko) * 2001-10-29 2004-06-23 삼성전자주식회사 웨이퍼 세정 장치
JP2004006819A (ja) * 2002-04-26 2004-01-08 Nec Electronics Corp 半導体装置の製造方法
JP2004066212A (ja) * 2002-06-11 2004-03-04 Dan-Takuma Technologies Inc 洗浄乾燥装置
US7556048B2 (en) * 2002-11-15 2009-07-07 Agere Systems Inc. In-situ removal of surface impurities prior to arsenic-doped polysilicon deposition in the fabrication of a heterojunction bipolar transistor
JP3967677B2 (ja) * 2002-12-25 2007-08-29 大日本スクリーン製造株式会社 乾燥処理装置および基板処理装置
GB0307428D0 (en) * 2003-03-31 2003-05-07 Medical Res Council Compartmentalised combinatorial chemistry
US20060078893A1 (en) 2004-10-12 2006-04-13 Medical Research Council Compartmentalised combinatorial chemistry by microfluidic control
GB0307403D0 (en) * 2003-03-31 2003-05-07 Medical Res Council Selection by compartmentalised screening
US20050221339A1 (en) * 2004-03-31 2005-10-06 Medical Research Council Harvard University Compartmentalised screening by microfluidic control
US7968287B2 (en) * 2004-10-08 2011-06-28 Medical Research Council Harvard University In vitro evolution in microfluidic systems
EP1984738A2 (fr) 2006-01-11 2008-10-29 Raindance Technologies, Inc. Dispositifs microfluidiques et leurs procédés d'utilisation dans la formation et le contrôle de nanoréacteurs
EP2481815B1 (fr) 2006-05-11 2016-01-27 Raindance Technologies, Inc. Dispositifs microfluidiques
US9562837B2 (en) 2006-05-11 2017-02-07 Raindance Technologies, Inc. Systems for handling microfludic droplets
EP3536396B1 (fr) 2006-08-07 2022-03-30 The President and Fellows of Harvard College Tensioactifs fluorocarbonés stabilisateurs d'émulsions
US8772046B2 (en) * 2007-02-06 2014-07-08 Brandeis University Manipulation of fluids and reactions in microfluidic systems
US8592221B2 (en) 2007-04-19 2013-11-26 Brandeis University Manipulation of fluids, fluid components and reactions in microfluidic systems
US12038438B2 (en) 2008-07-18 2024-07-16 Bio-Rad Laboratories, Inc. Enzyme quantification
EP4047367A1 (fr) 2008-07-18 2022-08-24 Bio-Rad Laboratories, Inc. Procedé de détection d'analytes cibles au moyens des bibliothèques de gouttelettes
US8528589B2 (en) 2009-03-23 2013-09-10 Raindance Technologies, Inc. Manipulation of microfluidic droplets
WO2011042564A1 (fr) 2009-10-09 2011-04-14 Universite De Strasbourg Nanomatériau marqué à base de silice à propriétés améliorées et ses utilisations
WO2011079176A2 (fr) 2009-12-23 2011-06-30 Raindance Technologies, Inc. Systèmes microfluidiques et procédés pour réduire l'échange de molécules entre des gouttelettes
US9366632B2 (en) 2010-02-12 2016-06-14 Raindance Technologies, Inc. Digital analyte analysis
US9399797B2 (en) 2010-02-12 2016-07-26 Raindance Technologies, Inc. Digital analyte analysis
US10351905B2 (en) 2010-02-12 2019-07-16 Bio-Rad Laboratories, Inc. Digital analyte analysis
WO2011100604A2 (fr) 2010-02-12 2011-08-18 Raindance Technologies, Inc. Analyse numérique d'analytes
WO2012045012A2 (fr) 2010-09-30 2012-04-05 Raindance Technologies, Inc. Dosages sandwich dans des gouttelettes
WO2012109600A2 (fr) 2011-02-11 2012-08-16 Raindance Technologies, Inc. Procédés de formation de gouttelettes mélangées
WO2012112804A1 (fr) 2011-02-18 2012-08-23 Raindance Technoligies, Inc. Compositions et méthodes de marquage moléculaire
US8841071B2 (en) 2011-06-02 2014-09-23 Raindance Technologies, Inc. Sample multiplexing
EP3709018A1 (fr) 2011-06-02 2020-09-16 Bio-Rad Laboratories, Inc. Appareil microfluidique pour l'identification de composants d'une reaction chimique
US8658430B2 (en) 2011-07-20 2014-02-25 Raindance Technologies, Inc. Manipulating droplet size
CN102274837B (zh) * 2011-08-09 2013-04-03 铜陵市晶威特电子有限责任公司 片状小零件清洗装置
US11901041B2 (en) 2013-10-04 2024-02-13 Bio-Rad Laboratories, Inc. Digital analysis of nucleic acid modification
US9944977B2 (en) 2013-12-12 2018-04-17 Raindance Technologies, Inc. Distinguishing rare variations in a nucleic acid sequence from a sample
EP3090063B1 (fr) 2013-12-31 2019-11-06 Bio-Rad Laboratories, Inc. Procédé de détection de rétrovirus latent
CN103839799A (zh) * 2014-02-21 2014-06-04 上海华力微电子有限公司 单片半导体衬底湿法刻蚀装置
US10647981B1 (en) 2015-09-08 2020-05-12 Bio-Rad Laboratories, Inc. Nucleic acid library generation methods and compositions
US10566309B2 (en) 2016-10-04 2020-02-18 Infineon Technologies Ag Multi-purpose non-linear semiconductor package assembly line

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5092937A (en) * 1989-07-19 1992-03-03 Matsushita Electric Industrial Co., Ltd. Process for treating semiconductors
JPH053187A (ja) * 1991-06-24 1993-01-08 Sony Corp ウエハ洗浄装置
JPH0878384A (ja) * 1994-08-31 1996-03-22 Hitachi Cable Ltd ＧａＡｓウェハの洗浄装置
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
WO1997026675A1 (fr) * 1996-01-16 1997-07-24 Fsi International Module de traitement par vapeur d'eau et rinçage compatible avec un systeme a faire le vide
US5686143A (en) * 1993-11-05 1997-11-11 Tokyo Electron Limited Resist treating method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60257525A (ja) * 1984-06-04 1985-12-19 Hitachi Tokyo Electronics Co Ltd 乾燥装置
US5105556A (en) * 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
JPH03241742A (ja) * 1990-02-20 1991-10-28 Matsushita Electron Corp 半導体基板の洗浄装置
US5054210A (en) * 1990-02-23 1991-10-08 S&K Products International, Inc. Isopropyl alcohol vapor dryer system
US5271774A (en) * 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
JP3154814B2 (ja) * 1991-06-28 2001-04-09 株式会社東芝 半導体ウエハの洗浄方法および洗浄装置
JPH05206092A (ja) 1992-01-24 1993-08-13 Kyushu Electron Metal Co Ltd 半導体ウェーハの自動洗浄方法
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
JPH07245285A (ja) * 1994-03-03 1995-09-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0817891A (ja) 1994-06-27 1996-01-19 Hitachi Ltd 半導体洗浄装置
JPH08126873A (ja) * 1994-10-28 1996-05-21 Nec Corp 電子部品等の洗浄方法及び装置
US5654057A (en) * 1994-12-28 1997-08-05 Hoya Corporation Sheet glass flattening method, method of manufacturing glass substrate for an information recording disk using flattened glass, method of manufacturing a magnetic recording disk using glass substrate, and magnetic recording medium
JP3253229B2 (ja) 1995-02-22 2002-02-04 東京エレクトロン株式会社 洗浄処理装置および洗浄処理方法
JP2832171B2 (ja) * 1995-04-28 1998-12-02 信越半導体株式会社 半導体基板の洗浄装置および洗浄方法
TW386235B (en) * 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
US5653045A (en) * 1995-06-07 1997-08-05 Ferrell; Gary W. Method and apparatus for drying parts and microelectronic components using sonic created mist
JPH09129583A (ja) * 1995-10-27 1997-05-16 Hitachi Ltd 洗浄装置
JP3198899B2 (ja) * 1995-11-30 2001-08-13 アルプス電気株式会社 ウエット処理方法
JP2969087B2 (ja) * 1996-11-06 1999-11-02 日本エー・エス・エム株式会社 半導体基板の処理方法
JPH10177979A (ja) * 1996-12-18 1998-06-30 Dainippon Screen Mfg Co Ltd 基板処理装置
US6054393A (en) * 1997-01-09 2000-04-25 Texas Instruments Incorporated Method for improving the wet process chemical sequence
US5922136A (en) * 1997-03-28 1999-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaner apparatus and method
US6122837A (en) * 1997-06-25 2000-09-26 Verteq, Inc. Centrifugal wafer processor and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5092937A (en) * 1989-07-19 1992-03-03 Matsushita Electric Industrial Co., Ltd. Process for treating semiconductors
JPH053187A (ja) * 1991-06-24 1993-01-08 Sony Corp ウエハ洗浄装置
US5686143A (en) * 1993-11-05 1997-11-11 Tokyo Electron Limited Resist treating method
JPH08102458A (ja) * 1994-08-01 1996-04-16 Tokyo Electron Ltd 洗浄処理装置およびその制御方法
JPH0878384A (ja) * 1994-08-31 1996-03-22 Hitachi Cable Ltd ＧａＡｓウェハの洗浄装置
WO1997026675A1 (fr) * 1996-01-16 1997-07-24 Fsi International Module de traitement par vapeur d'eau et rinçage compatible avec un systeme a faire le vide

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0172, no. 57 (E - 1368) 20 May 1993 (1993-05-20) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 07 31 July 1996 (1996-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 08 30 August 1996 (1996-08-30) *

Also Published As

Publication number Publication date
EP1898447A3 (fr) 2008-03-26
CN1132230C (zh) 2003-12-24
EP1898447A2 (fr) 2008-03-12
TW416089B (en) 2000-12-21
CN1230768A (zh) 1999-10-06
US6336463B1 (en) 2002-01-08
JPH11283955A (ja) 1999-10-15
JP3109471B2 (ja) 2000-11-13
EP0949661A2 (fr) 1999-10-13
KR19990078433A (ko) 1999-10-25

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