EP0922289B1 - Procede et dispositif pour la production d'un agencement de bobines - Google Patents

Procede et dispositif pour la production d'un agencement de bobines Download PDF

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Publication number
EP0922289B1
EP0922289B1 EP97938755A EP97938755A EP0922289B1 EP 0922289 B1 EP0922289 B1 EP 0922289B1 EP 97938755 A EP97938755 A EP 97938755A EP 97938755 A EP97938755 A EP 97938755A EP 0922289 B1 EP0922289 B1 EP 0922289B1
Authority
EP
European Patent Office
Prior art keywords
matrix
winding
wire
winding wire
additional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97938755A
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German (de)
English (en)
Other versions
EP0922289A1 (fr
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finn David
RIETZLER, MANFRED
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Individual
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Filing date
Publication date
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Publication of EP0922289A1 publication Critical patent/EP0922289A1/fr
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Publication of EP0922289B1 publication Critical patent/EP0922289B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/098—Mandrels; Formers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Definitions

  • the present invention relates to a method for producing a Coil arrangement according to claim 1, and a device for Execution of such a method according to claim 5.
  • DE 43 07 064 A1 describes a method for producing a coil arrangement known by means of a winding tool, in which a first End of the winding wire with a first connection surface in the winding tool arranged chips is contacted, then a winding process to form a wire spool and finally one second winding wire end region of the wire coil with a second Contact surface of the chip is contacted.
  • the end of the winding wire is first between one of the Winding tool executed separately, on the peripheral edge of the winding tool arranged holding device and a wire guide, then the contact and finally the winding wire between the respective contact surface and the holding device severed.
  • the winding tool for manufacturing a coil arrangement arranged on a die carrier is known.
  • the winding tool can be a component and a separately designed one Position the winding die and has wire guide devices on. On the circumference of the winding tool and separately from it formed, holding devices for holding winding wire ends intended.
  • the winding tool rotatable about an axis of rotation is a Counterholder assigned, its distance from that on the winding tool arranged winding die changeable along the axis of rotation is.
  • the present invention is therefore based on the object of a method or to propose a device with which the production of Coil arrangements of the aforementioned type is simplified.
  • the Additional matrix defined winding wire areas for the formation of in their orientation for contacting pads one Chip unit prepared coil wire ends used. This will in advantageously contacting the coil wire ends with the Pads of a chip unit in the winding tool possible without for this a positioning of the chip unit depending on the Orientation of the coil wire ends should be done.
  • the winding tool according to the invention defined in claim 5 for producing a on the above-described manner formed coil arrangement one die arranged on a die carrier and one on the periphery the matrix arranged on the matrix support with at least two wire holding devices for holding winding wire ends as well as one on the side of the die carrier that has the die counter-holder arranged adjacent to the die, the die is designed in such a way that it serves as a base matrix has, wherein on the die surface of the base die a Additional die is arranged and the counter-holder in its relative arrangement is changeable to the base matrix.
  • the additional die has at least two die parts on both sides a holding device arranged on the base die for positioning Recording a chip unit are arranged, the die parts are arranged and designed such that along one through the Die parts of defined winding circumference of the additional die Winding wire areas an overlap with pads in one the holding device arranged chip unit.
  • the winding tool can be used to produce a Coil arrangement consisting of a wire coil formed on the base die and use a chip unit, the additional matrix for training of winding wire areas precisely defined in their orientation serves the direct contacting of the winding tool enable wound wire coil with the chip unit.
  • the die parts are the Additional die formed as cylindrical pins.
  • a wire deflection device is arranged such that the space between an engagement space for the die part and the wire deflection device forms a wire gripper device, a removal of excess Wire ends are done in a simple manner from the winding tool.
  • FIG. 1 shows a top view of a winding tool 28 with a base die 21 arranged on a die carrier 20, which is essentially circular in the form of a circular disk, with a winding circumference 24 composed of four circumferential side surfaces 22 and 23, the circumferential side surfaces 22 and 23 being convex and in rounded transition areas 25 one inside the other pass.
  • the base die 21 has a flat die surface 26, in which a connecting bolt 27 is countersunk for the rotationally fixed connection of the die holder 20 with a threshing drive (not shown in more detail) for driving the winding tool 28.
  • the holding device 29 Inserted into the die surface 26 of the base die 21 there is a holding device 29 for the positioning arrangement of a chip unit, not shown in FIG. 1 .
  • the holding device 29 has a disc-shaped permanent magnet 30 and two positioning jaws 31, 32, the positioning jaw 31 being adjustable parallel to the positioning jaw 32.
  • An ejector mandrel 33 is located in a centrally arranged opening of the permanent magnet 30.
  • Adjacent to the cylinder pin 35 is also a cylinder pin Deflection pin 37 arranged. Between the cylinder pin 35 and the deflection pin 37, the die surface 26 has an elongated hole here trained gripper opening 38.
  • Another diverter pin 72 is in alignment with the cylindrical pins 34 and 35 and the deflection pin 37 and is adjacent to the transition region 25 arranged on the outer edge of the die surface 26.
  • the die carrier 20 is provided on its peripheral edge with two wire holding devices 39, 40 arranged on a central diagonal 71 in the present case.
  • the wire holding devices 39, 40 are of identical design and each have a clamping jaw 41 which can be moved relative to a clamping base 42, in the present case the movement of the clamping jaw 41 taking place transversely to the axis of rotation 43 of the winding tool 28.
  • the clamping jaw 41 is actuated via a wire guide 45 which can be moved on a translation axis 44 running parallel to the axis of rotation 43 of the winding tool 28.
  • a wire guide 45 through which a winding wire (not shown in detail here) is guided by a storage device (also not shown in detail here), is passed past a clamping gap 41 through a clamping gap 47 while overcoming restoring forces.
  • the winding wire is then clamped against the clamping base 42 by the clamping jaw 41.
  • FIG. 2 and 3 show the winding tool 28 provided with a counter-holder 48, the counter-holder 48 in FIG. 2 being moved against the die surface 26 of the base die 21 and in FIG. 3 the counter-holder 48 being spaced apart from the die surface 26 of the base die 21 ,
  • FIG. 1 two cylindrical driving pins 49 and 50 (FIG. 1) are arranged on the die surface 26 of the base die 21, which likewise engage in receiving openings in the counter-holder 48 provided for this purpose, which are not shown in FIG. 2 , As shown in FIG. 1 , the driving pins 49 and 50 are arranged on a center axis 51 intersecting the axis of rotation 43 and ensure that the counter-holder 48 is driven in rotation when the die carrier 20 rotates.
  • the driving pins 49, 50 are designed to be retractable into the die surface 26 of the base die 21, so that in the opening configuration of the winding tool 28 shown in FIG. 3 , only the cylindrical pins 34, 35 and the deflection pin 37 the die surface 26 of the base die 21 tower above.
  • the coil arrangement 52 has a wire coil 54 wound from winding wire 53, the winding wire ends of which, which in addition to the coil former 54 form further winding wire regions 55 and 56, are contacted with connection surfaces 57, 58 of a chip unit 59.
  • FIG. 4 shows the winding tool 28 in a loading position in which the counter-holder 48 (FIGS . 2 and 3 ) is removed from the base die 21 and the die surface 26 is freely accessible from a direction running parallel to the axis of rotation 43.
  • the chip unit 59 is inserted into the holding device 29, the position jaws 31, 32 initially being moved apart and the chip unit 59 being held only by the magnetic forces of the permanent magnet 30.
  • the magnetic forces act between the pad metallizations of the chip unit 59, which may have nickel, for example, and the permanent magnet 30.
  • the positioning jaws 31 and 32 are then moved toward one another. This results in an exact alignment on the positioning axis 61.
  • the exact alignment of the chip unit 59 on the longitudinal extension axis 60 can be neglected, as will be explained in more detail below with reference to FIG. 9 .
  • FIG. 5 shows the winding tool 28 in a first wire fixing position, in which the wire guide 45, together with the winding wire 53 led out of the wire guide capillary 46, is moved on the translation axis 44 by the wire holding device 39. After the wire guide capillary 46 has been moved through the clamping gap 47, the winding wire 53 is held clamped in the wire holding device 39. In the subsequent winding process, the wire guide remains in a position upstream of the wire holding device 39, so that when the winding tool 28 rotates, the winding wire held in the wire holding device 39 is continuously pulled out of the wire guide 45.
  • FIG. 6 shows the winding tool 28 in a closed position rotated counterclockwise by approximately 270 ° with respect to the first wire fixing position shown in FIG. 5 .
  • a first winding wire region 55 - in the view according to FIG. 6 on the left-hand side - bears against the cylindrical pins 34 and 35 of the additional die 36 and against the deflection pin 37, so that the wire configuration shown in FIG. 6 is formed.
  • a winding wire end 63 extending from the deflection pin 37 to the wire holding device 39 extends across the die surface 26 of the base die 21 in a wire channel 62 (FIG. 1) .
  • the winding tool 28 is closed by moving the counter-holder 48 against the die surface 26 of the base die 21.
  • the cylindrical pins 34, 35 as well as the deflection pin 37 and the driver pins 49, 50 which have previously been countersunk in the die surface 26 and now protrude, penetrate into the counter-holder 48.
  • the wire coil 54 is wound on the winding periphery 24 of the base die 21, the winding wire 53 being continuously pulled out of the wire guide capillary 46 of the wire guide 45.
  • the point of the winding wire transition from the die surface 26 ( FIG. 6 ) to the winding circumference 24 is defined by the deflection pin 72.
  • FIG. 8 shows the winding tool 28 in an open position in which the counter-holder 48, as shown in FIG. 3, is moved away from the die surface 26 of the base die 21 with the release of the cylindrical pins 34, 35 of the additional die 36 and the deflection pin 37.
  • the driving pins 49, 50 are countersunk in the die surface 26 of the base die 21.
  • the winding tool 28 is transferred to the second wire fixing position shown in FIG. 9 .
  • the winding wire area 56 lies opposite the winding wire area 55 on the cylindrical pins 34, 35 of the additional die 36 and the deflection pin 37, so that the wire configuration shown in FIG. 9 is established.
  • the alignment of the winding wire regions 55 and 56 results in overlap regions 65, 66 between the winding wire 53 and the connection surfaces 57, 58 of the chip unit 59 by means of the additional die 36. Due to the fact that The winding wire regions 55, 56, which are defined in their orientation, extend far beyond the surface of the chip unit 59 , there are no high demands on the exacurity of the positioning of the chip unit 59 along the longitudinal extension axis 61 of the additional die 36, in order to cover areas 65, 66 between the winding wire 53 and the Form pads 57, 58 of the chip unit 59.
  • the winding wire areas 55 are contacted to form the coil arrangement 52 shown in FIG. 10 as a transponder unit having the wire coil 54 and the chip unit 59 , 56 with the connection surfaces 57, 58 of the chip unit 59 in the winding tool 28.
  • a wire gripper device which engages the winding wire areas 55 and 56 comprehensively in the gripper opening 38 and the winding wire ends 63, 64 gripped before cutting and removed after cutting from the die surface 26 of the base die 21.
  • the finished coil arrangement 52 shown in FIG. 10 is then removed from the winding tool 28, for example by countersinking the base die 21 in the die holder 20.
  • the manufacture of the coil arrangement 52 (FIG. 10) explained above with reference to FIGS. 1 to 9 represents only one possibility of using the method according to the invention.
  • the winding tool 28 shown in FIGS . 1 to 9 can also be of an essentially unchanged design can be used to produce a coil arrangement 68 shown in FIG. 11 .
  • FIG. 11 shows the coil arrangement 68, which has two wire coils 69 and 70, which are continuously merged into one another by means of the method described above in a method variant.
  • the winding process of the winding tool 28 after the formation of the second winding wire region 56 on the additional die 36 is continued with the winding tool 28 open, so that in addition to the wire coil 69 formed on the base die 21 on the additional die 36 the further wire coil 70 can be formed with any number of turns.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coil Winding Methods And Apparatuses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • General Induction Heating (AREA)
  • Linear Motors (AREA)
  • Windings For Motors And Generators (AREA)
  • Manufacture Of Motors, Generators (AREA)

Claims (8)

  1. Procédé de fabrication d'un ensemble de bobine (52, 68) comprenant plusieurs zones de fil à torsade (54, 55, 56 ; 69, 70) configurées sur des niveaux de fil à torsade superposés dans un outil de bobinage (28), avec les étapes de procédé suivantes :
    fixation du fil à torsade (53) dans un premier dispositif de retenue de fil (39) disposé sur le bord périphérique de l'outil de bobinage (28),
    rotation de l'outil de bobinage (28) avec un fond de matrice mobile à distance de la matrice de base pour appliquer le fil à torsade (53) sur une matrice secondaire (36) disposée sur la matrice de base (21), et configuration d'une première zone de fil à torsade (55) disposée sur la surface de la matrice de base,
    fermeture de l'outil de bobinage (28) par déplacement du fond de matrice mobile (48) contre la surface de matrice (26) de la matrice de base (21), et rotation de l'outil de bobinage (28) pour appliquer le fil à torsade (53) sur le périmètre de bobinage (24) de la matrice de base (21), et configuration d'une autre zone de fil à torsade en bobine enroulée (54, 69),
    fixation de la bobine enroulée (54, 69) et rotation de l'outil de bobinage (28) avec un fond de matrice mobile (48) distancé de la surface de matrice (26) de la matrice de base pour appliquer le fil à torsade (53) sur la matrice secondaire (36), et configuration d'une autre zone de fil à torsade (56) disposée au-dessus de la bobine enroulée (54, 69) ;
    fixation du fil à torsade. (53) dans un deuxième dispositif de retenue de fil (40) disposé sur le bord périphérique de la matrice de base (21).
  2. Procédé selon la revendication 1, caractérisé en ce que la première zone de fil à torsade (55) configurée par application sur la matrice secondaire et l'autre zone de fil à torsade (56) configurée par application sur la matrice secondaire (36) sont conduites sur des pastilles d'une unité à puce (59) disposée sur la surface de matrice (26) de la matrice de base (21), et qu'ensuite on procède à un bonding des zones de fil à torsade (55, 56) avec les pastilles (57, 58) de l'unité à puce (59).
  3. Procédé selon la revendication 2, caractérisé en ce que l'unité à puce (59), avant la configuration de la première zone de fil à torsade (55) par application sur la matrice secondaire (36), est insérée dans un dispositif de retenue (29) sur la matrice de base (21) entre deux éléments de matrice (34, 35) de la matrice secondaire (36) disposés sur la matrice de base (21).
  4. Procédé selon la revendication 2 ou 3, caractérisé en ce qu'après le bonding on procède à une séparation d'extrémités de fil à torsade (63, 64) configurées dans la zone entre les dispositifs de retenue de fil (39, 40) et la matrice secondaire (36), au niveau de respectivement deux points de séparation dans la zone entre les pastilles (57, 58) de l'unité à puce (59) et les dispositifs de retenue de fil (39, 40).
  5. Outil de bobinage (28) pour fabriquer un ensemble de bobine (52, 68), comprenant une matrice (21) sur un support de matrice (20) pivotant autour d'un axe de rotation (43), et un ensemble de retenue disposé sur la périphérie de l'outil de bobinage et comprenant au moins deux dispositifs de retenue de fil (39, 40) pour retenir des extrémités de fil à torsade (63, 64), ainsi qu'un fond de matrice mobile (48) disposé au voisinage de la face du support de matrice présentant la matrice et dont la distance par rapport à la matrice le long de l'axe de rotation est variable, caractérisé en ce que l'ensemble de retenue est disposé sur le bord périphérique de l'outil de bobinage, et que la matrice est configurée de manière à présenter un corps de base servant de matrice de base (21), une matrice secondaire (36) étant disposée sur la surface de matrice (26) de la matrice de base (21).
  6. Outil de bobinage selon la revendication 5, caractérisé en ce que la matrice secondaire (36) présente au moins deux éléments de matrice (34, 35) disposés de part et d'autre d'un dispositif de retenue (29) prévu sur la matrice de base (21) pour recevoir et positionner une unité de puce (59), les éléments de matrice (34, 35) étant disposés et configurés tels que des zones de fil à torsade (55, 56) s'étendant le long d'un périmètre de bobinage de la matrice secondaire (36) défini par les éléments de matrice présentent une position de recouvrement avec des pastilles (57, 58) d'une unité à puce (59) disposée dans le dispositif de retenue (29).
  7. Outil de bobinage selon la revendication 6, caractérisé en ce que les éléments de matrice (34, 35) de la matrice secondaire (36) sont configurés en tant de tiges cylindriques.
  8. Outil de bobinage selon l'une des revendications 5 à 7, caractérisé en ce qu'au voisinage d'un élément de matrice (35) de la matrice secondaire (36) est disposé un dispositif de renvoi de fil (37), l'espace entre l'élément de matrice (35) et le dispositif de renvoi de fil (37) formant un espace d'intervention pour un dispositif de saisie de fil.
EP97938755A 1996-08-28 1997-08-12 Procede et dispositif pour la production d'un agencement de bobines Expired - Lifetime EP0922289B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19634661 1996-08-28
DE19634661A DE19634661A1 (de) 1996-08-28 1996-08-28 Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung
PCT/DE1997/001712 WO1998009305A1 (fr) 1996-08-28 1997-08-12 Procede et dispositif pour la production d'un agencement de bobines

Publications (2)

Publication Number Publication Date
EP0922289A1 EP0922289A1 (fr) 1999-06-16
EP0922289B1 true EP0922289B1 (fr) 2002-05-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP97938755A Expired - Lifetime EP0922289B1 (fr) 1996-08-28 1997-08-12 Procede et dispositif pour la production d'un agencement de bobines

Country Status (8)

Country Link
US (1) US6295720B1 (fr)
EP (1) EP0922289B1 (fr)
JP (1) JP3779330B2 (fr)
AT (1) ATE217440T1 (fr)
AU (1) AU4110697A (fr)
DE (2) DE19634661A1 (fr)
ES (1) ES2173475T3 (fr)
WO (1) WO1998009305A1 (fr)

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KR20130108068A (ko) 2010-05-04 2013-10-02 페이닉스 아마테크 테오란타 Ｒｆｉｄ 인레이의 제조
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US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9633304B2 (en) 2010-08-12 2017-04-25 Féinics Amatech Teoranta Booster antenna configurations and methods
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
EP2742464A1 (fr) 2011-08-08 2014-06-18 Féinics AmaTech Teoranta Amélioration du couplage dans et sur des cartes intelligentes d'identification par radiofréquence (rfid)
JP2014527230A (ja) 2011-08-08 2014-10-09 フェニックス アマテック テオランタ Ｒｆｉｄスマートカードに関する結合の向上
MX336040B (es) 2011-09-11 2016-01-07 Feinics Amatech Teoranta Modulos de antena rfid y procedimientos de fabricacion.
CN104471791A (zh) 2012-01-23 2015-03-25 菲尼克斯阿美特克有限公司 在金属化智能卡中的抵消屏蔽与增强耦合
JP2015511353A (ja) 2012-02-05 2015-04-16 フェイニクス アマテック テオランタ Ｒｆｉｄアンテナ・モジュールおよび方法
US10762413B2 (en) 2012-08-30 2020-09-01 Féinics Amatech Teoranta Booster antenna configurations and methods
WO2014206579A1 (fr) 2013-06-29 2014-12-31 Féinics Amatech Teoranta Configurations et procédés d'antenne amplificatrice
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CN108511184B (zh) * 2018-01-18 2020-06-02 林飘飘 一种具有适应范围广的变压器的绕线模具

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DE69101436T2 (de) 1990-04-19 1994-07-21 Ake Gustafson Verfahren zum montieren von einer spule auf eine leiterplatte.
ES2059215T3 (es) 1991-02-25 1994-11-01 Ake Gustafson Procedimiento de fijacion de un bobinado a un circuito electronico.
DE4307064C2 (de) 1993-03-06 1996-04-25 Amatech Gmbh & Co Kg Verfahren und Vorrichtung zur Herstellung einer Anordnung aus einem elektronischen Bauelement und einer gewickelten Spule
DE4332055C2 (de) 1993-09-21 1998-03-26 David Finn Vorrichtung zum Herstellen einer Spulenanordnung für die Kontaktierung mit einem Bauelement
DE4408124C2 (de) * 1994-03-10 1998-03-26 Amatech Gmbh & Co Kg Verfahren und Vorrichtung zur Herstellung einer Anordnung aus mindestens einem elektronischen Bauelement (IC) und einer gewickelten Spule

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate

Also Published As

Publication number Publication date
DE19634661A1 (de) 1998-03-05
JP2001505715A (ja) 2001-04-24
EP0922289A1 (fr) 1999-06-16
DE59707230D1 (de) 2002-06-13
WO1998009305A1 (fr) 1998-03-05
ES2173475T3 (es) 2002-10-16
ATE217440T1 (de) 2002-05-15
AU4110697A (en) 1998-03-19
JP3779330B2 (ja) 2006-05-24
US6295720B1 (en) 2001-10-02

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