EP0922289B1 - Process and device for producing a coil arrangement - Google Patents

Process and device for producing a coil arrangement Download PDF

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Publication number
EP0922289B1
EP0922289B1 EP97938755A EP97938755A EP0922289B1 EP 0922289 B1 EP0922289 B1 EP 0922289B1 EP 97938755 A EP97938755 A EP 97938755A EP 97938755 A EP97938755 A EP 97938755A EP 0922289 B1 EP0922289 B1 EP 0922289B1
Authority
EP
European Patent Office
Prior art keywords
matrix
wire
winding
die
additional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97938755A
Other languages
German (de)
French (fr)
Other versions
EP0922289A1 (en
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rietzler Manfred
Original Assignee
David Finn
Manfred Rietzler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19634661A priority Critical patent/DE19634661A1/en
Priority to DE19634661 priority
Application filed by David Finn, Manfred Rietzler filed Critical David Finn
Priority to PCT/DE1997/001712 priority patent/WO1998009305A1/en
Publication of EP0922289A1 publication Critical patent/EP0922289A1/en
Application granted granted Critical
Publication of EP0922289B1 publication Critical patent/EP0922289B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • H01F41/098Mandrels; Formers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49071Electromagnet, transformer or inductor by winding or coiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49162Manufacturing circuit on or in base by using wire as conductive path

Description

The present invention relates to a method for producing a Coil arrangement according to claim 1, and a device for Execution of such a method according to claim 5.

DE 43 07 064 A1 describes a method for producing a coil arrangement known by means of a winding tool, in which a first End of the winding wire with a first connection surface in the winding tool arranged chips is contacted, then a winding process to form a wire spool and finally one second winding wire end region of the wire coil with a second Contact surface of the chip is contacted. To contact the respective end of the winding wire with the relevant contact surface of the chip, the end of the winding wire is first between one of the Winding tool executed separately, on the peripheral edge of the winding tool arranged holding device and a wire guide, then the contact and finally the winding wire between the respective contact surface and the holding device severed.

From DE 43 07 064 A1 is also a winding tool for manufacturing a coil arrangement arranged on a die carrier is known. The winding tool can be a component and a separately designed one Position the winding die and has wire guide devices on. On the circumference of the winding tool and separately from it formed, holding devices for holding winding wire ends intended. The winding tool rotatable about an axis of rotation is a Counterholder assigned, its distance from that on the winding tool arranged winding die changeable along the axis of rotation is.

To produce coil assemblies with several different trained coils or with coils of different orientation It was previously customary to manufacture the coils individually and then in to contact each other in a subsequent working procedure that the desired coil arrangement results. This method proves not least because of the difficult handling of the extreme thin winding wire ends of the coils when contacting as complex. In addition, are for differently dimensioned coils different winding tools for the production of the individual coils to use.

The present invention is therefore based on the object of a method or to propose a device with which the production of Coil arrangements of the aforementioned type is simplified.

This object is achieved by a method with the features of the claim 1 or a device with the features of claim 5 solved.

The method according to the invention defined in claim 1 enables the manufacture of a coil arrangement with a plurality of winding wire regions formed in superimposed winding wire levels in a winding tool with the following method steps:

  • Fixation of the winding wire in a first wire holding device on the peripheral edge of a base die,
  • Rotation of the winding tool with counterholders spaced apart from the base die for contacting the winding wire with an additional die arranged on the base die and formation of a first winding wire region arranged on the surface of the base die,
  • Closing the winding tool by moving the counter-holder against the die surface of the base die and rotating the winding tool to rest the winding wire on the winding circumference of the base die and forming a further winding wire area as a wire coil.
  • Fixation of the wire spool and rotation of the winding tool with a counterholder spaced from the die surface of the base die for contacting the winding wire with the additional die and formation of a further winding wire region arranged above the wire spool, and
  • Fixation of the winding wire in a second wire holding device on the peripheral edge of the base die.

Depending on the design or number of turns of the further winding wire area this can be used as a connecting wire area for contacting the first wire coil or as another, with the first wire coil directly Form connected wire coil.

In a particularly advantageous variant of the method according to the invention are the first to be trained under the additional matrix Winding wire area and the second under contact with the additional matrix trained winding wire area over pads one at the Die surface of the base die arranged chip unit away and then contact is made with the winding wire areas with the pads of the chip unit.

In this variant of the method, the Additional matrix defined winding wire areas for the formation of in their orientation for contacting pads one Chip unit prepared coil wire ends used. This will in advantageously contacting the coil wire ends with the Pads of a chip unit in the winding tool possible without for this a positioning of the chip unit depending on the Orientation of the coil wire ends should be done.

In this context, it proves to be particularly advantageous if the chip unit between the formation of the first winding wire area two die parts of the additional die arranged on the base die is inserted into a holding device of the base die.

If following the contact a cut in the area trained between the wire holding devices and the additional die Winding wire ends at two separating points in the area between the pads of the chip unit and the wire holding devices takes place, it is possible to remove excess wire areas, i.e. over the Terminal surfaces of the chip unit protruding winding wire ends of the To remove the coil assembly already in the winding tool, so that a subsequent, separate handling of the coil arrangement for this Purpose can be omitted.

The winding tool according to the invention defined in claim 5 for producing a on the above-described manner formed coil arrangement one die arranged on a die carrier and one on the periphery the matrix arranged on the matrix support with at least two wire holding devices for holding winding wire ends as well as one on the side of the die carrier that has the die counter-holder arranged adjacent to the die, the die is designed in such a way that it serves as a base matrix has, wherein on the die surface of the base die a Additional die is arranged and the counter-holder in its relative arrangement is changeable to the base matrix.

This relative arrangement of the base matrix and additional matrix enables the procedure for the preparation explained in detail above a coil arrangement.

In a particularly advantageous embodiment of the winding tool the additional die has at least two die parts on both sides a holding device arranged on the base die for positioning Recording a chip unit are arranged, the die parts are arranged and designed such that along one through the Die parts of defined winding circumference of the additional die Winding wire areas an overlap with pads in one the holding device arranged chip unit.

Formed in this way, the winding tool can be used to produce a Coil arrangement consisting of a wire coil formed on the base die and use a chip unit, the additional matrix for training of winding wire areas precisely defined in their orientation serves the direct contacting of the winding tool enable wound wire coil with the chip unit.

In a particularly simple embodiment, the die parts are the Additional die formed as cylindrical pins.

If adjacent to a die part of the additional die, a wire deflection device is arranged such that the space between an engagement space for the die part and the wire deflection device forms a wire gripper device, a removal of excess Wire ends are done in a simple manner from the winding tool.

A variant of the method according to the invention and an embodiment of a winding tool which is particularly suitable for carrying out this method variant are explained in more detail below with reference to the drawings. Show it:

Fig. 1
a base die arranged on a die holder of a winding tool in plan view;
Fig. 2
a schematic representation of the winding tool shown in Figure 1 in side view with a counterholder placed on the base die;
Fig. 3
a view corresponding to the view of FIG. 2 of the winding tool with counterholder spaced from the base die;
Fig. 4
the winding tool shown in Figure 1 in a loading position.
Fig. 5
the winding tool shown in Figure 1 in a first wire fixing position.
Fig. 6
the winding tool shown in Figure 1 in a closed position with a first winding wire area against an additional die.
Fig. 7
the winding tool shown in Figure 1 during the winding of a wire coil on the base die.
Fig. 8
the winding tool shown in Figure 1 in an open position.
Fig. 9
the tool shown in Figure 1 in a second wire fixing position.
Fig. 10
a first coil arrangement produced on the winding tool according to FIG. 1 ;
Fig. 11
a second coil arrangement produced on the winding tool according to FIG. 1 .

1 shows a top view of a winding tool 28 with a base die 21 arranged on a die carrier 20, which is essentially circular in the form of a circular disk, with a winding circumference 24 composed of four circumferential side surfaces 22 and 23, the circumferential side surfaces 22 and 23 being convex and in rounded transition areas 25 one inside the other pass. The base die 21 has a flat die surface 26, in which a connecting bolt 27 is countersunk for the rotationally fixed connection of the die holder 20 with a threshing drive (not shown in more detail) for driving the winding tool 28.

Inserted into the die surface 26 of the base die 21 there is a holding device 29 for the positioning arrangement of a chip unit, not shown in FIG. 1 . The holding device 29 has a disc-shaped permanent magnet 30 and two positioning jaws 31, 32, the positioning jaw 31 being adjustable parallel to the positioning jaw 32. An ejector mandrel 33 is located in a centrally arranged opening of the permanent magnet 30.

Arranged on the die surface 26 of the base die 21 in a raised manner there are two die parts designed here as cylindrical pins 34 and 35, which together form one on the surface of the base die 21 form arranged additional die 36.

Adjacent to the cylinder pin 35 is also a cylinder pin Deflection pin 37 arranged. Between the cylinder pin 35 and the deflection pin 37, the die surface 26 has an elongated hole here trained gripper opening 38. Another diverter pin 72 is in alignment with the cylindrical pins 34 and 35 and the deflection pin 37 and is adjacent to the transition region 25 arranged on the outer edge of the die surface 26.

The die carrier 20 is provided on its peripheral edge with two wire holding devices 39, 40 arranged on a central diagonal 71 in the present case. The wire holding devices 39, 40 are of identical design and each have a clamping jaw 41 which can be moved relative to a clamping base 42, in the present case the movement of the clamping jaw 41 taking place transversely to the axis of rotation 43 of the winding tool 28. As is clear from FIG. 1 using the example of the wire holding device 39 arranged at the top left, the clamping jaw 41 is actuated via a wire guide 45 which can be moved on a translation axis 44 running parallel to the axis of rotation 43 of the winding tool 28. For this purpose, a wire guide 45, through which a winding wire (not shown in detail here) is guided by a storage device (also not shown in detail here), is passed past a clamping gap 41 through a clamping gap 47 while overcoming restoring forces. As a result of the closing of the clamping gap 47 after the wire guide capillary 46 has been moved through, the winding wire is then clamped against the clamping base 42 by the clamping jaw 41.

2 and 3 show the winding tool 28 provided with a counter-holder 48, the counter-holder 48 in FIG. 2 being moved against the die surface 26 of the base die 21 and in FIG. 3 the counter-holder 48 being spaced apart from the die surface 26 of the base die 21 ,

2 with the counter-holder 48 moved against the die surface 26 of the base die 21, it becomes clear that the cylindrical pins 34 and 35 of the additional die 36 and the deflection pin 37 engage in receiving openings correspondingly formed in the counter-holder 48, not shown here. In addition, as can be seen from FIG. 1 , two cylindrical driving pins 49 and 50 (FIG. 1) are arranged on the die surface 26 of the base die 21, which likewise engage in receiving openings in the counter-holder 48 provided for this purpose, which are not shown in FIG. 2 , As shown in FIG. 1 , the driving pins 49 and 50 are arranged on a center axis 51 intersecting the axis of rotation 43 and ensure that the counter-holder 48 is driven in rotation when the die carrier 20 rotates.

As shown in FIG. 3 , the driving pins 49, 50 are designed to be retractable into the die surface 26 of the base die 21, so that in the opening configuration of the winding tool 28 shown in FIG. 3 , only the cylindrical pins 34, 35 and the deflection pin 37 the die surface 26 of the base die 21 tower above.

The use of the winding tool 28 explained above with reference to FIGS. 1 to 3 in its components for the production of a coil arrangement 52, as shown in FIG. 10 , will be explained below. As can be seen from FIG. 10 , the coil arrangement 52 has a wire coil 54 wound from winding wire 53, the winding wire ends of which, which in addition to the coil former 54 form further winding wire regions 55 and 56, are contacted with connection surfaces 57, 58 of a chip unit 59.

FIG. 4 shows the winding tool 28 in a loading position in which the counter-holder 48 (FIGS . 2 and 3 ) is removed from the base die 21 and the die surface 26 is freely accessible from a direction running parallel to the axis of rotation 43. In this position, the chip unit 59 is inserted into the holding device 29, the position jaws 31, 32 initially being moved apart and the chip unit 59 being held only by the magnetic forces of the permanent magnet 30. The magnetic forces act between the pad metallizations of the chip unit 59, which may have nickel, for example, and the permanent magnet 30. For positioning on an axis 60 of the additional die 36 perpendicular to a longitudinal extension axis 60
Positioning axis 61 of the holding device 29, the positioning jaws 31 and 32 are then moved toward one another. This results in an exact alignment on the positioning axis 61. The exact alignment of the chip unit 59 on the longitudinal extension axis 60 can be neglected, as will be explained in more detail below with reference to FIG. 9 .

FIG. 5 shows the winding tool 28 in a first wire fixing position, in which the wire guide 45, together with the winding wire 53 led out of the wire guide capillary 46, is moved on the translation axis 44 by the wire holding device 39. After the wire guide capillary 46 has been moved through the clamping gap 47, the winding wire 53 is held clamped in the wire holding device 39. In the subsequent winding process, the wire guide remains in a position upstream of the wire holding device 39, so that when the winding tool 28 rotates, the winding wire held in the wire holding device 39 is continuously pulled out of the wire guide 45.

FIG. 6 shows the winding tool 28 in a closed position rotated counterclockwise by approximately 270 ° with respect to the first wire fixing position shown in FIG. 5 . In this position, a first winding wire region 55 - in the view according to FIG. 6 on the left-hand side - bears against the cylindrical pins 34 and 35 of the additional die 36 and against the deflection pin 37, so that the wire configuration shown in FIG. 6 is formed. A winding wire end 63 extending from the deflection pin 37 to the wire holding device 39 extends across the die surface 26 of the base die 21 in a wire channel 62 (FIG. 1) .

6 , the winding tool 28 is closed by moving the counter-holder 48 against the die surface 26 of the base die 21. As shown in FIG. 2 , the cylindrical pins 34, 35 as well as the deflection pin 37 and the driver pins 49, 50, which have previously been countersunk in the die surface 26 and now protrude, penetrate into the counter-holder 48.

After closing the winding tool 28, as shown in FIG. 7 , the wire coil 54 is wound on the winding periphery 24 of the base die 21, the winding wire 53 being continuously pulled out of the wire guide capillary 46 of the wire guide 45. The point of the winding wire transition from the die surface 26 ( FIG. 6 ) to the winding circumference 24 is defined by the deflection pin 72.

FIG. 8 shows the winding tool 28 in an open position in which the counter-holder 48, as shown in FIG. 3, is moved away from the die surface 26 of the base die 21 with the release of the cylindrical pins 34, 35 of the additional die 36 and the deflection pin 37. In addition, as also shown in FIG. 3 , the driving pins 49, 50 are countersunk in the die surface 26 of the base die 21. Subsequent continuation of the winding process by approximately 270 °, the winding tool 28 is transferred to the second wire fixing position shown in FIG. 9 . The winding wire area 56 lies opposite the winding wire area 55 on the cylindrical pins 34, 35 of the additional die 36 and the deflection pin 37, so that the wire configuration shown in FIG. 9 is established. In this position, the wire guide 45 with the wire guide capillary 46 is moved through the second wire holding device 40, so that the winding wire 53 is now also held clamped in the second wire holder device 40. Thus, another winding wire end 64 is formed between the deflection pin 37 and the second wire holder device 40, similarly between the deflection pin 37 and the first wire holder device 39.

As is also clear from the illustration according to FIG. 9 , the alignment of the winding wire regions 55 and 56 results in overlap regions 65, 66 between the winding wire 53 and the connection surfaces 57, 58 of the chip unit 59 by means of the additional die 36. Due to the fact that The winding wire regions 55, 56, which are defined in their orientation, extend far beyond the surface of the chip unit 59 , there are no high demands on the exacurity of the positioning of the chip unit 59 along the longitudinal extension axis 61 of the additional die 36, in order to cover areas 65, 66 between the winding wire 53 and the Form pads 57, 58 of the chip unit 59.

Starting from a coil configuration 67 shown in FIG. 9 as having a winding wire area of the wire coil 54 and further winding wire areas 55, 56, the winding wire areas 55 are contacted to form the coil arrangement 52 shown in FIG. 10 as a transponder unit having the wire coil 54 and the chip unit 59 , 56 with the connection surfaces 57, 58 of the chip unit 59 in the winding tool 28.

To remove the winding wire ends 63, 64 which have been cut through with a suitable device in the area of the wire holding devices 39, 40 and the deflection pin 37, a wire gripper device, not shown here, is used, which engages the winding wire areas 55 and 56 comprehensively in the gripper opening 38 and the winding wire ends 63, 64 gripped before cutting and removed after cutting from the die surface 26 of the base die 21. The finished coil arrangement 52 shown in FIG. 10 is then removed from the winding tool 28, for example by countersinking the base die 21 in the die holder 20.

The manufacture of the coil arrangement 52 (FIG. 10) explained above with reference to FIGS. 1 to 9 represents only one possibility of using the method according to the invention. The winding tool 28 shown in FIGS . 1 to 9 can also be of an essentially unchanged design can be used to produce a coil arrangement 68 shown in FIG. 11 .

FIG. 11 shows the coil arrangement 68, which has two wire coils 69 and 70, which are continuously merged into one another by means of the method described above in a method variant. In contrast to the manufacture of the coil arrangement 52 shown in FIG. 10 , the winding process of the winding tool 28 after the formation of the second winding wire region 56 on the additional die 36 is continued with the winding tool 28 open, so that in addition to the wire coil 69 formed on the base die 21 on the additional die 36 the further wire coil 70 can be formed with any number of turns.

Claims (8)

  1. Method for manufacturing a coil arrangement (52, 68) with a plurality of winding wire regions (54, 55, 56; 69, 70) constructed in superimposed winding wire planes in a winding tool (28) with the following method steps:
    fixing of the winding wire (53) in a first wire holding device (39) arranged at the circumferential edge of the winding tool (28),
    rotation of the winding tool (28) with a brace at a distance from the basic matrix so as to lay the winding wire (53) against an additional matrix (36) arranged on the basic matrix (21) and formation of a first winding wire region (55) arranged on the surface of the basic matrix,
    closure of the winding tool (28) by displacing the brace (48) towards the matrix surface (26) of the basic matrix (21) and rotation of the winding tool (28) so as to lay the winding wire (53) on the winding circumference (24) of the basic matrix (21) and formation of a further winding wire region as a wire coil (54, 69),
    fixing of the wire coil (54, 69) and rotation of the winding tool (28) with brace (48) at a distance from the matrix surface (26) of the basic matrix (21) so as to lay the winding wire (53) against the additional matrix (36) and formation of a further winding wire region (56) arranged above the wire coil (54, 69),
    fixing of the winding wire (53) in a second wire holding device (40) arranged at the circumferential edge of the basic matrix (21).
  2. Method according to claim 1, characterised in that the first winding wire region (55) formed against the additional matrix and the further winding wire region (56) formed against the additional matrix (36) are guided over connecting surfaces of a chip unit (59) arranged on the matrix surface (26) of the basic matrix (21), and a contacting of the winding wire regions (55, 56) with connecting surfaces (57, 58) of the chip unit (59) is then effected.
  3. Method according to claim 2, characterised in that, prior to the formation of the first winding wire region (55) formed against the additional matrix (36), the chip unit (59) is fitted into a holding device (29) on the basic matrix (21) between two matrix elements (34, 35) of the additional matrix (36) arranged on the basic matrix (21).
  4. Method according to claim 2 or 3, characterised in that, following the contacting, a cutting of the winding wire ends (63, 64) formed in the region between the wire holding devices (39, 40) and the additional matrix (36) is effected in each case at two cutting points in the region between the connecting surfaces(57, 58) of the chip unit (59) and the wire holding devices (39, 40).
  5. Winding tool (28) for manufacturing a coil arrangement (52, 68) with a matrix (21) arranged on a matrix support (20), which is rotatable about an axis of rotation (43), and with a holding arrangement arranged at the circumference of the winding tool with at least two wire holding devices (39, 40) for holding winding wire ends (63, 64), and with a brace (48), which is arranged adjacent to the matrix on the side of the matrix support comprising the matrix and whose distance relative to the matrix is variable along the axis of rotation, characterised in that the holding arrangement is arranged on the circumferential edge of the winding tool and the matrix is constructed in such a manner that it comprises a base element acting as a basic matrix (21), an additional matrix (36) being arranged on the matrix surface (26) of the basic matrix (21).
  6. Winding tool according to claim 5, characterised in that the additional matrix (36) comprises at least two matrix elements (34, 35), which are arranged either side of a holding device (29) arranged on the basic matrix (21) for the positioning accommodation of a chip unit (59), the matrix elements (34, 35) being arranged and constructed in such a manner that winding wire regions (55, 56) extending along a winding circumference of the additional matrix (36) defined by the matrix elements comprise an overlap position with connecting surfaces (57, 58) of a chip unit (59) arranged in the holding device (29).
  7. Winding tool according to claim 6, characterised in that the matrix elements (34, 35) of the additional matrix (36) are constructed as cylinder rods.
  8. Winding tool according to one of claims 5 to 7, characterised in that a wire deflecting device (37) is arranged adjacent to a matrix element (35) of the additional matrix (36), the intermediate space between the matrix element (35) and the wire deflecting device (37) forming an engagement space for a wire gripping device.
EP97938755A 1996-08-28 1997-08-12 Process and device for producing a coil arrangement Expired - Lifetime EP0922289B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19634661A DE19634661A1 (en) 1996-08-28 1996-08-28 Method and device for producing a coil arrangement
DE19634661 1996-08-28
PCT/DE1997/001712 WO1998009305A1 (en) 1996-08-28 1997-08-12 Process and device for producing a coil arrangement

Publications (2)

Publication Number Publication Date
EP0922289A1 EP0922289A1 (en) 1999-06-16
EP0922289B1 true EP0922289B1 (en) 2002-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP97938755A Expired - Lifetime EP0922289B1 (en) 1996-08-28 1997-08-12 Process and device for producing a coil arrangement

Country Status (8)

Country Link
US (1) US6295720B1 (en)
EP (1) EP0922289B1 (en)
JP (1) JP3779330B2 (en)
AT (1) AT217440T (en)
AU (1) AU4110697A (en)
DE (2) DE19634661A1 (en)
ES (1) ES2173475T3 (en)
WO (1) WO1998009305A1 (en)

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WO2014206579A1 (en) 2013-06-29 2014-12-31 Féinics Amatech Teoranta Booster antenna configurations and methods
KR20140123562A (en) 2012-02-05 2014-10-22 페이닉스 아마테크 테오란타 Rfid antenna module and methods
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US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
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Also Published As

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EP0922289A1 (en) 1999-06-16
DE19634661A1 (en) 1998-03-05
AT217440T (en) 2002-05-15
JP2001505715A (en) 2001-04-24
US6295720B1 (en) 2001-10-02
DE59707230D1 (en) 2002-06-13
ES2173475T3 (en) 2002-10-16
AU4110697A (en) 1998-03-19
WO1998009305A1 (en) 1998-03-05
JP3779330B2 (en) 2006-05-24

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