EP0922289A1

EP0922289A1 - Process and device for producing a coil arrangement

Info

Publication number: EP0922289A1
Application number: EP97938755A
Authority: EP
Inventors: David Finn; Manfred Rietzler
Original assignee: Individual
Current assignee: Finn David; RIETZLER, MANFRED
Priority date: 1996-08-28
Filing date: 1997-08-12
Publication date: 1999-06-16
Anticipated expiration: 2017-08-12
Also published as: DE59707230D1; EP0922289B1; JP3779330B2; AU4110697A; DE19634661A1; ES2173475T3; WO1998009305A1; US6295720B1; JP2001505715A; ATE217440T1

Abstract

Method for manufacturing a coil arrangement with a plurality of winding wire regions (54, 55, 56) constructed in superimposed winding wire planes in a winding tool (28) with the following method steps:fixing of the winding wire (53) in a first wire holding device (39) at the circumferential edge of a basic matrix (21),rotation of the winding tool (28) so as to lay the winding wire (53) against an additional matrix (36) arranged on the basic matrix (21) of the winding tool (28) and formation of a first winding wire region (55) arranged on the surface (26) of the basic matrix,closure of the winding tool (28) by displacing a brace (48) towards the matrix surface (26) of the basic matrix (21) and rotation of the winding tool (28) so as to lay the winding wire (53) on the winding circumference (24) of the basic matrix (21) and formation of a further winding wire region as coil element (54),fixing of the coil element (54) and rotation of the winding tool (28) with brace (48) at a distance from the matrix surface (26) of the basic matrix (21) so as to lay the winding wire (53) against the additional matrix (36) and formation of a further winding wire region (56) arranged above the coil element (54),fixing of the winding wire (53) in a second wire holding device (40) at the circumferential edge of the basic matrix (21).

Description

Method and device for producing a coil arrangement

The present invention relates to a method for producing a coil arrangement according to claim 1 and a device for executing such a method according to the preamble of claim 5

For the manufacture of coil arrangements with several differently designed coils or with coils of different orientations, it has hitherto been customary to manufacture the coils individually and then to contact them in a subsequent working process in such a way that the desired coil arrangement is obtained The extremely thin winding wire ends of the coils are difficult to make when contacting them. In addition, different winding tools must be used to manufacture the individual coils for differently dimensioned coils

The present invention is therefore based on the object of proposing a method or a device with which the manufacture of coil arrangements of the aforementioned type is simplified

This object is achieved by a method with the features of claim 1 or a device with the features of claim 5

The method according to the invention enables! the production of a coil arrangement with several layers of winding wire that are adjacent to each other trained winding wire areas in a winding tool with the following process steps

Fixation of the winding wire in a first wire holding device on the peripheral edge of a base die,

Rotation of the winding tool with a counter-holder spaced from the base die for contacting the winding wire with an additional die arranged on the base die and formation of a first winding wire region arranged on the surface of the base die,

- Closing the winding tool by moving the counter-holder against the surface of the base die and rotating the winding tool to rest the winding wire on the winding circumference of the base die and forming a further winding wire area as a coil former.

- Fixation of the bobbin and rotation of the winding tool with counterholders spaced from the die surface of the base die for contacting the winding wire with the additional die and forming a further winding wire region arranged above the bobbin, and

- Fixing the winding wire in a second wire holding device on the circumference '3 ^g s-edge of the base matrix

Depending on the design or number of turns of the further winding wire area, this can be designed as a connecting wire area for contacting the first coil former or also as a further coil former directly connected to the first coil former

In a particularly advantageous variant of the method according to the invention, the first winding wire area formed by abutment with the additional die and the second winding wire area formed by abutment with the additional mat are one of the connecting surfaces 5

The surface of the base die arranged chip unit and then contacting the winding wire areas with the connection surfaces of the chip unit

In this variant of the method, the winding wire areas defined in their course by the additional die are used to form coil wire ends prepared in their orientation for contacting connection surfaces of a chip unit.This advantageously makes it possible to contact the coil wire ends with the connection surfaces of a chip unit in the winding tool, without that the chip unit had to be positioned depending on the orientation of the coil wire ends

It proves to be particularly advantageous in this context if the chip unit is inserted into a holding device of the base mattress before the first end of the winding wire is formed between two mattress parts of the additional mattress arranged on the base die

If the contacting is followed by a cut in the area between the wire holding devices and the additional matrix of winding wire ends formed at two separating points in the area between the connection surfaces of the chip unit and the wire holding devices, it is possible to have excess wire areas, i.e. winding wire ends of the coil arrangement projecting beyond the connection surfaces of the chip unit to be removed in the winding tool, so that subsequent, separate handling of the coil arrangement can be dispensed with for this purpose

The winding tool according to the invention for producing a coil arrangement formed in the manner described above has a die arranged on a mat holder and a holding arrangement arranged on the periphery of the die on the mat holder with at least two holding devices for holding winding wire end regions and one opposite the mat holder and adjacent to the mat n g uenhaller arranges the matrix as the base die is designed with an additional die arranged on the base die, and the counter-holder can be changed in its arrangement relative to the base die

This relative arrangement of the base matrix and the additional matrix enables the procedure for producing a coil arrangement explained in detail above.

In a particularly advantageous embodiment of the winding tool, the additional die has at least two die parts, which are arranged on both sides of a holding device arranged on the base die for positioning accommodation of a chip unit, the die parts being arranged and designed such that along a winding circumference defined by the die parts winding wire areas extending the additional die have an overlap layer with connection areas of a chip unit arranged in the holding device

Designed in this way, the winding tool can be used to produce a coil arrangement from a coil former formed on the base matrix and a chip unit, the additional matrix used to form winding wire regions which are precisely defined in their orientation and which allow direct contact of the coil former wound in the winding tool with the chip unit

In a particularly simple embodiment, the die parts of the additional die are designed as cylindrical pins

If a wire deflection device is arranged adjacent to a die part of the additional die, such that the space between the die part and the wire deflection device forms an engagement space for a wire gripper device, excess wire ends can be removed from the winding tool in a simple manner

Next, a variant of the inventive method as well as a particularly suitable for carrying out this process variant Ausfuhrutitist ^'orm a Wickelwerkzeu ^ s reference to the drawings near explained it show

1 is a plan view of a base die arranged on a die holder of a winding tool,

2 shows a schematic illustration of the winding tool shown in FIG. 1 in a side view with a counterholder placed on the base die,

3 shows a representation of the winding tool corresponding to the view in FIG. 2 with the counter-holder spaced apart from the base die,

4 shows the winding tool shown in FIG. 1 in a mounting position,

5 shows the winding tool shown in FIG. I in a first wire fixing position,

6 shows the winding tool shown in FIG. 1 in a closed position with a first winding wire region in contact with an additional die,

7 shows the winding tool shown in FIG. 1 during the winding of a coil body on the base die,

8 shows the winding tool shown in FIG. 1 in an opening position,

9 the tool shown in FIG. 1 in a second wire fixing position,

10 shows a first coil arrangement produced on the winding tool according to FIG. 1,

11 shows a second coil arrangement produced on the winding tool according to FIG. 1

1 shows a plan view of a winding tool 28 with a mat carrier 20 formed on an essentially square sheave arranged base die 21 with a winding circumference 24 composed of four circumferential side faces 22 and 23, the circumferential side faces 22 and 23 being convex and merging into one another in rounded transition areas 25. The base die 21 has a flat die surface 26 in which a connecting bolt 27 countersinks rotationally fixed connection of the die carrier 20 is arranged with a rotary drive, not shown, for driving the winding tool 28

In the die surface 26 of the base die 21 there is a holding device 29 for the positioning arrangement of a chip unit not shown in FIG. 1. The holding device 29 has a disc-shaped permanent magnet 30 and two positioning jaws 31, 32, the positioning jaw 31 being adjustable parallel to the positioning jaw 32. An ejector mandrel 33 is located in a centrally arranged opening of the permanent magnet 30

On the die surface 26 of the base die 21 there are two die parts, here designed as cylindrical pins 34 and 35, which together form an additional die 36 arranged on the surface of the base die 21

Adjacent to the cylinder pin 35 is a T-deflection pin 37, which is also designed as a cylinder pin. Between the cylinder pin 35 and the deflection pin 37, the die surface 26 has a gripper opening 38, which is designed here as an elongated hole. A further deflection pin 72 is in alignment with the cylinder pins 34 and 35 and the deflection pin 37 and is arranged adjacent to the transition region 25 on the outer edge of the die surface 26

The die holder 20 is provided on its peripheral edge with two wire holding devices 39, 40 arranged in the present case on a central diagonal 71. The wire holding devices 39, 40 are of identical design and each have a clamping jaw 4 I which can be moved relative to a clamping base 42, in the present case Case the movement The clamping jaw 4 1 takes place transversely to the axis of rotation 43 of the winding tool 28. As can be seen from FIG. 1 using the example of the wire holding device 39 arranged at the top left, the clamping jaw 4 1 is moved via a translation axis running parallel to the axis of rotation 43 of the winding tool 28 44 Movable wire guide 45 actuated For this purpose, a wire guide 46, through which a winding wire (not shown in more detail here) is guided by a storage device (also not shown in more detail here), is overcome by restoring forces past the clamping jaw 4 1 by a clamping gap 47. With the clamping gap 47 after the wire guide capillary 46 has been moved through, the winding wire is then clamped against the clamping base 42 by the clamping jaw 41

2 and 3 show the winding tool 28 provided with a counter-holder 48, the counter-holder 48 being moved against the die surface 26 of the base die 21 in FIG. 2 and the counter-holder 48 being moved from the die surface 26 of the base die 2 in FIG. 3 1 is spaced

From the illustration according to FIG. 2 with the counter holder 48 moved against the die surface 26 of the base die 2 1, it is clear that the cylindrical pins 34 and 35 of the additional die 36 and the deflection pin 37 engage in receiving openings correspondingly designed in the counter holder 48 and not shown here Furthermore, as can be seen from FIG. 1, two cylindrical driver pins 49 and 50 (FIG. 1) are arranged on the die surface 26 of the base die 2 1, which likewise engage in receiving openings provided in the counter-holder 48, not shown in detail in FIG. 2 As shown in FIG. 1, the driving pins 49 and 50 are arranged on a center axis 5 1 intersecting the axis of rotation 43 and ensure that the counter-holder 48 is driven in rotation when the die carrier 20 rotates

As shown in FIG. 3, the driver posts 49, 50 are formed retractable into the die surface 26 dci B asi smat rize 2 1, so that in the case of FIG. 3 shown opening configuration of the winding tool 28 only the Zylindcrsti fte 34, 35 and the deflection pin 37 protrude the die surface 26 of the base die 2 1

The use of the winding tool 28 explained above with reference to FIGS. 1 to 3 in its components for the production of a coil arrangement 52, as shown in FIG. 10, will be explained. As can be seen from FIG. 10, the coil arrangement has 52 a coil body 54 wound from winding wire 53, the winding wire ends of which, in addition to the coil body 54 forming further winding wire regions 55 and 56, are contacted with connection surfaces 57, 58 of a chip unit 59,

FIG. 4 shows the winding tool 28 in an assembly position in which the counter-holder 48 (FIGS. 2 and 3) is removed from the base die 2 1 and the die surface 26 is freely accessible axially. In this position, the chip unit 59 is inserted into the holding device 29 , whereupon the positioning jaws 3 1, 32 are moved apart and the chip unit 59 is held only by the magnetic forces of the permanent magnet 30. The magnetic forces act between the pad metallizations of the chip unit 39, which may have nickel, for example, and the permanent magnet 30 for positioning The positioning jaws 3 1 and 32 are then moved relative to one another on a positioning axis 6 1 of the holding device 29 running perpendicular to an elongation axis 60 of the additional die 36. This results in an exact alignment on the positioning axis 6 1. The exact alignment of the chip unit 59 on the elongation axis 60 can neg are neglected, as will be explained in more detail below with reference to FIG. 9

5 shows the winding tool 28 in a first wire fixing position, in which the wire guide 45 is moved together with the winding wire 53 led out of the wire guide capillary 46 on the translation axis 44 by the wire holding device 1 movement of the diu ht capillary ai e 46 through the clamping gap 47 and the winding wire 53 held clamped in the wire holding device 39 During the subsequent winding process, the wire guide remains in a position upstream of the wire holding device 39, so that when the winding tool 28 rotates, the winding wire held in the wire holding device 39 is continuously pulled out of the wire guide 45

FIG. 6 shows the winding tool 28 in a closed position rotated counterclockwise by approximately 270 ° with respect to the first wire fixing position shown in FIG. 5. In this position, a first winding wire region 55 - in the view according to FIG. 6 on the left side - lies against the cylindrical pins 34 and 35 of the additional die 36 and on the deflection pin 37, so that the wire configuration shown in FIG. 6 is formed. From the deflection pin 37 to the wire holding device 39, a cross extends over the die surface 26 of the base die 2 1 in a wire channel 62 (FIG. 1 ) running winding wire end 63

When the wire configuration shown in FIG. 6 is present, the winding tool 28 is closed by moving the counter-holder 48 against the die surface 26 of the base die 2 1. As shown in FIG. 2, the cylindrical pins 34, 35 and the deflection pin 37 and the driver pins 49, 50, which were previously countersunk in the die surface 26 and now protrude, into the counter-holder 48

After the winding tool 28 has been closed, as shown in FIG. 7, the bobbin 54 is wound on the winding circumference 24 of the base mattress 2 1, the winding wire 53 being continuously pulled out of the wire guide capillary 46 of the wire guide 45 by the Deflection pin 72 is the location of the winding wire transition from the die surface 26 (Fig. 6) to the Wickelu mfang 24 defined

Fig. 8 shows the winding tool 28 in an opening position, in which the counter-holder 48 as shown in Fig. 3, with the release of the cylindrical pins 34, 3 5 of the sat / mat πze 36 and the deflection shaft 37 of the die Zen surface 26 of the base die 2 1 Weubeweuti wi rd Beyond 3, the driving pins 49, 50 are countersunk in the die surface 26 of the base die 21. When the winding process is subsequently continued by approximately 270 °, the winding tool 28 is transferred to the second wire fixing position shown in FIG. 9 56 opposite the winding wire area 55 to the cylindrical pins 34, 35 of the additional die 36 and the deflection pin 37, so that the wire configuration shown in FIG. 9 is established. In this position, the wire guide 45 with the wire guide cannula 46 is moved through the second wire holding device 40, so that the winding wire 53 is now also held clamped in the second wire holder device 40. A further winding wire end 64 is thus formed between the deflection pin 37 and the second wire holder device 40, similarly to the deflection pin 37 and the first wire holding device 39

As is also clear from the illustration according to FIG. 9, the alignment of the winding wire regions 55 and 56 results in overlap regions 65, 66 between the winding wire 53 and the connection surfaces 57, 58 of the chip unit 59 due to the fact that the winding wire areas 55, 56, defined in their alignment, which extend far beyond the surface of the chip unit 59, there are no high demands on the exactness of the positioning of the chip unit 59 along the longitudinal extension axis 61 of the additional die 36, to cover areas 65, 66 between the winding wire 53 and the connection surfaces 57, 58 of the chip unit 59

Starting from a coil configuration 67 shown in FIG. 9 as a winding wire area and having further winding wire areas 55, 56, a contact is made to form the coil arrangement 52 shown in FIG. 10 as a transponder unit having the coil body 54 and the chip 59 Winding wire regions 55, 56 with the connection surfaces 57, 58 of the chip unit 59 in the winding tool 28

For 1 nt fei now "dei with a" eeι "nelcn Pin rieh do in the Ber ic dei 1 ϊ

Wire holding devices 39, 40 and winding wire ends 63, 64 which are severed through deflecting element 37, a wire gripper device (not shown in more detail here) is used, which engages winding wire regions 55 and 56 comprehensively in gripper opening 38 and grips winding wire ends 63, 64 before cutting and after cutting of the die surface 26 of the base die 21 is then removed from the winding tool 28, for example by sinking the base die 21 in the die holder 20, the completed coil arrangement 52 shown

The manufacture of the coil arrangement 52 (FIG. 10) explained above with reference to FIGS. 1 to 9 represents only one possibility of using the method according to the invention. The winding tool 28 shown in FIGS. 1 to 9 can also be used in an essentially unchanged embodiment Production of a coil arrangement 68 shown in FIG. 11 can be used

FIG. 11 shows the coil arrangement 68, which has two coil formers 69 and 70, which are continuously merged into one another by means of the method described above in a method variant. In contrast to the manufacture of the coil arrangement 52 shown in FIG. 10, the winding process of the winding tool 28 after the second winding wire region 56 has been formed on the additional die 36, with the winding tool 28 open, so that, in addition to the bobbin 69 formed on the base die 21, the additional bobbin 70 can be formed with any number of turns on the additional die 36

Claims

claims

Method for producing a coil arrangement (52, 68) with a plurality of winding wire regions (54, 55, 56, 69, 70) formed in superimposed winding wire planes in a winding tool (28) with the following method steps

- Fixing the winding wire (53) in a first Drahthalteeinrich device (39) on the peripheral edge of the base die (21),

- Rotation of the winding tool (28) with counterholders spaced apart from the base die for contacting the winding wire (53) on an additional die (36) arranged on the base die (2 1) and forming a first winding wire region arranged on the surface of the base die,

- Closing the winding tool (28) by moving the counter-holder (28) against the die surface (26) of the base die (2 1) and rotating the winding tool (28) to rest the winding wire (53) on the winding circumference (24) of the base die (2 1) and formation of a further winding wire area as a pulp body (54, 69),

- Fixing the bobbin (54, 69) and rotation of the winding tool (28) with the m at i izenoberfiache (26) of the base trize (21) spaced counter-holder (48) for contacting the winding wire (53) on the additional die (36) and forming a further winding wire region (56), 5 arranged above the coil former (54, 69)

- Fixing the winding wire (53) in a second wire holding device (40) on the peripheral edge of the base die (21).

2. The method according to claim 1, characterized in that the first winding wire region (55) formed by contacting the additional die and the further winding wire region (56) formed by contacting the additional die (36) via connection surfaces of one on the die surface ( 26) of the base die (21) arranged chip unit (59), and subsequently contacting the winding wire areas (55, 56) with connection surfaces (57, 58) of the chip unit (59).

3. The method according to claim 2, characterized in that the chip unit (59), prior to the formation of the first winding wire region (55), is arranged between two on the base die (21)

Die parts (34, 35) of the additional die (36) on the base die (21) are inserted into a holding device (29).

4. The method according to claim 2 or 3, characterized in that 5 subsequent to the contact a severing in the area between the wire holding devices (39, 40) and the additional die (36) formed winding wire ends (63, 64) at two separation points in the area between the Pads (57, 58) of the chip unit (59) and the wire holding devices (39, 40)

5 winding unit for producing a coil arrangement with a mattress arranged on a matrix carrier and one on the Catch the die arranged on the die holder holding arrangement with at least two wire holding devices for holding winding wire ends, as well as a counter-holder arranged opposite the die holder and adjacent to the die, characterized in that the die is designed as a base die (21) with one on the Die surface (26) of the base die (21) arranged additional die (36) and the counter holder in its relative arrangement to the base die is changeable

6 winding tool according to claim 5, thereby g e k e n n τ. calibrates that the additional die (36) has at least two die parts (34, 35), which are arranged on both sides of a holding device (29) arranged on the base die (21) for the positioning of a chip unit (59), the die parts (34 , 35) are arranged and designed such that winding wire areas (55, 56) running along a winding circumference of the additional die (36) defined by the die parts form a covering layer with connection surfaces (57, 58) of a chip unit arranged in the holding device (29) ( 59)

7 winding tool according to claim 6, characterized g e k e n n z e i c h n e t that the die parts (34, 35) of the additional die (36) are designed as cylindrical pins

8 winding tool according to one or more of claims 5 to 7, characterized in that adjacent to a die part (35) of the additional die (36) a wire deflection device (37) is arranged such that the space between the die part (35) and Wire deflecting device (37) forms an engagement space for a wire gripper device