DE102009022427A1 - Method for winding and shifting electrical coil, involves winding coil within profiled region of shifting plates by wire shifting device, and supplying finished wound coil to substrate that is designed as self adhesive - Google Patents

Abstract

The method involves moving profiled shifting plates (4, 5) in a region of a substrate (1) around a defined drag axis (9, 10), and winding a coil within a profiled region (11) of the shifting plates by a wire shifting device (12). The finished wound coil is supplied to the substrate, and the shifting plates are connected with a pivoting body (8) that comprises a drive unit. The coil for forming a transponder on the substrate is connected to a chip module (2), where the substrate is designed as a self adhesive. An independent claim is also included for a device for winding and shifting an electrical coil.

Description

The The invention relates to a method for winding and laying at least a coil made of wire.

Of the DE 197 41 984 A1 is a chip carrier, in particular for the production of a chip card to refer to a coil substrate provided with at least one coil assembly, wherein the coil substrate in the region of contact ends of the coil assembly formed on the coil substrate on the coil substrate, the contact ends releasing connection material receiving areas, for receiving connecting material for the production of an electrically conductive connection between the contact ends of the coil arrangement and contact surfaces of a chip module.

The DE 196 19 771 A1 relates to a method and a device for laying a wire-shaped conductor on a substrate by means of an ultrasonically acting on the wire conductor installation device, wherein the wire conductor is applied in a direction transverse to the laying plane with ultrasound and the transverse movement of the laying device generated by the ultrasound application in the laying plane is superimposed on the ongoing installation movement.

In the DE 20 2004 010 227 U1 An electric coil is described in which preferably unpainted metal wire is used, there is a corresponding distance between the metal wires, each layer of a winding has its own electrical connections and the individual layers of the windings are insulated from one another.

In the DE 197 28 512 A1 For example, a transponder assembly is described that has a coil whose coil ends are connected to an integrated circuit that is deposited on a substrate. The coil is designed here as an air coil. Directly on the air coil, the substrate is attached to the integrated circuit.

The Air coil is formed here as a concentric wound flat coil.

Of the Invention is based on the object, a method for winding and laying at least one wire coil, by means of which one over the prior art faster Winding and laying process can be brought about.

About that In addition, a device for winding and laying of wire existing coils are presented, which is simple in construction and made a variety of coils in a short time can be.

These Task is solved on the one hand by a method for Winding and laying at least one coil of wire, in that at least one profiled in the region of at least one substrate Installation plate is positioned, a wire laying mechanism in profiled area of the installation plate winds the respective coil and the finished wound coil fed to the substrate becomes.

advantageous Further developments of the method according to the invention are the associated Verfahrensgemäßen Subclaims refer.

The The object is also achieved by a device for winding and laying at least one coil made of wire, including at least one installation plate, the wire side with a profile is provided, at least one wire laying mechanism, the Wire laid in the area of the profile to turns and at least an actuating means that the finished wound coil feeds to the substrate.

advantageous Further developments of the device according to the invention are the associated subject subclaims refer to.

To the winding of the coil can selbige about suitable tools, such as manipulators or the like of the installation plate lifted and fed to the substrate.

From particular advantage is, however, the installation plate to a defined Swing axle and the coil then the substrate supply.

The each installation plate is advantageously with one, at least connected to a drive means containing swivel body, the around a defined pivot axis from the field of wire laying position is pivotable in the region of the bobbin supply position.

ever According to embodiment of the subject invention, a chip module already in the course of wire laying on one of the installation panels be brought into operative connection with the wire ends. alternative There is also the option of chip modules on the substrate to position and the wire ends of the finished wound coil after being fed to the substrate with the chip module, for example by soldering, to connect.

The profile, which is provided in the region of the respective installation plate can be produced in many different ways. The simplest type is seen in a groove corresponding to the final shape of the coil, which by means of suitable processing methods is introduced in the laying area of the respective installation plate. It is also conceivable to provide an elevation, for example in the manner of a pyramid, and to wind the wire from top to bottom, so that after the coil has been deposited on the substrate, the turns are then inserted into one another.

In Dependence on the application of the wound coil the expert will choose the appropriate type of profiling.

Should the profile is formed for example by a circumferential groove, It makes sense to wire that wound to several turns is to fix on the respective laying plate. Another Thought of the invention according to the wire is in Area of trained as a groove profile by negative pressure on the respective installation plate, respectively within the groove, fixed. For this purpose, intake ports can be inserted into the intake manifold in the respective laying plate are introduced.

Consequently It is possible to be almost simultaneous in one part of the facility to wind a wire to a coil (and if necessary already here to connect with a chip) while a finish-wound coil the example, passing substrate is supplied.

For Different applications are also different Wires for use. Starting with a bare wire up towards (partially) insulated wires are all kinds of metallic ones Wires for making coils of different geometrical Gestalt conceivable, which also by alternative methods on the Substrate can be attached.

The Substrate itself can z. B. be self-adhesive, so that the ejector pins press the respective coil into the adhesive layer.

Of Furthermore, special adhesive dots on the substrate be provided, on which the respective coil through the cantilever pins is pressed.

About that In addition, there is the possibility of the coil by means of heat and / or ultrasound attached to the substrate.

Of the Swivel body, with one, two or depending on the design a plurality of laying plates are brought into operative connection can, includes the necessary drive means, on the one hand the To create negative pressure for the wire laying and on the other hand the actuating means to a finished coil, after cancellation the negative pressure to supply to the respective substrate. ever after the design of the swivel body can also the pivot means are provided in the region of the device. Provided this is not desired, the pivot axis can be extended and brought into operative connection with corresponding pivoting means become.

Of the Subject of the invention is based on an embodiment shown in the drawing and is described as follows. It demonstrate:

1 to 4 Schematic diagram of a flow chart for winding and laying coils;

5 Partial view of the installation plate according to 1 ;

6 Partial view of the installation plate according to 2 ;

7 Partial representation of a coil connected to a chip.

The 1 to 4 show as a schematic diagram of a possible flow chart of the method according to the invention. Shown in this example is a continuous, band-shaped substrate 1 , With the arrow is the transport direction of the substrate 1 indicated. In this example, a definable intervals a chip modules 2 applied. The inventive device 3 is formed in this example by two opposite laying plates 4 . 5 , each with a base plate 6 . 7 with a swivel body 8th in operative connection. With the reference numerals 9 and 10 Are possible pivoting or rotating axes indicated.

For better illustration is only a single from swivel body 8th , Base plates 6 . 7 and installation panels 4 . 5 formed device shown.

However, the scope of protection also includes that a common swivel body 8th with several adjacent or successively arranged upper and lower installation panels 4 . 5 is in active connection. The substrate 1 may also be formed as a bow, which is either stationary occupied with coils or moved analogous to the substrate.

One each installation plate 4 includes a profiled area 11 , which corresponds to the contour of the later, consisting of several turns coil. This profile 11 can be formed by groove-shaped depressions as well as by a combination of elevations and depressions. In this example, the profiled area 11 be formed by a groove. Above the respective installation plate 4 . 5 there is a wire laying mechanism 12 over which a wire 13 the profiled area 11 the laying plate 4 is supplied.

By doing that every one device 3 with two installation plates 4 . 5 is essentially simultaneously capable of laying the wire 13 in the profiled area 11 the laying plate 4 done while in the area of the installation plate 5 provided ready-wound coil 14 the substrate 1 in the area of the chip module 2 is supplied.

In 1 it can be seen that the wire laying mechanism 12 as the starting point of the coil to be wound in the direction of the groove end 15 to be led.

If a pivoting or turning operation of the installation plate 4 . 5 , respectively the swivel body 8th , not desired, can the finished wound coil 14 via suitable aids from the installation plate 4 . 5 delivered and the substrate 1 be supplied.

2 shows a partial winding of the wire 13 in the profiled area 11 , the end being 16 the groove 11 not yet with wire 13 is occupied. In this state, almost invisible here, in the area of the installation plate 5 provided coil 14 the substrate 1 fed. The wire to be wound 13 is due to negative pressure in the groove 11 fixed. Appropriate suction 11 ' are only indicated here. Used here only hinted if necessary, heated ejector pins 17 , About likewise not shown, in this example pneumatically acting drive elements, the installation plates 4 . 5 in the in 2 shown opened position to be extended. Only indicated guide elements between swivel body 8th and installation plate 4 . 5 are denoted by the reference numeral 18 Mistake.

In 3 it can be seen that in the area of the installation plate 4 the wire laying mechanism 12 the wire 13 has wrapped so far that same now also the end 16 the groove 11 has reached and now a ready coil 14 is present. In this schematic diagram it can be seen that in the area of the installation plate 5 the negative pressure was lifted and the in 2 indicated ejector pins 17 the finished coil 14 the substrate 1 respectively. Because the ejector pins 17 heated in this example, the finished coil 14 on the substrate 1 be attached by pressure and heat. As already mentioned, the chip modules are 2 at a defined distance a on the passing substrate 1 arranged. One each coil 14 will with their ends 19 . 20 in the area of a chip module 2 the substrate 1 fed. In the further manufacturing process are the ends 19 . 20 the coil 14 by suitable methods with the associated chip module 2 , for example, by soldering or the like, connected.

4 shows one of the possible pivot directions of the device 3 , In this example, the device should 3 around the pivot axis 10 from the field of wire laying mechanism 12 in the area of the substrate 1 be panned.

5 shows a partial view of the device 3 , for example, the installation plate 4 , Recognizable is the Nutende 15 as a starting point for laying the wire, which can not be seen here, the profile formed as a groove 11 , the ejector pins 17 as well as intake ducts 11 ' , the wire not visible here in the course of the winding process in the region of the groove 11 fix.

6 shows a partial view of the installation plate 4 in the 2 illustrated state. Visible is that the wire 13 , starting from the end of the groove 15 , was wrapped in the direction of the arrow. Depending on the design of the later coil becomes the wire 13 in several turns 21 wound. About the intake ducts 11 ' becomes the wire 13 in the area of the groove 11 fixed so that the turns 21 to lie exactly next to each other.

Alternatively, of course, it is also possible to dispense with the suction by means of negative pressure and corresponding tracks (grooves 11 ) parallel to each other, for example by lasers, in the installation plate 4 contribute. It is also conceivable, a pyramid-like survey (not shown) on the installation plate 4 on which the wire 13 is wound from top to bottom. As can be seen in this enlarged view, the groove end 16 not yet with the wire 13 busy.

7 shows a partial view of a section of the substrate 1 , Recognizable is a single chip module 2 , the sink 14 , the wire ends 19 . 20 as well as the contact points 22 . 23 over which the chip module 2 with the coil 14 connected is. The finished component 2 . 14 can now be supplied for example as a transponder its further use.

As in 1 indicated, in the directions x and y several facilities 3 next to or behind each other on a correspondingly long or wide swivel body 8th be positioned to in this way a corresponding number of coils 14 in the area of the respective installation plate 4 to wind, respectively in the area of the respective installation plate 5 the substrate 1 supply.

Are not heated ejector pins 17 desired, adhesive dots (not shown) may be provided on the substrate, on which the respective coil 14 is filed. Also conceivable is the use of ultrasound to the coil 14 on the substrate 1 to fix.

1

substratum

2

chip module

3

Facility

4

installation plate

5

installation plate

6

baseplate

7

baseplate

8th

pivoting body

9

swivel axis

10

swivel axis

11

profiled Area

11 '

suction (Intake passage)

12

Wire-embedding mechanism

13

wire

14

Kitchen sink

15

groove end

16

groove end

17

ejector

18

guide means

19

wire end

20

wire end

21

convolution

22

contact point

23

contact point

a

distance

x

direction

y

direction

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - DE 19741984 A1 [0002]
• - DE 19619771 A1 [0003]
• - DE 202004010227 U1 [0004]
• DE 19728512 A1 [0005]

Claims (29)

Method for winding and laying at least one of wire ( 13 ) existing coil ( 14 ) in the region of at least one substrate ( 1 ) at least one profiled laying plate ( 4 . 5 ), a wire laying mechanism ( 12 ) in the profiled area ( 11 ) of the installation plate ( 4 . 5 ) the respective coil ( 14 ) and the finished coil ( 14 ) the substrate ( 1 ) is supplied. Method according to claim 1, characterized in that the coil ( 14 ) including installation plate ( 4 . 5 ) in the region of the substrate ( 1 ) and the finished wound coil ( 14 ) the substrate ( 1 ) is supplied. Method according to claim 1 or 2, characterized in that the laying plate ( 4 . 5 ) in the region of the substrate ( 1 ) rotated and the coil ( 14 ) the substrate ( 1 ) is supplied. Method according to one of claims 1 to 3, characterized in that the respective laying plate ( 4 . 5 ) with a drive means containing swivel body ( 8th ) and the laying plate ( 4 . 5 ) about a defined pivot axis ( 9 . 10 ) in the region of the substrate ( 1 ) is pivoted. Method according to one of claims 1 to 4, characterized in that the wire ( 13 ) to form a transponder in the course of its winding process with a chip module ( 2 ) is brought into operative connection. Method according to one of claims 1 to 4, characterized in that the coil ( 14 ) to form a transponder on the substrate ( 1 ) with a chip module ( 2 ) is brought into operative connection. Method according to one of claims 1 to 6, characterized in that each swivel body ( 8th ) with at least two installation plates ( 4 . 5 ) is brought into operative connection. Method according to one of claims 1 to 7, characterized in that the wire ( 13 ) in the course of the winding process of the coil ( 14 ) and during the pivoting process of the pivoting body ( 8th ) on the respective laying plate ( 4 . 5 ) is fixed. Method according to one of claims 1 to 8, characterized in that the fixing of the wire ( 13 ), respectively the coil ( 14 ), on the respective laying plate ( 4 . 5 ) is brought about by negative pressure. Method according to one of claims 1 to 9, characterized in that in the course of the winding process of the wire ( 13 ) to a coil already a finished coil ( 14 ) the substrate ( 1 ) is supplied. Method according to one of claims 1 to 10, characterized in that the respective with the swivel body ( 8th ) provided laying plate ( 4 . 5 ) above a movable substrate ( 1 ) is arranged. Method according to one of claims 1 to 11, characterized in that in the region of the swivel body ( 8th ) Actuating means ( 17 ) for storing the respective coil ( 14 ) on the respective substrate ( 1 ) are provided, after the release of the negative pressure, the finished coil ( 14 ) on the substrate ( 1 ) lay down. Method according to one of claims 1 to 12, characterized in that the coil ( 14 ) in the region of on the substrate ( 1 ) is deposited adhesive dots. Method according to one of claims 1 to 12, characterized in that the coil ( 14 ) by heat and / or ultrasound influence on the substrate ( 1 ) is attached. Method according to one of claims 1 to 14, characterized in that in the region of the laying plates ( 4 . 5 ), respectively of the swivel body ( 8th ), Ejector pins ( 17 ) are provided, over which the coil ( 14 ) on the substrate ( 1 ) is applied. Method according to one of claims 1 to 15, characterized in that the ejector pins ( 17 ) are heated in the course of the bobbin feeding operation, so that the coil ( 14 ) on the substrate ( 1 ), in particular in the area of a chip module provided there ( 2 ), is attached. Device for winding and laying at least one of wire ( 13 ) existing coil ( 14 ), including at least one installation plate ( 4 . 5 ), the wire side with a profile ( 11 ), at least one wire laying mechanism ( 12 ), the wire ( 13 ) in the area of the profile ( 11 ) to turns ( 21 ) and at least one actuating means ( 17 ), the finished wound coil ( 14 ) the substrate ( 1 ) feeds. Device according to claim 17, characterized in that the laying plate ( 4 . 5 ) about a defined axis ( 9 . 10 ) is rotatable or pivotable. Device according to claim 17 or 18, characterized in that the respective laying plate ( 4 . 5 ) at least one, drive means and actuating means ( 17 ), Schwenkkör by ( 8th ) is in operative connection, which together with the respective installation plate ( 4 . 5 ) about a defined pivot axis ( 9 . 10 ) is pivotable from a wire winding position to a bobbin feeding position. Device according to one of claims 17 to 19, characterized in that the pivoting body ( 8th ) on its two end faces with at least one installation plate ( 4 . 5 ) is provided. Device according to one of claims 17 to 20, characterized in that the drive means by pneumatically or hydraulically acting cylinders are formed. Device according to one of claims 17 to 21, characterized in that the pivot means by a rotating or reversing drive are formed. Device according to one of claims 17 to 22, characterized in that the actuating means ( 17 ) are formed by particular heatable ejector pins. Device according to one of claims 17 to 23, characterized in that in the profiled area ( 11 ) of the respective installation plate ( 4 . 5 ) a receiving area for a chip module ( 2 ) is provided. Device according to one of claims 17 to 24, characterized in that the substrate ( 1 ) with at least one chip module ( 2 ), in the area of which the finished coil ( 14 ) the substrate ( 1 ) can be fed. Device according to one of claims 17 to 25, characterized in that the wire to be laid ( 13 ) in the profiled area ( 11 ) of the respective installation plate ( 4 . 5 ) is fixable. Device according to one of claims 17 to 26, characterized in that the wire ( 13 ) via intake ducts ( 21 ) by means of negative pressure in the profiled area ( 11 ) of the respective installation plate ( 4 . 5 ) is fixable. Device according to one of claims 17 to 27, characterized in that a plurality of installation plates ( 4 . 5 ) in the region of both end faces of a common pivoting body ( 8th ) are provided next to or behind each other and the wire laying and the feeding of the finished coil ( 14 ) in the region of the substrate ( 1 ) takes place substantially simultaneously. Device according to one of claims 17 to 28, characterized in that a common pivoting body ( 8th ) several side (y) or behind (x) provided laying plates ( 4 . 5 ), which together around the pivot axis ( 9 . 10 ) of the swivel body ( 8th ) are feasible from the wire laying position in the Spulenzuführposition.