CN111863656A - Laying device - Google Patents
Laying device Download PDFInfo
- Publication number
- CN111863656A CN111863656A CN201910347508.1A CN201910347508A CN111863656A CN 111863656 A CN111863656 A CN 111863656A CN 201910347508 A CN201910347508 A CN 201910347508A CN 111863656 A CN111863656 A CN 111863656A
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- CN
- China
- Prior art keywords
- induction coil
- induction
- substrate
- induction coils
- laying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000006698 induction Effects 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 11
- 238000001179 sorption measurement Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Induction Heating (AREA)
Abstract
The application belongs to the technical field of photovoltaic module processing, and discloses a laying device which is characterized by comprising a plurality of induction coils and a control device, wherein each induction coil is electrically connected with a power supply, and the induction coils are arranged according to the shape of a substrate; the substrate is placed on the induction coil; the control device controls the attaching degree of the piece to be laid and the substrate by controlling the connection time of each induction coil and a power supply and the current input into the induction coils. Through making induction coil circular telegram in proper order, can make and wait to lay the piece and laminate gradually on the base plate, avoided waiting to lay the piece and appear the fold, need not artifical secondary and smooths, improved device work efficiency.
Description
Technical Field
This paper relates to photovoltaic module processing technology field, especially relates to a laying device.
Background
In the manufacturing process of the photovoltaic module, before laminating by a laminating machine, the flexible solar chip needs to be laid on the substrate. When the substrate is a curved surface with a certain radian, the flexible solar chip is difficult to completely attach to the curved surface by attaching the flexible solar chip to the curved substrate along with the shape in the laying process of the photovoltaic module because the flexible solar chip has a certain deflection. At present, the following two methods are mainly used for laying and attaching the curved surface of the photovoltaic module: one method is to manually lay the solar chip on the curved substrate, which wastes time and labor, and causes larger size error due to the rebound of the chip during pressing; the other method is to lay the flexible solar chip on the curved-surface substrate through the magnetic chuck tool, the method improves the laminating rate of the solar chip, but the magnetic force of the magnetic chuck cannot be adjusted, so that the chip is folded in the laying process, and the chip needs to be flattened manually for the second time.
Disclosure of Invention
In order to solve the not enough of above-mentioned prior art, this application embodiment provides a curved surface laying device, through the magnetic induction intensity that magnetic chuck was adjusted to the electromagnetic induction utility, control solar chip by one end to the other end adsorb gradually the laminating curved surface base plate on, improved solar chip's the effect of laying.
The laying device comprises a plurality of induction coils and a control device, wherein each induction coil is respectively connected with a power supply in an on-off mode, and the placement position of each induction coil is determined according to the shape of a substrate; the substrate is placed on the induction coil; the control device controls the attaching degree of the piece to be laid and the substrate by controlling the connection time of each induction coil and a power supply and the current input into the induction coils.
Optionally, the induction coil is a linear induction coil.
Optionally, each of the induction coils is arranged in parallel.
Optionally, each of the induction coils is fixed to a fixing structure through a fulcrum, and the fixing structure is disposed at two end portions of each of the induction coils.
Optionally, the fulcrum connecting line of each induction coil is in a wave shape, and the fulcrum is located at a peak and a trough of the wave shape.
Optionally, each induction coil is provided with a plurality of buffer rings distributed at intervals.
Optionally, the induction coils are sequentially arranged along a first direction, and the induction coils are sequentially communicated with the power supply along the first direction.
Optionally, the clamping device further comprises a clamping device, the clamping device comprises a driving piece and an adsorption part, the driving piece drives the adsorption part to move, and the adsorption part is used for adsorbing the to-be-laid piece and the substrate.
Optionally, the suction part comprises at least one electromagnetic chuck.
Another embodiment of the present application provides a laying method, in which, with the laying apparatus according to any one of the above, the control device controls the energization time of each induction coil and the current magnitude of the input coil, and sequentially energizes the induction coils in the first direction after energization is started, and the energization time of each induction coil is 0.1 to 2 seconds.
Advantageous effects
The application provides a laying device can control each induction coil live time and input induction coil's electric current size, the circular telegram is started the back, is right in proper order along first direction induction coil circular telegram to the laminating process and the laminating degree of piece and base plate are treated to the control. Through making induction coil circular telegram in proper order, can make and wait to lay the piece and laminate gradually on the base plate, avoided waiting to lay the piece and appear the fold, need not artifical secondary and smooths, improved device work efficiency.
Drawings
The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.
FIG. 1 is a schematic view of a laying device according to an embodiment of the present application;
FIG. 2 is a left side view of the laying apparatus of an embodiment of the present application;
FIG. 3 is a schematic view of a control device coupled to an applicator device in accordance with an embodiment of the present application;
fig. 4 is a schematic structural view of a grasping apparatus according to an embodiment of the present application.
Reference numerals:
1-a scaffold; 2-an induction coil; 3-a fixed structure; 31-fulcrum; 4-a buffer ring;
5-a gripping device; 51-an adsorption part; 52-a drive member; 6-control device.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings of the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the application without any inventive step, are within the scope of protection of the application.
As shown in fig. 1, wherein the direction of the arrow is a first direction, one embodiment of the present application provides an application device, which is mainly used for applying an element to be applied on a substrate, especially a substrate with a certain curvature, the application device includes a plurality of induction coils 2, a core disposed in the induction coils 2, and a control device 6, each induction coil 2 is electrically connected with a power supply, and the placement position of each induction coil 2 is determined according to the shape of the substrate; the substrate is placed on the induction coil 2; the control device 6 controls the attaching degree of the piece to be laid and the substrate by controlling the connection time of each induction coil 2 and a power supply and the current input into the induction coils 2.
The laying device in this embodiment can control the energizing time of each induction coil 2 and the magnitude of the current input to the induction coil 2, and sequentially energize the induction coils 2 in a first direction (i.e., the direction indicated by the arrow in fig. 1) after the energization is started, thereby controlling the bonding process and the bonding degree of the member to be laid and the substrate. Through making induction coil 2 circular telegram in proper order, can make and wait to lay the piece and laminate gradually on the base plate, avoided waiting to lay the piece fold to appear, need not artifical secondary and smooths, improved device work efficiency.
In this embodiment, each of the induction coils 2 is fixed to a fixing structure 3 through a fulcrum 31, and the fixing structure 3 is disposed on the bracket 1. Each of the illustrated induction coils 2 fixed to the fixed structure 3 is a linear induction coil 2, and each of the illustrated induction coils 2 is disposed parallel to each other, but it should be understood that the parallel arrangement here is only that two induction coils 2 are parallel to each other, but each of the illustrated induction coils 2 is not necessarily in the same plane. In practice, the position of each induction coil 2 should be determined according to the shape of the substrate.
In this embodiment, the substrate is ultra-white curved glass, and the ultra-white curved glass is pre-coated with a POE film; the piece to be laid is a solar cell chip having a stainless steel substrate.
As shown in fig. 2, in an embodiment of the present application, since the substrate is a curved glass, and particularly preferably a curved glass in a wave shape, in order to make the solar chip string better fit on the curved glass, a connecting line of the fulcrums 31 of each of the induction coils 2 is set in a wave shape, and the fulcrums 31 are located at the positions of the peaks and the troughs of the wave shape.
In one embodiment of the present application, each of the induction coils 2 is provided with a plurality of buffer rings 4 distributed at intervals. The buffer ring 4 is a silica gel O-shaped ring. The induction coil 2 is provided with the silica gel O-shaped ring, so that not only can unstable support caused by machining errors of the curved glass be avoided, but also the curved glass and the electromagnetic coil can be prevented from being worn due to extrusion contact.
In another embodiment of the present application, as shown in fig. 3, each induction coil 2 is connected to the input power source through a wire and is connected to the control device 6, the controller may control the starting time of the induction coils 2 and the size of the input coil to adjust the magnetic force received by the member to be laid, each induction coil 2 is arranged along a first direction, each induction coil 2 is sequentially energized along the first direction, the starting time difference of the induction coils 2 is 0.1-2 seconds, and the energization time is adjusted as needed. Wherein, the electromagnetic coil is an electromagnetic polymerization conductor; the control device 6 is a PLC controller.
As shown in fig. 4, in another embodiment of the present application, the apparatus further includes a clamping device 5, and the clamping device 5 is configured to clamp the ultra-white curved glass and the solar cell chip. The clamping device comprises a driving part 52 and an adsorption part 51, and the driving part 52 drives the adsorption part 51 to move. The solar cell chip is adsorbed by the adsorption part 51, so that the solar cell chip can be prevented from being scratched by a mechanical structure. The driving element 52 is a mechanical arm which can drive the adsorption component to move in the horizontal plane and can also drive the adsorption part 51 to move in the vertical plane, so that the adsorption part 51 can be quickly and accurately positioned to a specified position. Optionally, the suction part 51 includes at least one electromagnetic chuck.
Specifically, the suction part 51 includes a base and at least one suction cup disposed on the base, a telescopic part is connected between the suction cup and the base, and the size of the suction cup protruding out of the base can be adjusted by the telescopic part. Therefore, the sucker can be stretched according to different requirements, so that the idle sucker can be retracted, and the interference of the idle sucker to other structures is avoided.
In order to facilitate the application of the piece to be laid, the suction cup is made of an electromagnet, and the suction cup can be connected with a power supply in an on-off manner. When the sucker is communicated with a power supply, magnetism is generated on the sucker, so that a piece to be laid can generate suction, and the piece to be laid can be adsorbed on the sucker; when the sucker is disconnected with the power supply, the magnetism on the sucker disappears, and the sucker and the piece to be laid can be conveniently separated.
In another embodiment of the present application, a laying method is further included, in which, with any one of the laying apparatuses described above, the control device 6 controls the energization time of each induction coil 2 and the current magnitude of the input coil, and after the energization is started, the induction coils 2 are sequentially energized in the first direction, and the energization time of each induction coil 2 is 0.1 to 2 seconds.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. The laying device is characterized by comprising a plurality of induction coils (2) and a control device (6), wherein each induction coil (2) is respectively connected with a power supply in a switching mode, and the placement position of each induction coil (2) is determined according to the shape of a substrate; the substrate is placed on the induction coil (2); the control device (6) controls the attaching degree of the piece to be laid and the substrate by controlling the time for connecting each induction coil (2) with a power supply and the current input into the induction coils (2).
2. Laying device according to claim 1, wherein said induction coil (2) is a linear induction coil (2).
3. The laying device as claimed in claim 2, wherein said induction coils (2) are arranged in parallel.
4. An applicator device according to claim 3, wherein each of said induction coils (2) is fixed to a fixed structure (3) by means of a fulcrum (31), said fixed structure (3) being provided at both ends of each of said induction coils (2).
5. Laying device according to claim 4, wherein said fulcrum (31) of each induction coil (2) is connected in a wave shape, said fulcrum (31) being located at the position of the peaks and valleys of said wave shape.
6. Laying device according to claim 1, wherein each induction coil (2) is provided with a plurality of spaced-apart buffer rings (4).
7. An applicator device according to claim 3, wherein said induction coils (2) are arranged in series along a first direction, and wherein said induction coils (2) are in series in said first direction in communication with said power source.
8. The laying device according to claim 1, further comprising a gripping device (5), said gripping device comprising a driving member (52) and a suction portion (51), said driving member (52) moving said suction portion (51), said suction portion (51) being adapted to suck said element to be laid and said substrate.
9. The laying device according to claim 1, wherein said suction portion (51) comprises at least one electromagnetic chuck.
10. Laying method, characterized in that, with the laying device of any one of claims 1-9, the control device (6) controls the time of energization of each induction coil (2) and the magnitude of the current of the input coil, after the energization is started, the induction coils (2) are sequentially energized in a first direction, and the energization time of each induction coil (2) is 0.1-2 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910347508.1A CN111863656A (en) | 2019-04-28 | 2019-04-28 | Laying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910347508.1A CN111863656A (en) | 2019-04-28 | 2019-04-28 | Laying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111863656A true CN111863656A (en) | 2020-10-30 |
Family
ID=72964908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910347508.1A Pending CN111863656A (en) | 2019-04-28 | 2019-04-28 | Laying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111863656A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101306566A (en) * | 2008-06-25 | 2008-11-19 | 江苏大学 | Eelectromagnetic control process and device for blank holder pressure |
| DE102009022427A1 (en) * | 2009-05-22 | 2010-11-25 | Melzer Maschinenbau Gmbh | Method for winding and shifting electrical coil, involves winding coil within profiled region of shifting plates by wire shifting device, and supplying finished wound coil to substrate that is designed as self adhesive |
| DE102011076462A1 (en) * | 2011-05-25 | 2012-11-29 | Aci-Ecotec Gmbh & Co. Kg | Method for laying adhesive tape for electrically conductive contact strips of thin-film photovoltaic solar cell module, involves replacing tape reel by supply station in which laying head with empty tape reels are stored |
| DE102011076900A1 (en) * | 2011-06-01 | 2012-12-06 | Aci Ecotec Gmbh | Method for moving electrical conductive cell contact tapes to e.g. photovoltaic thin layer solar cell modules, involves cutting-off tapes in initial position of head unit, so that renewed release of tapes is carried-out over moving length |
| CN103586324A (en) * | 2013-10-30 | 2014-02-19 | 华中科技大学 | Electromagnetic internal stress shape adjusting method for metal plate |
| CN103894468A (en) * | 2014-04-02 | 2014-07-02 | 华中科技大学 | Material fluidity control method for metal plate forming |
| CN104597534A (en) * | 2015-02-16 | 2015-05-06 | 杭州清渠科技有限公司 | Controllable compound-eye lens array and manufacturing method thereof |
| CN107584001A (en) * | 2017-10-11 | 2018-01-16 | 华中科技大学 | The electromagnetic forming method and device of a kind of metal sheet |
| CN108807599A (en) * | 2018-07-04 | 2018-11-13 | 汉能移动能源控股集团有限公司 | Laying device |
-
2019
- 2019-04-28 CN CN201910347508.1A patent/CN111863656A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101306566A (en) * | 2008-06-25 | 2008-11-19 | 江苏大学 | Eelectromagnetic control process and device for blank holder pressure |
| DE102009022427A1 (en) * | 2009-05-22 | 2010-11-25 | Melzer Maschinenbau Gmbh | Method for winding and shifting electrical coil, involves winding coil within profiled region of shifting plates by wire shifting device, and supplying finished wound coil to substrate that is designed as self adhesive |
| DE102011076462A1 (en) * | 2011-05-25 | 2012-11-29 | Aci-Ecotec Gmbh & Co. Kg | Method for laying adhesive tape for electrically conductive contact strips of thin-film photovoltaic solar cell module, involves replacing tape reel by supply station in which laying head with empty tape reels are stored |
| DE102011076900A1 (en) * | 2011-06-01 | 2012-12-06 | Aci Ecotec Gmbh | Method for moving electrical conductive cell contact tapes to e.g. photovoltaic thin layer solar cell modules, involves cutting-off tapes in initial position of head unit, so that renewed release of tapes is carried-out over moving length |
| CN103586324A (en) * | 2013-10-30 | 2014-02-19 | 华中科技大学 | Electromagnetic internal stress shape adjusting method for metal plate |
| CN103894468A (en) * | 2014-04-02 | 2014-07-02 | 华中科技大学 | Material fluidity control method for metal plate forming |
| CN104597534A (en) * | 2015-02-16 | 2015-05-06 | 杭州清渠科技有限公司 | Controllable compound-eye lens array and manufacturing method thereof |
| CN107584001A (en) * | 2017-10-11 | 2018-01-16 | 华中科技大学 | The electromagnetic forming method and device of a kind of metal sheet |
| CN108807599A (en) * | 2018-07-04 | 2018-11-13 | 汉能移动能源控股集团有限公司 | Laying device |
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| PB01 | Publication | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20220107 Address after: 510670 room 229, annex building, No. 111, Kexue Avenue, Huangpu District, Guangzhou City, Guangdong Province (office only) Applicant after: Hanwa Technology Co.,Ltd. Address before: Room 107, building 2, Olympic Village street, Chaoyang District, Beijing Applicant before: HANERGY MOBILE ENERGY HOLDING GROUP Co.,Ltd. |
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Application publication date: 20201030 |
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