CN103907125A - Improving coupling in and to rfid smart cards - Google Patents

Abstract

A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a "quasi-dipole". Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).

Description

Improve coupling in RFID smart card and the coupling with RFID smart card

Technical field

The present invention relates to " secure file ", for example E-Passport, electronics ID card and smart card, it has RFID(radio-frequency (RF) identification) chip or chip module, and operate with noncontact mode (ISO14443), comprise double nip (DI, or DIF) card, it also can operate at contact mode (ISO7816-2), and more specifically, relate to the coupling between the parts that improve in smart card, coupling between for example, card antenna (CA) in the module antenna (MA) being associated with chip module (CM) and the card (CB) that is positioned at smart card, thereby improve the interaction between external RF ID reader.

Background technology

For ease of discussing, RFID transponder generally includes substrate, is arranged on the RFID chip (or chip module) in substrate or in substrate and is arranged on the antenna in substrate or in substrate.Transponder can form the basis of secure file, and described secure file is for example E-Passport, smart card or I.D..

RFID chip (CM) can be touched formula (as ISO14443) operation with noncontact, can be maybe double nip (DIF) module, and it can be also with contact mode (as ISO7816-2) and noncontact mode work.The RF signal that chip module can provide from the external RF ID reader device by communicating with it, obtain energy.

Substrate can be called as " inlaying substrate " (for example, for E-Passport) or " card " (as for smart card), can comprise one deck of material or more multi-layered such as Polyvinylchloride (PVC), polycarbonate (PC), tygon (PE), the PET(PE that adulterates), the derivant of PET-G(PE), Teslin ^tM, the material such as paper or cotton/noil.Unless otherwise expressly stated, when in the time that this uses " inlaying substrate ", should comprise " card ", vice versa.

Chip module (can be lead frame posture chip module or expoxy glass cake core module.Glass epoxy module can be used the electroplates in hole to be metallized to interconnect with antenna in a side (contact side) or both sides.Unless otherwise expressly stated, when in the time that this uses " chip module ", should comprise " chip ", vice versa.

Antenna can be from engaging (or Self-adhesive) tinsel.A kind of classic method that antenna wire is mounted to substrate is: use the ultrasonic generator (ultrasonic tool) of vibration, supply with tinsel, and be inlaid into or affix to the surface of substrate by capillary action.The typical pattern of antenna is general rectangular, is coil (coiled piece) form of the plane (plane) with several circle coils.The two ends of antenna wire can be for example engage by hot pressing (TC) terminal (or terminal area, or contact pad) that is connected to chip module.Referring to, for example US6698089 and US6233818, it is incorporated to herein by reference.

The problem that antenna is included in to any layout in chip module (Anneta module) is: compared with more traditional antenna, main aerial region quite little (for example about 15mm x15mm), described traditional antenna can for example, by forming (in this case near counting circle (4 or 5) tinsel and be embedded in the periphery of the card of inlaying substrate or secure file, main aerial region can be about 80mm x50mm, and approximately 20 times large).In the time that antenna is included in chip module, the entity obtaining can be known as " Anneta module "

some prior aries

Patent below and open source literature are integrally incorporated in this literary composition by reference.

US5084699(Trovan, 1992) be entitled as " Impedance Matching Coil Assembly For An Inductively Coupled Transponder " (for the impedance matching coil assembly of inductive coupling transponder).Note Fig. 5.The coil that is used for the transponder of inductive power supply comprises primary coil (156) and secondary coil (158), and it is wound on around the same coil that forms feerod (160).Lead-in wire (162) lead-in wire (164) unsettled and secondary coil of primary coil is connected to the integrated identification circuit of transponder.

Be entitled as " Contactless Chip Card " (noncontact chip card) " US5955723(siemens, 1999) in a kind of data carrier structure that comprises semi-conductor chip is disclosed.Note Fig. 1.The first conductor circuit (2) is connected to semi-conductor chip (1), has at least one coil, and has the cross-sectional area about the same with the size of above-mentioned semi-conductor chip.At least one second conductor circuit (3) has at least one coil, region with the size of the size of described data carrier structure cross-sectional area about the same and formation and described the first conductor circuit (2) tertiary circuit (4) about the same.Tertiary circuit (4) and the first conductor circuit (2) and at least one the second conductor circuit (3) inductive coupling each other.

US6378774(Toppan, 2002) be entitled as " IC Module and Smart Card " (IC module and smart card).Note Figure 12 A, B and 17A, B.Smart card comprises the antenna and the IC module that transmit for noncontact.IC module had not only had the function of contact-type but also had had the function of non-contact type.IC module and antenna comprise respectively first and second pickup coil, and it is configured to close-coupled each other, and IC module and antenna are to be coupled with contactless state by transformer coupled.

The antenna (4) of Toppan comprises two similar coils (Fig. 4 a, 4b), and it is shown as on the opposite side that is arranged on substrate (5) in Figure 17 A, and a cardinal principle is on another.Pickup coil (3) is associated with described card antenna (4).Another pickup coil (8) is relevant to chip module (6).If the best is from Figure 12 A and 12B, these two pickup coils (3,8) have substantially identical size, and one is arranged on another substantially.

Be entitled as the US7928918(Gemalto of " Adjusting Resonance Frequency By Adjusting Distributed Inter-Turn Capacity " (" adjusting resonance frequency by adjusting capacitance profile between wire turn "), 2011) disclose a kind ofly for adjusting the method for resonance frequency of resonant circuit, the well-regulated pitch of its wire turn tool is to produce spuious line turn-to-turn capacitance.

US2009/0152362(Assa Abloy, 2009) " Coupling Device for Transponder And Smart Card With Such Device " (for coupling device of transponder and have smart card of this device) disclosed.Note Fig. 6.Coupling device is formed by continuous conduction path, described continuous conduction path has middle body (12) and two end parts (11,11'), middle body (12) is formed at least one the little coiled piece with transponder device inductive coupling, end sections (11,11') is respectively formed for the large coiled piece with reader device inductive coupling.

ASSA ABLOY illustrates, the outer end of the inner of outer end portion (11) and inner end portion (11') is connected with pickup coil (12).The outer end (13) of outer end portion (11) and the inner (13') of inner end portion (11') are not connected (loose).

US2010/0176205(SPS, 2010) be entitled as " Chip Card With Dual Communication Interface " (thering is the chip card of duplex interface).Note Fig. 4.Card (22) comprises that device can guide received Electromagnetic Flow for concentrating and/or amplifying electromagnetic device (18), particularly, and from the coil guiding towards the antenna (13) of microelectronic modules (11) by contactless chip card reader.For concentrated and/or amplify electromagnetic device (18) can be by the sheet metal formation that is arranged on the described microelectronic modules of reception (11) of (23) below the cavity of card body (22), also can be made up of antenna, this antenna is made up of at least one coil that is arranged on card (22) internal cavity (23) below reception microelectronic modules (11).

Also reference following file: CA2279176, DE4311493, US6142381, US6310778, US6406935, US6719206, US2009/0057414; US2010/0283690; And US2011/0163167.

Summary of the invention

A kind of double nip (DI) smart card (100), it comprises: chip module (CM); Module antenna (MA); Card (CB); With card antenna (CA), it has two coils (D, E) of anti-phase being connected to " accurate dipole ".Capacitive stub (B, C) is connected with the antenna structure (A) of module antenna (MA).Module antenna (MA) only with the coil overlaid of coil (D or E) of card antenna (CA).Card antenna can be formed by a continuous tinsel.Ferrite (156) shields module antenna (MA) from contact pad (CP), and strengthens the coupling between module antenna (MA) and card antenna (CA).

Double nip (DIF) smart card comprises:

The card CB of-general rectangular, it can be sandwich construction, is of a size of about 50mm x80mm,

-DIF chip module CM, is of a size of about 8mm x10mm, has metal contact pad (CP) in a side of chip module CM, has module antenna MA at the opposite side of chip module CM, and

-Ka antenna CA, its periphery around card CB extends, and has the overall dimensions identical with card CB cardinal principle.

Module antenna MA has several wire turns of flat coiled piece pattern, can be general rectangular circular, oval or that have four lateral edges, can have substantially identical overall dimension with chip module CM.Module antenna can comprise the tinsel element that is wound as pancake coil, or can be etched to pancake coil pattern by for example, conductive layer from insulation course (glass epoxy film or band).

Card antenna CA can comprise two coil-exterior loop D and be arranged on the interior loop E of exterior loop D inside.Interior loop E and exterior loop D have essentially identical length each other, and each have two ends (position) 7,8,9,10, and are inverted and are connected to " accurate dipole ".For example, the outer end of exterior loop D (7) are connected (or continuously) with the inner 10 of interior loop E.

Card antenna CA can be by traditional tinsel embedding inlay technique formation, or by being formed as conductive trace or pattern such as additive process or the technology that subtracts into outside the tinsel embedding inlay techniques such as technique.

Anneta module AM is provided so that its module antenna MA and interior loop E or exterior loop D one is overlapping, and not overlapping with another.Do not need independent pickup coil to make module antenna MA and card antenna CA coupling.The not isostructure of card antenna CA is disclosed, for example:

-Anneta module AM is arranged on the inside of card antenna CA, and module antenna MA is only overlapping with interior loop E.

-Anneta module AM can be arranged on the outside of card antenna CA, and its module antenna MA is only overlapping with interior loop E, or is arranged on card antenna inside, and its module antenna MA overlaps on exterior loop D.

-additional one or more Anneta module AM1, AM2 can be set, and be coupled with card antenna CA the function that provides additional

-Ka antenna CA can alternatively be formed as single coil, and it can be required more wire turn by " accurate dipole " (two anti-phase connections of coil D, E).

For slowing down the negative effect of metal contact pad CP to the coupling between module antenna MA and card antenna CA, can be plugged in Anneta module AM such as ferritic shielding element, between module antenna MA and the contact pad CP of chip module CM.

Module antenna MA can comprise " master " antenna structure A and two additional antenna structure B, C, and additional antenna structure is the capacitive stub extending from the end of antenna structure A.

Anneta module AM can be included in the secure file such as E-Passport front cover, smart card, ID card etc.

According to some embodiment of the present invention, smart card (100) comprising: Anneta module (AM), and it comprises: at least one chip or chip module (CM) and module antenna (MA); Card (CB), it has at least one surface and periphery; With card antenna (CA), its periphery around card (CB) is extended; It is characterized in that, at least a portion of described Anneta module (MA) is overlapping to be coupled with at least a portion of described card antenna under the situation of intermediary that there is no the pickup coil being associated with card antenna (CA) with at least a portion of described card antenna (CA).

According to some embodiment of the present invention, the method that the chip module (CM) with at least one noncontact mode is coupled to the card antenna (CA) in the card (CB) that is arranged on smart card comprises: in the Anneta module (AM) with chip module (CM), provide module antenna (MA), it is characterized in that: provide card antenna (CA) as " accurate dipole " antenna, described " accurate dipole " antenna has two coiler parts of connection inverting each other.Described card antenna (CA) has interior loop (E) and exterior loop (D); An and only overlaid of described module antenna (MA) and described interior loop and exterior loop (E, D).

In the time manufacturing contact and non-contact transaction card, use the pre-laminated array of special antenna configuration.In application, card antenna clip, between the skin and printed layers of smart card, with the Anneta module AM electromagnetic coupled of the implantation in card CB, obtains the read/write scope that is better than existing DIF technology.The method of this transceiving data is also the main improvement of the unreliable interconnection between the antenna to embedding in chip card module and card.

Safe printer can use existing smart card to grind and the EMV(Europay of the manufacture manufacture of chip module implant system and interface card compatibility, MasterCard and VISA).Some feature can comprise different sheet material design so that force of impression form, to the preferred read/write distance of each RFID chip, and excellent machinery and characteristic electron, and can easily combine with existing smart card manufacturing process.

Accompanying drawing explanation

With reference to disclosed embodiment, the non-limiting example of embodiment is shown with reference to accompanying drawing in detail.Accompanying drawing is schematic diagram normally.For illustrate clear for the purpose of, some elements in accompanying drawing may be exaggerated, other may be omitted.Although conventionally describe the present invention in the context of each exemplary embodiment, should be appreciated that this and do not mean that the present invention is limited to these specific embodiment, and the independent feature of various embodiment can mutually combine.

Figure 1A, 1B are according to the sectional view of DIF smart card of the present invention.

Fig. 1 C is the sectional view of the coil sub-component of the Anneta module (AM) according to smart card of the present invention.

Fig. 1 D is according to the sectional view of DIF smart card of the present invention.

Fig. 1 E is according to the sectional view of DI chip module of the present invention.

Fig. 2 A is according to the schematic diagram of Anneta module of the present invention (AM).

Fig. 2 B is the sectional view of the Anneta module (AM) of Fig. 2 A.

Fig. 3 A is according to the schematic diagram of the card antenna (CA) of smart card of the present invention.

Fig. 3 B is reaction part (electric capacity and the inductance) equivalent circuit diagram being associated with card antenna (CA) of Fig. 3 A.

Fig. 4 A is according to the schematic diagram (planimetric map) of the structure of the card antenna CA of some embodiment of the present invention.

Fig. 4 B is the sectional view of the structure shown in Fig. 4 A.

Fig. 4 C, 4D, 4E, 4F, 4G, 4H are according to the schematic diagram (planimetric map) of the structure of the card antenna CA of some embodiment of the present invention.

Fig. 4 I, 4J are according to the sectional view of the smart card with card antenna (CA) structure of some embodiment of the present invention.

Fig. 5 A, 5B, 5C, 5D, 5E, 5F, 5G, 5H be according to the not isostructure of the card antenna (CA) of some embodiment of the present invention and with the schematic diagram (planimetric map) of the interactional different device of one or more Anneta module AM.

Fig. 6 A is for being applied to mobile phone stickers (MPS) sectional view of the technology of mobile phone, and Fig. 6 B is according to the sectional view of the shielding element using in mobile phone stickers (MPS) is applied to the technology of mobile phone of some embodiment of the present invention.

Fig. 7 A, 7B, 7C, 7D are the skeleton views of the step related according to the method for the manufacture Anneta module (AM) of some embodiment of the present invention.

Fig. 7 E is the skeleton view of realizing the smart card of some embodiment of invention disclosed herein.Fig. 7 F is the skeleton view having through the part of the card CB of the antenna wire of the depression of Anneta module AM.

Embodiment

To describe various embodiment so that instruction of the present invention to be described, these embodiment should be interpreted as illustrative and nonrestrictive.Substantially the example that hereinafter, the transponder of secure file (it can be smart card or national I.D.) form can be used as the various features of embodiments of the invention disclosed herein is discussed.As apparent, many features and embodiment go for other form of (being easily incorporated to) secure file, as E-Passport.

Substantially hereinafter, by embedding the antenna structure that tinsel forms in substrate or card and discuss as example inlaying.But, should be understood that, antenna can use other technique except tinsel is embedded in substrate to form, for example following additive process or subtract into technique: print antenna structure, coil winding technology (for example disclosed in US6295720), be formed in independent antenna substrate and transfer to the antenna structure of inlaying in substrate (or its layer), the antenna structure forming from suprabasil conductive layer etching (comprising laser-induced thermal etching), is deposited on conductive material in the passage of substrate etc.

Description is below mostly under the situation of double nip (DI, DIF) smart card, mostly relates to its contactless operation.Many instructions of setting forth herein go for only having the E-Passport of Touchless manipulation pattern etc.Conventionally, any size of setting forth herein is all similar to, and material described in this paper to be intended to be exemplary.

By chip module CM is disconnected with the CA coupling of card antenna, eliminate " the weak contact " of the physical connection (described at US7980477) between chip module CM and card antenna.But, contacting and compare with direct physical, coupling is more difficult to realize.Therefore, between module antenna MA and card antenna CA, the efficient coupling of (thereby and between antenna of contactless reader) is very important

Card antenna CA(disclosed herein and further feature) can increase the valid function distance between Anneta module AM and the outside contactless reader with capacitive coupling and inductive coupling.It sends energy to Anneta module AM by concentrating at Anneta module AM position place the magnetic field being generated by reader antenna.

Figure 1A shows DIF smart card, comprising:

-DIF chip module CM, it is arranged on the downside of substrate or modular belt MT;

The contact pad CP of-some (for example 6), for realizing contact interface (ISO7816) in the top side of modular belt MT; And

-module antenna MA, it is arranged on the downside of modular belt MT, is conventionally formed by etched conductor or tinsel, has coiled piece (coil) pattern.

-substrate MT supports and causes interconnecting between chip module CM, contact pad CP and module antenna MA, and can be one side, an only side metallization, or two-sided, two sides is all metallized.

-chip module CM can be connected to modular belt MT in any suitable manner, as flip-chip (flip-chip) connects (going out as shown in Figure 1A) or wire-bonded (going out as shown in Figure 1B).

-as used herein, " chip module " comprises one or more bare semiconductor sheets (chip)." mixed type " chip module can comprise for the chip of contact interface with for chip of non-contact interface etc.The example of DIF chip solution can be with reference to US6378774(Toppan, 2002), one of them chip carry out contact function and another chip carry out the example of two chip solution of non-contact function can be with reference to US2010/0176205(SPS, 2010).

-chip module CM, chip belt MT, contact pad CP form " Anneta module " AM together with module antenna MA.

Smart card also comprises:

-substrate, for smart card, described substrate can be called as " card " CB.(for E-Passport, described substrate is " inlaying substrate ".）

-card antenna (CBA) (or being called for short card antenna CA) is shown as the periphery setting around card CB, normally has the rectangle of multiple wire turns, the form of plane coiled piece.

-as used herein, card CB is intended to contain any substrate of supporting card antenna CA and receiving antenna modules A M.Depression can be set in card for receiving antenna modules A M.

Some exemplary and/or approximate size, material and specifications can be:

-modular belt (MT): based on the band of epoxy resin, 60 μ m are thick

-chip module (CM): NXP SmartMx or Infineon SLE66, or other

-Anneta module (AM): 15mm × 15mm and 300 μ m are thick

-module antenna (MA): the copper tinsel of a few circle 50 μ m is approximately the size (size is not more than AM) of chip module CM.

-card CB: about 50mm × 80mm, 300 μ m are thick, polycarbonate (PC).Card and card antenna thereof significantly (as 20 times) are greater than chip module CM and module antenna MA thereof.

-Ka antenna CA:3-12 circle 112 μ m copper are from closing line, and ultrasound wave is embedded in card CB.

Can be laminated to card such as tectal extra play (not shown), to complete the structure of smart card.

Figure 1A show have for contact mode (ISO7316) via contact pad CP and chip module CM interact (electric power swap data are provided) contact contact read write line, and show and have for by the non-contact reader of card antenna CA and module antenna MA and the interactional antenna of chip module CM.

Figure 1B shows the general structure of (exploded view) DIF smart card 100, comprises

-glass epoxy substrate (MT) 102, it has several contact pads (CP) 104 at its top surface (as can be seen), manufactures the contact interface operating with the contact mode of external reader for " contact mode " in operation;

-several joint sheets 106 can be arranged on on 102 opposite face;

-before it, on (bottom, as directed) surface, there is the DIF chip module (CM) 108 of several (only illustrating two) joint sheet 110;

-module antenna (MA) 112, it comprises (for example) number circle tinsel, for example, have 3x8 structure (3 layers, every layer has 8 circles), and have two end 112a and 112b.

Chip module 108 can be mounted to the downside (as directed) with 102, and its contact pad 110 for example engages the pad of the selection that is connected to the joint sheet 106 on the downside (as observed) with 102 by traditional tinsel.For illustrate clear for the purpose of, two tinsel joint connections 114a and 114b are only shown.Alternatively, connect at least some, can, through being with 102 opening (not shown) is provided, be engaged to the downside of contact pad 104 with direct metal silk.If necessary, except the contact pad 104 for contact interface (ISO-7816), before with 102, (top) lip-deep metallization can comprise for end 112a, the 112b of link block antenna 112 and the region (not shown) of impact interconnection (wiring).

Module antenna 112 by its end 112a, 112b at the downside with 102 for example by thermo-compressed to two joint sheet 106, as shown in the figure.

The set of above-described element (normally modular belt 102, chip module 108 and module antenna 112) can be called as " Anneta module " 118.

The card (CB) 120 of smart card has the larger card antenna (CA) 122 of the inner side annex that is embedded in its periphery.Module antenna 112 is coupled (electromagnetic coupled) with card antenna 122, to improve the coupling of smart card and outside contactless reader.Card antenna 122 can use conventional ultrasound tinsel embedded technology to be formed in card 120.

For strengthening the coupling between module antenna 112 and card antenna 122, the material (as ferrite) that shows electromagnetic coupled character can be used as film 124 with any required pattern setting on the surface of card 120, or can be used as particle 126 with any required combination of patterns or be embedded in card 120, or both (film and particles) have both at the same time.

Use ferrite to be discussed in this as the example of the material with high electromagnetism magnetoconductivity to strengthen coupling or to shield (preventing) coupling as material, it is often combined with antenna with various forms.Referring to for example US5084699(Trovan).

the coil antenna sub-component of DIF chip module

Fig. 1 C shows the structure of the coil sub-component 130 of smart card (the DIF smart card 100 of for example Figure 1B).The wire coils 112 of module antenna (MA) can be used any suitable coil winding device to reel, and is arranged on film supporting course 132.

Module antenna MA can comprise several circle tinsels, for example, have 3x8 structure (3 layers, every layer has 8 circles), and have two end 112a and 112b.Metal wire can have the diameter that is about 80 μ m, and the module antenna 112 obtaining has about 240 μ m(3 × 80 μ gross thickness (or height) m).Module antenna MA can have the form of ring (cylinder), the about 9mm of internal diameter (ID) of ring, and the external diameter of about 10mm.

Film supports layer 132 can be butyronitrile film, and 60 μ m are thick, and has the monnolithic case size of about 10-15mm × 10-15mm, or module antenna MA(is mounted thereon) approximately twice (overall dimensions in a dimension) large.

Central opening 134 is set through film 132, the position general alignment of itself and module antenna MA, and have and the inner diameter, ID large diameter about the same of module antenna MA.Opening 134 can form by punching operation.In the time that Anneta module AM is assembled, opening 134 for example, engages for holding chip module (108) and tinsel thereof.

Can two opening 136a and 136b(and central opening 134 be set by film 132 forms in same punching operation), to allow antenna wire end 112a and 112b to be engaged to respectively modular belt MT(102) on joint sheet (106, Figure 1B).

Disengaging lining 138 can be arranged on a side of film 132, a for example side relative with module antenna MA.Central opening 134 can or can not extend through disengaging lining 138 and extend, and departing from lining 138 can be paper, and its thickness is approximately 60 μ m.

Module antenna MA can be fixed to tread support membrane 132 with bonding agent (not shown), and the structure obtaining can be called as " module antenna sub-component ".Can prepare multiple module antenna sub-components, it can be arranged in sub-component array (m x n row and column) or be positioned at continuous band (a long row) upper, to be for example assembled to modular belt MT by lamination subsequently.(assembly shown in Fig. 1 C is inverted, is mounted to the modular belt 102 shown in Figure 1B).Then, chip module (108) can be installed to modular belt (102) and as the following describes, be connected to the joint sheet (106) on modular belt by the central opening in module antenna MA.

Because it has metal gasket (and interior conductive through hole) on two sides as using " two-sided " modular belt MT(why to be called as " two-sided " modular belt) substitute, modular belt can be " one side ", and only a side has for example for contact pad CP metallide.For one-side band, opening extends to the below of the rear side of contact pad CP from the chip module side of band, for being connected in this.(also can realize in this way the back side of exposing that module antenna is connected to the pad of the selection of contact pad.）

another DIF smart card

Fig. 1 D shows exemplary double nip (DIF) smart card 140, wherein DIF chip module (CM) 148 is mounted to interconnect substrate (MT) 142, in one surface, (top has the contact pad (CP) 144 of contact interface to described interconnect substrate (MT) 142 as shown).Coil antenna (MA) 152 is set to contactless pattern, and is connected to chip module CM by substrate MT.Module antenna MA conventionally the side relative with contact pad CP of chip module CM (bottom, as shown in the figure) on.Substrate MT, chip module CM, contact pad CP and coil antenna MA(and ferrite component 156, be described below) can be called as " Anneta module " (AM) together.

Anneta module (AM) is installed to the card (CB) 160 with card antenna (CA) 162.Under noncontact mode, module antenna (MA) 152 interacts with card antenna (CA) 162, and card antenna (CA) 162 interacts with the antenna (not shown) of external reader (not shown) then.Some details may comprise:

-this Anneta module and module antenna are relatively little, as 10mm × 10mm

-card and card antenna are relatively large, as 50mm x80mm

-module antenna can be located substantially on card antenna (as shown in FIG.) directly over, card antenna remainder can be away from chip module and module antenna

-Ka antenna can be made with conductive trace or analog, in other words, uses the technology embedding outside tinsel (the simplest " traditional " technology).

The contact pad CP of the top side of DIF module is metal, thereby can make the RF signal attenuation of transmitting between module antenna MA and card antenna CA.In order to alleviate the coupling that decays and strengthen (finally between chip module and external reader) between module antenna and card antenna, ferrite component (FE) 156 can be set up (to be planted, insert) between chip module and module antenna,-or, in other words, between contact pad (CP) 144 and module antenna (MA) 152.

Ferrite component FE can cover at least 50% the region in the region that limited or limited by contact pad by chip and antenna, this region has passive electromagnetic element, this passive electromagnetic element can strengthen the electromagnetic coupled between module antenna MA and card antenna CA, make signal intensity (for the signal transmitting in any direction between module antenna MA and card antenna CA) increase for example at least+3dB, coverage between smart card 140 and outside contactless card reader (Figure 1A) is also increased thereupon, for example make read/write (and collection of energy) ability be increased to 10 centimeters of approximately 6 – from approximately 3 – 5cm.

Ferrite component 156 can be the independent layer of material, for example, see http://www.kitagawa.de/index.php id=8 & L=1 from TDK company or Kitagawa().Ferrite component 156 can be sprayed at the lower surface of chip module before installation module antenna.Ferrite component 156 can be continuous (or continuing, except allowing by ferrite component, Anneta module to be connected to the opening of chip module), or can be discontinuous (for example, grid or sieve).As shown in the figure, opening 158 can be set in ferrite component/layer 156, for chip module CM is installed to substrate 142.Ferrite component 156 can have smooth surface, can be maybe ripple, or is formed with " corner reflector " pattern and is used for strengthening between module antenna MA and card antenna CA and is coupled.Ferrite component 156 can comprise nanostructured, as nano particle, and nano wire or nanotube.Ferrite (or other) element 156 can be at module antenna MA and chip module CM(contact pad CP) between, as long as obtain desirable effect.Can be by the material outside ferrite for " ferrite component ".Can be with any material substitution ferrite, for example there is the material of high electromagnetism conductance, increase the coupling (energy transfer efficiency) between module antenna MA and card antenna CA.

The chip module of Figure 1B can be implanted in card CB, card CB can comprise tube core, this die attachment to expoxy glass adhesive tape and tinsel is engaged to this expoxy glass adhesive tape, be filled with transparent UV-cast compound (epoxy resin) barrier (its on tape the thickness of side be about the connection of 400 μ encapsulation m)." barrier and the filling " of protection silicon die be shaped as circle, diameter is about 6mm.Ferrite component FE is installed on the surface of barrier and surrounding area, using the shielding of the decay as to anti-electromagnetic field.Tinsel module antenna MA is installed to ferrite layer, and wire ends is bonded to the end regions of glass epoxy band by hot compression.

In alternative structure, chip module CM can comprise the chip for example, with its oneself antenna (, at US6373447), or directly with card antenna CA coupling (without module antenna MA), or be coupled with Anneta module (AM) (itself and card antenna-coupled).

Fig. 1 E shows double nip chip module (CM), and it can directly be connected with the card antenna (CA) being arranged in card (CB).Contact pad (CP) is arranged on the top surface of chip module (CM) as contact interface.Two terminals are arranged in the lower surface of chip module for being connected with card antenna.Double nip (DI) chip can be joined to the each contact pad (CP) in the strip substrate of chip module by tinsel.Can apply dome packaging body engages with protection DI chip and tinsel.

As discussed in this article, module antenna (MA) can be set, be combined with chip module, for chip module being electromagnetically coupled to card antenna.And as mentioned above, ferrite can be incorporated in obtained Anneta module (AM) to improve the coupling between module antenna and card antenna.

Module antenna (MA) can be arranged on the flat coiling coil on the dome packaging body mould piece of chip module (MA).

Commercially available chip module (CM) or Anneta module (AM) are (as the SmartMX of NXP or Infineon SLE66, or other) can be combined with the present invention, the present invention can be " ready-made " or have modification disclosed herein, as upper in module antenna MA added to chip module CM, or increase ferrite component in obtained Anneta module AM).

Now aspects more of the present invention of discussing are comprised module antenna MA(Fig. 2 A, 2B) improvement and the improvement to card antenna (Fig. 3 A, 3B).

the capacitive stub (capacitive stub) of module antenna (MA)

Fig. 2 A, 2B show the embodiment of Anneta module (AM) 200, comprising:

-chip module (CM) 208, it has two terminal 208a, 208b

-inductance wire antenna structure (A) 210, it is formed as embedding pancake coil wiry, there is the wire turn of multiple (as 12), and there are two ends, be i.e. the end of an outer circle of outer end 1(wire turn) and the end of the inner circle of inner 2(wire turn)

The total length of o antenna A can be 400mm

The end 1 and 2 of o antenna A can be connected to the terminal of chip module.

O chip module can be arranged on the wire turn interior (in the inside of wire turn) of antenna A

The outer circle of o antenna A can be crossed over the interior circle of antenna A to be arranged to chip module CM

-capacity antenna expansion (or short-term, or " antenna structure ") B and C are also formed as embedding pancake coil wiry, have multiple wire turns, and are connected to inductance wire antenna as described below.

Chip module 208 and antenna A210 can be arranged on stacked antenna substrate 200 layer 222 in or be arranged on this layer.Chip module 208 can be arranged on and partly extend through layer 222(as shown in the figure) depression (bag) 206 in, or can be disposed in and extend fully through in layer 222 depression (opening), chip module 208 is supported by bottom 224.

In Fig. 2 B, chip module is shown as " towards upper ", and its for the terminal that is connected with antenna A in its top side.Or chip module can be oriented " facing down ", its antenna reception terminal (for example extends through substrate 222) in its bottom side, and for another group terminal (not shown) of contact interface in its top side.

Other modification of AM200 can include, but are not limited to:

-antenna A can be on the bottom of layer 222

-short-term B212 can be on the bottom of layer 224

-short-term C214 can be on the bottom of layer 226

-short-term B and C can be in the top of individual layer and lower surface, and described individual layer can be above or below layer 222

Short-term B212 can be formed as pancake coil wiry, has multiple (as 12) wire turn, and has two ends, i.e. the outer end 3 of outer circle and the inner 4 of interior circle in the layer 224 of overlayer 222.Short-term B can have the total length of about 400mm, and can align with antenna A (directly above it).

Short-term C214 can be formed as pancake coil wiry, has multiple (as 12) wire turn, and has two ends, i.e. the outer end 5 of outer circle and the inner 6 of interior circle in the layer 226 of overlayer 222.Short-term C can have the total length of about 400mm, and can align with antenna A (under).Can be by etching, printing or other technique but not form short-term B and C with embedding tinsel.

In the schematic diagram of Fig. 2 A, antenna A and short-term B, C are depicted as lateral excursion each other.In Fig. 2 B, inductance wire antenna A and capacitive character tinsel expansion B and C are shown as self location and alignment.As shown in the best in Fig. 2 A, each of antenna structure A, B, C can be formed as having multiple wire turns, the pancake coil pattern of total length (passing through) and footprint (long × wide), and can be basic identical each other in these areas.As illustrated Fig. 2 B institute is best, antenna structure A, B, C can be set to substantially one directly on another.

Fig. 2 B illustrates that the number of turn, length, width, pitch and the pattern of short-term B, C can substantially mutually the same (couplings), and they can stacked alignment in the layer of Anneta module 200, and its wire turn one circle one is in alignment with each other all over the ground.Short-term B, C also can mate substantially, and align with antenna A.Electric capacity and resonant circuit are formed between A+B and A+C.Antenna A is depicted as in the layer being arranged between short-term B and the multilayer of C, and antenna A can be arranged in the layer above or below short-term B and C two-layer.

Dotted line (---) represents that the inner 4 of short-term B212 can for example be connected to the outer end 1 of antenna A210 at terminal 208b place, and the outer end 5 of short-term C can for example be connected to the inner 2 of antenna A at terminal 208b place.The outer end 3 of short-term B and the inner 6 of short-term C can not be connected (keeping opening wide).

Alternatively, vertically arrow (↓, ↑) represents that outer end 1(that the outer end 3 of short-term B can be connected to antenna A is for example at terminal 208b place), the inner of short-term C can be connected to the inner of antenna A.

Note that in this arbitrary situation, two ends 1,2(that short-term B, C " on the contrary " (interior and outer) end is connected to antenna A, the inner 4 of B and the outer end 5 of C).As used herein, the inner that " in the opposite direction connect " refers to (B or C) in two short-terms is connected with one end of antenna (A), and the outer end of another (C or B) in two short-terms is connected with the other end of antenna (A).Conventionally " identical " end (as two the inners) of not expecting short-term is connected with the end of antenna A.Connection (interconnection) discussed herein can be carried out with any usual manner, as the trace by the passing through of across-layer, layer, joint, scolder welding, crimping, melting welding etc.

Short-term B and C are orientated as and be closely adjacent to each other, and one on another, antenna A is between them, and this is forming the extra resonant circuit of realizing by the stray capacitance between antenna structure A, B, C between A and short-term B, C.Be exposed to self-resonance (or resonance certainly) frequency that can advantageously reduce antenna A from the interaction between short-term B and the C of the coupling of the identical electromagnetic field of antenna A.Short-term B is near antenna A, and short-term C is near antenna A, and therefore short-term B is near short-term C.

In electron device, electric capacity and inductance have respectively stray inductance and electric capacity.For a capacitor, inductance is mainly because physical size (comprising lead-in wire) causes.Because the series connection of electric capacity and inductance creates an oscillatory circuit, so while using step by-step impulse to stimulate, all capacitor and inductors all vibrate.The frequency of this vibration is self-resonant frequency (SRF).

The size of Anneta module AM can be about 10-15mm x10-15mm, and it can be circle and non-rectangle certainly.During due to relatively little Free Region, the inductance wire rings of the size of Anneta module can have the self-resonant frequency of about 75MHz.The capacitor (thering is unlimited wire end 3 and 6) that stacked closely-coupled antenna structure (short-term B and C) can form as tinsel, described capacitor can be reduced to formed transponder resonance frequency the value of the approximately 13-17MH more expecting, sends power to chip module thereby increase voltage.

By the additional tinsel wire turn of structure (short-term) B, C being moved to face separately, the principle of stacked closely-coupled tinsel (or other conductive trace) antenna structure (short-term B and C) is conducive to space shared antenna A to drop to minimum.This principle can be than by more effective several inductance wire antenna (all wire ends are connected) serial or parallel connection.Can form by manufacturing more conventional conductive surface (plate) counteracting resonance frequency the condenser type expansion of antenna A.Using an advantage wiry is that tinsel embedded technology easy to use is manufactured, and utilizes space better.Anneta module may have very limited space constraint.

Various replacement schemes to above-mentioned " solution " can include but not limited to:

-there is two short-term B and C at same layer, but its wire turn is interlaced with each other,

-make one or two and the antenna A of short-term B and C at same layer,

-make two short-term B and C at same layer, but the two the same side at antenna A (covering or stacked)

-by the outer end of short-term B 3 but not inner 4 be connected to the outer end 1 of antenna A, and by the inner of short-term C 6 but not outer end 5 is connected to the inner 2 of antenna A,

-make a short-term (B or C) only be connected to outer end or the inner (only one end) of antenna A by its outer end or the inner (only one end), preferably connect the end of reverse direction (outer end of is connected to another the inner), but the connection of equidirectional (the inner is connected to the inner, and outer end is connected to outer end) is also possible.

" accurate dipole " card antenna (CA)

Fig. 3 A shows the card antenna 350 of the general form that is substantially coiled piece wiry plane, that be generally rectangle, described tinsel is embedded in card (CB, not shown), and comprises two different parts (or coil or antenna structure, or " utmost point ") 352,354, as follows:

-exterior loop (D) has several circle tinsels, outer end 7 and inner 8

-interior loop (E) has several circle tinsels, outer end 9 and inner 10

O notes, described interior loop E is illustrated as dotted line, for exterior loop D(solid line) distinguish.

-exterior loop D and interior loop E respectively can have the total length of about 1200mm.Interior loop and exterior loop have essentially identical length each other.

-interior loop E and exterior loop D are all considered to " antenna structure " of card antenna CA.(" antenna structure " A, B and the C of comparison module antenna MA).

Interior loop E and exterior loop D are connected to " accurate dipole " antenna with " anti-phase ".The outer end 7 of exterior loop D is connected in any suitable manner with the inner 10 of interior loop E, for example, by using independent wire jumper or the conductive trace in substrate.Web member " j " indicates 356 and can be node simply.The inner 8 of exterior loop D and the outer end 9 of interior loop E are not connected.

Interior loop E and exterior loop D inductive coupling close to each other, the induced voltage in interior loop E and exterior loop D can have phases opposite.Interior loop E and exterior loop D can be formed on identical layer, and interior loop E is arranged in the inside of exterior loop D, or they can be formed in substrate in the layer covering each other, are substantially in alignment with each other.Interior loop E and exterior loop D can be formed as embedding the pancake coil of tinsel etc., and this pancake coil has the number of turn of some and the total length of about 1200mm.

It is upper that coupled antenna 350 can use traditional tinsel embedded technology (using hyperacoustic sonotrode, for example, described in US6233818) to be formed on substrate (or card), and described tinsel embedded technology is for example as follows:

-start tinsel to be embedded in the outer end of position 9(interior loop E), and continue to be embedded into the inner of position 10(interior loop E), thereby number circle (for example 2,3 or 4 circles) internal antenna coil E formed

-stop embedding (turn off ultrasound wave, lift sonotrode), in next step, above several circle interior loop E by tinsel guiding (guiding) to position 7, described position 7, by the wire turn of outer end that is exterior loop D, does not cut off tinsel.

O jump over interior loop E make to have connect the independent connecting bridge of the end 10 of exterior loop D and the inner 7 of interior loop E or wire jumper (here, " 7 " and " 10 " be position, but not end)

-in the outer end of position 7(outside antenna structure) locate to recover embed and continue, formation number circle (for example 2,3 or 4 circles) outside antenna structure (D), if necessary, jumps over and lays one wire jumper 356.

As shown, form the top that the part wiry " a " of web member " j " can have been laid wire turn through two (as shown in the figure) of interior loop E, partly " b " can be through the below of two (as shown in the figure) wire turns to be laid of exterior loop E.All these is the bottom (being the relative common point at each wire turn in essence, i.e. " 6 positions ") at pattern.About the below tinsel web member " j " through outside antenna structure, should be appreciated that tinsel web member " j " can be embedded in the surface of substrate (card) simply, in the time laying the wire turn of exterior loop D, temporarily stop embed, make wire turn can jump over embed tinsel web member " j ".(not being connected with any parts) can be opened wide in the outer end 9 of interior loop E with the inner 8 of exterior loop D.

The part " b " of the tinsel web member " j " of the below of process outside antenna structure D can for example be laid in the passage being pre-formed in substrate (card) by laser burn, and this can make not need to turn off ultrasound wave during laying outside antenna structure is jumped over tinsel web member " j ".

By (the inner of interior loop E 10 being connected to the outer end 7 of exterior loop D by this way, or " anti-phase ") connection interior loop E and exterior loop D, interior loop E and exterior loop D are very closely coupled, due to the induced voltage of interior loop E can show with exterior loop D in the phase place (phase reversal) of single spin-echo of induced voltage, effect add and.Exterior loop D can allow to realize card antenna CA with the less number of turn compared with the scheme possible with other with the reactance coupling (electric capacity and inductance) of interior loop E.

Be easy to being connected to form of exterior loop (E and D) to show " accurate dipole " card antenna and the US6378774(Toppan of phase reversal) and US2009/0152362(Assa Abloy) compare.

-note, two " end portion " 11 and 11'(are for example disclosed in Assa Abloy corresponding to exterior loop D and interior loop E), the outer end of outer end portion 11 and the inner of interior end portion 11' (corresponding to end or the position 7 and 10 of card antenna CA) is not connected.The inner of outer end portion 11 is connected with middle body 12 with the outer end of interior end portion 11' (corresponding to the end 8 and 9 of the card antenna CA not being connected), the coupling of at least one little coiled piece inductance of formation and transponder device (corresponding to Anneta module AM) inductive coupling.Note, there is no similar pickup coil at Fig. 3 A() in, coupling is that Anneta module AM is set directly in a part of card antenna CA and is realized, as discussion in more detail below.

-Toppan also needs independent pickup coil (3)

Interior loop E and exterior loop D can use conventional wiring to imbed technology and be formed as continuous structure in the case of the wire jumper without independent or trace, for example, as follows:

-start tinsel to be embedded in the outer end of position 9(interior loop E), and continue to be embedded into position 10, thus number circle (for example 2,3 or 4 circles) interior loop E formed

-stop embedding (turn off ultrasound wave, lift sonotrode), in next step, above several circle interior loop E by tinsel guiding (guiding) to position 7, described position 7, by the wire turn of outer end that is exterior loop D, does not cut off tinsel.The internal antenna coil E that jumps over makes to have the independent wire jumper that connects the end 10 of exterior loop and the end 7 of interior loop.Here, " 7 " and " 10 " representative is corresponding to each outer end of exterior loop and interior loop and inner position).

Between o position 7 and 10, part wiry can be called as " connecting bridge " or " tie jumper " 356.(and, as described in, if two coil D and E are not one each other, use independent " wire jumper " to connect end 7 and 10)

-after the interior loop E that jumps over, in the outer end of position 7(exterior loop D) locate to recover embed and continue, form number circle outside antenna coil D, if necessary, the connecting bridge 356 of jumping over and having laid.

O notes, in the drawings, the part of connecting bridge 356 " a " is through the top of the wire turn of interior loop E, and the part " b " of connecting bridge 356 is through the below of the wire turn of exterior loop D.

O can for example be laid in the passage being pre-formed in substrate (card) by laser burn through the part " b " of the connecting bridge 356 of the below of outside antenna structure D, and this can make not need to turn off ultrasound wave during laying outside antenna coil D jumps over connecting bridge 356.

Card antenna CA can comprise the copper cash (diameter: m), 46mmx76mm(is more smaller than card for 80 μ) of 80 μ m of insulation, and the pitch of wire turn is 300 μ m, resonance frequency 13.56MHz.

Fig. 3 B is schematically illustrated, and card antenna 350 is made up of exterior loop D and interior loop E, its objective is as nonrestrictive example and may how to work for instruction card antenna.In this example, exterior loop D has 3 circles by the molded coil of inductance L 1, L2 and L3, and interior loop E has 3 circles by the molded coil of inductance L 4, L5 and L6.All inductance (L) are subject to the coupling influence between all coils.Capacitor C 1-C6 is the intrinsic stray capacitance of coil

Capacitor C 7-C9 is described in the interaction existing between interior loop E and exterior loop D in close-coupled situation between two coil E and D.These additional electric capacity reduce the self-resonant frequency of card antenna (CA), and can make not need extra capacity cell.

Electric capacity (C) can be subject to the impact of wire tie distance, the impact of the number of turn that inductance (L) is subject to.

For example, the self-resonant frequency of card antenna 350 is by the stray capacitance manufacture (work separately, do not interfere with each other) being formed between coil D and E.Only there is a loop construction (rather than two) and will cause the self-resonant frequency higher than desirable self-resonant frequency, for example about 40-50MHz.Self-resonant frequency can be by reducing to get off: (1) increases the quantity (inductance) of wire turn or (2) increase capacity (reduce wire tie apart from).The quantity that increases wire turn increases the self-resonant frequency of inductance reduction.Be connected and 7 and 10 be not connected in the situation that, will form standard coil in wire ends 8 and 9, the quantity of two loop constructions all increases.This will for example cause, at certain self-resonant frequency (, 50-60MHz).In the wire turn of equal number or the situation wiry of equal length, self-resonant frequency is decreased to about 13-17MHz by as directed connecting coil D and E.

the structure of Anneta module AM and card antenna CA

How the module antenna MA of Anneta module AM how interacts with card antenna CA and how to use two coil structure card antenna CA that " anti-phase " is connected technical characterictic with formation " accurate dipole " antenna if being more than discussed.The various concrete structure (layout) of following instruction card antenna CA.Under each situation, card antenna CA has the form of the rectangle coiled piece of extending around card CB periphery conventionally.In some drawings, for illustrate clear for the purpose of, card CB can omit.Card antenna is intended to the mode that Anneta module works under noncontact mode works, and this Anneta module includes but not limited to DIF module, and comprises have " on chip " the separately antenna semi-conductor chip of (for example open in US6373447).

Herein in illustrated all structures illustrating (only have a kind of exception, exception is shown in Fig. 4 C), card antenna CA is " accurate dipole " form of the coil (or " utmost point ") with two interconnection.These two coils should have the substantially mutually the same number of turn, mutually the same length and mutually the same pitch, and interval is each other as much as possible little on its most of girth.They can be reeled with mutually the same " direction " (clockwise or counterclockwise).Natural energy is made change to these parameters (length, pitch, spacing, direction) arbitrary, and some of them are discussed in this article.

Fig. 4 A, 4B illustrate card antenna CA, and exemplary Anneta module AM is positioned as and blocks antenna CA coupling.Anneta module AM comprises DIF chip module CM and the antenna MA for contactless pattern, and for the contact pad CP of contact mode.As mentioned above, card CB is provided with card antenna CA, and described card antenna CA can be " the accurate dipole " with two coils of interior loop E and exterior loop D.(line " j " represents being connected of the inner 10 of interior loop E and the outer end 7 of exterior loop D, as mentioned above).What can use 112 μ m forms card antenna CA from jointing metal silk, maybe can use any additive process (as printing) or subtract into technique (as etching) card antenna CA is formed as to conductive trace.

Anneta module AM is rectangle substantially, has four limits.Module antenna MA is also roughly rectangle, has four limits.Card antenna CA is also roughly rectangle, has four limits.

Be to be understood that, in all explanations of explaining herein, different " rectangle " antenna structures (A, B, C, D, E, MA, CA) will have the edge of rounding conventionally, and module antenna MA can be formed circular coil, or can be circular or oval simply.

Anneta module AM be shown as setting (locating in smart card) become to make in four sides of module antenna MA at least one only with at least some wire turn overlaids of the interior loop E of card antenna CA, so that the former with the latter is coupled (preferably not and any exterior loop D overlaid) effectively.Do not need independent pickup coil.

Anneta module AM, particularly its module antenna MA, can be with exterior loop D but not interior loop E overlaid.But importantly, Anneta module AM, particularly its module antenna MA, when different and interior loop E and exterior loop D overlaid.

The end 8 and 9 not connecting of card antenna CA can be positioned close to each other, in the centre of interior loop E and exterior loop D.Connect two coils by tinsel wire jumper (or band), card antenna forms the resonant circuit of the about 13-17MHz of frequency of operation.

It is identical level that web member " j " makes the electromotive force of invocation point (or end) 7,10.In the time that interior loop E and outer coiling D are exposed to the identical magnetic flux of reader (Figure 1A), increase the voltage of coil.The layout of two coils is very important, and web member " j " causes phase reversal, and has additive effect.

The preferred self-resonant frequency of card antenna CA can be about 13-17MHz, and this can manufacture coupling the most closely between card antenna CA and module antenna MA, thereby strengthens (increase) read/write distance with respect to external reader.

Anneta module AM and module antenna MA are physically overlapping and couple directly to two coil card antenna CA, such layout and US6378774(Toppan) and US2009/0152362(Assa Abloy) form a sharp contrast, US6378774 and US2009/0152362 depend on the independent coupling mechanism coil coupling with module antenna with realization outside two coil card antennas.This direct-coupling feature of the present invention is attributable to the method that interior loop E is connected with exterior loop D: it is " anti-phase " that interior coiling E and exterior loop D connect into it, and make module antenna MA only with interior loop and exterior loop in one or the other is overlapping.

Fig. 4 C illustrates the modification of card antenna, is labeled as " F " (but not CA) at this, only has a continuous wire coils (but not two coils), and has two ends that are not connected 11 and 12.The Anneta module AM with module antenna MA is positioned as with to block at least one in the lateral edges of antenna F overlapping.In the figure, module antenna MA is overlapping with all wire turns of card antenna F.

Conventionally the tinsel wire turn that, this unicoil structure may need more (as 20) is so that respectively to have the structure of only " the accurate dipole " of 3 or 4 wire turns equally effective with interior loop E and exterior loop D.The more region of needs of more wire turn, this may be problem to smart card.More wire turn also causes more stiff antenna structure, and this may cause mechanical problem, as the micro-crack in card CB.It is more practical that single coil structure may be compared smart card to E-Passport.In any embodiment of card antenna CA disclosed herein, tinsel can be some in these problems that solve of " wriggling ".

Coating (as the figure layer of particle or form of nanoparticles) can put on for example one or both sides of card CB (referring to Figure 1B, coating 124).Can apply conductive coating to form electric capacity, conductive coating can be applied to the part of interior loop E and exterior loop D and contact.This extra electric capacity can improve the performance of card antenna CA.This can be to the unicoil structure advantageous particularly (reducing required number of wire turns) of Fig. 4 C.

Fig. 4 D shows the modification of card antenna, and it is noted as CA, and it is similar to the card antenna CA of Fig. 4 A, and difference is that two coil E and D are herein interlaced with each other, but not coil E is arranged on the inside of another coil D completely.The end 7,8,9,10 of coil D and E is equivalent to the D of coil and the end of E 7,8,9,10 of the card antenna CA of Fig. 4 A, and it is connected, so that the CA of card antenna is similarly constructed as " accurate dipole ".

Due to interweaving of coil D and E, only make the overlapping inefficent or effect of one of them or another and Anneta module AM.

Fig. 4 E shows the modification of card antenna CA, and wherein at least a portion of interior loop E and exterior loop D interval obtain fartherly, and wherein Anneta module AM is overlapping with card antenna CA.Here,, compared with other three side of interior loop, (right side obtains farther with exterior loop D interval a whole side of interior loop E as shown in the figure).

The interval of this increase makes more easily to locate to make all wire turns of its module antenna MA and interior loop E overlapping and not overlapping with any wire turn of exterior loop to Anneta module AM.But the interval increasing between interior loop and exterior loop may cause efficiency to decline to some extent.

Fig. 4 F illustrates the modification that increases interval.Here, not that a whole side of interior loop E and the corresponding side interval of exterior loop D obtain farther, but only make the relatively little part of this side (being depicted as bottom side here) of interior loop farther with exterior loop D,, only need to make Anneta module AM overlapping with module antenna MA is coupled to the position of the interior loop E of card antenna CA make this side of interior loop and exterior loop D farther.

The advantage of this structure is the tight spacing that has retained the expectation of coil E and coil D in the major part of card antenna CA.(only reduce this interval at module antenna MA with the card interactional position of antenna CA.）

Fig. 4 G shows a modification, wherein, be not interior loop and exterior loop have identical " sense of rotation " (as two be all counterclockwise, as shown at Fig. 4 A), but the interior and exterior loop of card antenna CA is formed as having reciprocal sense of rotation.Here, exterior loop D is formed as having the direction of being rotated counterclockwise (from end 7 to end 10), and interior loop E is formed as having dextrorotation veer (from end 9 to end 10).Other structure is identical, and " 7/10 " of the outer end 7 of exterior loop D to the inner 10 of interior loop E connects (Fig. 4 A) as hereinbefore, and the inner 8 of exterior loop and the outer end 9 of interior loop E are not connected, as hereinbefore.

In theory, due to the stray capacitance between coil, single coil can be formed in the situation that there is no capacitor and form resonant circuit.But this structure may be increased to disadvantageous level in the time that 13.56MHz operates by the resonance frequency of card antenna CA.

Fig. 4 H shows a modification, and wherein the connection of the end of inside and outside coil is contrary with the connected mode (the inner of interior loop is connected to the outer end of exterior loop) in aforementioned exemplary." contrary sense of rotation " structure based on Fig. 4 G, the inner 8 of the exterior loop D is here connected with the outer end 9 of interior loop, and the outer end 7 of exterior loop D and the inner 10 of interior loop E are not connected.Can realize in the following manner " 8/9 " connects: only turned round and laid (embedding) tinsel by manufacture " U " shape, making card antenna (CA) is to have the wiry of continual length (above to mention, as substituting of the independent wire jumper of two coils, as discussed in Fig. 3 A).Alternatively, lay exterior loop D, doing " U " shape staggered returning of turning round from 7 o'clock to 8 o'clock.

This structure may be increased to disadvantageous level in the time that 13.56MHz operates by the resonance frequency of card antenna CA.

Fig. 4 I shows a modification, and one of two coil of " standard-dipole " card antenna CA are wherein stacked on another, and for example, a coil F is on the top surface of one deck of card CB, and another coil G is on the basal surface of this layer.In other words, two coil F, G are here in visibly different plane, and in embodiment before, coil D and E are in essentially identical plane.As in example above, two coil F are similar each other with G, and can be connected (not shown) by " anti-phase ".

Mentioned above, an interaction (by its module antenna MA) in two coils of " accurate dipole " card antenna CA that expectation Anneta module AM is only connected with " anti-phase ", this effect can obtain in the following manner: at module antenna MA with expect to provide between the coil of card antenna CA of conductively-closed the mode of a kind of shielding material (as ferrite), and another not conductively-closed of coil of card antenna CA.This can be by least providing ferrite particle to realize the position being positioned on card CB at Anneta module AM in card CB.Alternatively, between the top surface that can be arranged on card CB and coil F of the Ferrite Material of one deck, under top winding F.This permission and can be the coupling being tending towards between the coil F at the top that increases module antenna MA and card CB makes the coupling attenuation of the coil G of the below of itself and card CB simultaneously.

The thickness of described substrate has determined gas penetration potential, thus determined two coil F and G between the efficiency of coupling.Dielectric can be polymkeric substance, for example polycarbonate or Textilene TM(Teslin ^tM).

Fig. 4 J shows another example of one in two coils of shielding " accurate dipole " card antenna CA.In this case, coil may be interior loop and exterior loop, as described in conjunction with Fig. 4 A, on the top surface that two are all arranged on card CB.Interior loop E is in the inside of exterior loop D.

Shielding material as ferrite can by optionally Anneta module AM can be applied to the interactional position of exterior loop D as described on exterior loop D.Extra Ferrite Material can be applied under card CB at same position place, further to reduce the less desirable coupling of Anneta module and exterior loop D.

In the embodiment of Fig. 4 I, 4J these " shieldings ", shielding material should only put on position or bottom place or exterior loop (G or the D on card CB, with attempt that the coupling of itself and module antenna MA is reduced to minimum coil) locate, and it generally should avoid all the other major parts of shielding bottom or exterior loop (G or D), this be because, bottom or exterior loop with the coupling of the antenna of the contactless reader (referring to Figure 1A) of outside in play an important role.

other structure of card antenna CA

In above-mentioned various structures, card antenna CA is to be that the form of rectangle coiled piece of plane is (except the structure in Fig. 4 I substantially, wherein there are two planes), lateral edges of Anneta module AM is overlapping with at least a portion of card antenna CA, conventionally only overlapping with of two coil.Some extra structures of card antenna for improvement of coupling are described below, wherein (conventionally):

(i) Anneta module AM can be with the exterior loop D(of card antenna CA but not interior loop E) overlapping

(ii) two or more edges of Anneta module AM can be with card two coils of antenna CA (D or E) (or another) from folding

(iii) two or more Anneta modules can be arranged in smart card, and each and card antenna CA interacts, and may be interact with each other.

In the embodiment being described below, Anneta module AM will be illustrated in card CB and block in " simplification " demonstration of antenna CA.For illustrate clear for the purpose of, some details (as the interconnection between the end of interior and exterior loop) can be omitted.

Be to be understood that, in any suitable noncontact (or DIF) Anneta module AM(or chip module, or there is antenna integrated chip) can be for interacting with the representative configuration of card antenna CA, this representative configuration comprises that commercially available Anneta module (can only have antenna A, do not there is capacitive stub B, C).

The different pattern (A, B, C, D, E) of antenna structure is " general rectangular " by the place of showing.Be to be understood that, other pattern can be also suitable, for example, avoid the ellipse of wedge angle, or increase antenna structure total length, slow down card CB and increase the zigzag (complications) etc. of rigidity.

Fig. 5 A shows the embodiment of card antenna CA, and it has interior loop E and exterior loop D on card CB.First day wire module AM1 is set to that (right side, as shown) overlapping with the interior loop E of card antenna CA, first day wire module AM1 can be also DIF Anneta module as described above in a side.

Conventionally, at least a portion coupling of at least one part of module antenna MA and card antenna CA, under the situation of the intermediary at the pickup coil not being associated with card antenna CA with its coupling.Here, a side of the module antenna MA of rectangle is shown as with the interior loop E of CA that blocks antenna overlapping.Module antenna MA can have other shape, and such as circular or oval, it can be with exterior loop but not interior loop E is overlapping.In some embodiment disclosed herein, for example by make rectangular module antenna MA and card antenna selection partly overlap to increase overlapping between module antenna MA and card antenna CA.

The second Anneta module AM2 with the module antenna MA of himself is set in its opposite side (left side, as shown in the figure) overlapping with the interior loop E of card antenna CA, the second Anneta module AM2 can be also the Anneta module only with contactless function of the security extra for providing of many application answer device, etc.Two Anneta module AM1 and AM2 are coupled to identity unit (the interior loop E of card antenna CA), can communicate with one another and communicate by letter (referring to Figure 1A) with external reader.

Fig. 5 B shows the example that two lateral edges of the AM3 of Anneta module is coupled to card antenna CA.Here, Anneta module AM3 arranges a jiao of rectangular card antenna CA, as the upper right corner, makes the top of Anneta module AM3 and right side edge and the top of interior loop E and a part for right hand edge overlapping.This is the correct position of contactless read-only (ISO14443) Anneta module AM3.The form factor (for example embossed region) of other regulation may forbid, on smart card, the DIF Anneta module with contact pad is positioned to this position.

Module antenna MA dual edge is coupled to card antenna CA and can provides (other factors is identical) stronger coupling than single edges coupling.

Fig. 5 C shows another example that two lateral edges of Anneta module AM is coupled to card antenna CA.Here, card antenna CA departs from rectangular shape: in its upper right corner (as shown), its top from card inwardly has a certain degree, then outwards have a certain degree towards the right hand edge of card CB, " L shaped " path (disappearance that these two right angles cause in the upper right corner of card antenna CA, breach), roughly there is the size of Anneta module AM.

In the aforementioned exemplary of Fig. 5 B,, can not there be contact interface in the upper right corner of the AM3 of Anneta module in smart card.Here, Anneta module AM can be arranged on the centre of card CB, with arbitrary in Fig. 4 A, 4C, 4D, 4G, 4H, 5A shown in identical, and can be suitably therefore the DIF Anneta module with contact pad.(the second noncontact Anneta module (not shown) only, can be arranged on the upper right corner of card CB, and in the upper right corner, itself and exterior loop D are coupled the function that provides additional, as discussed with respect to Fig. 5 A above.）

Fig. 5 D shows a kind of structure, wherein block antenna CA and depart from rectangular shape, it has " U " v notch v (or otch), this breach comprises two right angles, extend internally from the right hand edge of CA of card antenna, at the middle part of card CB, there are suitable shape and size to hold the Anneta module AM at the middle part that is arranged on card CB, Anneta module AM can be suitably the DIF Anneta module with contact pad.In Fig. 4 A, Anneta module AM and interior loop E coupling, in Fig. 5 D, Anneta module AM and exterior loop D coupling.

The structure of Fig. 5 C makes 2 limits of Anneta module AM be coupled with blocking antenna CA, and " U-shaped " otch allows 3 limits of Anneta module AM to be coupled with card antenna CA, and coupling efficiency increases thereupon.In this structure, Anneta module AM and exterior loop D but not interior loop E is overlapping.

The second Anneta module can be with Fig. 5 A(AM2) mode add, the second Anneta module and another coil (interior loop E) coupling.Above mention, these couplings are main relevant to non-contact pattern, and the different coils that each of two Anneta modules are coupled to two coupled antenna coils (D or E) can provide extra performance.

Fig. 5 E shows a kind of structure, wherein block antenna CA and depart from rectangular shape, it has " U " shape projection, stretch out from the right hand edge of CA of card antenna, at the middle part of card CB, have suitable shape and size to hold the Anneta module AM at the middle part that is arranged on card CB, Anneta module AM can be suitably the DIF Anneta module with contact pad.It has inside breach with Fig. 5 D(, and Anneta module AM arranges the outside of card antenna CA, with exterior loop D coupling) contrast.Here, card antenna CA is outwards outstanding, and Anneta module AM is arranged on the inside of card antenna CA, is coupled with interior loop E.

This structure is coupled Anneta module AM and the Inside coil E limit of card antenna CA.(above mention, the structure of Fig. 5 D also provides three limit couplings, but is and exterior loop D coupling)

By the advantage shown in this structure be, given Anneta module (AM1) can be coupled with interior loop E, and other at least one given Anneta module can easily be positioned in arbitrary limit and the exterior loop D coupling of " L " otch.

Fig. 5 F shows a kind of structure, wherein block antenna CA and depart from rectangular shape, it has " U " shape projection, mode take identical with " U " shape projection in Fig. 5 E (as object is discussed) stretches out from the right hand edge of the CA of card antenna, at the middle part of card CB, DIF Anneta module is arranged in this projection similarly.

This illustrates, and extra Anneta module AM2 can be arranged on the middle part of card CB, in the left side of card antenna CA, and can be suitably the 2nd DIF Anneta module with contact pad.Additionally or alternati, third antenna modules A M3 can be arranged in the upper right corner (as shown in the figure) of card antenna CA, in the outside of CA of card antenna, with the exterior loop D coupling of card antenna CA.Or third antenna modules A M3 or another Anneta module can be arranged on the lower right corner of card antenna CA.

Can be easily by making card antenna CA be incorporated to extra Anneta module (AM2, AM3) in the position that is different from first day wire module (AM1), this feature is and the another significant difference of Assa Abloy or Toppan that any one in Assa Abloy and Toppan requires additional pickup coil to each additional Anneta module.

Fig. 5 G is the sketch that the upper right corner of the card CB with card antenna CA is shown.Exterior loop D(solid line) there are 4 circle tinsels, and the outward flange of close card CB.Inside coil E(dotted line) there are 4 circle tinsels, be positioned at the D inside of exterior loop, towards the inside of card CB.Some considerations of structure card antenna CA comprise:

-in this example, module antenna MA and interior loop E are overlapping

-two coil E, D can have and cause identical number of wire turns (as all having 3 or 4), have mutually the same length and identical pitch, and will be on its most of girth interval each other as much as possible little.Interval between the wire turn of the outermost of interior loop E and the innermost wire turn of exterior loop D should remain possibly little, to improve to greatest extent reaction coupling.

-Ka antenna CA can finely tune the pitch (relatively US7928918, Gemalto) of the wire turn of the outermost of (resonant frequency adjustment) change exterior loop D

The outermost wire turn of-interior loop E should be as far as possible near the innermost wire turn of exterior loop D so that two coil E, D efficient coupling

Fig. 5 H shows the structure of the card antenna CA that is similar to Fig. 5 C.For clarity, interior loop E and exterior loop D are all only illustrated to two wire turns (it has 3 or 4 each wire turns conventionally).Interior loop E and exterior loop D are not " L " v notch vs that is formed with right angle (Fig. 5 C), but there is the more path of arc (bending) of " soft ", comprise arc bight portion (wherein round die block antenna MA and interior loop E are overlapping), for example, there is the circumference (comparing with the above-mentioned one or more edges coupling with rectangular module antenna MA) of 90 degree.Conventionally, target is the overlapped surfaces region that will cover between many as far as possible card antenna CA and module antenna MA.This structure illustrates the Anneta module AM with round module antenna MA, and the suitable position that card antenna CA is patterned on card CB provides a large amount of overlapping chances.Other consideration of structure card antenna CA comprises:

End or the part 7,10 of-connection should be as close as possible together

The wire turn of-coil can separate a little, to hold the free end 8,9 that is positioned at card antenna middle part.

-by laser ablation or grind the passage for web member " j " in substrate manufacture

-to note, end 8,9 separates exterior loop D and interior loop E at middle part.This " metallic filaments " should remain as much as possible little, and the wire turn of the innermost wire turn of the exterior loop D making and the outermost of interior loop E keeps and comes in close proximity to each other.

the application of contactless RFID label

For guiding the flux field of sending from high-frequency RF ID label; the ferrite layer with high permeability can be integrated into the middle layer of card; described layer accommodates ferrite nanometer particle in resin region, the polymkeric substance with magnetic filling agent or the ferritic sheet material of sintering, and object is to reduce eddy current loss and for example, by RFID label and metal surface (metal shell in mobile phone) uncoupling below.This shielding in HF frequency band prevents the decay of the carrier wave (13.56MHz) being caused by the inducing eddy-current on the metal surface of battery.Do not having under shielded situation, the reversing magnetic field that vortex flow is set up carries wave line of propagation.

Fig. 6 A shows mobile phone 650, and it has display and keyboard on its front surface (facing down in figure), and contains an electric battery (" battery ").Contactless RFID device (" label ") 660 be arranged on mobile phone the back side (top, as shown in the figure) on.Label 660 inside have for the interactional antenna 662 of external RF ID reader 680.Antenna 662 can be the antenna traditional with label all-in-one-piece.Reader 680 also has antenna associated with it 682, conventionally much bigger than what illustrate.

Label 660 is examples of mobile phone paster (MPS), and it can be used for paying by mails, electronic bill, loyalty and access control application.

The shielding element 670 of ferrite (or other suitable material) is arranged between the back side and label 660 of mobile phone 650, to alleviate the decay of the coupling between label and reader.This element can be the form of film or belt, and can have bonding agent to noncontact tag is pasted to mobile phone in both sides.The double sticky tape in both sides with bonding agent is well-known, as for carpet is installed.

Fig. 6 B illustrates that ferritic shielding element 670 can comprise:

-sandwich layer (or substrate) 672, it can be the form of the elongated band of several centimetres wide, has two surfaces, ferrite (or other) particle (comprising nanostructured) is dispersed on whole surface

-band basal surface on bond layer 674(as shown)

-band top surface on adhesive phase 676(as shown), and

The peel ply 678 of-protection top adhesive phase 676, it will be stripped from and abandon.

Shielding element is suitably sent with the form of roller, is similar to common two back sides adhesive tape, and when mask tape 670 rolled-up (in roller supply form), releasing layer prevents the top bonding coat 676 that bottom adhesive layer 674 pastes.

some production technology

Fig. 7 A shows the exemplary manufacture of Anneta module (AM) and the first step of assembling, comprising:

-there is the Copper Foil of gold, nickel or palladium coating,

-modular belt (MT), for example traditional " super 35mm " band

-super 35mm band.Can hole be set through band, for be connected to the bottom surface of described paper tinsel from the opposite side of band, as used plated-through-hole (PTH)

Fig. 7 B shows the another step in manufacture and the assembling of Anneta module (AM).Paper tinsel by laser-induced thermal etching to there are several (as the 6) contact pads (CP) for contact interface.This is the familiar contact jaw sub-block of seeing on a lot of bank cards etc.At the opposite side (invisible) of band, be provided with chip module CM and module antenna MA.

Fig. 7 C, 7D show the opposite side of this modular belt MT.(in this view, contact pad CP is sightless.) plated-through-hole (PTH) and some cross tie parts be visible.DI chip can be installed to modular belt MT, and tinsel joins plated-through-hole PTH and cross tie part to.Can install and link block antenna MA.Can apply dome packaging body (resinous conformal coating) to protect tube core and tinsel to engage, module antenna MA serves as the Barriers for dome packaging body.Alternatively, described module antenna MA can be installed to molded (the dome packaging body) of Anneta module AM, as Flat aerial structure.

(Fig. 1 D, 156) as discussed above, ferrite layer can be set, it has for the interconnection hole of (as tinsel engages).Fig. 7 C illustrates (right side), can be by opening (Fig. 1 D, 158) is set at ferrite layer, to hold tube core.

Fig. 7 E shows the DI smart card that uses the Anneta module of Fig. 7 D to form, and it has in the card of card antenna (CA) (CB).

Can in the substrate such as card CB, form passage, to accept to be layed in tinsel (or conductive material) wherein.(for example, US7028910 – Schlumberger).Can be formed for accepting the depression of Anneta module AM.(referring to Figure 1A, Fig. 7 E).Can use and be laser-ablated in substrate formation passage and depression.

Fig. 7 F shows antenna wire, and it extends into depression, crosses the bottom of depression, and draws from depression, to accept Anneta module AM(Fig. 7 E).For illustrate clear for the purpose of, only show a wire turn of the relevant portion antenna wire of card CB.In the time that module antenna MA is implanted in card CB, this is conducive to reduce to greatest extent the distance between the antenna MA of module and CA of card antenna, leans on to such an extent that very closely guarantee the efficient coupling of module antenna MA and the CA of card antenna.

Although described the present invention with the embodiment of limited quantity, these should not be interpreted as the restriction of the scope to (multiple) of the present invention, but as the example of some embodiment.According to disclosing of explaining herein, those skilled in the art it is contemplated that other possible modification, modification and embodiment also within the scope of the invention.

Claims (15)

1. a smart card (100), it comprises:

Anneta module (AM), it comprises: at least one chip or chip module (CM) and module antenna (MA);

Card (CB), it has at least one surface and periphery; With

Card antenna (CA), its periphery around described card (CB) is extended;

It is characterized in that, at least a portion of described module antenna (MA) is overlapping to be coupled with at least a portion of described card antenna under the situation of intermediary that there is no the pickup coil being associated with card antenna (CA) with at least a portion of described card antenna (CA).

2. smart card according to claim 1, wherein:

Described card antenna (CA) comprises two coils (D, E) of connection inverting each other; And

Described Anneta module (MA) only with an overlaid of described two coils (D, E) with a coupling of described two coils (D, E).

3. smart card according to claim 1, wherein said card antenna (CA) comprising:

Exterior loop (D), it has outer end (7) and inner (8);

Interior loop (E), it has outer end (9) and inner (10);

The inner (10) of described interior loop (E) is connected with the outer end (7) of described exterior loop (D);

The inner (8) of described exterior loop (D) and the outer end (9) of described interior loop (E) are not connected.

4. smart card according to claim 1, wherein:

Described card antenna (CA) is formed with breach or otch (Fig. 5 C, 5D, 5E, 5F, 5H), for making module antenna (MA) and the overlapping maximization that blocks antenna (CA).

5. smart card according to claim 1, also comprises: the one or more Anneta modules (AM2, AM3) additional with overlapping (Fig. 5 A, the 5F) of described card antenna (CA).

6. smart card according to claim 1, wherein (Fig. 2 A) described module antenna (MA, 200) comprising:

First day line structure (A), it is the form with the coil of first end and the second end (1,2);

The second antenna structure (B), it is the form with the coil of first end and the second end (3,4);

Third antenna structure (C), it is the form with the coil of first end and the second end (5,6);

The first end (4) of described the second antenna structure (B) is connected with the first end (1) of described first day line structure (1), and is connected to the first terminal of described chip module (CM), and second end (3) of described the second antenna structure (B) is not connected; With

The first end (5) of described third antenna structure (C) is connected with second end (2) of described first day line structure (1), and is connected to the second terminal of described chip module (CM), and second end (6) of described third antenna structure (C) is not connected.

7. smart card according to claim 1, also comprises:

Ferrite Material (124,126; Figure 1B), it is arranged in described card or in described card, for strengthening the coupling of described module antenna (MA) and described card antenna (CA).

8. smart card according to claim 1, wherein said Anneta module (AM) also comprises:

For the contact pad (CP) of contact mode operation.

9. smart card according to claim 8, also comprises:

Ferrite component (FE; Fig. 1 D, 7C, 7D, 7E), for by module antenna (MA) from contact pad (CP) uncoupling.

10. smart card according to claim 9, wherein:

Described card antenna (CA) is patterned (5C, 5D, 5E, 5F, 5H), to increase overlapping between the part of selection of described module antenna (MA) and described card antenna (CA).

The chip module (CM) with at least one noncontact mode is coupled to the method for the card antenna (CA) in the card (CB) that is arranged on smart card by 11., comprising:

In the Anneta module (AM) with chip module (CM), provide module antenna (MA), it is characterized in that:

Provide card antenna (CA) as " accurate dipole " antenna, described " accurate dipole " antenna has two coiler parts of connection inverting each other.

12. methods according to claim 11, wherein:

Described card antenna (CA) has interior loop (E) and exterior loop (D); And

An only overlaid of described module antenna (MA) and described interior loop and exterior loop (E, D).

13. methods according to claim 11, wherein: described chip module (CM) is double nip (DI) chip module with contact pad (CP), and described chip module also comprises:

Ferrite (FE, 156), it is arranged between module antenna (MA) and contact pad (CP).

14. methods according to claim 11, wherein, described module antenna (MA, 200) comprising:

First day line structure (A), it is the form with the coil at two ends (1,2);

The second antenna structure (B), it is the form with the coil of first end (4) and the second end (3), and described first end (4) is connected with one end (1) of described first day line structure (A), and described the second end (3) is not connected; With

Third antenna structure (C), it is the form with the coil of first end (5) and the second end (6), and described first end (5) is connected with the other end (2) of described first day line structure (A), and described the second end (6) is not connected;

Described the second antenna structure and described third antenna structure form the capacitive stub of first day line structure (A).

15. methods according to claim 11, also comprise:

Make card antenna (CA) patterning (Fig. 5 C, 5D, 5E, 5F, 5H), to make and the overlapping maximization of described module antenna (MA).

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