Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
  • H01H85/02—Details
  • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
  • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
  • H01H85/0411—Miniature fuses
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C1/00—Details
  • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
  • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C1/00—Details
  • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
  • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
  • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
  • H01H85/02—Details
  • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
  • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
  • H01H85/0411—Miniature fuses
  • H01H2085/0414—Surface mounted fuses
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
  • H01H85/02—Details
  • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
  • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
  • H01H85/048—Fuse resistors
  • H01H2085/0483—Fuse resistors with temperature dependent resistor, e.g. thermistor

Definitions

• the present invention relates generally to a surface mountable electrical circuit protection device and a method for making the device.
• PTC positive temperature coefficient
• Many crystalline polymers made electrically conductive by dispersing conductive fillers therein, exhibit this PTC effect . These polymers generally include polyolefins such as polyethylene, polypropylene and ethylene/propylene copolymers. Certain doped ceramics such as barium titanate also exhibit PTC behavior.
• the PTC material exhibits a relatively low, constant resistivity. However, as the temperature of the PTC material increases beyond this point, the resistivity sharply increases with only a slight increase in temperature.
• Electrical devices employing polymer and ceramic materials exhibiting PTC behavior have been used as overcurrent protection in electrical circuits. Under normal operating conditions in the electrical circuit, the resistance of the load and the PTC device is such that relatively little current flows through the PTC device. Thus, the temperature of the device due to I 2 R heating remains below the critical or switching temperature of the PTC device. The device is said to be in an equilibrium state (i.e., the rate at which heat is generated by I 2 R heating is equal to the rate at which the device is able to lose heat to its surroundings) .
• This power dissipation only occurs for a short period of time (i.e., a fraction of a second) , however, because the increased power dissipation will raise the temperature of the PTC device to a value where the resistance of the PTC device has become so high that the current in the circuit is limited to a relatively low value.
• This new current value is enough to maintain the PTC device at a new, high temperature/high resistance equilibrium point, but will not damage the electrical circuit components.
• the PTC device acts as a form of a fuse, reducing the current flow through the short circuit load to a safe, relatively low value when the PTC device is heated to its critical temperature range.
• the PTC device Upon interrupting the current in the circuit, or removing the condition responsible for the short circuit (or power surge) , the PTC device will cool down below its critical temperature to its normal operating, low resistance state. The effect is a resettable, electrical circuit protection device.
• Particularly useful devices of this type generally include a PTC element sandwiched between a pair of laminar electrodes.
• terminals are commonly soldered to the electrode. The soldering process, however, can adversely affect the resistance of a polymeric PTC element.
• electrical connection generally occurs on opposing sides of the PTC element, devices of this type commonly take up more space on a PC board than is necessary.
• the wrap-around configuration of the PTC devices of the present invention allow one to make an electrical connection to an electrode on the opposite side of the PTC device. Further, since electrical devices of the present invention make electrical connection by wrapping a conductive layer around the PTC element rather than putting a conductive layer through an aperture in the PTC element, the device utilizes the entire PTC element. Moreover, the manufacturing steps necessary to produce electrical devices according to the present invention allow for numerous strips to be prepared simultaneously, with the final strips ultimately divided into a plurality of electrical devices. This process makes it possible to reduce the size and, hence, the resistance of the electrical devices of the present invention.
• the present invention provides an electrical device comprising: a resistive element having top and bottom surfaces and first and second sides, the top and bottom surfaces each having two end portions separated by a mid- portion; a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element; an insulating layer contacting the first and second electrodes, the insulating layer having a portion removed from the first and second electrodes to form first and second contact points; and,
• the present invention provides an electrical device comprising: a laminar PTC element comprised of a polymer component and a conductive filler component, the PTC element having a top and bottom surface and a first side and a second side, the top and bottom surfaces each having a pair of end portions separated by a mid-portion; a first electrode contacting the top surface of the PTC element and a second electrode contacting the bottom surface of the PTC element; an insulating layer formed on the first and second electrodes and the first and second sides of the PTC element, the insulating layer having a portion removed from the first electrode adjacent one end portion of the top surface of the PTC element to define a first contact point and a portion removed from the second electrode adjacent the end portion of the bottom surface of the PTC element opposite the first contact point to define
• a third aspect of the present invention provides a method for manufacturing an electrical device comprising the steps of : providing a solid laminar PTC sheet having a top and bottom surface, a first electrode formed on the top surface, and a second electrode formed on the bottom surface; creating a plurality of strips in a regular pattern in the laminar PTC sheet; coating the strips in the laminar PTC sheet with an insulating layer; forming a plurality of contact points in a regular pattern on the top and bottom surfaces of each strip in the laminar PTC sheet; coating the strips in the laminar PTC sheet with a first conductive layer, the first conductive layer being in contact with the electrodes at each contact point; forming a plurality of electrically non-conductive gaps in the first conductive layer in a regular pattern on the top and bottom surfaces of each strip in the laminar PTC sheet; and, dividing each strip in the laminar PTC sheet into a plurality of electrical devices.
• a final aspect of the present invention provides a method for manufacturing an electrical device comprising the steps of: providing a laminar PTC element having a top and bottom surface and first and second sides, the top and bottom surfaces each having end portions separated by a mid-portion; forming a first electrode on the top surface of the PTC element; forming a second electrode on the bottom surface of the PTC element; coating the first and second electrodes and the first and second sides of the PTC element with an insulating layer; removing a first portion of the insulating layer to form a first contact point; removing a second portion of the insulating layer to form a second contact point,* applying a first conductive layer to the insulating layer, the first contact point and the second contact point; removing portions of the first conductive layer to form first and second end terminations separated by electrically non-conductive gaps; and, applying a second conductive layer to the first conductive layer.
• FIG. 1 is a top view of an electrical device according to the present invention.
• FIG. 2 is a cross-sectional view along line a-a of a first embodiment of the electrical device illustrated in FIG. 1.
• FIG. 3 is a cross-sectional view along line a-a of a second embodiment of the electrical device illustrated in FIG. 1.
• FIG. 4 is a perspective view of a laminar PTC sheet having a plurality of strips created in a regular pattern.
• FIG. 4A is a perspective view of the laminar PTC sheet illustrated in FIG. 4 having a plurality of break points created on each strip.
• FIG. 5 is a partial enlarged perspective view of the laminar PTC sheet having a plurality of strips as illustrated in FIG. 4.
• FIGS. 6A-6H illustrate the various steps of a preferred method of manufacturing electrical devices of the present invention, as applied to a cross- section of a single strip of the PTC sheet in FIG. 4A.
• FIGS. 7A-7D illustrate the steps of a second preferred method of manufacturing electrical devices of the present invention, starting with the device illustrated in FIG. 6E.
• FIG. 8 is a cross-sectional view of a preferred embodiment of the device in FIG. 1 soldered to a PC board.
• the present invention will be described below generally with reference to a polymer PTC element having electrodes formed on the top and bottom surfaces. It is to be understood, however, that the present invention contemplates electrical devices with a ceramic PTC element, or a resistive element that does not exhibit PTC characteristics.
• the resistive element of the present invention will be composed of a PTC composition comprised of a polymer component and a conductive filler component .
• the polymer component may be a single polymer or a mixture of two or more different polymers.
• the polymer component may comprise a polyolefin having a crystallinity of at least 40%.
• Suitable polymers include polyethylene, polypropylene, polybutadiene, polyethylene acrylates, ethylene acrylic acid copolymers, and ethylene propylene copolymers.
• the polymer component comprises polyethylene and maleic anhydride (such a polymer is manufactured by Du Pont and sold under the tradename FusabondTM) .
• the conductive filler component is dispersed throughout the polymer component in an amount sufficient to ensure that the composition exhibits PTC behavior.
• the conductive filler can be grafted to the polymer.
• the conductive filler component will be present in the PTC composition by approximately 25-75% by weight.
• Suitable conductive fillers to be used in the present invention include powders, flakes or spheres of the following metals; nickel, silver, gold, copper, silver-plated copper, or metal alloys.
• the conductive filler may also comprise carbon black, carbon flakes or spheres, or graphite.
• the conductive filler component used in the present invention is carbon black (manufactured by Columbian Chemicals and sold under the tradename RavenTM) .
• Particularly useful PTC compositions have a resistivity at approximately 25°C of less than 10 ohm cm, particularly less than 5 ohm cm, and especially less than 3 ohm cm.
• Suitable PTC compositions for use in the present invention are disclosed in U.S. patent application Serial No. 08/614,038, and U.S. Patent Nos. 4,237,441, 4,304,987, 4,849,133, 4,880,577, 4,910,389 and 5,190,697.
• the PTC element has a first electrode in electrical contact with the top surface and a second electrode in electrical contact with the bottom surface.
• the electrodes may be in direct physical contact with the top and bottom surfaces of the PTC element, however, electrical devices of the present invention may also include a conductive adhesive composition which lies between the electrodes and the PTC element .
• the PTC element is sandwiched between two metal foil electrodes to form a laminate.
• the electrodes can be formed on the top and bottom surfaces of the PTC element using conventional electroless or electrolytic plating processes.
• the first and second electrodes preferably comprise a metal selected from the group consisting of nickel, copper, silver, tin, gold and alloys thereof.
• the electrical device 10 of the present invention comprises a resistive element 20 having a top surface 30, a bottom surface 40, a first side 50 and a second side 60. Both the top and bottom surfaces 30, 40 have two end portions 70, 80 and 70', 80' separated by mid-portions 90, 90' .
• a first electrode 100 is formed on the top surface 30 of resistive element 20 and a second electrode 110 is formed on the bottom surface 40 of resistive element 20.
• resistive element 20 is composed of a polymer PTC composition.
• An insulating layer 120 is formed on electrodes 100, 110 and the first side 50 and the second side 60 of the resistive element 20.
• the insulating layer 120 can be composed of a photo resist material, a dielectric material, a ceramic material, a solder mask, or any electrically non ⁇ conductive material .
• the insulating layer 120 has a portion removed from the first electrode 100 to define a first contact point 130 and a portion removed from the second electrode 110 to define a second contact point 140. In the preferred embodiments illustrated in FIGS.
• the first contact point 130 is adjacent the end portion 70 of the top surface 30 of the resistive element 20, while the second contact point 140 is adjacent the end portion 80' of the bottom surface 40 of the resistive element 20 (i.e., the first and second contact points 130, 140 are located on opposite sides and opposite ends of the electrical device 10) . While this configuration is preferred, the present invention covers electrical devices having contact points located anywhere along the first and second electrodes provided that electrical connection can be made to both electrodes from the same side of the electrical device.
• a first conductive layer 150 is formed on the insulating layer 120 and makes electrical contact with the first and second electrodes 100, 110 at first and second contact points 130, 140.
• Conductive layer 150 may be comprised of any conductive material, but preferably comprises a metal selected from the group consisting of copper, tin, silver, nickel, gold and alloys thereof . It is important that the first conductive layer wrap-around the sides of the electrical device . This wrap-around configuration allows for electrical connection to be made to both electrodes from the same side of the electrical device.
• the first conductive layer 150 has portions removed from insulating layer 120 to form end terminations 155, 156. Each end termination includes a contact point. The end terminations 155, 156 are separated by electrically non-conductive gaps 160, 170. FIGS.
• the electrically non-conductive gaps 160, 170 are formed adjacent the mid-portions 90, 90' of the top and bottom surfaces 30, 40 of resistive element 20. It should be understood, however, that the electrically non-conductive gaps 160, 170 can be formed anywhere in the first conductive layer 150 as long as the electrically non-conductive gaps separate end terminations 155, 156, with each end termination including a contact point. This configuration prevents current from flowing circularly around the electrical device. Instead, current may flow around either end portion of the electrical device via an end termination, to the first contact point, and through the resistive element to the second contact point formed on the opposite side of the electrical device.
• the electrically non-conductive gaps 160, 170 can be formed by a conventional etching process. In FIGS. 2- 3, the non-conductive gaps 160, 170 are left vacant, thus exposing insulating layer 120. Alternatively, the non-conductive gaps 160, 170 can be filled with any electrically non-conductive material.
• a second conductive layer 180 is formed on the first conductive layer 150.
• the second conductive layer should not bridge non-conductive gaps 160, 170 or any electrically non-conductive material which might fill the non-conductive gaps 160, 170.
• the second conductive layer 180 is preferably a solder composition which allows the device 10 to be easily connected to the conductive terminals of a PC board.
• the electrical device 10 of the preferred embodiment is symmetrical . Accordingly, the device 10 does not need to be oriented in a special manner before it is mounted to a PC board or connected to additional electrical components.
• the present invention covers an electrical device 10 where the second conductive layer 180 contacts only a portion of the first conductive layer 150, or is in contact with the first conductive layer 150 on one side of the device only, i.e., a non-symmetrical device.
• Electrical devices of the present invention have a resistance at approximately 25°C of less than 1 ohm, preferably less than 0.5 ohm, and especially less than 0.2 ohm.
• the electrical devices of the present invention can be manufactured in various ways. However, as illustrated in FIG. 4, the preferred method provides for carrying out the processing steps on a relatively large laminar sheet 185 which comprises a plurality of strips 186, 186', 186' ' , etc.
• the final processing step includes dividing the strips into a plurality of electrical devices. Accordingly, extremely small electrical devices with low resistances can be produced in an economical fashion.
• electrodes are formed on the top and bottom surfaces of a solid laminar PTC sheet of convenient size.
• the PTC sheet is laminated between two metal foil electrodes.
• electrodes may be plated directly on the top and bottom surfaces of the PTC sheet using conventional electrolytic or electroless plating processes.
• the terminated laminar PTC sheet is then routed or punched to create a plurality of strips 186, 186' , 186'', etc. The strips are created in a regular pattern and preferably have a width, W, approximately the desired length of the final electrical device.
• a laminar PTC sheet approximately 6 inches wide by 8 inches long by .0150 inches thick may be routed or punched to create a plurality of strips 186, 186', 186' ', etc. approximately 7 inches in length with a width of approximately 0.160 - 0.180 inches or less.
• the top and bottom surfaces of each strip are composed of the first and second electrodes 100, 110.
• the side surfaces of each strip are composed of PTC element 20 due to the routing or punching procedure.
• a plurality of break points 187, 187', 187' ' . . . 187a, 187a', 187a'' . . . 187b, 187b', 187b'' . . . etc. are created horizontally across each strip (FIG 4A) .
• the break points allow the final strips to be divided into a plurality of electrical devices by exerting minimal pressure at each break point.
• the final strips can be efficiently divided into a plurality of electrical devices by snapping or simply running the strip over an edge.
• the conductive layers tend to smear upon dividing the strips into electrical devices with conventional dicing and shearing techniques. Smeared conductive layers lead to faulty electrical devices and the increased possibility of short circuits.
• the break points are created by removing portions of the electrodes on both the top and bottom surfaces of each strip. This can be accomplished by laminating the routed, terminated PTC sheet illustrated in FIG. 4 with a dry film photo resist material. A masking material is laid over the portions of the photo resist material which are to be developed or cured, leaving a plurality of unmasked regions approximately 5 mils thick stretching horizontally across each strip.
• the unmasked regions are formed on the routed, terminated laminar PTC sheet in the same direction as the direction in which the PTC composition was extruded. Since the polymer chains in the PTC composition are elongated in the direction of extrusion, the brittleness of the PTC sheet is anisotropic. That is, the PTC sheet is stronger in one direction (i.e., perpendicular to the direction of extrusion) than it is in the direction parallel to extrusion. Thus, by creating the break points parallel to the direction of extrusion, the final strips may be easily divided into a plurality of electrical devices.
• the unmasked regions should be created to leave a plurality of masked portions having a dimension approximately equal to the desired width of the final electrical device, e.g., 0.100 - 0.150 inches or less.
• the strips are then exposed to ultraviolet light whereby the unmasked regions of the photo resist material degrade.
• the degraded photo resist material is rinsed away to expose portions of the electrode surfaces.
• the exposed portions of the electrodes are then removed by a conventional etching process (e.g., subjecting the exposed electrode surfaces to a ferric chloride solution) , thus, creating a plurality break points.
• the developed or cured dry film photo resist material is chemically removed by dipping the PTC sheet into a solvent such as potassium hydroxide.
• FIGS. 6A- 6H and 7A-7D illustrate a partial enlarged cross-sectional view of several strips of the laminar PTC sheet. While the various process steps are to be carried out after the break points have been formed on the routed PTC sheet, for purposes of clarity, the various process steps will be discussed with reference to a cross-section of a single strip (illustrated in FIGS. 6A- 6H and 7A-7D) .
• the strips of the laminar PTC sheet are coated with an insulating layer 120 (FIG. 6B) .
• the insulating layer 120 may be applied using any one of the following conventional techniques: brushing, laminating, dipping, screen printing or spraying.
• the insulating layer 120 may comprise any electrically non-conductive material, however, preferred materials include a photo resist material, a ceramic material, a dielectric material, or a solder mask.
• each strip 130, 140 are formed in a regular pattern on the top and bottom surfaces of each strip (FIGS. 6C-6D) . It should be understood that the present invention covers methods where the insulating layer
• the present invention covers methods where the insulating layer 120 is initially applied to the entire surface of each strip. Contact points 130, 140 are then formed by removing portions of the insulating layer 120.
• a positive working photo resist material is used as the insulating layer 120.
• a first conductive layer 150 is applied to the strips (FIG. 6E) .
• the conductive layer 150 may be applied by a conventional plating technique (e.g., electroless plating) .
• the conductive layer may be applied by dipping, spraying or brushing a conductive material to the strips in a liquid form.
• the first conductive layer 150 comprises a metal selected from the group consisting of nickel, copper, tin, silver, gold or alloys thereof. The first conductive layer 150 must make electrical contact with the electrodes 100, 110 at each contact point formed on the strips.
• the first conductive layer 150 wraps around the end portions of the electrical device 10. This wrap-around configuration makes it possible to make electrical contact to both electrodes from the same side of the electrical device.
• a plurality of electrically non-conductive gaps 160, 170 are formed in the first conductive layer 150 in a regular pattern on the top and bottom surfaces of each strip (FIGS. 6F-
• the electrically non-conductive gaps 160, 170 may be formed by applying the first conductive layer 150 initially in a manner which leaves portions of the insulating layer 120 exposed. However, the present invention also covers methods where each strip is completely covered with the first conductive layer 150 and the electrically non-conductive gaps 160, 170 are created by removing portions of the first conductive layer 150 in a regular pattern on the top and bottom surfaces of each strip. Either. rocess results in forming on each strip a plurality of first and second end terminations 155, 156 separated by the electrically non ⁇ conductive gaps 160, 170. For example, with reference to
• FIGS. 6E-6G a protective mask, reference letter M in FIG. 6F, is applied to the conductive layer 150, leaving predetermined portions exposed (the exposed portions are represented by the cross-hatched sections of the conductive layer 150 in FIG. 6F) .
• the exposed portions are then removed by a conventional etching process, e.g., subjecting the exposed portions to a ferric chloride solution.
• the electrically non-conductive gaps 160, 170 and end terminations 155, 156 can be formed by the following method.
• First conductive layer 150 is applied to each strip, coating insulating layer 120 and contact points 130, 140 (FIG. 6E) .
• a photo resist material 190 is applied to the conductive layer 150. If a photo resist material is used to form insulating layer 120, then the second photo resist material 190 used in this step must have an opposite reaction to ultraviolet light (i.e., if a negative-working photo resist material was used to form the insulating layer, than a positive-working photo resist material must be used to form the electrically non-conductive gaps in the conductive layer and vice-versa) .
• a masking material, reference letter M in FIG. 7B, is applied to the outer photo resist layer 190, leaving a plurality of portions of the top and bottom surfaces of the layer 190 exposed in a regular pattern.
• the strips are then subjected to ultraviolet light, causing the unmasked portions of the outer photo resist layer 190 to degrade.
• the degraded portions of the photoresist material 190 are rinsed away, leaving a plurality of portions of the first conductive layer 150 exposed in a regular pattern on the top and bottom surfaces of each strip (FIG. 7C) .
• the exposed portions of the conductive layer 150 (shown as cross-hatched sections of the conductive layer in FIG. 7C) are then removed by dipping the strips in a standard etching solution.
• portions of insulating layer 120 are exposed.
• the outer photo resist material 190 is then removed by further exposing the strips to ultraviolet light (FIG. 7D) . Since portions of the insulating layer 120 are exposed during this step, it is important to use a photo resist material 190 which has an opposite reaction to ultraviolet light than the photo resist material that may have been used to form insulating layer 120.
• a second conductive layer 180 is applied to the first conductive layer 150.
• the second conductive layer 180 is preferably comprised of a solder composition and can be applied by any conventional process, including electrolytic plating or solder dipping.
• the layer of solder permits the electrical devices 10 of the present invention to be easily connected to the conductive terminals of a PC board.
• the strips are divided at each break point into a plurality of electrical devices such that each device has a contact point and an electrically non-conductive gap on both sides (i.e., top and bottom) of the device. As previously mentioned, the strips may be divided into a plurality of electrical devices by simply applying a minimal amount of pressure at each break point .
• the arrows indicate the flow of current through the device.
• the end terminations allow current to flow from a conductive terminal of a PC board, around the outer edge of the device (via the first end termination) , to the first electrode at the first contact point. The current then flows through the PTC element to the second electrode. Current exits the device through the contact point of the second end termination and continues to flow through the remainder of the circuit.

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• 1997
  • 1997-01-21 CN CN97192553A patent/CN1212072A/zh active Pending
  • 1997-01-21 JP JP9527886A patent/JPH11509689A/ja active Pending
  • 1997-01-21 AU AU19536/97A patent/AU1953697A/en not_active Abandoned
  • 1997-01-21 WO PCT/US1997/001719 patent/WO1997028543A1/en active IP Right Grant
  • 1997-01-21 EP EP97907561A patent/EP0922286A1/de not_active Withdrawn
  • 1997-01-21 KR KR1019980705686A patent/KR19990081968A/ko active IP Right Grant

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