EP0813943A2 - Schneidzenter - Google Patents

Schneidzenter Download PDF

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Publication number
EP0813943A2
EP0813943A2 EP97109938A EP97109938A EP0813943A2 EP 0813943 A2 EP0813943 A2 EP 0813943A2 EP 97109938 A EP97109938 A EP 97109938A EP 97109938 A EP97109938 A EP 97109938A EP 0813943 A2 EP0813943 A2 EP 0813943A2
Authority
EP
European Patent Office
Prior art keywords
slicing
operations
unit
center according
slices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97109938A
Other languages
English (en)
French (fr)
Other versions
EP0813943A3 (de
EP0813943B1 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
Hauser Charles
HCT Shaping Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hauser Charles, HCT Shaping Systems SA filed Critical Hauser Charles
Publication of EP0813943A2 publication Critical patent/EP0813943A2/de
Publication of EP0813943A3 publication Critical patent/EP0813943A3/de
Application granted granted Critical
Publication of EP0813943B1 publication Critical patent/EP0813943B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor

Definitions

  • the present invention relates to a slicing center for producing slices from pieces to be sliced.
  • the manufacture of wafers from ingots is generally done according to a series of successive stages grouping in an erratic way a certain number of machines or devices more or less well matched, generally manufactured to achieve a very precise function, but without interface thought previous or subsequent operations. Integration is generally carried out by the user with more or less difficulty or success and with more or less automation.
  • the following operations must be carried out.
  • the ingots are fixed on a support in a position which must be very precise, if it is a single crystal where the orientation of the crystal structure has a role to play. In this case, a determination of the orientation must be made by X-rays for example and a positioning is necessary.
  • the slicing device which can be a diamond saw or a wire saw or any other means enabling the material to be cut either in bundles or pieces by room.
  • a coarse cleaning operation and packaging of the slices obtained will then follow. This conditioning is generally done in a packaging which keeps each slice separate from the next one to avoid any contact between them which could cause chipping.
  • This type of packaging is called a cassette and is used to transport the wafers for subsequent operations.
  • the object of the present invention is to remedy these drawbacks and it is characterized, for this purpose, by the fact that the slicing center comprises, assembled in the same set of first means, for carrying out the operations necessary for the production of the slices conditioned subsequent use from pieces to be cut and by the fact that these operations are managed and linked together by second means so as to form sub-groups and by the fact that these sub-groups are themselves linked together by third means thus forming a transfer chain in which all the operations and all the means are compatible and interconnected to form the cutting center.
  • the wafers can be produced in an automated manner with a very high yield, with increased reliability and security, with uniform and excellent quality and at a lower cost price.
  • Integration into subgroups by second means and then full integration, by third means, of individual protection operations made up of the first means can be carried out in such a way as to make the whole almost automatic, therefore replacing a series of well separated steps, difficult for the user to coordinate, by a single operation which consists in putting back pieces to be sliced or ingots and receiving in return slices conditioned in a pre-selected packaging. It is therefore a question of providing the user with an automatic or semi-automatic slicing center according to a global concept of slice manufacturing.
  • the implementation of the overall concept overcomes the drawbacks of the multiple stages currently required for the manufacture of wafers from the ingot to the conditioned wafer by providing an overall concept integrating all of the operations required, therefore the first means. The user then no longer has to worry about making each operation compatible with the next, this being carried out by the second and / or third means.
  • the ingot or the piece to be cut, as well as its spatial orientation with possible control of the crystal by X-rays or by an optical method, can be carried out by second means in the form of a robot managed by computer and coordinating the orientation and fixing operations in position, as well as the location of ingots.
  • the first means being in this case constituted inter alia by the fixing stations, the R-X measuring station, possibly a cleaning station, the list not being exhaustive.
  • the placement in the slicing unit of the pieces to be sliced can also be achieved by second means in the form of a robot manipulator always computer controlled and always keeping track of the workpiece.
  • the part to be sliced can be taken up by the same manipulator robot to be transferred to the packaging unit. This operation is generally only necessary when slicing into a package by a wire saw or multi-blade for example.
  • the slices will be taken directly one after the other from the slicing unit to be packaged in the packaging unit.
  • the first means of the slicing unit can consist of a set of one or more free or fixed abrasive slicing devices, such as wire saws, diamond or multi-blade saws.
  • the packaging unit will receive the slices either in the form of pieces sawn into slices, but always attached to each other generally by a glued heel, or either in the form of separate slices but also having an adherent heel.
  • the packaging unit will therefore have to distribute the slices in containers called cassettes and now these separate from one another.
  • the packaging unit can also have a role of cleaning the edges or removing the heel, but can also insert other operations such as chamfering or marking or even control and scrap operations which each represents one of the first means, the second means can for example consist of conveyor belts connecting the various first means to each other.
  • the passage between the different subgroups consisting of the first and second means through intermediate storage can be achieved by independent robotics and separate from the second means. This independent robotics then constitutes with intermediate storage the third means.
  • the second means are sufficient to ensure the transfer and the operations and functions of the third means can then be carried out entirely. or only partially by the second means or integrated into them.
  • the invention allows the slicing unit by the overall concept of slicing to become a slicing center and thus avoid the multiple steps which require a significant workforce and the difficulties of keeping track of each piece to be cut.
  • the slicing center therefore consists of first means for carrying out the necessary operations, second means making it possible to manage a series of operations between them and thus constituting a sub-group of operations, and third means linking the sub-groups together. to make a single transfer chain called a slicing center.
  • Figure 1 is a slicing center flowchart.
  • Figure 2 shows a variant
  • Figure 3 shows the general principle of hierarchical organization of a slicing center.
  • FIG. 4 illustrates by means of a flowchart an exemplary embodiment of the organization of another slicing center.
  • FIG. 1 shows a possible flow diagram for carrying out the present invention with the various possible intermediate storages.
  • the slicing piece 1 is stored in an input storage 2.
  • the robot 3 of the positioning unit 4 positions it after having possibly measured it, on the RX generator 6.
  • the part to be sliced 1 positioned on the support 5 is put on hold in the first intermediate storage 7.
  • the slicing piece 1 is then taken up by the manipulator 9 of the slicing unit 10 mounted on a rail 8 and introduced into the slicing device 11, in this case a wire saw.
  • the slices 12 still adhering to the support 5 are put on hold in the second intermediate storage 13 before being taken up by a new manipulator 14 to be introduced into the packaging unit 30 comprising the packaging device 15.
  • the slices 12 mounted on their support 5 are presented one after the other by the motor 16 in front of a saw blade 17 which cuts the heel which retains the slices 12. These will therefore fall on the conveyor 18 and will be introduced one after the others in the cassette 19 which moves downwards thanks to the motor 20.
  • the cassettes once full will be transported by a conveyor belt in the outlet storage 22.
  • Figure 2 gives a plan view of a possible variant of cutting center.
  • the pieces to be cut 1 are stored in an input storage 2.
  • the robot 3 of the positioning unit 4 positions, after having possibly measured it on the RX generator 6, the piece to be cut 1 on the support 5 in the assembly station 29. It is then put on hold in the first intermediate storage 7.
  • the part to be cut is then taken up by the manipulator 9 of the slicing unit 10 mounted on a rail 8 and introduced into one of the slicing devices 11 six in number in this example.
  • the slices 12 still adhering to the support 5 are put on hold in the second intermediate storage 13 before being taken up by a new manipulator 14 to be introduced into one of the two packaging devices 15 which constitute the unit for packaging 30.
  • the slices 12 once separated from their support are transported by the conveyor 18 and then placed in cassettes 19.
  • the cassettes 19 are transported by conveyor belts 21 to the outlet storage 22.
  • Figure 3 shows a possible schematic flowchart of a slicing center.
  • the first means 23 are grouped into operations 24.
  • the second means 25 manage a certain number of operations 24 and form sub-groups 26. These are linked together by the third means 27 to form the cutting center 28.
  • FIG. 4 illustrates a practical example of a flow diagram of an embodiment of the slicing center 28.
  • second means 25a constituted for example by a robot to form the sub-group 26a corresponding to the positioning unit.
  • the slicing unit 26b comprises as first means six slicing machines 23b1, which are for example wire saws performing the slicing operation 24b1, and a shower 23b2 for carrying out a pre-cleaning operation 24b2.
  • second means 25b constituted by a rail manipulator to form a second subgroup 26b.
  • the slicing unit 28 could possibly also be supplemented by a subsequent processing unit forming a sub-group 26d.
  • the first means of the latter may include a milling device 23d1 intended for the operation of removing the heel 22d1, a grinder 23d2 performing the chamfering 24d2, a polisher 23d3 and a lapping member 23d4 for polishing 24d3 and lappage 24d4 , a washing device 23d5 for carrying out a final washing 24d5, control and measuring devices 23d6 intended for quality control 24d6 and a device 23d7 intended for marking 24d7 of the slices obtained. All of these operations 24d1 to 24d7 can be connected by second means 25d constituted by manipulators and / or conveyors to obtain a continuous sequence forming the subsequent processing unit 26d.
  • the three or four units corresponding to the subgroups 26a to 26d are interconnected by the third means 27 to form a cutting center 28 forming a coherent whole.
  • These third means comprise input storage members, intermediate between some or all of the sub-groups and output, and means of transport and handling comprising manipulating robots and / or conveyors.
  • the various first, second and third means may be commanded and controlled in whole or in part by a central computer control unit 28A.
  • the second means 25a to 25d can also perform some of the functions of the third means 27 and vice versa.
  • the robot of the positioning unit can also transport and direct the parts to be cut in the intermediate storage.
  • the rail manipulator of the slicing unit can also transport the first intermediate storage to the slicing machines and the pre-cleaning shower to the second intermediate storage before the conditioning unit 26c.
  • Other first means 23 and other operations 24 may be provided and integrated into the slicing center. Certain operations may be integrated into neighboring subgroups.
  • fixing 24a3 of the piece to be cut with its unique support on the plate machine support may be performed as part of subgroup 26b of the slicing unit.
  • the pre-cleaning 24b2 can be deleted or integrated into the following subgroup 26c.
  • the organs and the operations of mechanical preparations namely the removal of the heel, the chamfering, the polishing and the lapping, and the operations of cleaning and final washing may also be integrated into the third subgroup 26c of conditioning.
  • the choice of the number of each organ and device of the first, second and third means will be determined according to the desired production capacity.
  • first, second and third means can also be executed manually. It is of course also possible that certain operations described with reference to Figures 1,2 and 4 may be missing.
EP97109938A 1996-06-19 1997-06-18 Schneidzentrum Expired - Lifetime EP0813943B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1532/96 1996-06-19
CH01532/96A CH691798A5 (fr) 1996-06-19 1996-06-19 Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
CH153296 1996-06-19

Publications (3)

Publication Number Publication Date
EP0813943A2 true EP0813943A2 (de) 1997-12-29
EP0813943A3 EP0813943A3 (de) 1998-04-08
EP0813943B1 EP0813943B1 (de) 2002-11-27

Family

ID=4212643

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97109938A Expired - Lifetime EP0813943B1 (de) 1996-06-19 1997-06-18 Schneidzentrum

Country Status (5)

Country Link
US (1) US6524162B1 (de)
EP (1) EP0813943B1 (de)
JP (1) JPH1076430A (de)
CH (1) CH691798A5 (de)
DE (1) DE69717349T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072329A1 (en) * 2002-02-28 2003-09-04 Memc Electronic Materials, S.P.A. Automated control of wafer slicing process

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9046892B2 (en) * 2009-06-05 2015-06-02 The Boeing Company Supervision and control of heterogeneous autonomous operations
DE102011119015A1 (de) 2011-11-14 2013-05-16 Jens Hansen Zusammenfaltbare Tastatur
US10052848B2 (en) 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
JP6021261B2 (ja) * 2013-01-09 2016-11-09 コマツＮｔｃ株式会社 多軸加工ワイヤソーシステム
US9154678B2 (en) 2013-12-11 2015-10-06 Apple Inc. Cover glass arrangement for an electronic device
US10406634B2 (en) 2015-07-01 2019-09-10 Apple Inc. Enhancing strength in laser cutting of ceramic components

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736968A (en) * 1970-11-25 1973-06-05 Sun Studs Method and apparatus for processing logs
US4719694A (en) * 1985-11-13 1988-01-19 Siemens Aktiengesellschaft Installation for automatic assembly and testing of electronic card modules
JPH04282702A (ja) * 1991-03-12 1992-10-07 Omron Corp 階層型工場管理システム
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5246524A (en) * 1988-06-06 1993-09-21 Nitto Denko Corporation Semiconductor wafer processing system
US5255197A (en) * 1990-07-06 1993-10-19 Honda Giken Kogyo Kabushiki Kaisha Line production management system
JPH076939A (ja) * 1992-12-02 1995-01-10 Hitachi Ltd 生産管理システム
JPH08110805A (ja) * 1994-10-07 1996-04-30 Kokusai Electric Co Ltd 多連型プロセス装置の制御システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688193B2 (ja) * 1986-07-18 1994-11-09 三洋電機株式会社 生産制御装置
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
DE4001885A1 (de) * 1990-01-23 1991-07-25 Kuka Schweissanlagen & Roboter Mehrachsiger industrieroboter
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
JPH05121521A (ja) * 1991-10-29 1993-05-18 Komatsu Electron Metals Co Ltd 半導体ウエハ製造装置および製造方法
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
JPH0821807B2 (ja) * 1993-04-07 1996-03-04 日本電気株式会社 マイクロ波回路モジュールの製造装置
JP3085136B2 (ja) * 1995-03-25 2000-09-04 信越半導体株式会社 ワークのスライシング方法および装置
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736968A (en) * 1970-11-25 1973-06-05 Sun Studs Method and apparatus for processing logs
US4719694A (en) * 1985-11-13 1988-01-19 Siemens Aktiengesellschaft Installation for automatic assembly and testing of electronic card modules
US5164905A (en) * 1987-08-12 1992-11-17 Hitachi, Ltd. Production system with order of processing determination
US5246524A (en) * 1988-06-06 1993-09-21 Nitto Denko Corporation Semiconductor wafer processing system
US5255197A (en) * 1990-07-06 1993-10-19 Honda Giken Kogyo Kabushiki Kaisha Line production management system
JPH04282702A (ja) * 1991-03-12 1992-10-07 Omron Corp 階層型工場管理システム
JPH076939A (ja) * 1992-12-02 1995-01-10 Hitachi Ltd 生産管理システム
JPH08110805A (ja) * 1994-10-07 1996-04-30 Kokusai Electric Co Ltd 多連型プロセス装置の制御システム

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 082 (P-1489), 18 février 1993 & JP 04 282702 A (OMRON CORP), 7 octobre 1992, *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 004, 31 mai 1995 & JP 07 006939 A (HITACHI LTD;OTHERS: 01), 10 janvier 1995, *
PATENT ABSTRACTS OF JAPAN vol. 096, no. 008, 30 août 1996 & JP 08 110805 A (KOKUSAI ELECTRIC CO LTD), 30 avril 1996, *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003072329A1 (en) * 2002-02-28 2003-09-04 Memc Electronic Materials, S.P.A. Automated control of wafer slicing process

Also Published As

Publication number Publication date
EP0813943A3 (de) 1998-04-08
JPH1076430A (ja) 1998-03-24
US6524162B1 (en) 2003-02-25
CH691798A5 (fr) 2001-10-31
DE69717349T2 (de) 2003-10-09
EP0813943B1 (de) 2002-11-27
DE69717349D1 (de) 2003-01-09

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